Datasheet CMOS LDO Regulator Series for Portable Equipments Versatile Package FULL CMOS LDO Regulator BUxxTD3WG series ●General Description ●Key Specifications BUxxTD3WG series is high-performance FULL CMOS (cid:132) Output voltage: 1.0V to 3.4V regulator with 200-mA output, which is mounted on (cid:132) Accuracy output voltage: ±1.0% (±25mV) versatile package SSOP5 (2.9 mm × 2.8 mm × 1.25 mm). (cid:132) Low current consumption: 35μA It has excellent noise characteristics and load (cid:132) Operating temperature range: -40°C to +85°C responsiveness characteristics despite its low circuit current consumption of 35μA. It is most appropriate for ●Applications various applications such as power supplies for logic IC, Battery-powered portable equipment, etc. RF, and camera modules.ROHM’s. ●Package SSOP5: 2.90mm x 2.80mm x 1.25mm ●Features (cid:132) High accuracy detection (cid:132) low current consumption (cid:132) Compatible with small ceramic capacitor(Cin=Co=0.47uF) (cid:132) With built-in output discharge circuit (cid:132) High ripple rejection (cid:132) ON/OFF control of output voltage (cid:132) With built-in over current protection circuit and thermal shutdown circuit (cid:132) Package SSOP5 is similar to SOT-23-5 (JEDEC) (cid:132) Low dropout voltage ●Typical Application Circuit STBY STBY VOUT VOUT VIN VIN GND GND GND Fig.1 Application Circuit ○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･14･001 1/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet ●Connection Diagram SSOP5 VOUT N.C. Lot. No Marking VIN GND STBY TOP VIEW ●Pin Descriptions SSOP5 PIN No. Symbol Function 1 VIN Power Supply Voltage 2 GND Grouding ON/OFF control of output voltage 3 STBY (High: ON, Low: OFF) 4 N.C. Unconnected Terminal 5 VOUT Output Voltage ●Ordering Information B U x x T D 3 W G - ｘ T R Part Output Voltage Series with Package Halogen Free Packageing and forming specification Number 10 : 1.0V Maximum Output Current output discharge G : SSOP5 G : compatible Embossed tape and reel 200mA Blank : incompatible TR : The pin number 1 is the upper right 34 : 3.4V SSOP5 2.9±0.2 4°+−64°° 5 4 ±2.80.2 +0.21.6−0.1 Min. 1 2 3 0.2 0.13+−00..0053 Max. 1.25 +0.05 ±1.10.05 ±0.050.05 0.95 0.01.42−0.04 (Unit : mm) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 2/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet ●Lineup Marking F0 L6 F1 M0 L5 F2 F3 F4 F5 Output Voltage 1.0V 1.1V 1.2V 1.25V 1.3V 1.5V 1.8V 1.85V 1.9V Part Number BU10 BU11 BU12 BU1C BU13 BU15 BU18 BU1J BU19 F6 F7 F8 F9 G0 G1 G2 G3 G4 2.0V 2.1V 2.5V 2.6V 2.7V 2.8V 2.85V 2.9V 3.0V BU20 BU21 BU25 BU26 BU27 BU28 BU2J BU29 BU30 G5 G6 G7 G8 3.1V 3.2V 3.3V 3.4V BU31 BU32 BU33 BU34 ●Absolute Maximum Ratings (Ta=25°C) PARAMETER Symbol Limit Unit Power Supply Voltage VMAX -0.3 ～ +6.5 V Power Dissipation Pd 540(*1) mW Maximum junction temperature TjMAX +125 ℃ Operating Temperature Range Topr -40 ～ +85 ℃ Storage Temperature Range Tstg -55 ～ +125 ℃ (*1)Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6 mm glass-epoxy PCB. ● RECOMMENDED OPERATING RANGE (not to exceed Pd) PARAMETER Symbol Limit Unit Power Supply Voltage VIN 1.7～6.0 V Maximum Output Current IMAX 200 mA ●OPERATING CONDITIONS PARAMETER Symbol MIN. TYP. MAX. Unit CONDITION Input Capacitor Cin 0.22(*2) 0.47 - μF Ceramic capacitor recommended Output Capacitor Co 0.22(*2) 0.47 - μF (*2)Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time progresses characteristic. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 3/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet ●Electrical Characteristics (Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.) Limit PARAMETER Symbol Unit Conditions MIN. TYP. MAX. Overall Device VOUT×0.99 VOUT×1.01 IOUT=10μA, VOUT≧2.5V Output Voltage VOUT VOUT V VOUT-25mV VOUT+25mV IOUT=10μA, VOUT＜2.5V Operating Current IIN - 35 60 μA IOUT=0mA Operating Current (STBY) ISTBY - - 1.0 μA STBY=0V Ripple Rejection Ratio RR 45 70 - dB VRR=-20dBv, fRR=1kHz, IOUT=10mA - 800 1100 mV 1.0V≦VOUT＜1.2V(IOUT=200mA) - 600 900 mV 1.2V≦VOUT＜1.5V(IOUT=200mA) - 440 700 mV 1.5V≦VOUT＜1.8V(IOUT=200mA) - 380 600 mV 1.8V≦VOUT＜2.5V(IOUT=200mA) Dropout Voltage VSAT - 280 540 mV 2.5V≦VOUT≦2.6V(IOUT=200mA) - 260 500 mV 2.7V≦VOUT≦2.85V(IOUT=200mA) - 240 460 mV 2.9V≦VOUT≦3.1V(IOUT=200mA) - 220 420 mV 3.2V≦VOUT≦3.4V(IOUT=200mA) Line Regulation VDL - 2 20 mV VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA Load Regulation VDLO - 10 80 mV IOUT=0.01mA to 100mA Over Current Protection (OCP) Limit Current ILMAX 220 400 700 mA Vo=VOUT*0.95 Short Current ISHORT 20 70 150 mA Vo=0V Standby Block Discharge Resistor RDSC 20 50 80 Ω VIN=4.0V, STBY=0V, VOUT=4.0V STBY Pin Pull-down Current ISTB 0.1 0.6 2.0 μA STBY=1.5V ON VSTBH 1.2 - 6.0 V STBY Control Voltage OFF VSTBL -0.3 - 0.3 V This product is not designed for protection against radioactive rays. (*3) VIN=2.5V for VOUT≦1.5V (*4) VIN=2.5V to 3.6V for VOUT≦1.5V ●Block Diagrams VIN VIN 1 VREF Cin VOUT VOUT 5 GND 2 OCP Co TSD STBY STBY STBY Discharge Cin･･･0.47μF (Ceramic) 3 Co ･･･0.47μF (Ceramic) Fig. 2 Block Diagrams BU18TD3WG ●Reference data (Ta=25ºC unless otherwise specified.) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 4/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet 2.0 1.85 100 1.8 Temp=25°C 1.84 Temp=25°C VIN=STBY Io=0uA VIN=STBY Output Voltage (V) 0001111.......4680246 IIIIoooo====10520u000Am0umAAA Output Voltage (V) 1111111.......77788887890123 IIoo==01u0A0uA Gnd Current (uA) 24680000 TTeemmpp==8255°°CC 0.2 VIN=STBY 1.76 IIoo==5200m0mAA Temp=-40°C 0.0 1.75 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Input Voltage (V) Input Voltage (V) Fig 3. Output Voltage Fig 4. Line Regulation Fig 5. Circuit Current IGND 1.6 100 1.85 STBY Pin Current (uA) 000111......468024 Temp=25°TCemp=85°C Temp=-40°C Gnd Current (uA) 24680000 SVTIBNY==21.8.T5VVemp=25T°eCmp=85T°eCmp=-40°C Output Voltage (V) 11111111........7778888878901234 Temp=-40°C Temp=25°C Temp=85°CSVTIBNY==21.8.5VV 0.2 1.76 0.0 0 1.75 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0 0.05 0.1 0.15 0.2 0 0.05 0.1 0.15 0.2 Input Voltage (V) Output Current (A) Output Current (A) Fig 6. VSTBY - ISTBY Fig 7. IOUT - IGND Fig 8. Load Regulation 1.85 2.0 2.0 VIN=2.8V 1.8 VIN=3.8V 1.84 STBY=1.5V Output Voltage (V) 0001111.......4680246 VIN=5.5V VIN=2.3VTVINe=m2p.=8V25°C Output Voltage (V) 011...505 Io=0mTTeeAmmpp==2855°°CC Temp=-40°C Output Voltage (V) 1111111.......77788887890123 Io=0.1mA 0.2 STBY=1.5V 1.76 0.0 0.0 1.75 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 0.5 1 1.5 -40 -15 10 35 60 85 Output Current (mA) STBY Voltage (V) Temp (°C) Fig 9. OCP Threshold Fig 10. STBY Threshold Fig 11. VOUT - Temp 60 1.0 A) 50 SVTIIoBN=Y=0=m21.A8.5VV A) 00..89 SVTINB=Y2=.08VV nt (u 40 nt (u 00..67 e e urr 30 urr 0.5 nd C 20 nd C 00..34 G G 10 0.2 0.1 0 0.0 -40 -15 10 35 60 85 -40 -15 10 35 60 85 Temp (°C) Temp (°C) Fig 12. IGND - Temp Fig 13. IGND - Temp (STBY) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 5/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet BU18TD3WG ●Reference data (Ta=25ºC unless otherwise specified.) Output Voltage (V) 1111....77885005 IOUT=0mA→50mA 15000 0 Output Current (mA) Output Voltage (V) 1111....87890550 IOUT=50mA→0mA 15000 0 Output Current (mA) Fig 14. Load Response Fig 15. Load Response Output Voltage (V) 1111....77885005 IOUT=0mA→100mA 15000 0 Output Current (mA) Output Voltage (V) 1111....87890550 IOUT=100mA→0mA 15000 0 Output Current (mA) Fig 16. Load Response Fig 17. Load Response Output Voltage (V) 1111....76890000 IOUT=0mA→200mA 21000 00 Output Current (mA) Output Voltage (V) 1112....87900000 IOUT=200mA→0mA 21000 00 Output Current (mA) Fig 18. Load Response Fig 19. Load Response O O IOUT=50mA→100mA 15000 0 utput Current (m IOUT=100mA→50mA 15000 0 utput Current (m A A ) ) V) 1.90 V) 1.85 Voltage ( 1.80 Voltage (1.80 Output 11..7600 Output 11..7750 Fig 20. Load Response Fig 21. Load Response www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 6/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet BU18TD3WG ●Reference data (Ta=25ºC unless otherwise specified.) 