Datasheet Operational Amplifiers Series Ground Sense High Speed Low Voltage CMOS Operational Amplifiers BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx General Description Key Specifications BU7485G/BU7486xxx/BU7487xx are CMOS operational  Operating Power Supply Voltage Range amplifiers with input ground sense and full swing output. (Single Supply): +3.0V to +5.5V This series has extended operational amplifiers  Slew Rate: 10.0V/µs(Typ) BU7485SG/BU7486Sxxx/BU7487Sxx which can operate  Temperature Range: over a wider temperature range (-40°C to +105°C). BU7485G -40°C to +85°C These ICs have wide band, high slew rate, low voltage BU7486xxx -40°C to +85°C operation and low input bias current, making the BU7487xx -40°C to +85°C operational amplifiers suitable for portable equipment and BU7485SG -40°C to +105°C sensor application. BU7486Sxxx -40°C to +105°C BU7487Sxx -40°C to +105°C Features  Input Bias Current: 1pA (Typ)  Input Offset Current: 1pA (Typ)  High Slew Rate  Wide Bandwidth  Low Input Bias Current Package W(Typ) x D(Typ) x H(Max)  Output Full Swing SSOP5 2.90mm x 2.80mm x 1.25mm SOP8 5.00mm x 6.20mm x 1.71mm Application SSOP-B8 3.00mm x 6.40mm x 1.35mm  Battery-powered Equipment MSOP8 2.90mm x 4.00mm x 0.90mm  General Purpose Electronics SOP14 8.70mm x 6.20mm x 1.71mm SSOP-B14 5.00mm x 6.40mm x 1.35mm Simplified schematic VDD Vbias Class +IN OUT AB control -IN Vbias VSS Figure 1. Simplified schematic (1 channel only) ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/40 21.Oct.2016 Rev.003 TSZ22111･14･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Pin Configuration BU7485G, BU7485SG : SSOP5 Pin No. Pin Name +IN 1 5 VDD 1 +IN VSS 2 2 VSS 3 -IN -IN 3 4 OUT 4 OUT 5 VDD BU7486F, BU7486SF : SOP8 BU7486FV, BU7486SFV : SSOP-B8 BU7486FVM, BU7486SFVM : MSOP8 Pin No. Pin Name OUT1 1 8 VDD 1 OUT1 2 -IN1 -IN1 2 CH1 7 OUT2 - + 3 +IN1 4 VSS +IN1 3 6 -IN2 CH2 5 +IN2 + - VSS 4 5 +IN2 6 -IN2 7 OUT2 8 VDD BU7487F, BU7487SF : SOP14 BU7487FV, BU7487SFV : SSOP-B144 Pin No. Pin Name OUT1 1 14 OUT4 1 OUT1 -IN1 2 CH1 CH4 13 -IN4 2 -IN1 －- ＋+ ＋+ －- 3 +IN1 +IN1 3 12 +IN4 4 VDD VDD 4 11 VSS 5 +IN2 6 -IN2 +IN2 5 10 +IN3 7 OUT2 －- ＋+ ＋+ －- -IN2 6 CH2 CH3 9 -IN3 8 OUT3 9 -IN3 OUT2 7 8 OUT3 10 +IN3 11 VSS 12 +IN4 13 -IN4 14 OUT4 Package SSOP5 SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 BU7485G BU7486F BU7486FV BU7486FVM BU7487F BU7487FV BU7485SG BU7486SF BU7486SFV BU7486SFVM BU7487SF BU7487SFV www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 2/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Ordering Information B U 7 4 8 x x x x x - x x Part Number Package Packaging and forming specification BU7485G G:FVMIISSOP5 E2: Embossed tape and reel BU7485SG F:FVMESOP8 (SOP8/SSOP-B8/SOP14/ SSOP-B14) BU7486xxx SOP14 TR: Embossed tape and reel BU7486Sxxx FV:FMVSSOP-B8 (SSOP5/MSOP8) BU7487xx SSOP-B14 BU7487Sxx FVM:FFMSOP8 Line-up Topr Package Operable Part Number SSOP5 Reel of 3000 BU7485G-TR SOP8 Reel of 2500 BU7486F-E2 SSOP-B8 Reel of 2500 BU7486FV-E2 -40°C to +85°C MSOP8 Reel of 3000 BU7486FVM-TR SOP14 Reel of 2500 BU7487F-E2 SSOP-B14 Reel of 2500 BU7487FV-E2 SSOP5 Reel of 3000 BU7485SG-TR SOP8 Reel of 2500 BU7486SF-E2 SSOP-B8 Reel of 2500 BU7486SFV-E2 -40°C to +105°C MSOP8 Reel of 3000 BU7486SFVM-TR SOP14 Reel of 2500 BU7487SF-E2 SSOP-B14 Reel of 2500 BU7487SFV-E2 Absolute Maximum Ratings (T =25C) A Ratings Parameter Symbol BU7485G/BU7486xxx BU7485Sx/BU7486Sxxx Unit /BU7487xx /BU7487Sxx Supply Voltage VDD-VSS +7 V SSOP5 0.54(Note 1,7) SOP8 0.55(Note 2,7) SSOP-B8 0.50(Note 3,7) Power dissipation P W D MSOP8 0.47(Note 4,7) SOP14 0.45(Note 5,7) SSOP-B14 0.70(Note 6,7) Differential Input Voltage(Note 8) V VDD – VSS V ID Input Common-mode V (VSS - 0.3) to VDD + 0.3 V Voltage Range ICM Input Current(Note 9) I ±10 mA I Operating Supply Voltage V +3.0 to +5.5 V opr Operating Temperature T -40 to +85 -40 to +105 C opr Storage Temperature T -55 to +125 C stg Maximum Junction Temperature T +125 C Jmax (Note 1) To use at temperature above TA=25C reduce 5.4mW/°C. (Note 2) To use at temperature above TA=25C reduce 5.5mW/°C. (Note 