T1610, T1635, T1650 BTA16, BTB16 Datasheet Snubberless™, logic level and standard 16 A Triacs Features A2 • Medium current Triac • Low thermal resistance with clip bonding G • Low thermal resistance insulation ceramic for insulated BTA A1 • High commutation (4Q) or very high commutation (3Q, Snubberless™) A2 capability • BTA series UL1557 certified (file ref: 81734) • Packages are RoHS (2002/95/EC) compliant G G A2 A2 A1 A1 • Insulated tab (BTA series, rated at 2500 VRMS) TO-220AB TO-220AB Ins. A2 Applications • Snubberless versions (BTA/BTB...W and T1635) especially recommended for A2 G use on inductive loads, because of their high commutation performances A1 D²PAK • On/off or phase angle function in applications such as static relays, light dimmers and appliance motor speed controllers Description Available either in through-hole or surface mount packages, the BTA16, BTB16 and T1610, T1635 and T1650 Triac series are suitable for general purpose mains power AC switching. They can be used as ON/OFF function in applications such as static relays, heating regulation or induction motor starting circuit. They are also Product status link recommended for phase control operations in light dimmers and appliance motors speed controllers. BTA16 The Snubberless™ versions (W suffix and T1610, T1635, T1650) are especially BTB16 recommended for use on inductive loads, because of their high commutation T1610 performance. T1635 By using an internal ceramic pad, the Snubberless™ series provide an insulated tab (rated at 2500 V ) complying with UL standards (file reference: E81734). RMS T1650 Product summary IT(RMS) 16 A VDRM/VRRM 600, 800 V IGTSnubberless™ 10, 35, 50 mA IGTstandard 25, 50 mA DS2114 - Rev 11 - May 2018 www.st.com For further information contact your local STMicroelectronics sales office.

T1610, T1635, T1650, BTA16, BTB16 Characteristics 1 Characteristics Table 1. Absolute maximum ratings Symbol Parameters Value Unit TO-220AB, D2PAK Tc = 100 °C IT(RMS) RMS on-state current (full sine wave) 16 A TO-220AB Ins. Tc = 86 °C Non repetitive surge peak on-state current (full cycle, F = 50 Hz tp = 20 ms 160 ITSM Tj initial = 25 °C) F = 60 Hz tp = 16.7 ms 168 A I2t I2t value for fusing tp = 10 ms 144 A2s Critical rate of rise of on-state current dl/dt F = 120 Hz Tj = 125 °C 50 A/µs IG = 2 x IGT , tr ≤ 100 ns VDSM/VRSM Non repetitive surge peak off-state voltage tp = 10 ms Tj = 25 °C VDRM/VRRM + V 100 IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A PG(AV) Average gate power dissipation Tj = 125 °C 1 W Tstg Storage junction temperature range -40 to +150 °C Tj Operating junction temperature range -40 to +125 °C Table 2. Static electrical characteristics Symbol Test conditions Tj Value Unit VT(1) ITM = 22.5 A, tp = 380 µs 25 °C Max. 1.55 V VTO(1) threshold on-state voltage 125 °C Max. 0.85 V RD(1) Dynamic resistance 125 °C Max. 25 mΩ 25 °C 5 µA IDRM/IRRM VDRM = VRRM Max. 125 °C 2 mA 1. For both polarities of A2 referenced to A1 Table 3. Electrical characteristics (T = 25 °C, unless otherwise specified) - standard (4 quadrants) j BTA16 Symbol Parameters Quadrant BTB16 Unit C B I - II - III 25 50 IGT(1) Max. mA VD = 12 V, RL = 33 Ω IV 50 100 VGT All Max. 1.3 V VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C All Min. 0.2 V IH(2) IT = 500 mA Max. 25 50 mA I - III - IV Max. 40 60 IL IG = 1.2 IGT mA II Max. 80 120 DS2114 - Rev 11 page 2/18

T1610, T1635, T1650, BTA16, BTB16 Characteristics BTA16 Symbol Parameters Quadrant BTB16 Unit C B dV/dt(2) VD = 67 % VDRM gate open, Tj = 125 °C Min. 200 400 V/µs (dV/dt)c(2) (dI/dt)c = 7 A/ms, Tj = 125 °C Min. 5 10 V/µs 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 4. Electrical characteristics (T = 25 °C, unless otherwise specified) - Snubberless and logic level (3 j quadrants) T1610 / BTA16- T1635 / T1650 / Symbol Parameters Quadrant SW / BTB16- BTA16-CW / BTA16-BW / Unit SW BTB16-CW BTB16-BW IGT(1) Max. 10 35 50 mA VD = 12 V, RL = 30 Ω VGT I - II - III Max. 1.3 V VGD VD = VDRM, RL = 3,3 kΩ, Tj = 125 °C Min. 0.2 V IH(2) IT = 500 mA Max. 15 35 50 mA I - III Max. 25 50 70 IL IG = 1.2 IGT mA II Max. 30 60 80 (dV/dt)(2) VD = 67 % VDRM gate open, Tj = 125 °C Min. 40 500 1000 V/µs (dV/dt)c = 0.1 V/μs, Tj = 125 °C 8.5 (dI/dt)c(2) (dV/dt)c = 10 V/μs, Tj = 125 °C Min. 3.0 A/ms Without snubber, Tj = 125 °C 8.5 14 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 5. Thermal resistance Symbol Parameters Value Unit TO-220AB / D²PAK 1.2 Rth(j-c) Max. junction to case (AC) TO-220AB insulated 2.1 °C/W Junction to ambient (S = 2 cm²) D²PAK 45 Rth(j-a) Junction to ambient TO-220AB / TO-220AB ins 60 1. Copper surface under tab. DS2114 - Rev 11 page 3/18

