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DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D109 BSR30; BSR31; BSR33 PNP medium power transistors Product data sheet 2004 Dec 13 Supersedes data of 1999 Apr 26

NXP Semiconductors Product data sheet PNP medium power transistors BSR30; BSR31; BSR33 FEATURES PINNING • High current (max. 1 A) PIN DESCRIPTION • Low voltage (max. 80 V). 1 emitter 2 collector APPLICATIONS 3 base • Telephony and general industrial applications • Thick and thin-film circuits. DESCRIPTION 2 PNP medium power transistor in a SOT89 plastic package. 3 NPN complements: BSR40; BSR41 and BSR43. 1 MARKING 3 2 1 sym079 TYPE NUMBER MARKING CODE BSR30 BR1 BSR31 BR2 Fig.1 Simplified outline (SOT89) and symbol. BSR33 BR4 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION BSR30 SC-62 plastic surface mounted package; collector pad for good heat SOT89 BSR31 transfer; 3 leads BSR33 2004 Dec 13 2

NXP Semiconductors Product data sheet PNP medium power transistors BSR30; BSR31; BSR33 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V collector-base voltage open emitter CBO BSR30; BSR31 − −70 V BSR33 − −90 V V collector-emitter voltage open base CEO BSR30; BSR31 − −60 V BSR33 − −80 V V emitter-base voltage open collector − −5 V EBO I collector current (DC) − −1 A C I peak collector current − −2 A CM I peak base current − −200 mA BM P total power dissipation T ≤ 25 °C; note 1 − 1.35 W tot amb T storage temperature −65 +150 °C stg T junction temperature − 150 °C j T ambient temperature −65 +150 °C amb Note 1. Device mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 6 cm2. For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT R thermal resistance from junction to ambient note 1 93 K/W th(j-a) R thermal resistance from junction to soldering point 13 K/W th(j-s) Note 1. Device mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 6 cm2. For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”. 2004 Dec 13 3

NXP Semiconductors Product data sheet PNP medium power transistors BSR30; BSR31; BSR33 CHARACTERISTICS T = 25 °C unless otherwise specified. amb SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT I collector-base cut-off current I = 0 A; V = −60 V − −100 nA CBO E CB I = 0 A; V = −60 V; T = 150 °C − −50 μA E CB j I emitter-base cut-off current I = 0 A; V = −5 V − −100 nA EBO C EB h DC current gain I = −100 μA; V = −5 V; note 1 FE C CE BSR30 10 − BSR31; BSR33 30 − DC current gain I = −100 mA; V = −5 V; note 1 C CE BSR30 40 120 BSR31; BSR33 100 300 DC current gain I = −500 mA; V = −5 V; note 1 C CE BSR30 30 − BSR31; BSR33 50 − V collector-emitter saturation I = −150 mA; I = −15 mA; note 1 − −0.25 V CEsat C B voltage I = −500 mA; I = −50 mA; note 1 − −0.5 V C B V base-emitter saturation voltage I = −150 mA; I = −15 mA; note 1 − −1 V BEsat C B I = −500 mA; I = −50 mA; note 1 − −1.2 V C B f transition frequency I = −50 mA; V = −10 V; 100 − MHz T C CE f = 100 MHz Note 1. Pulse test: t = 300 μs; δ < 0.01. p 2004 Dec 13 4

NXP Semiconductors Product data sheet PNP medium power transistors BSR30; BSR31; BSR33 PACKAGE OUTLINE Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89 D B A bp3 E HE Lp 1 2 3 bp2 c w M bp1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp1 bp2 bp3 c D E e e1 HE Lp w 1.6 0.48 0.53 1.8 0.44 4.6 2.6 4.25 1.2 mm 3.0 1.5 0.13 1.4 0.35 0.40 1.4 0.23 4.4 2.4 3.75 0.8 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 04-08-03 SOT89 TO-243 SC-62 06-03-16 2004 Dec 13 5

NXP Semiconductors Product data sheet PNP medium power transistors BSR30; BSR31; BSR33 DATA SHEET STATUS DOCUMENT PRODUCT DEFINITION STATUS(1) STATUS(2) Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for General ⎯ Information in this document is believed to be extended periods may affect device reliability. accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, Terms and conditions of sale ⎯ NXP Semiconductors expressed or implied, as to the accuracy or completeness products are sold subject to the general terms and of such information and shall have no liability for the conditions of commercial sale, as published at consequences of use of such information. http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights Right to make changes ⎯ NXP Semiconductors infringement and limitation of liability, unless explicitly reserves the right to make changes to information otherwise agreed to in writing by NXP Semiconductors. In published in this document, including without limitation case of any inconsistency or conflict between information specifications and product descriptions, at any time and in this document and such terms and conditions, the latter without notice. This document supersedes and replaces all will prevail. information supplied prior to the publication hereof. No offer to sell or license ⎯ Nothing in this document Suitability for use ⎯ NXP Semiconductors products are may be interpreted or construed as an offer to sell products not designed, authorized or warranted to be suitable for that is open for acceptance or the grant, conveyance or use in medical, military, aircraft, space or life support implication of any license under any copyrights, patents or equipment, nor in applications where failure or malfunction other industrial or intellectual property rights. of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe Export control ⎯ This document as well as the item(s) property or environmental damage. NXP Semiconductors described herein may be subject to export control accepts no liability for inclusion and/or use of NXP regulations. Export might require a prior authorization from Semiconductors products in such equipment or national authorities. applications and therefore such inclusion and/or use is at Quick reference data ⎯ The Quick reference data is an the customer’s own risk. extract of the product data given in the Limiting values and Applications ⎯ Applications that are described herein for Characteristics sections of this document, and as such is any of these products are for illustrative purposes only. not complete, exhaustive or legally binding. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2004 Dec 13 6

NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/04/pp7 Date of release: 2004 Dec 13 Document order number: 9397 750 13873