3) To use at temperature above Ta＝25C reduce 5.0mW. (Note 4) To use at temperature above Ta＝25C reduce 4.7mW. (Note 5) To use at temperature above Ta＝25C reduce 4.5mW. (Note 6) To use at temperature above Ta＝25C reduce 7.0mW. (Note 7) Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). (Note 8) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 9) An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 3/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Electrical Characteristics ○BU7485G, BU7485SG（Unless otherwise specified VDD=+3V, VSS=0V, T =25C） A Temperature Limits Parameter Symbol Unit Condition Range Min Typ Max Input Offset Voltage(Note 10) V 25C - 1 9.5 mV - IO Input Offset Current(Note 10) I 25C - 1 - pA - IO Input Bias Current(Note 10) I 25C - 1 - pA - B Supply Current(Note 11) I 25C - 1500 2000 μA RL =∞ DD Full range - - 2400 Av=0dB, IN=0.8V Maximum Output Voltage V 25C VDD-0.1 - - V R =10kΩ (High) OH L Maximum Output Voltage V 25C - - VSS+0.1 V R =10kΩ (Low) OL L Large Signal Voltage Gain A 25C 70 105 - dB R =10kΩ V L Input Common-mode V 25C 0 - 1.6 V VSS ~ VDD-1.4V Voltage Range ICM Common-mode Rejection CMRR 25C 45 60 - dB - Ratio Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 12) I 25C 4 8 - mA VDD-0.4V SOURCE Output Sink Current (Note 12) I 25C 7 12 - mA VSS+0.4V SINK Slew Rate SR 25C - 10 - V/μs C =25pF L Unity Gain Frequency f 25C - 10 - MHz C =25pF, Av=40dB T L Phase Margin θ 25C - 50 - deg C =25pF, Av=40dB L Total Harmonic Distortion THD+N 25C - 0.03 - % OUT=0.7V , f=1kHz +Noise P-P (Note 10) Absolute value (Note 11) Full range BU7485G: TA =-40C to +85C BU7485SG: TA =-40C to +105C (Note 12) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 4/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Electrical Characteristics - continued ○BU7486xxx, BU7486Sxxx（Unless otherwise specified VDD=+3V, VSS=0V, T =25C） A Temperature Limits Parameter Symbol Unit Condition Range Min Typ Max Input Offset Voltage(Note 13) VIO 25C - 1 9.5 mV - Input Offset Current(Note 13) IIO 25C - 1 - pA - Input Bias Current(Note 13) IB 25C - 1 - pA - Supply Current(Note 14) I 25C - 3000 4000 μA RL =∞ DD Full range - - 4500 Av=0dB, IN=0.8V Maximum Output Voltage (High) VOH 25C VDD-0.1 - - V RL =10kΩ Maximum Output Voltage (Low) VOL 25C - - VSS+0.1 V RL =10kΩ Large Signal Voltage Gain AV 25C 70 105 - dB RL =10kΩ Input Common-mode Voltage Range VICM 25C 0 - 1.6 V VSS ~ VDD-1.4V Common-mode Rejection CMRR 25C 45 60 - dB - Ratio Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 15) ISOURCE 25C 4 8 - mA VDD-0.4V Output Sink Current (Note 15) ISINK 25C 7 12 - mA VSS+0.4V Slew Rate SR 25C - 10 - V/μs CL =25pF Unity Gain Frequency fT 25C - 10 - MHz CL =25pF, Av=40dB Phase Margin θ 25C - 50 - deg CL =25pF, Av=40dB Total Harmonic Distortion +Noise THD+N 25C - 0.03 - % OUT=0.7VP-P, f=1kHz Channel Separation CS 25C - 100 - dB Av=40dB (Note 13) Absolute value (Note 14) Full range BU7486xxx: TA =-40C to +85C BU7486Sxxx: TA =-40C to +105C (Note 15) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 5/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Electrical Characteristics - continued ○BU7487xx, BU7487Sxx（Unless otherwise specified VDD=+3V, VSS=0V, T =25C） A Temperature Limits Parameter Symbol Unit Condition Range Min Typ Max Input Offset Voltage(Note 16) VIO 25C - 1 9.5 mV - Input Offset Current(Note 16) IIO 25C - 1 - pA - Input Bias Current(Note 16) IB 25C - 1 - pA - Supply Current(Note 17) I 25C - 6000 8000 μA RL =∞ DD Full range - - 9000 Av=0dB, IN=0.8V Maximum Output Voltage (High) VOH 25C VDD-0.1 - - V RL =10kΩ Maximum Output Voltage (Low) VOL 25C - - VSS+0.1 V RL =10kΩ Large Signal Voltage Gain AV 25C 70 105 - dB RL =10kΩ Input Common-mode Voltage Range VICM 25C 0 - 1.6 V VSS ~ VDD-1.4V Common-mode Rejection CMRR 25C 45 60 - dB - Ratio Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 18) ISOURCE 25C 4 8 - mA VDD-0.4V Output Sink Current (Note 18) ISINK 25C 7 12 - mA VSS+0.4V Slew Rate SR 25C - 10 - V/μs CL =25pF Unity Gain Frequency fT 25C - 10 - MHz CL =25pF, Av=40dB Phase Margin θ 25C - 50 - deg CL =25pF, Av=40dB