T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Maximum power dissipation versus on-state Figure 3. RMS on-state current versus case temperature RMS current (full cycle) (full cycle) P(W) IT(RMS)(A) 20 18 18 16 16 BTB/T16 14 14 BTA 12 12 10 10 8 8 6 6 4 4 02 IT(RMS)(A) 02 Tc(°C) 0 2 4 6 8 10 12 14 16 0 25 50 75 100 125 Figure 4. On-state rms current versus ambient Figure 5. Relative variation of thermal impedance versus temperature (full cycle) pulse duration IT(RMS)(A) K = [Zth/Rth] 4.0 1E+0 3.5 Zth(j-c) D²PAK Printed circuit board FR4, copper thickness: 35 µm 3.0 (S = 1 cm²) 2.5 Zth(j-a) 2.0 1E-1 1.5 1.0 0.5 Tc(°C) tp(s) 0.0 1E-2 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 DS2114 - Rev 11 page 4/18

T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) Figure 7. Surge peak on-state current versus number of Figure 6. On-state characteristics (maximum values) cycles 200 ITM(A) ITSM(A) 180 100 VtoT j= m 0a.8x5. V Tj = Tj max. 160 Rd = 25 mΩ 140 t=20ms 120 Non repetitive One cycle Tjinitial=25°C 100 10 Tj = 25 °C 80 Repetitive TC=85°C 60 40 20 VTM(V) Number of cycles 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 10 100 1000 Figure 8. Non-repetitive surge peak on-state current for a Figure 9. Relative variation of gate trigger current sinusoidal I , I , I[Tj] / I , I , I[T = 25 °C] GT H L GT H L j 2.5 ITSM(A),I 2t (A 2s) holding current and latching current versus junction 3000 temperature (typical values) dI/dt limitation: Tjinitial=25°C 2.0 50A/µs IGT 1.5 1000 ITSM 1.0 IH& IL 0.5 Tj(°C) 0.0 pulse with width t < 10 ms tp(ms) -40 -20 02 04 06 08 0 100 120 140 100 p 0.01 0.10 1.00 10.00 Figure 10. Relative variation of critical rate of decrease of Figure 11. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) main current versus (junction temperature (typical values) (dl/dt)c [(dV/dt)c] / specified (dl/dt)c (dl/dt)c [Tj] / (dl/dt)c [Tj specified] 2.0 6 SW/T1610 Snubberless and logic level types 1.8 C 5 1.6 B 4 1.4 1.2 T1635/T1650/CW/BW 3 1.0 2 0.8 0.6 1 (dV/dt)c (V/µs) Tj(°C) 0.4 0 0.1 1.0 10.0 100.0 0 25 50 75 100 125 DS2114 - Rev 11 page 5/18

T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) Figure 12. D²PAK thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 80 D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40 DS2114 - Rev 11 page 6/18

T1610, T1635, T1650, BTA16, BTB16 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS2114 - Rev 11 page 7/18

T1610, T1635, T1650, BTA16, BTB16 TO-220AB Insulated and non Insulated package information 2.1 TO-220AB Insulated and non Insulated package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) • Recommended torque value: 0.55 N·m • Maximum torque value: 0.70 N·m Figure 13. TO-220AB Insulated and non Insulated package outline B C b2 I Resin gate 0.5 mm max. protusion(1) L F A I4 l3 c2 a1 l2 a2 M c1 b1 Resin gate 0.5 mm max. protusion(1) e (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. DS2114 - Rev 11 page 8/18

T1610, T1635, T1650, BTA16, BTB16 TO-220AB Insulated and non Insulated package information Table 6. TO-220ABInsulated and non Insulated package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 15.20 15.90 0.5984 0.6260 a1 3.75 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.40 16.80 0.6220 0.6457 0.6614 M 2.6 0.1024 1. Inch dimensions are for reference only. DS2114 - Rev 11 page 9/18

