Datasheet CMOS LDO Regulators for Automotive Equipments 1ch 200mA CMOS LDO Regulators BUxxSD2-M series ●General Description ●Key Specifications BUxxSD2-M series are high-performance CMOS LDO (cid:132) Input Power Supply Voltage Range: 1.7V to 6.0V (cid:132) Output Current Range: 0 to 200mA regulators with output current ability of up to 200-mA. (cid:132) Operating Temperature Range: -40℃ to +105℃ These devices have excellent noise and load response (cid:132) Output Voltage Lineup: 1.2V,1.5V,1.8V,2.5V characteristics despite of its low circuit current 2.8V,3.0V,3.3V consumption of 33µA. They are most appropriate for (cid:132) Output Voltage Accuracy: ±2.0% various applications such as power supplies for logic IC, (cid:132) Circuit Current: 33µA(Typ.) (cid:132) Standby Current: 0μA (Typ.) RF, and camera modules. ●Package W(Typ.) x D(Typ.) x H(Max.) ●Features SSOP5 2.90mm x 2.80mm x 1.25mm (cid:132) High Output Voltage Accuracy: ±2.0% (In all recommended conditions) (cid:132) High Ripple Rejection: 68 dB (Typ, 1 kHz,) (cid:132) Compatible with small ceramic capacitor (Cin=Cout=0.47 µF) (cid:132) Low Current Consumption: 33 µA (cid:132) Output Voltage ON/OFF control (cid:132) Built-in Over Current Protection Circuit (OCP) (cid:132) Built-in Thermal Shutdown Circuit (TSD) (cid:132) Package SSOP5 is similar to SOT23-5(JEDEC) ●Applications (cid:132) Automotive equipments. (cid:132) Portable devices (cid:132) Camera modules (cid:132) Other electronic devices using microcontrollers or logic circuits (cid:132) AEC-Q100 qualified ●Typical Application Circuit VVViiinnn VVVIIINNN VVVOOOUUUTTT VVVooouuuttt CCCiiinnn CCCooouuuttt BBBUUUBxxxUxxxxSSSxDDDS222DMMM2GGG-M---MMM OOOnnn OOOffffff SSSTTTBBBYYY GGGNNNDDD Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays .w ww.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/35 TSZ22111・14・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Pin Configuration VOUT N.C. Lot. No Marking VIN GND STBY ●Pin Description Pin No. Symbol Function 1 VIN Input Pin 2 GND GND Pin Output Control Pin 3 STBY (High:ON, Low:OFF) 4 N.C. No Connect 5 VOUT Output Pin ●Block Diagram VIN VIN 1 VREF Cin VOUT VOUT 5 GND 2 OCP Cout TSD VSTBY 4 N.C. STBY STBY 3 Cin(min)=0.47µF (Ceramic) Cout(min)=0.47µF (Ceramic) Figure 2. Block diagram www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 2/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Absolute Maximum Ratings Parameter Symbol Rating Unit Maximum Power Supply VMAX -0.3 to +6.5 V Voltage Range Power Dissipation Pd 540(*1) mW Maximum Junction Tjmax +125 ℃ Temperature Operating Temperature Range Topr -40 to +105 ℃ Storage Temperature Range Tstg -55 to +125 ℃ (*1) Derate by 5.6mW/℃ when operating above Ta=25℃.(When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer) ●Recommended Operating Ratings Parameter Symbol Limit Unit Input Power Supply Voltage VIN 1.7 to 6.0 V Range Maximum Output Current IMAX 200 mA ●Recommended Operating Conditions Rating Parameter Symbol Unit Conditions Min. Typ. Max. Input capacitor Cin 0.47(*2) 1.0 － µF A ceramic capacitor is recommended. Output capacitor Cout 0.47(*2) 1.0 － µF A ceramic capacitor is recommended. (*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics, DC device characteristics, and degradation with time. www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 3/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Electrical Characteristics (Unless otherwise noted, Ta=-40 to 105℃, VIN=VOUT+1.0V(*3), VSTBY=1.5V, Cin=1μF, Cout=1μF.) Limit PARAMETER Symbol Unit Conditions MIN. TYP. MAX. IOUT=0 to 200mA, VOUT VOUT VOUT≧2.5V, VIN=VOUT+0.5 to 6.0V Output Voltage VOUT ×0.98 VOUT ×1.02 V VOUT＜2.5V, VIN=3.0 to 6.0V Ta=-40 to +105℃ (*4,5,6) IOUT=10mA - 4 10 mV VOUT≦2.5V, VIN=3.0 to 6.0V Line Regulation VDLI IOUT=10mA 6 15 mV VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V Load Regulation1 VDLO1 - 0.5 5 mV IOUT=1 to 100mA Load Regulation2 VDLO2 - 1 10 mV IOUT=1 to 200mA - 400 700 mV 1.0V≦VOUT＜1.2V, IOUT=100mA - 280 550 mV 1.2V≦VOUT＜1.5V, IOUT=100mA - 180 370 