Total Harmonic Distortion +Noise THD+N 25C - 0.03 - % OUT=0.7VP-P, f=1kHz Channel Separation CS 25C - 100 - dB Av=40dB (Note 16) Absolute value (Note 17) Full range BU7487xx: TA =-40C to +85C BU7487Sxx: TA =-40C to +105C (Note 18) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 6/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (V ) ID Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (V ) ICM Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (P ) D Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, P is determined by the temperature that can be permitted by the IC in D the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (V ) IO Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (I ) IO Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (I ) B Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (I ) DD Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (V /V ) OH OL Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (A ) V Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (7) Input Common-mode Voltage Range (V ) ICM Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset voltage fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset voltage fluctuation) (10) Output Source Current/ Output Sink Current (I / I ) SOURCE SINK The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (11) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) Unity Gain Frequency (f ) T Indicates a frequency where the voltage gain of operational amplifier is 1. (13) Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (14) Total Harmonic Distortion+Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (15) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 7/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves ○BU7485G, BU7485SG 0.8 0.8 W] . 0.6 W] . 0.6 N [ N [ O O BU7485SG TI BU7485G TI A A P P SSI 0.4 SSI 0.4 DI DI R R E E W W O 0.2 O 0.2 P P 0 0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 2. Figure 3. Derating curve Derating curve 4 4 A] 3 A] 3 m m NT [ 85C 105C NT [ 5.5V E E 4.0V R R R 2 R 2 U U C C Y Y PL PL UP 1 25C UP 1 3.0V S -40C S 0 0 2.5 3 3.5 4 4.5 5 5.5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 4. Figure 5. Supply Current vs Supply Voltage Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 8/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 6 6 5.5V 5 5 105C H [V] 85C H [V] 4.0V G 4 G 4 HI HI E 25C E AG 3 -40C AG 3 3.0V T T L L O O V V T 2 T 2 U U P P T T U U O O 1 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 6. Figure 7. Maximum Output Voltage High vs Supply Voltage Maximum Output Voltage High vs Ambient Temperature (RL =10kΩ) (RL =10kΩ) 20 20 V] V] m 15 m 15 W [ W [ O O L L E E G G A 10 A 10 LT LT VO 85C 25C VO 5.5V T 105C T 4.0V U U P 5 P 5 T T U U O O 3.0V -40C 0 0 2.5 3 3.5 4 4.5 5 5.5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 8. Figure 9. Maximum Output Voltage Low vs Supply Voltage Maximum Output Voltage Low vs Ambient Temperature (RL =10kΩ) (RL =10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 9/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 50 20 A] A] m 40 m T [ T [15 EN EN 5.5V RR 30 -40C RR 4.0V U U E C 25C E C10 C C UR 20 UR O O T S T S TPU 10 TPU 5 3.0V OU 105C 85C OU 0 0 0 0.5 1 1.5 2 2.5 3 -50 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 10. Figure 11. Output Source Current vs Output Voltage Output Source Current vs Ambient Temperature (VDD=3V) (OUT=VDD-0.4V) 80 40 70 A] A] m 60 m 30 RENT [ 50 -40C 25C RENT [ 4.0V 5.5V R R CU 40 CU 20 K K N N SI 30 SI T T U U P 20 P 10 UT 85C 105C UT 3 .0V O O 10 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 OUTPUT VO LTAGE [V] AMBIENT TEMP ERATURE [°C] Figure 12. Figure 13. Output Sink Current vs Output Voltage Output Sink Current vs Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 10/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 10.0 10.0 7.5 7.5 V] V] E [m 5.0 E [m 5.0 G G OLTA 2.5 85C 105C OLTA 2.5 5.5V ET V 0.0 ET V 0.0 FFS -2.5 25C -40C FFS -2.5 3 .0V 4.0V O O UT -5.0 UT -5.0 NP NP I -7.5 I -7.5 -10.0 -10.0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 