Datasheet Operational Amplifiers Series Input/Output Full Swing High Slew Rate Low Voltage CMOS Operational Amplifiers BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●General Description ●Key Specifications BU7291G/BU7294xx and BU7291SG/BU7294Sxx  Low Operating Supply Voltage (single supply): are low supply voltage CMOS operational single/quad +2.4V to +5.5V Amplifiers. This series is a Input/Output full swing, high  High Slew Rate: 3.0V/µs slew rate, low supply current and high speed operation.  Wide Temperature Range: Input bias current is very low at 1pA (Typ) . BU7291G/BU7294xx -40C to +85C Especially,BU7291SG and BU7294Sxx, it has wide BU7291SG/BU7294Sxx -40C to +105C temperature range from -40C to +105C.  Low Input Offset Current: 1pA (Typ) ●Features  Low Input Bias Current: 1pA (Typ)  High slew rate  Input/Output full swing ●Package W(Typ) x D(Typ) x H(Max)  Large DC voltage gain SSOP5 2.90mm x 2.80mm x 1.25mm  Low input bias current SOP14 8.70mm x 6.20mm x 1.71mm SSOP-B14 5.00mm x 6.40mm x 1.35mm ●Application  Battery equipment  Consumer electronics ●Simplified schematic VDD Vbias +IN Class OUT AB control -IN Vbias VSS Figure 1. Simplified schematic (1 channel only) ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 1/27 22.May.2013 Rev.001 TSZ22111･14･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Pin Configuration BU7291G, BU7291SG : SSOP5 Pin No. Pin Name +IN 1 5 VDD 1 +IN + 2 VSS VSS 2 3 -IN -IN 3 4 OUT 4 OUT 5 VDD BU7294F, BU7294SF : SOP14 BU7294FV, BU7294SFV : SSOP-B14 OUT1 1 14OUT4 Pin No. Pin Name -IN1 2 CH1 CH4 13 -IN4 1 OUT1 - + + - +IN1 3 12 +IN4 2 -IN1 VDD 4 11 VSS 3 +IN1 4 VDD +IN2 5 10 +IN3 - + + - 5 +IN2 -IN2 6 CH2 CH3 9 -IN3 6 -IN2 OUT2 7 8 OUT3 7 OUT2 8 OUT3 9 -IN3 10 +IN3 11 VSS 12 +IN4 13 -IN4 14 OUT4 Package SSOP5 SOP14 SSOP-B14 BU7291G BU7294F BU7294FV BU7291SG BU7294SF BU7294SFV ●Ordering Information B U 7 2 9 x x x x - x x Part Number Package Packaging and forming specification BU7291G G:SSOP5 E2: Embossed tape and reel BU7291SG F:SOP14 (SOP14/ SSOP-B14) BU7294xx FV:SSOP-B14 TR: Embossed tape and reel BU7294Sxx (SSOP5) www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 2/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Line-up Topr Package Operable Part Number -40C to +85C SSOP5 Reel of 3000 BU7291G-TR -40C to +105C SSOP5 Reel of 3000 BU7291SG-TR -40C to +85C SOP14 Reel of 2500 BU7294F-E2 -40C to +105C SOP14 Reel of 2500 BU7294SF-E2 -40C to +85C SSOP-B14 Reel of 2500 BU7294FV-E2 -40C to +105C SSOP-B14 Reel of 2500 BU7294SFV-E2 ●Absolute Maximum Ratings(Ta=25C) Ratings Parameter Symbol BU7291 BU7291S Unit BU7294 BU7294S Supply Voltage VDD-VSS +7 V SSOP5 0.54*1*4 Power dissipation Pd SOP14 0.45*2*4 W SSOP-B14 0.70*3*4 Differential Input Voltage*5 Vid VDD - VSS V Input Common-mode Vicm (VSS - 0.3) to VDD + 0.3 V Voltage Range Input Current *6 Ii ±10 mA Operating Supply Voltage Vopr +2.4 to +5.5 V Operating Temperature Topr - 40 to +85 - 40 to +105 C Storage Temperature Tstg - 55 to +125 C Maximum Tjmax +125 C Junction Temperature Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 To use at temperature above Ta＝25C reduce 5.4mW. *2 To use at temperature above Ta＝25C reduce 4.5mW. *3 To use at temperature above Ta＝25C reduce 7.0mW. *4 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). *5 The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. *6 An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 3/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Electrical Characteristics ○BU7291, BU7291S (Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C) Temperature Limits Parameter Symbol Unit Condition Range Min. Typ. Max. Input Offset Voltage *7 Vio 25C - 1 9 mV - Input Offset Current*7 Iio 25C - 1 - pA - Input Bias Current *7 Ib 25C - 1 - pA - Supply Current*8 IDD 25C - 470 800 μA RL=∞ Full range - - 1100 Av=0dB, +IN=1.5V Maximum Output