mV 1.5V≦VOUT＜1.7V, IOUT=100mA Dropout Voltage VDROP - 150 290 mV 1.7V≦VOUT＜2.1V, IOUT=100mA - 110 220 mV 2.1V≦VOUT＜2.5V, IOUT=100mA - 100 180 mV 2.5V≦VOUT＜2.8V, IOUT=100mA - 85 150 mV 2.8V≦VOUT, IOUT=100mA Maximum Output Current IOMAX 200 - - mA VIN=VOUT+1.0V (*3) Limit Current ILMAX 250 400 - mA Vo=VOUT×0.98, Ta=25℃ Short Current ISHORT - 100 200 mA Vo=0V, Ta=25℃ Circuit Current IGND - 33 80 µA IOUT=0mA Circuit Current (STBY) ICCST - - 2.0 µA VSTBY=0V Ripple Rejection Ratio R.R. - 68 - dB VRR=-20dBv,fRR=1kHz,IOUT=10mA Load Transient Response VLOT - ±65 - mV IVOIUNT==V1O UtoT +115.00mVA (*,5T) rise=Tfall=1µs, Line Transient Response VLIT - ±5 - mV VIN=VOUT+0.5 to VOUT+1.0V, Trise=Tfall =10µs Output Noise Voltage VNOIS - 30 - µVrms Bandwidth 10 to 100kHz Output Voltage settled Startup Time TST - 100 300 µsec within tolerances (*7) STBY Control ON VSTBH 1.1 - VIN V Voltage OFF VSTBL -0.2 - 0.5 V Ta=25℃ STBY Pin Current ISTBY - - 4.0 µA (*3) VIN=3.5V for VOUT＜2.5V. (*4) Operating Conditions are limited by Pd. (*5) Typical values apply for Ta=25℃. (*6) VIN=3.0V to 6.0V for VOUT＜2.5V. (*7) Startup time=time from EN assertion to VOUT×0.98 www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 4/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.4 1.25 1.24 1.2 1.23 V) 1.0 V) 1.22 (T (T U IOUT=0mA U O O 1.21 V 0.8 IOUT=50mA V age IOUT=200mA age 1.20 olt 0.6 olt put V put V 1.19 IIOOUUTT==500mmAA ut 0.4 ut 1.18 IOUT=200mA O O Ta=25℃ 1.17 0.2 VIN=VSTBY 1.16 Ta=25℃ VIN=VSTBY 0.0 1.15 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Input Voltage VIN (V) Input Voltage VIN (V) Figure 3. Output Voltage vs. Input Voltage Figure 4. Line Regulation 50 1.25 45 1.24 40 1.23 Ta=25℃ (μA)D 35 (V)UT 1.22 TTaa==-14005℃℃ GN 30 VO 1.21 ent I 25 TTaa==21505℃℃ age 1.20 urr Ta=-40℃ olt C 20 V 1.19 uit put Circ 15 Out 1.18 VIN=3.5V VSTBY=1.5V 10 1.17 5 VIN=VSTBY 1.16 IOUT=0mA 0 1.15 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 Input Voltage VIN (V) Output Current IOUT (mA) Figure 5. Circuit Current vs. Input Voltage Figure 6. Load Regulation www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 5/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 1.40 90 1.20 80 (μA)GND 6700 TTTaaa===2-14050℃5℃℃ V (V)OUT 01..8000 VVVIIINNN===633...050VVV nt I 50 ge e a urr olt 0.60 C 40 V Circuit 30 VIN=3.5V Output 0.40 Ta=25℃ 20 VSTBY=1.5V VSTBY=1.5V 0.20 10 0 0.00 0 50 100 150 200 0 100 200 300 400 500 Output Current IOUT (mA) Output Current IOUT (mA) Figure 7. Circuit Current vs. Output Current Figure 8. OCP Threshold 1.25 100 1.24 90 1.23 80 V) 1.22 A) 70 (UT (μD O 1.21 N 60 V G age 1.20 ent I 50 olt urr put V 1.19 VIN=3.5V uit C 40 Out 1.18 VSTBY=1.5V Circ 30 VIN=3.5V IOUT=0.1mA VSTBY=1.5V 1.17 20 IOUT=0.1mA 1.16 10 1.15 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature Ta (℃) Temperature Ta (℃) Figure 9. Output Voltage vs. Temperature Figure 10. Circuit Current vs. Temperature www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 6/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.4 100 90 1.2 ) A 80 Ta=105℃ n ( V) 1.0 Ta=25℃ T V (OUT 0.8 Ta=-40℃ BY ICCS 6700 e T ut Voltag 0.6 rent at S 4500 utp 0.4 Cur 30 O uit rc 20 VIN=6.0V 0.2 VIN=3.5V Ci VSTBY=0V IOUT=0.1mA 10 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 -40 -20 0 20 40 60 80 100 STBY Pin Voltage VSTBY (V) Temperature Ta (℃) Figure 11. STBY Threshold Figure 12. Circuit Current ( at STBY) vs. Temperature 2.0 1.8 1.6 A) μ (Y 1.4 TB S 1.2 ent I 1.0 TTaa==2150℃5℃ rr u Ta=-40℃ C Pin 0.8 Y 0.6 B T S 0.4 0.2 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 STBY Pin Voltage VSTBY (V) Figure 13. STBY Pin Current vs. STBY Pin Voltage www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 7/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 50 90 45 ) B) 80 ms 40 d Vr R.R. ( 70 (μOIS 35 o 60 N 30 n Rati 50 age V 25 ctio 40 Ta=25℃ Volt 20 Ripple Reje 2300 VVVIOIRSUNTRT=B==3Y-1.=25001Vmd. 5BAVv utput Noise 1105 VTVCaISiNn=T==2B3CY5.