14. Figure 15. Input Offset Voltage vs Supply Voltage Input Offset Voltage vs Ambient Temperature (V =VDD-1.4V, OUT=1.5V) (V =VDD-1.4V, OUT=1.5V) ICM ICM 15 140 B] L 120 mV] 10 N [d -40C E [ AI 100 G 5 G A E OLT 85C 105C AG 80 T V 0 OLT 105C 85C 25C E V UT OFFS -5 -40C 25C SIGNAL 4600 P E N G I -10 R 20 A L -15 0 -1 0 1 2 3 2 3 4 5 6 COMMON MODE INPUT VOLTAGE [V] SUPPLY VOLTAGE [V] Figure 16. Figure 17. Input Offset Voltage vs Common Mode Input Voltage Large Signal Voltage Gain vs Supply Voltage (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 11/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 160 120 B] L d dB] L 140 TIO [ 100 -40C N [ RA AI N 80 G O GE 120 5.5V CTI 25C 85C 105C A E T J 60 OL 4.0V 3.0V RE L V 100 DE A O 40 N M G SI N RGE 80 MMO 20 A O L C 60 0 -50 -25 0 25 50 75 100 125 2 3 4 5 6 AMBIENT TEMPERATURE [°C] SUPPLY VOLTAGE [V] Figure 18 Figure 19. Large Signal Voltage Gain vs Ambient Temperature Common Mode Rejection Ratio vs Supply Voltage 120 120 B] L dB] ATIO [d 100 3.0V RATIO [ 100 N R 80 ON 80 TIO 4.0V 5.5V CTI C E JE 60 EJ 60 E R E R LY OD 40 PP 40 M U ON R S M 20 E 20 M W O O C P 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 20. Figure 21. Common Mode Rejection Ratio vs Ambient Temperature Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 12/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 12.0 30.0 5.5V 10.0 25.0 5.5V s] s] V/μ 8.0 3.0V 4.0V V/μ 20.0 H [ L [ 4.0V L- H- E 6.0 E 15.0 AT AT R R EW 4.0 EW 10.0 3.0V L L S S 2.0 5.0 0.0 0.0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 22. Figure 23. Slew Rate L-H vs Ambient Temperature Slew Rate H-L vs Ambient Temperature 100 200 Phase 80 150 60 g] B] e N[d 100E [d GAI 40 Gain HAS P 50 20 0 0 1 .E1+ 0 0 1 .1E+001 1 1 .E1+0022 1 .E1+0033 1 .1E0+40 4 1 .1E+005 5 FREQUENCY [kHz] Figure 24. Voltage Gain・Phase vs Frequency （VDD=+3V,VSS=0V,T =25C） A (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 13/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 0.8 0.8 W] .0.6 W] . 0.6 N [ BU7486F N [ BU7486SF TIO BU7486FV TIO BU7486SFV A A SIP0.4 SIP 0.4 S S DI DI ER ER W W O0.2 O 0.2 P P BU7486FVM BU7486SFVM 0 0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 25. Figure 26. Derating curve Derating curve 5.0 5.0 4.5 4.5 105C 4.0 85C 4.0 5.5V mA] 3.5 mA] 3.5 4.0V T [ T [ N 3.0 N 3.0 E E R R R 2.5 R 2.5 U U 3.0V C C Y 2.0 Y 2.0 L 25C -40C L P P UP 1.5 UP 1.5 S 1.0 S 1.0 0.5 0.5 0.0 0.0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] SUPPLY VOLTAGE [V] Figure 27. Figure 28. Supply Current vs Supply Voltage Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 14/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 6 6 105C 5 5 5.5V V] 25C V] H [ 85C H [ 4.0V G 4 G 4 HI HI E E G -40C G A 3 A 3 T T L L O O 3.0V T V 2 T V 2 U U TP TP U U O 1 O 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 29. Figure 30. Maximum Output Voltage High vs Supply Voltage Maximum Output Voltage High vs Ambient Temperature (RL =10kΩ) (RL =10kΩ) 10 10 9 9 mV] 8 105C mV] 8 5.5V W [ 7 85C W [ 7 O O L 6 L 6 4.0V E E G G A 5 A 5 LT LT O 4 O 4 V V T T U 3 25C U 3 P P 3.0V T -40C T U 2 U 2 O O 1 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 31. Figure 32. Maximum Output Voltage Low vs Supply Voltage Maximum Output Voltage Low vs Ambient Temperature (RL =10kΩ) (RL =10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 15/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 40 40 A] A] m m T [ 30 T [30 N N E -40C E R R R R U 25C U E C 20 E C20 C C R R 4.0V 5.5V U U O O UT S 10 85C 105C UT S10 TP TP U U O O 3.0V 0 0 0 0.5 1 1.5 2 2.5 3 -50 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 33. Figure 34. Output Source Current vs Output Voltage Output Source Current vs Ambient Temperature (VDD=3V) (OUT=VDD-0.4V) 60 40 50 A] 25C -40C A] m m30 T [ T [ N 40 N E E 4.0V 5.5V R R UR UR C 30 C20 SINK 85C 105C SINK T 20 T PU PU10 UT UT 3.0V O 10 O 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 OUTPUT VO LTAGE [V] AMBIENT TEM PERATURE [°C] Figure 35. Figure 36. Output Sink Current vs Output Voltage Output Sink Current