Voltage(High) VOH 25C VDD-0.1 - - V RL=10kΩ Maximum Output Voltage(Low) VOL 25C - - VSS+0.1 V RL=10kΩ Large Signal Voltage Gain Av 25C 70 105 - dB RL=10kΩ Input Common-mode Vicm 25C 0 - 3 V VSS to VDD Voltage Range Common-mode Rejection Ratio CMRR 25C 40 60 - dB - Power Supply Rejection Ratio PSRR 25C 45 80 - dB - Output Source Current *9 Isource 25C 5 8 - mA VDD-0.4V Output Sink Current *9 Isink 25C 9 16 - mA VSS+0.4V Slew Rate SR 25C - 3.0 - V/μs CL=25pF Gain Band Width GBW 25C - 2.8 - MHz CL=25pF, f=100kHz Unity Gain Frequency f 25C - 2.8 - MHz CL=25pF T Phase Margin θ 25C - 50 - deg CL=25pF Total Harmonic Distortion THD+N 25C - 0.03 - % OUT=0.8V , f=1kHz +Noise P-P *7 Absolute value *8 Full range BU7291: Ta=-40C to +85C BU7291S: Ta=-40C to +105C *9 Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 4/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ○BU7294, BU7294S (Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C) Temperature Limits Parameter Symbol Unit Condition Range Min. Typ. Max. Input Offset Voltage *10 Vio 25C - 1 9 mV - Input Offset Current*10 Iio 25C - 1 - pA - Input Bias Current *10 Ib 25C - 1 - pA - Supply Current*11 IDD 25C - 2000 3200 μA RL=∞, All Op-Amps Full range - - 4400 Av=0dB, +IN=1.5V Maximum Output Voltage(High) VOH 25C VDD-0.1 - - V RL=10kΩ Maximum Output Voltage(Low) VOL 25C - - VSS+0.1 V RL=10kΩ Large Signal Voltage Gain Av 25C 70 105 - dB RL=10kΩ Input Common-mode Vicm 25C 0 - 3 V VSS to VDD Voltage Range Common-mode Rejection Ratio CMRR 25C 40 60 - dB - Power Supply Rejection Ratio PSRR 25C 45 80 - dB - Output Source Current *12 Isource 25C 5 8 - mA VDD-0.4V Output Sink Current *12 Isink 25C 9 16 - mA VSS+0.4V Slew Rate SR 25C - 3.0 - V/μs CL=25pF Gain Band Width GBW 25C - 2.8 - MHz CL=25pF, f=100kHz Unity Gain Frequency f 25C - 2.8 - MHz CL=25pF T Phase Margin θ 25C - 50 - deg CL=25pF Total Harmonic Distortion THD+N 25C - 0.03 - % OUT=0.8V , f=1kHz +Noise P-P Channel Separation CS 25C - 100 - dB f=1kHz, OUT=0.5Vrms *10 Absolute value *11 Full range BU7294: Ta=-40C to +85C BU7294S: Ta=-40C to +105C *12 Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 5/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. 1.2 Differential Input Voltage (Vid) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. 1.3 Input Common-mode Voltage Range (Vicm) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25C (normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics 2.1 Input Offset Voltage (Vio) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. 2.2 Input Offset Current (Iio) Indicates the difference of input bias current between the non-inverting and inverting terminals. 2.3 Input Bias Current (Ib) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. 2.4 Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. 2.5 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. 2.6 Large Signal Voltage Gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) 2.7 Input Common-mode Voltage Range (Vicm) Indicates the input voltage range where IC normally operates. 2.8 Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) 2.9 Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) 2.10 Output Source Current/ Output Sink Current (Isource / Isink) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. 2.11 Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. 2.12 Gain Band Width (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. 2.13 Unity Gain Frequency (f ) T Indicates a frequency where the voltage gain of operational amplifier is 1. 2.14 Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. 2.16 Total Harmonic Distortion+Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.12 Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 6/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves ○BU7291, BU7291S 800.80 800.80 W] . 600.60 W] . 