=℃o51uV .t 5=V1µ F Cin=Cout=1µF O Bndwidth 10 to 100kHz 10 5 0 0 100 1000 10000 100000 0 50 100 150 200 Frequency (Hz) Output Current IOUT (mA) Figure 14. Ripple Rejection Ratio vs. Frequency Figure 15. Output Noise Voltage vs. Output Current 10 ) z H √ / V μ ( y 1 sit n e D e s oi N al ctr 0.1 Ta=25℃ e Sp VIN=3.5V ut VSTBY=1.5V utp IOUT=10mA O Cin=Cout=1µF 0.01 10 100 1000 10000 100000 Frequency (Hz) Figure 16.Output Spectral Noise Density vs. Frequency www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 8/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) O O u u tp tp VIN=3.5V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut Cu VIN=3.5V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut Cu rre 150mA rre 100n 100n 100mA t(m t(m 0 A 0 A IOUT 1mA 100mA/div ) IOUT 1mA 100mA/div ) 20μs/div 20μs/div V)1.30 V)1.30 ge( VOUT ge( VOUT ata1.20 100mV/div ata1.20 100mV/div ol ol ut V1.10 ut V1.10 p p ut ut O O Figure 17. Load Response Figure 18. Load Response (1mA to 100mA) (1mA to 150mA) In In 6.0put V VIN=VSTBY 6.0V 2.0V/div 6.0put V o o VIN=VSTBY 3.5V 2.0V/div 4.0lta 4.0lta g g e e 3.0V Slew Rate＝1V/μs 2.0(V 3.0V Slew Rate＝1V/μs 2.0(V ) ) 0.0 0.0 ge(V)1.22 1ms/div ge(V)1.22 1ms/div Output Volata11..1280 IVOOUUT=T10mA Cout=1.0μF 20mV/div Output Volata11..1280 IVOOUUT=T10mA Cout=1.0μF20mV/div Figure 19. Line Transient Response Figure 20. Line Transient Response (3.0 to 3.5V) (3.0 to 6.0V) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 9/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) S S T T B B Y Y 2.0 P 2.0 P in in 1.5V 1.0V/div 1.0 Vo 1.5V 1.0V/div 1.0 Vo VSTBY lta VSTBY lta 0.0g 0.0g e e 0V (V 0V (V ) ) V) 20μs/div V) 20μs/div e(2.0 e(2.0 g g a a at1.0 at1.0 ut Vol0.0 VOUT CCoouutt==01..40μ7μFF1.0V/div ut Vol0.0 VOUT CCoouutt==01..407μμFF1.0V/div utp VIN=3.5V Cout=2.2μF utp VIN=3.5V Cout=2.2μF O O Figure 21. Startup Time Figure 22. Startup Time (ROUT=none) (ROUT=6Ω) S S T T B B Y Y 1.5V 2.0 P 1.5V 2.0 P in in VSTBY 1.0 V VSTBY 1.0 V o o 1.0V/div lta 1.0V/div lta 0.0g 0.0g 0V e(V 0V e(V ) ) V) 400ms/div V) 20μs/div ge(2.0 Cout=0.47μF ge(2.0 Cout=0.47μF olata1.0 VOUT CCoouutt==12..02μμFF olata1.0 VOUT CCoouutt==12..02μμFF V 1.0V/div V 1.0V/div ut 0.0 ut 0.0 utp VIN=3.5V utp VIN=3.5V O O Figure 23. Discharge Time Figure 24. Discharge Time (ROUT=none) (ROUT=6Ω) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 10/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 2.0 1.85 1.8 1.84 1.6 1.83 V) 1.4 V) 1.82 (UT (UT VO 1.2 VO 1.81 age 1.0 IOUT=0mA age 1.80 IOUT=0mA ut Volt 0.8 IIOOUUTT==25000mmAA ut Volt 1.79 IIOOUUTT==25000mmAA p p Out 0.6 Out 1.78 0.4 Ta=25℃ 1.77 Ta=25℃ 0.2 VIN=VSTBY 1.76 VIN=VSTBY 0.0 1.75 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Input Voltage VIN (V) Input Voltage VIN (V) Figure 25. Output Voltage vs. Input Voltage Figure 26. Line Regulation 60 1.85 Ta=25℃ Ta=105℃ 1.84 Ta=25℃ Ta=-40℃ 50 Ta=-40℃ 1.83 Ta=105℃ A) V) 1.82 (μD 40 (UT N O 1.81 G V nt I 30 ge 1.80 e a urr olt C V 1.79 uit 20 put rc ut 1.78 VIN=3.5V Ci VIN=VSTBY O VSTBY=1.5V IOUT=0mA 1.77 10 1.76 0 1.75 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 Input Voltage VIN (V) Output Current IOUT (mA) Figure 27. Circuit Current vs. Input Voltage Figure 28. Load Regulation www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 11/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 2.00 90 Ta=105℃ 1.80 Ta=25℃ 80 1.60 Ta=-40℃ VIN=6.0V (μA)D 70 (V)UT 1.40 VVIINN==33..50VV N 60 O 1.20 G V nt I 50 ge 1.00 e a Curr 40 Volt 0.80 uit put Circ 30 VIN=3.5V Out 0.60 Ta=25℃ 20 VSTBY=1.5V 0.40 VSTBY=1.5V 10 0.20 0 0.00 0 50 100 150 200 0 100 200 300 400 500 Outut Current IOUT (mA) Output Current IOUT (mA) Figure 29. Circuit Current vs. Output Current Figure 30. OCP Threshold 1.85 100 1.84 90 1.83 80 V) 1.82 A) 70 (UT (μD O 1.81 N 60 V G ge 1.80 nt I 50 a e olt urr V 1.79 C 40 put VIN=3.5V uit Out 1.78 VSTBY=1.5V Circ 30 VIN=3.5V IOUT=0.1mA VSTBY=1.5V 1.77 20 IOUT=0.1mA 1.76 10 1.75 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature Ta (℃) Temperature Ta (℃) Figure 31. Output Voltage vs. Temperature Figure 32. Circuit Current vs. Temperature