T1610, T1635, T1650, BTA16, BTB16 D²PAK package information 2.2 D²PAK package information Figure 14. D²PAK package outline A E1 E c2 E2 2 L 1 D D H 2 D 3 L b2 Resin gate e b 0.5 mm max. protrusion(1) G A1 A2 A3 L R Gauge Plane c V2 (1) Resin gate position accepted in one of the two positions or in the symmetrical opposites DS2114 - Rev 11 page 10/18

T1610, T1635, T1650, BTA16, BTB16 D²PAK package information Table 7. D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 A3 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 0.1 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R 0.40 0.0157 V2 0° 8° 0° 8° 1. Dimensions in inches are given for reference only DS2114 - Rev 11 page 11/18

T1610, T1635, T1650, BTA16, BTB16 D²PAK package information Figure 15. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 3.70 8.90 DS2114 - Rev 11 page 12/18

T1610, T1635, T1650, BTA16, BTB16 Ordering information 3 Ordering information Figure 16. Ordering information scheme (BTA16 and BTB16 series) BT A 16 - 600 BW (RG) Triac Insulation A = Insulated B = Non-insulated Current 16 = 16 A Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA BW = 50 mA Snubberless™ C = 25 mA standard CW = 35 mA Snubberless™ SW = 10 mA logic level Packing mode RG = Tube DS2114 - Rev 11 page 13/18

T1610, T1635, T1650, BTA16, BTB16 Ordering information Figure 17. Ordering information scheme (T8 series) T 16 35 - 600 G (-TR) Triac series Current 16 = 16 A Sensitivity 10 = 10 mA 35 = 35 mA 50 = 50 mA Voltage 600 = 600 V 800 = 800 V Package G = D²PAK Packing mode Blank = Tube TR = Tape and reel DS2114 - Rev 11 page 14/18

T1610, T1635, T1650, BTA16, BTB16 Product selector 3.1 Product selector Table 8. Product selector Part Number Sensitivity Type Package 600 800 BTB16-600C 35 mA Standard TO-220AB BTB16-600B BTB16-800B 50 mA Standard TO-220AB BTB16-600SW BTB16-800SW 10 mA Snubberless™ TO-220AB BTB16-600CW BTB16-800CW 35 mA Snubberless™ TO-220AB BTB16-600BW BTB16-800BW 50 mA Snubberless™ TO-220AB BTA16-600C 35 mA Standard TO-220AB Ins. BTA16-600B BTA16-800B 50 mA Standard TO-220AB Ins. BTA16-600SW BTA16-800SW 10 mA Snubberless™ TO-220AB Ins. BTA16-600CW BTA16-800CW 35 mA Snubberless™ TO-220AB Ins. BTA16-600BW BTA16-800BW 50 mA Snubberless™ TO-220AB Ins. T1610-600G T1610-800G 10 mA Snubberless™ D2PAK T1635-600G T1635-800G 35 mA Snubberless™ D2PAK T1650-600G 50 mA Snubberless™ D2PAK DS2114 - Rev 11 page 15/18

T1610, T1635, T1650, BTA16, BTB16 Ordering information 3.2 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty. Delivery mode BTA16-600BRG BTA16-600B BTA16-600BWRG BTA16-600BW BTA16-600CRG BTA16-600C BTA16-600CWRG BTA16-600CW BTA16-600SWRG BTA16-600SW TO-220AB Ins. Tube BTA16-800BRG BTA16-800B BTA16-800BWRG BTA16-800BW BTA16-800CWRG BTA16-800CW BTA16-800SWRG BTA16-800SW 2.30 50 BTB16-600BRG BTB16-600B BTB16-600BWRG BTB16-600BW BTB16-600CRG BTB16-600C BTB16-600CWRG BTB16-600CW BTB16-600SWRG BTB16-600SW TO-220AB Tube BTB16-800BRG BTB16-800B BTB16-800BWRG BTB16-800BW BTB16-800CWRG BTB16-800CW BTB16-800SWRG BTB16-800SW T1610-600G-TR T1610-600G T1610-800G-TR T1610-800G T1635-600G-TR T1635-600G 1000 Tape and reel D²PAK 1.50 T1635-800G-TR T1635-800G T1650-600G-TR T1650-600G T1635-600G T1635-600G 50 Tube DS2114 - Rev 11 page 16/18

T1610, T1635, T1650, BTA16, BTB16 Revision history Table 10. Document revision history Date Revision Changes Oct-2002 6A Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement 13-Feb-2006 7 added. 03-Jul-2009 8 Added part number T1610. 04-Dec-2009 9 Updated value for VDSM / VRSM in Table 2. Updated temperature in Table 2 from 15 °C to 86 °C. 11-Mar-2010 10 Updated value for VDSM / VRSM in Table 2. Updated temperature in Table 2 from 15 °C to 86 °C. Updated Section ● Product status / summary. Added T1650 package 30-May-2018 11 information. DS2114 - Rev 11 page 17/18

T1610, T1635, T1650, BTA16, BTB16 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2114 - Rev 11 page 18/18