600.60 N [ N [ O BU7291G O TI TI BU7291SG PA PA SI 400.40 SI 400.40 S S DI DI R R E E W W O 200.20 O 200.20 P P 0 0 85 105 0 25 50 75 100 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 2. Figure 3. Derating curve Derating curve 1200 1200 1000 1000 NT [μA] 800 T [μA] 800 E 105C N 5.5V R 85C E R R 600 R 600 U U C C LY Y 3.0V PP 400 PL 400 U -40C P 2.4V S 25C SU 200 200 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 4. Figure 5. Supply Current – Supply Voltage Supply Current – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 7/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7291, BU7291S 6 6 105C 5 5 V] V] 5.5V H [ 85C H [ HIG 4 HIG 4 GE 25C GE 3.0V A 3 A 3 T T OL -40C OL V V 2.4V T 2 T 2 U U P P T T U U O 1 O 1 0 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMP ERATURE [°C] Figure 6. Figure 7. Maximum Output Voltage High – Supply Voltage Maximum Output Voltage High – Ambient (RL=10kΩ) Temperature (RL=10kΩ) 10 10 V] 8 V] 8 m m W [ W [ O O GE L 6 GE L 6 TA -40C 85C 105C TA 5.5V OL 4 25C OL 4 V V T T U U P P UT 2 UT 2 O O 2.4V 3.0V 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 8. Figure 9. Maximum Output Voltage Low - Maximum Output Voltage Low – Supply Voltage Ambient Temperature (RL=10kΩ) (RL=10kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 8/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7291, BU7291S 50 20 A] A] 5.5V m m NT [40 NT [15 E -40C E R R UR30 25C UR 3.0V E C E C10 C C UR20 UR 2.4V UT SO 105C 85C UT SO 5 UTP10 UTP O O 0 0 0 0.5 1 1.5 2 2.5 3 -50 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 10. Figure 11. Output Source Current – Output Voltage Output Source Current – Ambient Temperature (VDD=3V) (OUT=VDD-0.4V) 80 80 -40C A] A] m m T [ 60 T [60 N 25C N E E RR RR 5.5V CU 40 CU40 K K N N SI SI 3.0V T 85C 105C T U U P 20 P20 T T U U O O 2.4V 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 12. Figure 13. Output Sink Current – Output Voltage Output Sink Current – Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 9/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7291, BU7291S 5 5 4 4 V] 3 -40C 25C mV] 3 E [m 2 GE [ 2 LTAG 1 OLTA 1 5.5V T VO 0 105C 85C ET V 0 SE -1 FS -1 3.0V F F 2.4V F O UT O -2 UT -2 P -3 NP -3 N I I -4 -4 -5 -5 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 14. Figure 15. Input Offset Voltage – Supply Voltage Input Offset Voltage – Ambient Temperature (Vicm=VDD, OUT=1.5V) (Vicm=VDD, OUT=1.5V) 15 160 B] . mV]10 N [d 140 AGE [ 5 85C -40C 105C E GAI 85C 105C T G OL TA 120 V L T 0 O E 25C V S L 100 25C -40C F A OF -5 GN T SI PU E 80 N-10 G I R A L -15 60 -1 0 1 2 3 4 2 3 4 5 6 COMMON MODE INPUT VOLTAGE [V] SUPPLY VOLTAGE [V] Figure 16. Figure 17. Input Offset Voltage – Large Signal Voltage Gain – Supply Voltage Common Mode Input Voltage (VDD=3V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 10/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7291, BU7291S 160 B] B] 120 N [dB] .140 ATIO [dATIO [d 100 GAI 5.5V N RN R 85C 105C E OO 80 AG120 CTICTI T EE OL EJEJ 60 V RR L 100 2.4V 3.0V E E -40C 25C A DD N OO 40 G MM E SI 80 ON ON G MM 20 R A MM L OO CC 60 0 -50 -25 0 25 50 75 100 125 2 3 4 5 6 AMBIENT TEMPERATURE [°C] SUPPLY VOLTAGE [V] Figure 18. Figure 19. Common Mode Rejection Ratio – Supply Voltage Large Signal Voltage Gain – Ambient Temperature ATIO [dB] .110200 RATIO [dB]112400 R CTION 80 5.5V CTION 10800 E JE 60 EJ E E R 2 .4V 3.0V Y R 60 D 40 PL MO UP 40 N S MO 20 ER 20 M W O O C 0 P 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 20. Figure 21. Common Mode Rejection Ratio – Ambient Temperature Power Supply Rejection Ratio – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 11/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7291, BU7291S 5 5 5.5V 4 4 s] 5.5V s] μ μ V/ V/ H [ 3 L [ 3 3.0V L- H- E E 2.4V T T W RA 2 2 .4V 3.0V W RA 2 E E L L S S 1 1 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 22. Figure 23. Slew Rate L-H – Ambient