www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 12/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 2.0 100 1.8 90 1.6 Ta=105℃ A) 80 Ta=25℃ (n V) 1.4 Ta=-40℃ ST 70 (T CC OU 1.2 Y I 60 V B e T Voltag 01..80 nt at S 4500 ut re p ur ut 0.6 C 30 O uit 0.4 rc 20 VIN=6.0V VIN=3.5V Ci VSTBY=0V 0.2 IOUT=0.1mA 10 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 -40 -20 0 20 40 60 80 100 STBY Pin Voltage VSTBY (V) Temperature Ta (℃) Figure 33. STBY Threshold Figure 34. Circuit Current (at STBY) vs. Temperature 2.0 1.8 1.6 A) μ (Y 1.4 TB S 1.2 ent I 1.0 TTaa==2150℃5℃ rr u Ta=-40℃ C n 0.8 Pi Y 0.6 B T S 0.4 0.2 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 STBY Pin Voltage VSTBY (V) Figure 35. STBY Pin Current vs. STBY Pin Voltage www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 13/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 50 90 45 ) B) 80 ms 40 d Vr R.R. ( 70 (μOIS 35 o 60 N 30 n Rati 50 age V 25 ctio 40 Ta=25℃ Volt 20 eje VIN=3.5V se e R 30 VRR=-20dBv Noi 15 Ta=25℃ Rippl 20 VCIOSiUnTT=B=CY1=o01um.t5=AV1 μ F Output 10 VVCISiNnT==B3CY.=o51uV.t 5=V1μ F 10 5 Bndwidth 10 to 100kHz 0 0 100 1000 10000 100000 0 50 100 150 200 Frequency (Hz) Output Current IOUT (mA) Figure 36. Ripple Rejection Ratio vs. Frequency Figure 37. Output Noise Voltage vs. Output Current 10 z) H √ / V μ ( y 1 sit n e D e s oi N al ctr 0.1 Ta=25℃ e p VIN=3.5V S ut VSTBY=1.5V p IOUT=10mA Out Cin=Cout=1μF 0.01 10 100 1000 10000 100000 Frequency (Hz) Figure 38.Output Spectral Noise Density vs. Frequency www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 14/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) O O u u tp tp VIN=3.5V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut Cu VIN=3.5V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut Cu 100rren 150mA 100rren 100mA t(m t(m 0 A 0 A IOUT 1mA 100mA/div ) IOUT 1mA 100mA/div ) 20μs/div 20μs/div ge(V)1.90 VOUT ge(V)1.90 VOUT ata1.80 100mV/div ata1.80 100mV/div ol ol ut V1.70 ut V1.70 Outp Outp Figure 39. Load Response Figure 40. Load Response (1mA to 100mA) (1mA to 150mA) In In 6.0put V VIN=VSTBY 6.0V 2.0V/div 6.0put V o o VIN=VSTBY 3.5V 2.0V/div 4.0lta 4.0lta g g 3.0V Slew Rate＝1V/μs 2.0e(V 3.0V Slew Rate＝1V/μs 2.0e(V ) ) 0.0 0.0 V) 1ms/div V) 1ms/div ge(1.82 ge(1.82 a a Volat1.80 VOUT 20mV/div Volat1.80 VOUT 20mV/div put 1.78 put 1.78 Out IOUT=10mA Cout=1.0μF Out IOUT=10mA Cout=1.0μF Figure 41. Line Transient Response Figure 42. Line Transient Response (3.0 to 3.5V) (3.0 to 6.0V) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 15/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) S S T T B B 2.0Y P 2.0Y P in in 1.5V 1.0V/div 1.0 V 1.5V 1.0V/div 1.0 V o o VSTBY lta VSTBY lta 0.0g 0.0g 0V e(V 0V e(V ) ) V) 20μs/div V) 20μs/div e(2.0 e(2.0 g g a 1.0V/div a 1.0V/div at1.0 at1.0 ol Cout=0.47μF ol Cout=0.47μF ut V0.0 VOUT Cout=1.0μF ut V0.0 VOUT Cout=1.0μF utp VIN=3.5V Cout=2.2μF utp VIN=3.5V Cout=2.2μF O O Figure 43. Startup Time Figure 44. Startup Time (ROUT=none) (ROUT=9Ω) S S T T B B Y Y 1.5V 2.0 P 1.5V 2.0 P in in VSTBY 1.0 V VSTBY 1.0 V o o 1.0V/div lta 1.0V/div lta 0.0g 0.0 g 0V e(V 0V e(V ) ) V) 400ms/div V) 20μs/div ge(2.0 VOUT Cout=0.47μF ge(2.0 Cout=0.47μF ata1.0 Cout=1.0μF ata1.0 Cout=1.0μF ol Cout=2.2μF ol VOUT Cout=2.2μF V 1.0V/div V 1.0V/div ut 0.0 ut 0.0 utp VIN=3.5V utp VIN=3.5V O O Figure 45. Discharge Time Figure 46. Discharge Time (ROUT=none) (ROUT=9Ω) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 16/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.0 2.55 2.54 2.5 2.53 (V) UT 2.0 (V)UT 2.52 V O VO 2.51 e e g 1.5 g 2.50 olta olta IOUT=0mA V V 2.49 IOUT=50mA ut IOUT=0mA ut IOUT=200mA p 1.0 p Out IIOOUUTT==25000mmAA Out 2.48 2.47 0.5 Ta=25℃ 2.46 Ta=25℃ VIN=VSTBY VIN=VSTBY 0.0 2.45 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Input Voltage VIN (V) Input Voltage VIN (V) Figure 47. Output Voltage vs. Input Voltage Figure 48. Line Regulation 60 2.55 Ta=105℃ 2.54 Ta=25℃ 50 Ta=-40℃ 2.53 Ta=25℃ Ta=-40℃ (μA)D 40 (V)UT 2.52 Ta=105℃ N O 2.51 G V ent I 30 age 2.50 urr olt