2.0 STB 2.0 STB STBY=0→1.5V 10..00 Y Voltage (V STBY=0→1.5V 10..00 Y Voltage (V ) ) Voltage (V) 12..00 Voltage (V) 12..00 Output 0.0 Output 0.0 Fig 22. Start Up Time Fig 23. Start Up Time Iout=0mA Iout=200mA 4.0 STB 4.0 STB Y Y VIN=STBY=0→2.8V 2.0 Voltag VIN=STBY=2.8→0V 2.0 Voltag 0.0 e (V 0.0 e (V ) ) Output Voltage (V) 012...000 Output Voltage (V) 012...000 Fig 24. Start Up Time Fig 25. Start Up Time (VIN=STBY) Iout=0mA (VIN=STBY) Iout=200mA Iout=0mA STBY=1.5→0V 120...000 STBY Voltage (V) VIN=2.8V→3.8V→2.8V 342...888 Input Voltage (V) Output Voltage (V) 012...000 utput Voltage (V) 111...788901 O1.78 Fig 26. Discharge Time Fig 27. VIN Response www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 7/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet (cid:122) About power dissipation (Pd) As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current) (cid:123) Measurement conditions Standard ROHM Board Layout of Board for Measurement Top Layer (Top View) IC Implementation Position Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Board Size 70 mm x 70 mm x 1.6 mm Top layer Metal (GND) wiring rate: Approx. 0% Wiring Bottom Rate Metal (GND) wiring rate: Approx. 50% layer Through Hole Diameter 0.5mm x 6 holes Power Dissipation 0.54W Thermal Resistance θja=185.2°C/W 0.6 0.5 0.54W Standard ROHM 0.4 Board W]0.3 d[ * Please design the margin so that P 0.2 PMAX becomes is than Pd (PMAX<Pd) within the usage temperature range 0.1 0 0 25 50 7 5 85 100 125 Ta [℃] Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 8/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet ●Operation Notes 1.) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2.) GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than GND to any pin, even if only transiently. 3.) Thermal design Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions. 4.) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result in damage to the IC. 5.) Operation in strong electromagnetic fields Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 6.) Common impedance Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a minimum. 7.) Voltage of STBY pin To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8.) Over-current protection circuit (OCP) This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 9.) Thermal shutdown circuit (TSD) This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds about 150℃. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 10.) Input/output capacitor Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with long or winding power supply traces. The output capacitance value is directly related to the overall stability and transient response of the regulator, and should be set to the largest pUonssstiabbllee vraelgueio fno r the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application.(Please refer the technical note, regarding ceramic capacitor of recommendation) Cout=0.47μF, Cin=0.47μF, Temp=+25℃ 11.) About the equivalent series resistance (ESR) of a ceramic capacitor 100 Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic 10 capacitors, etc. generally have different ESR, please check Ω]Ω] tshtea bEiSlRi toyf atrheea craapnagcei tsohro wtno ibne tuhsee dr iagnhdt ugsrea piht fwoirt heivna ltuhaet ion SR　[ESR [ 1 E of the actual application. 0.1 0.01 0 50 100 150 200 IOUT [mA] Fig. 29 Stable region (example) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 9/10 21.AUG.2013.Rev.003

BUxxTD3WG series Datasheet ●Revision History Date Revision Changes 7.Feb.2013 001 New Release Adding a Revision History. 30.Jul.2013 002 VSBYH is changed. ELECTRICAL CHARACTERISTICS of each Output Voltageis removed. 21.AUG.2013 003 Adding dropout voltage. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111･15･001 10/10 21.AUG.2013.Rev.003

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.