Hall IC Series Omnipolar Detection Hall ICs (Polarity detection for both S and N features dual outputs) BU52004GUL, BU52014HFV No.10045EDT01 ●Description The BU52004GUL and BU52014HFV are bipolar Hall ICs incorporating a polarity determination circuit that enables operation (output) on both the S- and N-poles, with the polarity judgment based on the output processing configuration. These Hall IC products can be in with movie, mobile phone and other applications involving crystal panels to detect the (front-back) location or determine the rotational direction of the panel. ●Features 1) Omnipolar detection (polarity detection for both S and N features dual outputs) 2) Micropower operation (small current using intermittent operation method) 3) Ultra-compact CSP4 package(BU52004GUL) 4) Small outline package (BU52014HFV) 5) Line up of supply voltage For 1.8V Power supply voltage (BU52014HFV) For 3.0V Power supply voltage (BU52004GUL) 6) Polarity judgment and output on both poles (OUT1: S-pole output; OUT2: N-pole output) 7) High ESD resistance 8kV(HBM) ●Applications Mobile phones, notebook computers, digital video camera, digital still camera, etc. ●Product Lineup Supply Supply current Operate point Hysteresis Period Product name voltage (AVG. ) Output type Package (mT) (mT) (ms) (V) (μA) BU52004GUL 2.40～3.30 +/-3.7 ※ 0.8 50 8.0 CMOS VCSP50L1 BU52014HFV 1.65～3.30 +/-3.0 ※ 0.9 50 5.0 CMOS HVSOF5 ※Plus is expressed on the S-pole; minus on the N-pole ●Absolute Maximum Ratings BU52004GUL (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ~ +4.5※1 V Output Current IOUT ±1 mA Power Dissipation Pd 420※2 mW Operating Temperature Range Topr -40 ~ +85 ℃ Storage Temperature Range Tstg -40 ~ +125 ℃ ※1. Not to exceed Pd ※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) BU52014 HFV (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ~ +4.5※3 V Output Current IOUT ±0.5 mA Power Dissipation Pd 536※4 mW Operating Temperature Range Topr -40 ~ +85 ℃ Storage Temperature Range Tstg -40 ~ +125 ℃ ※3. Not to exceed Pd ※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70mm×1.6mm Glass-epoxy PCB) www.rohm.com 1/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Magnetic, Electrical Characteristics BU52004GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) LIMIT PARAMETERS SYMBOL UNIT CONDITIONS MIN TYP MAX Power Supply Voltage V 2.4 3.0 3.3 V DD OUTPUT：OUT1 B - 3.7 5.5 opS (respond the south pole) Operate Point mT OUTPUT：OUT2 B -5.5 -3.7 - opN (respond the north pole) OUTPUT：OUT1 B 0.8 2.9 - rpS (respond the south pole) Release Point mT OUTPUT：OUT2 B - -2.9 -0.8 rpN (respond the north pole) B - 0.8 - hysS Hysteresis mT B - 0.8 - hysN Period T - 50 100 ms p V B <B<B ※5 Output High Voltage V DD - - V rpN rpS OH -0.4 I =-1.0mA OUT B<B , B <B ※5 Output Low Voltage V - - 0.4 V opN opS OL I =+1.0mA OUT Supply Current I - 8 12 μA Average DD(AVG) Supply Current During Startup Time I - 4.7 - mA During Startup Time Value DD(EN) Supply Current During Standby Time I - 3.8 - μA During Standby Time Value DD(DIS) ※5. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (T) to become definite output. P Radiation hardiness is not designed. BU52014HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) LIMIT PARAMETERS SYMBOL UNIT CONDITIONS MIN TYP MAX Power Supply Voltage V 1.65 1.80 3.30 V DD OUTPUT：OUT1 B - 3.0 5.0 opS (respond the south pole) Operate Point mT OUTPUT：OUT2 B -5.0 -3.0 - opN (respond the north pole) OUTPUT：OUT1 B 0.6 2.1 - rpS (respond the south pole) Release Point mT OUTPUT：OUT2 B - -2.1 -0.6 rpN (respond the north pole) B - 0.9 - hysS Hysteresis mT B - 0.9 - hysN Period T - 50 100 ms p V B <B<B ※6 Output High Voltage V DD - - V rpN rpS OH -0.2 I =-0.5mA OUT B<B , B <B ※6 Output Low Voltage V - - 0.2 V opN opS OL I =+0.5mA OUT Supply Current 1 I - 5 8 μA V =1.8V, Average DD1(AVG) DD V =1.8V, Supply Current During Startup Time 1 I - 2.8 - mA DD DD1(EN) During Startup Time Value V =1.8V, Supply Current During Standby Time 1 I - 1.8 - μA DD DD1(DIS) During Standby Time Value Supply Current 2 I - 8 12 μA V =2.7V, Average DD2(AVG) DD V =2.7V, Supply Current During Startup Time 2 I - 4.5 - mA DD DD2(EN) During Startup Time Value V =2.7V, Supply Current During Standby Time 2 I - 4.0 - μA DD DD2(DIS) During Standby Time Value ※6. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (T) to become definite output. P Radiation hardiness is not designed. www.rohm.com 2/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Figure of measurement circuit Bop/Brp Tp 200Ω VDD VDD VDD VDD OUT 100μF OUT Oscilloscope GND GND V Bop and Brp are measured with applying the magnetic field The period is monitored by Oscilloscope. from the outside. Fig.1 Bop,Brp measurement circuit Fig.2 Tp measurement circuit V OH Product Name I OUT BU52004GUL 1.0mA VDD BU52014HFV 0.5mA VDD 100μF OUT GND V IOUT Fig.3 VOH measurement circuit V Product Name I OL OUT BU52004GUL 1.0mA BU52014HFV 0.5mA VDD VDD 100μF OUT GND V I OUT Fig.4 V measurement circuit OL I DD A VDD 2200μF VDD OUT GND Fig.5 I measurement circuit DD www.rohm.com 3/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Technical (Reference) Data BU52004GUL (VDD=2.4V～3.3V type) 8.0 8.0 100 TY [mT] 46..00 VDD=3.0V Bop S TY [mT] 46..00 Ta = 25°C Bop S 899505 VDD=3.0V UX DENSI 02..00 Brp S UX DENSI 02..00 Brp S OD [ms] 778050 C FL -2.0 Brp N C FL-2.0 Brp N PERI 6605 GNETI --64..00 Bop N GNETI--64..00 Bop N 5505 A A 45 M -8.0 M-8.0 40 -60 -40-20 0 20 40 60 80 100 2.0 2.4 2.8 3.2 3.6 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] SUPPLY VOLTAGE ［V］ AMBIENT TEMPERATURE [℃] Fig.6 Bop,Brp – Fig.7 Bop,Brp – Fig.8 TP– Ambient Ambient temperature Supply voltage temperature 100 A]20.0 20.0 ms] 67890000 Ta = 25°C CURRENT [µ11112468....0000 VDD=3.0V URRENT [µA] 11112468....0000 Ta = 25°C PERIOD [ 345000 E SUPPLY 1068...000 E SUPPLY C 1068...000 12000 AVERAG 024...000 AVERAG 024...000 2.0 2.4 2.8 3.2 3.6 -60 -40 -20 0 20 40 60 80 100 2.0 2.4 2.8 3.2 3.6 SUPPLLY VOLTAGE[V] AMBIENT TEMPERATURE [℃] SUPPLY VOLTAGE [V] Fig.11 I – Supply voltage Fig.9 TP – Supply voltage Fig.10 IDD – Ambient DD temperature BU52014HFV (VDD=1.65V～3.3V type) 8.0 8.0 100 MAGNETIC FLUX DENSITY [mT]----86420246........00000000 VDD=1.8V BBBBroropppp NS NS MAGNETIC FLUX DENSITY [mT]----02468642........00000000 Ta = 25°C BBBBroropppp N SNS PERIOD [ms] 1234567890000000000 VDD=1.8V -60 -40-20 0 20 40 60 80 100 1.4 1.8 2.2 2.6 3.0 3.4 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] AMBIENT TEMPERATURE [℃] SUPPLY VOLTAGE ［V］ Fig.12 Bop,Brp – Fig.13 Bop,Brp – Supply voltage Fig.14 TP– Ambient Ambient temperature temperature 100 20.0 20.0 PERIOD [ms] 1234567890000000000 Ta = 25°C AVERAGE SUPPLY CURRENT [µA]111110246802468..........0000000000 VDD=1.8V AVERAGE SUPPLY CURRENT [µA] 111110246802468..........0000000000 Ta = 25°C 1.4 1.8 2.2 2.6 3.0 3.4 3.8 -60 -40 -20 0 20 40 60 80 100 1.4 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [℃] SUPPLY VOLTAGE[V] Fig.15 TP– Supply voltage Fig.16 IDD – Ambient Fig.17 IDD – Supply voltage temperature www.rohm.com 4/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Block Diagram BU52004GUL VDD A1 0.1µF Adjust the bypass capacitor value as necessary, according to TIMING LOGIC voltage noise conditions, etc. HALL LATCH B1 OUT1 The CMOS o utput terminals enable direct ELEMENT N × DYNAMIC OFFSET NCELLATIO SAMPLE & HOLD GVDNDD creosnisnteocr trioenq utiore dth. e PC, with no external pull-up A C H TC B2 OUT2 A L A2 GND Fig.18 A1 A2 A2 A1 PIN No. PIN NAME FUNCTION COMMENT A1 VDD POWER SUPPLY A2 GND GROUND B1 OUT1 OUTPUT( respond the south pole) B1 B2 B2 B1 Surface Reverse B2 OUT2 OUTPUT( respond the north pole) BU52014HFV VDD 4 0.1μF TIMING LOGIC Adjust the bypass capacitor HALL ATCH 5 OUT1 vvaollutaeg ea sn oniescee csosnadryit,i oancsc,o erdtcin. g to L ELEMENT N × DYNAMIC OFFSET ANCELLATIO SAMPLE & HOLD GVDNDD Tdexihrteeec rCtn cMaol OnpnSuel lo-cuutiptop nrue tts otie strhtmoeri nPreaCqls,u weirneitahdb .n leo C H TC 1 OUT2 LA 2 GND Fig.19 PIN No. PIN NAME FUNCTION COMMENT 5 4 4 5 OUTPUT 1 OUT2 ( respond the north pole) 2 GND GROUND 3 N.C. OPEN or Short to GND. 1 2 3 3 2 1 4 VDD POWER SUPPLY Surface Reverse OUTPUT 5 OUT1 ( respond the south pole) www.rohm.com 5/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ● Description of Operations Micropower Operation (Small current using intermittent action) The dual output bipolar detection Hall IC adopts an IDD intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits Period 50ms power ON and magnetic detection begins. During standby, Startup time the detection circuits power OFF, thereby reducing current Standby consumption. The detection results are held while standby is active, and then output. t Reference period: 50ms (MAX100ms) Fig.20 Reference startup time: 48μs (Offset Cancelation) VDD The Hall elements form an equivalent Wheatstone (resistor) I bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this B × ＋ offset voltage. When Hall elements are connected as shown in Fig. 21 and a Hall Voltage magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. － This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the GND figure) to redirect the current flow to a 90˚ angle from its Fig.21 original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. (Magnetic Field Detection Mechanism) S N S S N S N Flux direction Flux direction Fig.22 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. www.rohm.com 6/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note OUT1 N S N S OUT 1[V] S N Flux Flux High High High Low B Brp S Bop S 0 N-Pole Magnetic flux density [mT] S-Pole Fig.23 S-Pole Detection The OUT1 pin detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole. OUT2 N S N S S N OUT 2[V] Flux Flux High High High Low B Bop N Brp N 0 N-Pole S-Pole Magnetic density [mT] Fig.24 N-Pole Detection The OUT2 pin detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole. The dual output Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. www.rohm.com 7/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Intermittent Operation at Power ON Power ON VDD Startup time Standby time Startup time Standby time Supply current (Intermittent action) OUT Indefinite High (No magnetic field present) Indefinite OUT (Magnetic field present) Low Fig.25 The dual output Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 25. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. ●Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 26 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 27 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52014HFV operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area. 10 9 t=3mm 8 T] m 7 y[ t=1mm t=2mm t si 6 n e x d 5 u c fl 4 ti ne 3 g a M 2 1 7.6mm 9.2mm 1 0.4 mm 0 0 2 4 6 8 10 12 14 16 18 20 Distance between magnet and Hall IC [mm] Fig.26 X Magnet material: NEOMAX-44H (material) Magnet Y t Maker: NEOMAX CO.,LTD. X=Y=4mm t t=1mm,2mm,3mm L: Variable …Flux density measuring point Magnet size Fig.27 Magnet Dimens ions and Flux Density Measuring Point www.rohm.com 8/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Position of the Hall Effect IC(Reference) VCSP50L1 HVSOF5 0.55 0.6 0.55 0.8 0.35 0.2 (UNIT：mm) ●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) VCSP50L1 HVSOF5 (UNIT：mm) Strings Size(Typ) e 0.50 b3 0.25 SD 0.25 SE 0.25 ●Terminal Equivalent Circuit Diagram Because they are configured for CMOS (inverter) output, the OUT1, OUT2 output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the VDD current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. GND Fig.28 www.rohm.com 9/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Operation Notes 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6) Slide-by position sensing Fig.29 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.30, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output Omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of position detection. Fig. 31 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions. Flu x Magnet T] 10 Slide m 8 d A B sity[ 46 Reverse n e 2 Hall IC S ux d -20 c f -4 L N Flux eti -6 n g -8 Fig.29 Fig.30 Ma -10 0 1 2 3 4 5 6 7 8 9 10 Horizontal distance from the magnet [mm] Fig.31 7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 11) Power source design Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source. www.rohm.com 10/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

BU52004GUL, BU52014HFV Technical Note ●Ordering part number B U 5 2 0 0 4 G U L - E 2 Part No. Part No. Package Packaging and forming specification 52004 GUL: VCSP50L1 E2: Embossed tape and reel 52014 HFV: HVSOF5 (VSCP50L1) TR: Embossed tape and reel (HVSOF5) VCSP50L1(BU52004GUL) 1PIN MARK 1.10±0.1 <TaTpapee and ReEeml ibnofossrmeda ctiaornrie>r tape Quantity 3000pcs E2 1.10±0.1 0.10±0.05 0.55MAX S Dofi rfeecetdion (Treheel odnir ethcteio lne fits h tahned 1 apnind oyfo pur opduull cot uist tahte t htaep uep opne rt hleef tr iwghhte hna ynodu hold ) 0.08 S 4-φ00.2.055±0A.05B A 0.30±0.1 B B 0.30±0.1A 1 20.50 0.50 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. HVSOF5 <Tape and Reel information> 1.6±0.05 (0.8) Tape Embossed carrier tape ±1.60.05 ±1.20.05X 1.28 include BURR)(0.05) 1.150±20.4035 (0.91) (0.41) 34(02.31)5 0.0.2MAX13±0.05 QDofiu rfeaecnettdiiotyn 3T(0RTre0he0elp odcnirs ethcetio lenf tis h tahned 1 apnind oyfo pur opduull cot uist tah1te pt htianep uep opne rt hrieg hritg whth heann ydou hold ) A M ( X S A M 0.6 +0.03–0.02 0.5 0.1 S 0.02 0.22±0.05 0.08M Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com 11/11 2010.01 - Rev.D © 2010 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.

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