uit C 20 put V 2.49 Circ Out 2.48 VIN=3.5V VSTBY=1.5V 2.47 10 VIN=VSTBY IOUT=0mA 2.46 0 2.45 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 Input Voltage VIN (V) Output Current IOUT (mA) Figure 49. Circuit Current vs. Input Voltage Figure 50. Load Regulation www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 17/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 3.00 90 80 Ta=105℃ 2.50 Ta=25℃ A) 70 Ta=-40℃ V) VIN=3.0V (μ ND 60 (OUT 2.00 VVIINN==63..05VV G V nt I 50 ge 1.50 e a urr olt C 40 V uit put 1.00 rc 30 ut Ci O VIN=3.5V 20 VSTBY=1.5V 0.50 Ta=25℃ 10 VSTBY=1.5V 0 0.00 0 50 100 150 200 0 100 200 300 400 500 Outut Current IOUT (mA) Output Current IOUT (mA) Figure 51. Circuit Current vs. Output Current Figure 52. OCP Threshold 2.55 100 2.54 90 2.53 80 V) 2.52 A) 70 (T (μ U D O 2.51 N 60 V G ge 2.50 nt I 50 a e olt urr V 2.49 C 40 put VIN=3.5V uit Out 2.48 VSTBY=1.5V Circ 30 IOUT=0.1mA 2.47 20 VIN=3.5V VSTBY=1.5V 2.46 10 IOUT=0.1mA 2.45 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature Ta (℃) Temperature Ta (℃) Figure 53. Output Voltage vs. Temperature Figure 54. Circuit Current vs. Temperature www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 18/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.0 100 90 2.5 ) A 80 Ta=105℃ (n ) T V Ta=25℃ S 70 (T 2.0 Ta=-40℃ CC OU Y I 60 V B ge 1.5 ST 50 Volta nt at 40 put 1.0 urre ut C 30 O uit rc 20 VIN=6.0V 0.5 VIN=3.5V Ci VSTBY=0V IOUT=0.1mA 10 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 -40 -20 0 20 40 60 80 100 STBY Pin Voltage VSTBY (V) Temperature Ta (℃) Figure 55. STBY Threshold Figure 56. Circuit Current ( at STBY) vs. Temperature 2.0 500 1.8 450 VIN=0.98*VOUT VSTBY=1.5V 1.6 400 A) V) (μSTBY 11..24 (mROP 330500 urrent I 1.0 TTaa==2150℃5℃ age VD 250 n C 0.8 Ta=-40℃ Volt 200 BY Pi 0.6 pout 150 ST 0.4 Dro 100 Ta=105℃ Ta=25℃ 0.2 50 Ta=-40℃ 0.0 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 STBY Pin Voltage VSTBY (V) Output Current IOUT (mA) Figure 57. STBY Pin Current vs. STBY Pin Voltage Figure 58. Dropout Voltage vs. Output Current www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 19/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 50 90 45 ) s B) 80 m 40 d Vr R.R. ( 70 (μOIS 35 atio 60 e VN 30 n R 50 ag 25 ctio 40 Ta=25℃ Volt 20 eje VIN=3.5V se ple R 30 VVRSTRB=Y-=201d.5BVv ut Noi 15 TVaIN==235.℃5V Rip 20 CIOiUnT==C1o0umt=A1 μF Outp 10 VCSinT=BCY=o1u.t5=V1μ F 10 5 Bndwidth 10 to 100kHz 0 0 100 1000 10000 100000 0 50 100 150 200 Frequency (Hz) Output Current IOUT (mA) Figure 59. Ripple Rejection Ratio vs. Frequency Figure 60. Output Noise Voltage vs. Output Current 10 z) H √ / V μ ( y 1 sit n e D e s oi N al ctr 0.1 Ta=25℃ e p VIN=3.5V S ut VSTBY=1.5V p IOUT=10mA Out Cin=Cout=1μF 0.01 10 100 1000 10000 100000 Frequency (Hz) Figure 61.Output Spectral Noise Density vs. Frequency www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 20/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) O O u u tp tp VIN=3.5V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut C VIN=3.5V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut C u u rre 150mA rre 100n 100n 100mA t(m t(m 0 A 0 A IOUT 1mA 100mA/div ) IOUT 1mA 100mA/div ) 20μs/div 20μs/div (V)2.60 V)2.60 e ( put Volatag22..4500 VOUT 100mV/div ut Volatage22..4500 VOUT 100mV/div Out utp O Figure 62. Load Response Figure 63. Load Response (1mA to 100mA) (1mA to 150mA) In In 6.0put V VIN=VSTBY 6.0V 2.0V/div 6.0put V o o VIN=VSTBY 3.5V 2.0V/div 4.0lta 4.0lta g g 3.0V Slew Rate＝1V/μs 2.0e(V 3.0V Slew Rate＝1V/μs 2.0e(V ) ) 0.0 0.0 V) 1ms/div V) 1ms/div ge(2.52 ge(2.52 a a olat2.50 VOUT 20mV/div olat2.50 VOUT 20mV/div V V ut ut p2.48 p2.48 Out IOUT=10mA Cout=1.0μF Out IOUT=10mA Cout=1.0μF Figure 64. Line Transient Response Figure 65. Line Transient Response (3.0 to 3.5V) (3.0 to 6.0V) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 21/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) S S TB TB 2.0Y P 2.0Y P VSTBY0V 1.5V 1.0V/div 01..00in Voltage(V VSTBY0V 1.5V 1.0V/div 01..00in Voltage(V ) ) 20μs/div 20μs/div V) V) Output