vs Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 16/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 10 10.0 8 7.5 V] V] m m E [ 5 E [ 5.0 G G TA 3 -40℃ 25℃ TA 2.5 4.0V 5.5V L L O O T V 0 T V 0.0 SE 85℃ 105℃ SE 3.0V OFF -3 OFF -2.5 T T PU -5 PU -5.0 N N I I -8 -7.5 -10 -10.0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 37. Figure 38. Input Offset Voltage vs Supply Voltage Input Offset Voltage vs Ambient Temperature 15 140 V] 10 dB] L 120 25℃- 40℃ E [m AIN [ 100 G 5 -40℃ 25℃ G A E T G L O A 80 V T FSET 0 105℃ 85℃ L VOL 60 105℃ 85℃ F A O -5 N UT SIG 40 NP GE I -10 R 20 A L -15 0 -1 0 1 2 3 2 3 4 5 6 INPUT VOLTAGE [V] SUPPLY VOLTAGE [V] Figure 39. Figure 40. Input Offset Voltage vs Common Mode Input Voltage Large Signal Voltage Gain vs Supply Voltage (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 17/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 120 120 B]. dB] . 110 O [d 110 AIN [ 3.0V RATI -40℃ E G 100 ON 100 25℃ G TI OLTA 90 5.5V EJEC 90 AL V 4.0V E R 85℃ 105℃ D GN 80 O 80 E SI ON M G M R 70 70 A M L O C 60 60 -50 -25 0 25 50 75 100 125 2 3 4 5 6 AMBIENT TEMPERATURE [°C] SUPPLY VOLTAGE [V] Figure 41. Figure 42. Large Signal Voltage Gain vs Ambient Temperature Common Mode Rejection Ratio vs Supply Voltage 120 120 B] . B] O [d 110 O [d 100 ATI ATI R 3.0V R ON 100 4.0V ON 80 CTI CTI E E EJ 90 EJ 60 E R 5.5V Y R D PL O 80 P 40 M U N S O R M 70 E 20 M W O O C P 60 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 43. Figure 44. Common Mode Rejection Ratio vs Ambient Temperature Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 18/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 15 25 12 20 5.5V μs] μs] H [V/ 9 5.5V L [V/ 15 4.0V L- H- E E T 3.0V T RA 6 4 .0V RA 10 3.0V W W E E L L S S 3 5 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 45. Figure 46. Slew Rate L-H vs Ambient Temperature Slew Rate H-L vs Ambient Temperature 100 200 Phase 80 150 60 g] B] e AIN[d 100ASE [d G 40 Gain H P 50 20 0 0 1.E1+00 1.E1+0011 1.E1+0022 1.1E0+303 1.1E+0044 1.E1+0055 FREQUENCY [kHz] Figure 47. Voltage Gain・Phase vs Frequency （VDD=+3V, VSS=0V, T =25C） A (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 19/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves ○BU7487xx, BU7487Sxx 800 800 W] . 600 W] . 600 m BU7487FV m BU7487SFV N [ N [ O O TI TI A A P 400 P 400 SI SI S S DI DI R R E E W BU7487F W O 200 O 200 BU7487SF P P 0 0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMP ERATURE [°C] A MBIENT TEMPERATURE [°C] Figure 48. Figure 49. Derating curve Derating curve 10 10 105C 9 9 85C 4.0V 8 8 mA] 7 A] . 7 5.5V NT [ 6 T [m 6 E N R E 3.0V UR 5 25C -40C RR 5 C U LY 4 Y C 4 P L P 3 P 3 U P S 2 SU 2 1 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 50. Figure 51. Supply Current vs Supply Voltage Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 20/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 6 6 105C 5 5 V] V] 5.5V H [ 25C H [ 4.0V G 4 G 4 HI 85C HI E E G G A 3 A 3 T -40C T L L O O 3.0V V V T 2 T 2 U U P P T T U U O O 1 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 52. Figure 53. Maximum Output Voltage High vs Supply Voltage Maximum Output Voltage High vs Ambient Temperature (R =10kΩ) (R =10kΩ) L L 10 10 9 9 mV] 8 105C mV] 8 OW [ 7 85C OW [ 7 5 .5V L 6 L 6 GE GE 4 .0V A 5 A 5 T T L L O 4 O 4 V V T T U 3 U 3 UTP 2 -40C 25C UTP 2 3.0V O O 1 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 54. Figure 55. Maximum Output Voltage Low vs Supply Voltage Maximum Output Voltage Low vs Ambient Temperature (RL =10kΩ) (RL =10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 21/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 40 40 A] A] . m m T [ 30 T [30 EN -40C EN R R UR 25C UR C C RCE 20 RCE 20 4.0V 5.5V OU OU S S UT 10 85C 105C UT 10 P P T T U U O O 3.0V 0 0 0 0.5 1 1.5 2 2.5 3 -50 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 56. Figure 57. Output Source Current vs Output Voltage Output Source Current vs Ambient Temperature (VDD=3V) (OUT=VDD-0.4V) 60 40 50 -40C mA] 25C mA]30 NT [ 40 ENT [ 4.0V E R R 5.5V R R U CU 30 C20 K K PUT SIN 20 85C 105C TPUT SIN10 3.0V T U OU 10 O 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 OUTPUT VO LTAGE [V] AMBIENT TEMP ERATURE [°C] Figure 58. Figure 59. Output Sink Current vs Output Voltage Output Sink Current vs Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 22/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 3 3 V] 2 V] . 