Temperature Slew Rate H-L – Ambient Temperature 100 200 Phase 80 150 B] 60 eg] GAIN[d 40 Gain 100HASE [d P 50 20 0 0 11.E+0011 11.E0+022 11.E+0033 11.0E+044 11.E0+055 11.E+0066 11.E0+077 FREQUENCY [Hz] Figure 24. Voltage Gain・Phase－Frequency (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 12/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7294, BU7294S 800.08 800.80 BU7294F W] 600.06 W] 600.60 N [ BU7294FV N [ BU7294SF O O TI TI A A P P SSI 400.04 SSI 400.40 BU7294SFV DI DI R R E E W W O O P 200.02 P 200.20 0 0 105 85 0 25 50 75 100 125 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 25. Figure 26. Derating curve Derating curve 5000 5000 4000 4000 A] A] u u T [ 105C T [ N 3000 N 3000 E 85C E R R 5.5V R R U U C C Y 2000 Y 2000 L L P P 3.0V P P U U S 1000 25C -40C S 1000 2.4V 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 27. Figure 28. Supply Current – Supply Voltage Supply Current – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294G: -40C to +85C BU7294SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 13/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7294, BU7294S 6 6 105C 5 5 H [V] 25C H [V] 5.5V G G HI 4 HI 4 GE 85C GE 3.0V TA 3 TA 3 L L O -40C O V V T 2 T 2 U U P P 2.4V T T OU 1 OU 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOLTAGE [V] AMBIENT TEMP ERATURE [°C] Figure 29. Figure 30. Maximum Output Voltage High – Maximum Output Voltage High – Supply Voltage Ambient Temperature (RL=10kΩ) (RL=10kΩ) 10 10 9 9 V] 8 V] 8 m m W [ 7 W [ 7 O O AGE L 56 85C 105C AGE L 56 5.5V T T L L O 4 O 4 UT V 3 UT V 3 OUTP 2 -40C 25C OUTP 2 3 .0V 1 2.4V 1 0 0 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VOL T A G E [V ] AMBIENT TEMPERATURE [°C] Figure 31. Figure 32. Maximum Output Voltage Low – Maximum Output Voltage Low – Supply Voltage Ambient Temperature (RL=10kΩ) (RL=10kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294G: -40C to +85C BU7294SG: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 14/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7294, BU7294S 50 50 A] A] m40 m40 NT [ -40C NT [ E E RR30 25C RR30 U U E C E C C C R20 R20 OU OU 5.5V T S 85C T S 3.0V U 105C U TP10 TP10 OU OU 2.4V 0 0 0 0.5 1 1.5 2 2.5 3 -50 -25 0 25 50 75 100 125 OUTPUT V OLTAGE [V] AMBIENT TEMP ERATURE [°C] Figure 33. Figure 34. Output Source Current – Output Voltage Output Source Current –Ambient Temperature (VDD=3V) (OUT=VDD-0.4V) 80 80 A] -40C A] m m T [ 60 T [60 N N RE 25C RE R R U U C 40 C40 K K 5.5V T SIN 85C 105C T SIN 3.0V U U P 20 P20 T T U U O O 2.4V 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 35. Figure 36. Output Sink Current – Output Voltage Output Sink Current – Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 15/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7294, BU7294S 5 5 4 4 V] V] m 3 m 3 E [ E [ G 2 G 2 A A LT 1 LT 1 O O T V 0 T V 0 FSE -1 85C 105C FSE -1 F F O O PUT --32 -40C 25C PUT --32 2.4V 3.0V 5.5V N N I I -4 -4 -5 -5 2 3 4 5 6 -50 -25 0 25 50 75 100 125 SUPPLY VO LTAGE [V] AMBIENT TEMP ERATURE [°C] Figure 37. Figure 38. Input Offset Voltage – Supply Voltage Input Offset Voltage – Ambient Temperature 15 160 AGE [mV]150 -40C 25C 85C 105C GE GAIN [dB]E GAIN [dB] 140 T AG120 105C OL LTTA V OL FFSET 0 NAL VNAL VO100 PUT O -5 GE SIGE SIG 80 -40C 25C 85C N-10 RG I LAAR L -15 60 -1 0 1 2 3 4 2 3 4 5 6 COMMON MODE INPUT VOLTAGE [V] SUPPLY VOLTAGE [V] Figure 40. Figure 39. Large Signal Voltage Gain – Supply Voltage Input Offset Voltage – Common Mode Input Voltage (VDD=3V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 16/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7294, BU7294S 160 B] B] 120 GAIN [dB]AIN [dB] 112400 RATIO [dRATIO [d 100 105C GNAL VOLTAGE GNAL VOLTAGE G 1068000 2 .4V 3.0V 5.5V ODE REJECTION ODE REJECTION 468000 85-4C0 C 25C GE SIE SI 40 N MON M RG OM 20 LALAR 200 COMMCOM 0 -50 -25 0 25 50 75 100 125 2 3 