Volatage(021...000 VVOINU=T3.5V CCCooouuuttt===012...4027μμμFFF1.0V/div Output Volatage(021...000 VVOINU=T3.5V CCCooouuuttt===012...402μμ7μFFF1.0V/div Figure 66. Startup Time Figure 67. Startup Time (ROUT=none) (ROUT=12.5Ω) S S TB TB VSTBY 1.5V 21..00Y Pin Vo VSTBY 1.5V 21..00 Y Pin Vo 0V 1.0V/div 0.0ltage(V 0V 1.0V/div 0.0 ltage(V ) ) V) 400ms/div V) 20μs/div e(2.0 VOUT Cout=0.47μF e(2.0 VOUT Cout=0.47μF g g a Cout=1.0μF a Cout=1.0μF olat1.0 Cout=2.2μF olat1.0 Cout=2.2μF V 1.0V/div V 1.0V/div ut 0.0 ut 0.0 utp VIN=3.5V utp VIN=3.5V O O Figure 68. Discharge Time Figure 69. Discharge Time (ROUT=none) (ROUT=12.5Ω) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 22/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.5 3.35 3.34 IOUT=0mA 3.0 IOUT=50mA 3.33 IOUT=200mA V) 2.5 V) 3.32 (T (T U U O O 3.31 V 2.0 V e e ag ag 3.30 olt 1.5 olt put V IOUT=0mA put V 3.29 ut 1.0 IOUT=50mA ut 3.28 O O IOUT=200mA 3.27 0.5 Ta=25℃ 3.26 Ta=25℃ VIN=VSTBY VIN=VSTBY 0.0 3.25 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Input Voltage VIN (V) Input Voltage VIN (V) Figure 70. Output Voltage vs. Input Voltage Figure 71. Line Regulation 70 3.35 3.34 Ta=25℃ 60 Ta=-40℃ Ta=105℃ 3.33 Ta=105℃ Ta=25℃ (μA)GND 4500 Ta=-40℃ V (V)OUT 33..3312 nt I ge 3.30 e a Curr 30 Volt 3.29 uit put Circ 20 Out 3.28 VIN=4.3V VSTBY=1.5V 3.27 10 VIN=VSTBY 3.26 IOUT=0mA 0 3.25 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 Input Voltage VIN (V) Output Current IOUT (mA) Figure 72. Circuit Current vs. Input Voltage Figure 73. Load Regulation www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 23/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 3.50 90 Ta=105℃ 3.00 Ta=25℃ 80 Ta=-40℃ A) 70 2.50 (μ VIN=3.0V ND 60 VIN=3.5V nt IG 50 2.00 VIN=6.0V e urr V) 1.50 C 40 ( uit OUT rc 30 V 1.00 Ci VIN=4.3V ge Ta=25℃ 20 VSTBY=1.5V olta 0.50 VSTBY=1.5V V 10 ut p 0 Out 0.00 0 50 100 150 200 0 100 200 300 400 500 Outut Current IOUT (mA) Output Current IOUT (mA) Figure 74. Circuit Current vs. Output Current Figure 75. OCP Threshold 3.35 100 3.34 90 3.33 80 V) 3.32 A) 70 (UT (μD O 3.31 N 60 V G ge 3.30 nt I 50 a e olt urr V 3.29 C 40 put VIN=4.3V uit Out 3.28 VSTBY=1.5V Circ 30 VIN=4.3V IOUT=0.1mA VSTBY=1.5V 3.27 20 IOUT=0.1mA 3.26 10 3.25 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature Ta (℃) Temperature Ta (℃) Figure 76. Output Voltage vs. Temperature Figure 77. Circuit Current vs. Temperature www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 24/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.5 100 90 3.0 Ta=105℃ ) Ta=25℃ nA 80 ( V) 2.5 Ta=-40℃ T V (OUT 2.0 BY ICCS 6700 e T ut Voltag 1.5 rent at S 4500 utp 1.0 Cur 30 O uit rc 20 VIN=6.0V 0.5 VIN=4.3V Ci VSTBY=0V IOUT=0.1mA 10 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 -40 -20 0 20 40 60 80 100 STBY Pin Voltage VSTBY (V) Temperature Ta (℃) Figure 78. STBY Threshold Figure 79. Circuit Current ( at STBY) vs. Temperature 2.0 500 1.8 450 VIN=0.98*VOUT VSTBY=1.5V 1.6 400 A) μ V) (STBY 11..24 Ta=105℃ (mOP 330500 rrent I 1.0 TTaa==2-450℃℃ e VDR 250 u g C a Pin 0.8 Volt 200 Y 0.6 ut 150 B o T p S 0.4 Dro 100 Ta=105℃ 0.2 50 Ta=25℃ Ta=-40℃ 0.0 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 STBY Pin Voltage VSTBY (V) Output Current IOUT (mA) Figure 80. STBY Pin Current vs. STBY Pin Voltage Figure 81. Dropout Voltage vs. Output Current www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 25/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 50 90 45 ) ) 80 ms 40 B d Vr R. ( 70 (μS 35 R. OI atio 60 e VN 30 R 50 g 25 on olta cti 40 Ta=25℃ V 20 eje VIN=4.3V se ple R 30 VVRSTRB=Y-=201d.5BVv ut Noi 15 VTaIN==245.