2 m m E [ 25C -40C E [ G 1 G 1 TA 85C TA 4.0V 3.0V OL OL ET V 0 ET V 0 S S OFF-1 105C OFF -1 5.5V T T U U P P IN-2 IN -2 -3 -3 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 60. Figure 61. Input Offset Voltage vs Supply Voltage Input Offset Voltage vs Ambient Temperature 15 140 B] . 120 -40℃ mV] 10 N [d 25℃ E [ GAI 100 AG 5 E OLT 25℃ -40℃ TAG 80 V L 105℃ 85℃ T 0 O SE 85℃ L V 60 F 105℃ A F N O -5 G T SI 40 PU E N G I -10 AR 20 L -15 0 -1 0 1 2 3 2 3 4 5 6 INPUT VOLTAGE [V] SUPPLY V OLTAGE [V] Figure 62. Figure 63. Input Offset Voltage vs Common Mode Input Voltage Large Signal Voltage Gain vs Supply Voltage (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 23/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 120 120 dB] . 110 O [dB] L 110 N [ TI AGE GAI 100 3.0V TION RA 100 -40℃ 25℃ T C L 5.5V E O 90 J 90 V E AL 4.0V E R 105℃ 85℃ N D G 80 O 80 SI M E N G O R 70 M 70 A M L O C 60 60 -50 -25 0 25 50 75 100 125 2 3 4 5 6 AMBIENT TEMPERATURE [°C] SUPPLY VOLTAGE [V] Figure 64. Figure 65. Large Signal Voltage Gain vs Ambient Temperature Common Mode Rejection Ratio vs Supply Voltage 120 120 TIO [dB] L 110 ATIO [dB] 100 A R N R 100 ON 80 TIO 3.0V 4.0V CTI C E JE 90 EJ 60 E RE 5.5V LY R OD 80 PP 40 M U ON R S M 70 E 20 W M O O C P 60 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMP ERATURE [°C] Figure 66. Figure 67. Common Mode Rejection Ratio vs Ambient Temperature Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 24/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 16 25 14 20 12 s] s] μ 5.5V μ V/ V/ 5.5V H [ 10 L [ 15 L- H- TE 8 4.0V 3.0V TE A A 3.0V R R 10 4.0V W 6 W E E L L S S 4 5 2 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 68. Figure 69. Slew Rate L-H vs Ambient Temperature Slew Rate H-L vs Ambient Temperature 100 200 Phase 80 150 60 g] B] e N[d 100E [d AI AS G 40 Gain H P 50 20 0 0 1. E1+ 0 0 1 .E1+001 1 11.E0+20 2 11.E0+30 3 1 .1E0+40 4 1 .E1+0055 FREQUENCY [kHz] Figure 70. Voltage Gain・Phase vs Frequency （VDD=+3V, VSS=0V, T =25C） A (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 25/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Application Information NULL method condition for Test circuit1 VDD, VSS, E , V , V Unit:V, R Unit:ohms K ICM RL L Parameter VF SW1 SW2 SW3 VDD VSS EK VICM VRL RL Calculation Input Offset Voltage VF1 ON ON OFF 3 0 -1.5 1.6 - - 1 VF2 -0.5 Large Signal Voltage Gain ON ON ON 3 0 0.8 0 10k 2 VF3 -2.5 Common-mode Rejection Ratio VF4 0 ON ON OFF 3 0 -1.5 - - 3 (Input Common-mode Voltage Range) VF5 1.6 VF6 3 Power Supply Rejection Ratio ON ON OFF 0 -1.5 0 - - 4 VF7 5.5 －Calculation－ |V | 1. Input Offset Voltage (VIO) VIO = 1 + RF1/R [V] F S E × (1+R /R ) Av = 20Log K F S [dB] 2. Large Signal Voltage Gain (Av) |V - V | F3 F2 V × (1+R /R ) 3. Common-mode Rejection Ratio (CMRR) CMRR = 20Log ICM F S [dB] |V - V | F5 F4 VDD × (1+ R /R ) 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log F S [dB] |V - V | F7 F6 0.1μF R =50kΩ F SW1 VDD 500kΩ 0.01μF 15V RS=50Ω RI=1MΩ Vo EK 500kΩ 0.015μF 0.015μF DUT SW3 NULL RS=50Ω RI=1MΩ 1000pF VICM RL V VF 50kΩ SW2 V RL VSS -15V Figure 71. Test circuit 1 (one channel only) www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 26/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Switch Condition for Test circuit2 Parameter SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage R =10kΩ OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF L Output Current OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF Slew Rate OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON Unity Gain Frequency ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON SW3 SW4 R2 100kΩ ● VDD=3V － SW1 SW2 ＋ SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 R1 1kΩ VSS RL CL VIN- VIN+ Vo Figure 72. Test circuit 2 IN[V] OUT[V] SR= ∆V/∆t 1.6 V 1.6 V 1.6V ∆V P-P 0V 0V t t ∆t Input wave Output wave Figure 73. Slew rate input output wave R2=100kΩ R2=100kΩ VDD VDD R1=1kΩ R1=1kΩ OUT1 OUT2 VIN R1//R2 VSS R 1//R2 VSS 100×OUT1 CS=20Log OUT2 Figure 74. Test circuit 3 (Channel Separation) www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 27/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Application example ○Voltage follower VDD Voltage gain is 0dB. Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input OUT impedance and low output impedance. Computation for IN output voltage (OUT) is shown below. OUT=IN VSS Figure 75. Voltage follower ○Inverting amplifier R2 For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next VDD expression OUT=-(R2/R1)・IN R 1 This circuit has input impedance equal to R1. IN OUT VSS Figure 76. Inverting amplifier circuit ○Non-inverting amplifier R 1 R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase VDD with the input voltage (IN) and is shown in the next expression. OUT=(1 + R2/R1)・IN Effectively, this circuit has high input impedance since OUT its input side is the same as that of the operational amplifier. IN VSS Figure 77. Non-inverting amplifier circuit www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 28/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at T =25°C (normal temperature). As the IC A consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θ °C/W, indicates this heat dissipation JA capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 78 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θ ), given the ambient temperature (T ), maximum junction temperature (T ), and power dissipation JA A Jmax (P ). D θ = (T -T ) / P °C/W JA Jmax A D The Derating curve in Figure 78 (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θ ), which depends on the chip size, power consumption, package, ambient temperature, package condition, JA wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 79. (a) to (f) shows an example of the derating curve for BU7485G, BU7485SG, BU7486xxx, BU7486Sxxx, BU7487xx, BU7487Sxx. Power dissipation of LSI [W] PDmax θ =(T -T )/ P °C/W JA Jmax A D C P2 Ambient temperature TA [ °C ] on of I θJA2 < θJA1 dissipati P1 θJA2 wer TJmax Po θJA1 Chip surface temperature T [ °C ] 0 25 50 75 100 125 J Ambient temperature TA[C] (a) Thermal Resistance (b) Derating Curve Figure 78. Thermal resistance and Derating Curve 0.8 0.8 W] . W] . N [ 0.6 BU7485G (Note 19) N [ 0.6 O O BU7485SG (Note 19) TI TI A A P P SSI 0.4 SSI 0.4 DI DI R R E E W W PO 0.2 PO 0.2 0 85 0 105 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMPERATURE [℃] AMBIENT TEMPERATURE [℃] (a) BU7485G (b) BU7485SG Figure 79. Derating Curve www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 29/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Power Dissipation - continued 0.8 0.8 W] . W] N [ 0.6 BU7486F (Note 20) N [ 0.6 BU7486SF (Note 20) O O ATI BU7486FV (Note 21) ATI BU7486SFV (Note 21) SIP 0.4 SIP 0.4 S S DI DI R R WE BU7486FVM (Note 22) WE BU7486SFVM (Note 22) O 0.2 O 0.2 P P 0 0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMPERATURE [℃] AMBIENT TEMPERATURE [℃] (c) BU7486F/FV/FVM (d) BU7486SF/SFV/SFVM 0.8 0.8 W] . BU7487FV (Note 23) W] . BU7487SFV (Note 23) N [ 0.6 N [ 0.6 O O TI TI A A P P SI 0.4 SI 0.4 S S DI DI R R E E W BU7487F (Note 24) W BU7487SF (Note 24) O 0.2 O 0.2 P P 0 0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMPERATURE [℃] AMBIENT TEMPERATURE [℃] (e) BU7487F/FV (f) BU7487SF/SFV (Note19) (Note20) (Not21) (Note22) (Note23) (Note24) Unit 5.4 5.5 5.0 4.7 7.0 4.5 mW/C When using the unit above TA=25C, subtract the value above per degree C. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted. Figure 79. Derating Curve www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the P stated in this specification is when D the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the P rating. D 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 31/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Operational Notes – continued 13. Unused Circuits When there are unused op-amps, it is recommended that they are connected as in Figure 80, setting the non-inverting input terminal to a potential within the input common mode voltage range (V ). ICM VDD Keep this potential in V ICM V ICM VSS Figure 80. Example of Application Circuit for Unused Op-amp 14. Input Voltage Applying (VSS－0.3) to (VDD+0.3) to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 15. Power Supply(single/dual) The op-amp operates when the voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can be used as dual supply op-amp as well. 16. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1uF between output pin and VSS pin. 17. Oscillation by Output Capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 18. Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. 18. Crossover Distortion Inverting amplifier generates crossover distortion when feedback resistance value is small. To suppress the crossover distortion, connect a resistor between the output terminal and VSS. Feedback Resistor VDD Pull-down Resistor VSS Figure 81. To Suppress the Crosover Distortion www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 32/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information Package Name SSOP5 www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 33/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 34/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SSOP-B8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 35/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name MSOP8 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs TR Direction of feed (The direction is the 1pin of product is at the upper right when you hold ) reel on the left hand and you pull out the tape on the right hand 1pin Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 36/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 37/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SSOP-B14 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 38/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Marking Diagram SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number SSOP-B8(TOP VIEW) MSOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SOP14(TOP VIEW) SSOP-B14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Product Name Package Type Marking BU7485 D5 G SSOP5 BU7485S FC F SOP8 BU7486 FV SSOP-B8 7486 FVM MSOP8 F SOP8 7486S BU7486S FV SSOP-B8 486S FVM MSOP8 7486S F SOP14 BU7487F BU7487 FV SSOP-B14 7487 F SOP14 BU7487SF BU7487S FV SSOP-B14 7487S www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 39/40 21.Oct.2016 Rev.003 TSZ22111･15･001

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Revision History Date Revision Changes 12.Jul.2013 001 New Release 06.Mar.2015 002 Correction of Figure number (page.29 Power Dissipation) P.1…Add (Typ) for Slew Rate, Corrected BU7485S→BU7485SG P.3…Corrected Power dissipation of SOP14, SSOP-B14 P.5…Corrected (Note14) BU7485G→BU7486xxx, BU7485SG→BU7486Sxxx P.6…Corrected (Note17) BU7485G→BU7487xx, BU7485SG→BU7487Sxx P.7…Corrected Input offset fluctuation→Input offset voltage fluctuation P.12…Corrected explanatory notes at Figure 18 P.16…Corrected the scale at Figure 33, 35 P.18…Corrected explanatory notes at Figure 41 21.Oct.2016 003 P.20…Corrected explanatory notes at Figure 48, 49 P.22…Corrected the scale at Figure 56, 58 P.26…Corrected S1～S3→SW1～SW3, and E , V value, Add V , R K ICM RL L P.27…Corrected SW No.→Parameter, Figure 73 1.8V→1.6V P.29, 30…Corrected Figure 79 (c)～(h)→(a)～(f), explanatory notes at (e), (f) P.31…Corrected Operational Notes 2, Add “Unused Input Pins” P.32…Add “Unused Circuits”, Corrected each Numbering P.39…Corrected SSOP5 Marking Diagram P.40…Delete Land pattern data www.rohm.com TSZ02201-0GMG0G200380-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 40/40 21.Oct.2016 Rev.003 TSZ22111･15･001

Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.

Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: R OHM Semiconductor: BU7485SG-TR BU7485G-TR BU7487F-E2 BU7486F-E2 BU7487SFV-E2 BU7486FV-E2 BU7487SF-E2 BU7487FV-E2 BU7486FVM-TR BU7486SFVM-TR BU7486SFV-E2 BU7486SF-E2