4 5 6 AMBIENT TEMPERATURE [°C] SUPPLY VOLTAGE [V] Figure 41. Figure 42. Large Signal Voltage Gain – Ambient Temperature Common Mode Rejection Ratio – Supply Voltage 120 140 B] B] dB] O [d O [d120 O [ATI100 ATI RATIN R 5.5V N R100 ON TIO 80 TIO TIEC EC 80 REJECDE REJ 60 2 .4V 3.0V LY REJ 60 E O 40 P MODN M SUP 40 ON MMO 20 WER 20 MMCO PO O 0 0 C -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 44. Figure 43. Power Supply Rejection Ratio – Ambient Temperature Common Mode Rejection Ratio – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 17/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Typical Performance Curves - Continued ○BU7294, BU7294S 5 5 5.5V 4 4 s] 5.5V s] μ μ V/ V/ H [ 3 L [ 3 3.0V TE L- TE H- 2 .4V W RA 2 2 .4V 3.0V W RA 2 E E L L S S 1 1 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 45. Figure 46. Slew Rate L-H – Ambient Temperature Slew Rate H-L – Ambient Temperature 100 200 Phase 80 150 N[dB] 60 100E [deg] AI AS G 40 H Gain P 50 20 0 0 1001 1002 1103 11004 110005 1 010006 1 0100070 FREQUENCY [Hz] Figure 47. Voltage Gain・Phase－Frequency (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 18/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Application Information NULL method condition for Test circuit1 VDD, VSS, EK, Vicm Unit:V Parameter VF S1 S2 S3 VDD VSS EK Vicm Calculation Input Offset Voltage VF1 ON ON OFF 3 0 -1.5 3 1 VF2 -0.5 Large Signal Voltage Gain ON ON ON 3 0 1.5 2 VF3 -2.5 VF4 0 Common-mode Rejection Ratio ON ON OFF 3 0 -1.5 3 (Input Common-mode Voltage Range) VF5 3 VF6 2.4 Power Supply Rejection Ratio ON ON OFF 0 -1.2 0 4 VF7 5.5 － Calculation－ |VF1| 1. Input Offset Voltage (Vio) Vio= [V] 1+RF/RS 2 × (1+RF/RS) 2. Large Signal Voltage Gain(Av) Av=20Log [dB] |VF2-VF3| 3. Common-mode Rejection Ratio (CMRR) 1.8 × (1+RF/RS) CMRR=20Log [dB] |VF4 - VF5| 4. Power Supply Rejection Ratio (PSRR) 3.8 × (1+ RF/RS) PSRR=20Log [dB] |VF6 - VF7| 0.1µF RF=50kΩ 0.01µF SW1 VDD 500kΩ EK 15V RS=50Ω Ri=10kΩ Vo 500kΩ 0.015µF 0.015µF DUT NULL SW3 RS=50Ω Ri=10kΩ 1000pF RL Vicm VF SW2 50kΩ VSS VRL -15V Figure 48. Test circuit 1 (one channel only) www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 19/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet Switch Condition for Test circuit2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF Slew Rate OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON Unity Gain Frequency ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON Input voltage SW3 VH SW4 R2 100kΩ ● ● VDD=3V VL － t Input wave SW1 SW2 Output voltage ＋ SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 90% SR=ΔV/Δt R1 VH 1kΩ VSS ΔV RL CL 10% VIN- VIN+ Vo VVLL Δt t Output wave Figure 49. Test circuit 2 Figure 50. Slew rate input output wave R2=100kΩ R2=100kΩ VDD VDD R1=1kΩ R1=1kΩ OTHER CH OUT1 OUT2 VIN R1//R2 VSS =0 .5Vrms R1//R2 VSS 100×OUT1 CS=20Log OUT2 Figure 51. Test circuit 3 (Channel Separation) www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 20/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Application example ○Voltage follower Voltage gain is 0dB. VDD Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT OUT=IN IN VSS Figure 52. Voltage follower ○Inverting amplifier For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. Figure 53. Inverting amplifier circuit ○Non-inverting amplifier For non-inverting amplifier, input voltage (IN) is R1 R2 amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase VDD with the input voltage (IN) and is shown in the next expression. OUT=(1 + R2/R1)・IN Effectively, this circuit has high input impedance since its input side is the same as that of the operational OUT amplifier. IN VSS Figure 54. Non-inverting amplifier circuit www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 21/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at Ta=25C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θjaC/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 55. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power dissipation (Pd). θja = (Tjmax－Ta) / Pd C/W ・・・・・ (Ⅰ) The Derating curve in Figure 55. (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 56. (c) to (d) shows an example of the derating curve for BU7291, BU7291S, BU7294, BU7294S. Power dissipation of LSI [W] Pd(max) θja=(Tjmax-Ta)/Pd C/W P2 θja2 <θja1 Ambient temperatureTa[C ] of IC n o pati P1 θja2 dissi Tj(max) er θja1 w Po Chip surface temperature Tj[C ] 0 25 50 75 100 125 Ambient temperature Ta[C] (a) Thermal resistance (b) Derating curve Figure 55. Thermal resistance and Derating Curve 110.00 0 110.00 0 W] . 08.80 0 BU7294FV (*13) W] . 08.80 0 BU7294SFV (*13) N [ N [ TIO 06.60 0 TIO 06.60 0 A A P P SI SI BU7294SF (*15) S BU7294F (*15) S DI 04.40 0 DI 04.40 0 R R E E W W O O P 02.20 0 BU7291G (*14) P 02.20 0 BU7291SG (*14) 0 0 85 105 0 25 50 75 100 0 25 50 75 100 125 AMBIENT TEMPERAT URE [℃] AMBIENT TEMPERATURE [℃] (*13) (*14) (*15) Unit 7.0 5.4 4.5 mW/C When using the unit above Ta=25C, subtract the value above per degree C. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted Figure 56. Derating Curve www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 22/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Operational Notes 1) Absolute maximum ratings Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely charged to the terminal. However, it does not guarantee the circuit operation. 2) Applied voltage to the input terminal For normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage VDD + 0.3V. Then, regardless of power supply voltage,VSS - 0.3V can be applied to input terminals without deterioration or destruction of its characteristics. 3) Power supply (single / dual) The op-amp operates when the voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can be used as dual supply op-amp as well. 4) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 5) Short-circuit between pins and erroneous mounting Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Short-circuit between pins and erroneous mounting Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) IC handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. 8) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. 9) Output capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1μF between output pin and VSS pin. 10) Oscillation by output capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 11) Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 23/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Physical Dimensions Tape and Reel Information Package Name SSOP5 www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 24/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 25/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet Package Name SSOP-B14 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 26/27 22.May.2013 Rev.001 TSZ22111･15･001

BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Marking Diagram SSOP5(TOP VIEW) SOP14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK SSOP-B14(TOP VIEW) Part Number Marking Product Name Package Type Marking LOT Number BU7291 D1 G SSOP5 BU7291S FB F SOP14 BU7294F BU7294 FV SSOP-B14 7294 F SOP14 BU7294SF BU7294S FV SSOP-B14 7294S 1PIN MARK ●Land pattern data all dimensions in mm Land pitch Land space Land length Land width PKG e MIE ≧ℓ 2 b2 SSOP5 0.95 2.4 1.0 0.6 SOP14 1.27 4.60 1.10 0.76 SSOP-B14 0.65 4.60 1.20 0.35 SSOP5 SOP14, SSOP-B14 e e MIE e MIE ℓ2 b2 b 2 ℓ 2 ●Revision History Date Revision Changes 22.May.2013 001 New Release www.rohm.com TSZ02201-0RAR1G200390-1-2 ©2013 ROHM Co., Ltd. All rights reserved. 27/27 22.May.2013 Rev.001 TSZ22111･15･001

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: R OHM Semiconductor: BU7291G-TR BU7291SG-TR BU7294FV-E2 BU7294SF-E2 BU7294SFV-E2 BU7294F-E2