℃3V Rip 20 CIOiUnT==C1o0umt=A1 μF Outp 10 CVSinT=BCY=o1u.t5=V1μ F 10 5 Bndwidth 10 to 100kHz 0 0 100 1000 10000 100000 0 50 100 150 200 Frequency (Hz) Output Current IOUT (mA) Figure 82. Ripple Rejection Ratio vs. Frequency Figure 83. Output Noise Voltage vs. Output Current 10 z) H √ / V μ ( y 1 sit n e D e s oi N al r 0.1 ect Ta=25℃ p S VIN=4.3V ut VSTBY=1.5V utp IOUT=10mA O Cin=Cout=1μF 0.01 10 100 1000 10000 100000 Frequency (Hz) Figure 84.Output Spectral Noise Density vs. Frequency www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 26/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) O O u u tp tp VIN=4.3V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut Cu VIN=4.3V,VSTBY=1.5V TCriins=eC＝oTufta=l1l=μ1Fμs, 200ut Cu rre 150mA rre 100n 100n 100mA t(m t(m 0 A 0 A IOUT 1mA 100mA/div ) IOUT 1mA 100mA/div ) 20μs/div 20μs/div Output Volatage(V)333...243000 VOUT 100mV/div Output Volatage(V)333...243000 VOUT 100mV/div Figure 85. Load Response Figure 86. Load Response (1mA to 100mA) (1mA to 150mA) In In VIN=VSTBY 4.3V 2.0V/div 6.0put Vo VIN=VSTBY 6.0V 2.0V/div 6.0put Vo 4.0lta 4.0lta 3.8V Slew Rate＝1V/μs g 3.8V Slew Rate＝1V/μs g e e 2.0(V 2.0(V ) ) Output Volatage(V)333...233820 IOVUOTU=T10mA Cout=1.0μF201mmVs//ddiivv 0.0 Output Volatage(V)333...233820 IVOOUUT=T10mA Cout=1.0μF201mmVs//ddiivv 0.0 Figure 87. Line Transient Response Figure 88. Line Transient Response (3.8 to 4.3V) (3.8 to 6.0V) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 27/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) S S T T B B 2.0Y P 2.0Y P in in 1.5V 1.0V/div 1.0 V 1.5V 1.0V/div 1.0 V o o VSTBY lta VSTBY lta 0.0g 0.0g 0V e(V 0V e(V 20μs/div ) 20μs/div ) 3.0 3.0 V) 1.0V/div V) 1.0V/div e(2.0 e(2.0 g g ata1.0 Cout=0.47μF ata1.0 Cout=0.47μF ut Vol0.0 VOUT CCoouutt==12..02μμFF ut Vol0.0 VOUT CCoouutt==12..02μμFF utp VIN=4.3V utp VIN=4.3V O O Figure 89. Startup Time Figure 90. Startup Time (ROUT=none) (ROUT=16.5Ω) S S TB TB 1.5V 2.0Y Pin 1.5V 2.0 Y Pin VSTBY 1.0V/div 1.0 Volta VSTBY 1.0V/div 1.0 Volta 0V 0.0ge(V 0V 0.0 ge(V ) ) 3.0 3.0 V) 1.0s/div V) 40μs/div e(2.0 VOUT Cout=0.47μF e(2.0 VOUT Cout=0.47μF g g olata1.0 CCoouutt==12..02μμFF olata1.0 CCoouutt==12..02μμFF V 1.0V/div V 1.0V/div ut 0.0 ut 0.0 utp VIN=3.5V utp VIN=3.5V O O Figure 91. Discharge Time Figure 92. Discharge Time (ROUT=none) (ROUT=16.5Ω) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 28/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Input/Output Capacitor Capacity value of ceramic capacitor - DC bias characteristics It is recommended that an input capacitor is placed near pins (Example) between the VCC pin and GND as well as an output capacitor 10 1B01-cVh awriathcstetarinsdti cvosltage between the output pin and GND. The input is valid when the 0 GRM188B11A105KA61D power supply impedance is high or when the PCB trace has -10 10-V withstand voltage sctafhoaicgertp nu altiaohfcilacei tdfaa u nnaantccnc ettdluie,o anlntilhng aeetalhi tpv.my po oFlolitcraofe agrt htesioti sthvan eab.c ralieCoap uteatithorcpaeniutm soto. ri ucHcb tapoycpu waamtep cowvaituecoilnrilrt ,,ot b ipnretslhge e adui set segpou rencaen hlaaldyet ei cnbrkhgo a attohhvrdneee Capacitance Change [%] ------765432000000 1F0 c-Vha wraitchtsetrainsdti cvsoltage 1F0 c-Vha wraitchtsetrainsdti cvsoltageB characteris4Xti-6cVSs 6B wc.i 3htcha-hsVrata arwcanticedthtr evsisrotaitlsitncatdisgc vseoltage different, thermal and equivalent series resistance -80 characteristics, and may degrade gradually over continued -90 use. -100 0 0.5 1 1.5 2 2.5 3 3.5 4 For additional details, please check with the manufacturer, DC Bias Voltage [V] and select the best ceramic capacitor for your application Figure 93. Capacity-bias characteristics Stable region Cin=Cout=0.47μF　Ta=-40 to 105℃ ●Equivalent Series Resistance (ESR) of a Ceramic Capacitor 100 Capacitors generally have ESR (equivalent series resistance) Unstable region and it operates stably in the ESR-IOUT area shown on the right. 10 Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the Ω] ESR of the capacitor to be used and use it within the stability R[ 1 S area range shown in the right graph for evaluation of the actual E application. 0.1 Stable region 0.01 0 50 100 150 200 IOUT[mA] Figure 94. Stability area characteristics (Example) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 29/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Power Dissipation (Pd) As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) P MAX=(VIN-VOUT)×IOMAX Where : VIN=Input voltage VOUT= Output voltage IOMAX: Maximum output current) ○Measurement conditions Standard ROHM Board Layout of Board for Measurement Top Layer (Top View) IC Implementation Position Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Board Size 70 mm x 70 mm x 1.6 mm Top layer Metal (GND) wiring rate: Approx. 0% Wiring Rate Bottom layer Metal (GND) wiring rate: Approx. 50% Through Hole Diameter 0.5mm x 6 holes Power Dissipation 0.54W Thermal Resistance θja=185.2℃/W 0.6 0.5 0.54W Standard ROHM 0.4 board W) d ( 0.3 * Please design the margin so that P PMAX is less than Pd (PMAX<Pd) within 0.2 the usage temperature range 0.1 0 0 25 50 75 100 105 125 Ta (℃) Figure 95. SSOP5 Power dissipation heat reduction characteristics (Reference) www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 30/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●I/O Equivalence Circuits 5pin (VOUT) 2pin (GND) 3pin (STBY) 1pin (VIN) VVIINN VVOOUUTT Figure 96. Input / Output equivalent circuit www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 31/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Operational Notes 1) Absolute maximum ratings This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. 2) GND Potential GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Setting of Heat Carry out the heat design that have adequate margin considering Pd of actual working states. 4) Pin Short and Mistake Fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC may be burned up. 5) Actions in Strong Magnetic Field Using the IC within a strong magnetic field may cause the IC to malfunction. 6) Mutual Impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum. 7) STBY Pin Voltage To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more. Setting STBY to a voltage between 0.5 and 1.1 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8) Over Current Protection Circuit Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid applications to where the over current protection circuit operates continuously. 9) Thermal Shutdown This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175℃, the output is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not recommended that you design application where TSD will work in normal condition. 10) Actions under Strong light A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like sunrays or halogen lamps. 11) Output capacitor To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 94. It operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved. www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 32/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Ordering Information B U x x S D 2 M G - M T R ROHM Output voltage Series name Package Grade Packaging and forming specifications Part No. xx=12:1.2V SD2M:High-speed G: SSOP5 M;Automotive TR:Embossed tape and reel xx=15:1.5V load response Accessories (SSOP5) xx=18:1.8V 　 xx=25:2.5V Low noise xx=28:2.8V xx=30:3.0V 　 Shutdown SW xx=33:3.3V ●Marking Diagram SSOP5(TOP VIEW) Part Number Marking xx Output Voltage Marking ｘ 12 1.2V typ. M3 15 1.5V typ. NV ｘ 18 1.8V typ. M4 25 2.5V typ. M5 28 2.8V typ. NW LOT Number 30 3.0V typ. NX 33 3.3V typ. NY www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 33/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Physical Dimension Tape and Reel Information Package Name SSOP5 www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 34/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett BUxxSD2-M series ●Revision History Date Revision Changes 21.Dec.2012 001 New Release 1) 4 devices (1.5V,2.8V,3.0V,3.3V) are added to the Output Voltage Lineup. 19.Mar.2013 002 2) Some graphs are added to the Reference data. 17.Feb.2014 003 Graphs about BU33SD2 are added to the Reference data. www.rohm.com TSZ02201-0RBR0A300020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 35/35 TSZ22111・15・001 2014.02.17 Rev.003

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.

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