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  • 型号: BSP122,115
  • 制造商: NXP Semiconductors
  • 库位|库存: xxxx|xxxx
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BSP122,115产品简介:

ICGOO电子元器件商城为您提供BSP122,115由NXP Semiconductors设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 BSP122,115价格参考。NXP SemiconductorsBSP122,115封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 N 沟道 200V 550mA(Ta) 1.5W(Ta) SC-73。您可以下载BSP122,115参考资料、Datasheet数据手册功能说明书,资料中有BSP122,115 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

ChannelMode

Enhancement

描述

MOSFET N-CH 200V 0.55A SOT223MOSFET TAPE-7 MOSFET

产品分类

FET - 单分离式半导体

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

Id-ContinuousDrainCurrent

550 mA

Id-连续漏极电流

550 mA

品牌

NXP Semiconductors

产品手册

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产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,NXP Semiconductors BSP122,115-

数据手册

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产品型号

BSP122,115

PCN封装

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PCN设计/规格

点击此处下载产品Datasheet

Pd-PowerDissipation

1500 mW

Pd-功率耗散

1.5 W

RdsOn-Drain-SourceResistance

1.7 Ohms

RdsOn-漏源导通电阻

1.7 Ohms

Vds-Drain-SourceBreakdownVoltage

200 V

Vds-漏源极击穿电压

200 V

Vgs-Gate-SourceBreakdownVoltage

+/- 20 V

Vgs-栅源极击穿电压

20 V

不同Id时的Vgs(th)(最大值)

2V @ 1mA

不同Vds时的输入电容(Ciss)

100pF @ 25V

不同Vgs时的栅极电荷(Qg)

-

不同 Id、Vgs时的 RdsOn(最大值)

2.5 欧姆 @ 750mA,10V

产品种类

MOSFET

供应商器件封装

SC-73

其它名称

568-6849-2
934019820115
BSP122 T/R
BSP122 T/R-ND
BSP122,115-ND

功率-最大值

1.5W

包装

带卷 (TR)

商标

NXP Semiconductors

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

TO-261-4,TO-261AA

封装/箱体

SOT-223-3

工厂包装数量

1000

晶体管极性

N-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

1,000

漏源极电压(Vdss)

200V

电流-连续漏极(Id)(25°C时)

550mA (Ta)

通道模式

Enhancement

配置

Single Dual Drain

零件号别名

BSP122 T/R

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PDF Datasheet 数据手册内容提取

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BSP122 N-channel enhancement mode vertical D-MOS transistor Product specification 2001 May 18 Supersedes data of 1997 Jun 23

Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor FEATURES QUICK REFERENCE DATA • Direct interface to C-MOS, TTL, SYMBOL PARAMETER MAX. UNIT etc. V drain-source voltage (DC) 200 V DS • High-speed switching I drain current (DC) 550 mA D • No secondary breakdown. R drain-source on-state resistance 2.5 W DSon V gate-source threshold voltage 2 V GSth DESCRIPTION N-channel enhancement mode vertical D-MOS transistor in a SOT223 package and intended for use as a line current interruptor in handbook, halfpage 4 d telephonesetsandforapplicationsin relay, high-speed and line transformer drivers. g PINNING - SOT223 1 2 3 s PIN DESCRIPTION Top view MAM054 1 gate 2 drain 3 source Fig.1 Simplified outline (SOT223) and symbol. 4 drain LIMITING VALUES In accordance with the Absolute Maximum System (IEC60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V drain-source voltage (DC) - 200 V DS V gate-source voltage (DC) open drain - – 20 V GSO I drain current (DC) - 550 mA D I peak drain current - 3 A DM P total power dissipation T £ 25(cid:176) C; note1 - 1.5 W tot amb T storage temperature - 55 +150 (cid:176) C stg T junction temperature - 150 (cid:176) C j Note 1. Transistor mounted on an epoxy printed circuit board, 40x40x1.5mm, mounting pad for the drain tab minimum 6cm2. THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT R thermal resistance from junction to ambient; note1 83.3 K/W th j-a Note 1. Transistor mounted on an epoxy printed circuit board, 40x40x1.5mm, mounting pad for the drain tab minimum 6cm2. 2001May18 2

Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor CHARACTERISTICS T = 25(cid:176) Cunless otherwise specified. j SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V drain-source breakdown voltage I =10m A; V =0 200 - - V (BR)DSS D GS I drain-source leakage current V =160V; V =0 - - 1 m A DSS DS GS I gate-source leakage current V =– 20V; V =0 - - 100 nA GSS GS DS V gate-source threshold voltage I =1mA; V =V 0.4 - 2 V GSth D GS DS R drain-source on-resistance I =750mA; V =10V - 1.7 2.5 W DSon D GS I =20mA; V =2.4V - 3 - W D GS (cid:247) Y Œ transfer admittance I =750mA; V =25V 400 900 - mS fs D DS C input capacitance V =25V; V =0; f=1MHz - 100 - pF iss DS GS C output capacitance V =25V; V =0; f=1MHz - 20 - pF oss DS GS C reverse transfer capacitance V =25V; V =0; f=1MHz - 10 - pF rss DS GS Switching times (see Figs2and3) t turn-on time I =750mA; V =50V; - 10 20 ns on D DD V =0to10V GS t turn-off time I =750mA; V = 50V; - 45 60 ns off D DD V =0 to 10V GS handbook, halfpage 90 % handbook, halfpage VDD = 50 V INPUT 10 % 90 % 10 V OUTPUT ID 0 V 10 % 50 W ton toff MBB691 MBB692 VDD=50V. Fig.2 Switching times test circuit. Fig.3 Input and output waveforms. 2001May18 3

Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223 D B E A X c y HE v M A b1 4 Q A A1 1 2 3 Lp e1 bp w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y 1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95 mm 4.6 2.3 0.2 0.1 0.1 1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION 97-02-28 SOT223 SC-73 99-09-13 2001May18 4

Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor DATA SHEET STATUS PRODUCT DATA SHEET STATUS(1) DEFINITIONS STATUS(2) Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to makechanges at any time in order to improve the design, manufacturing and supply. Changes will be communicatedaccording to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification(cid:190) The data in a short-form Life support applications(cid:190) These products are not specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or same type number and title. For detailed information see systems where malfunction of these products can the relevant data sheet or data handbook. reasonablybeexpectedtoresultinpersonalinjury.Philips Semiconductorscustomersusingorsellingtheseproducts Limitingvaluesdefinition(cid:190) Limitingvaluesgivenarein for use in such applications do so at their own risk and accordance with the Absolute Maximum Rating System agree to fully indemnify Philips Semiconductors for any (IEC60134). Stress above one or more of the limiting damages resulting from such application. values may cause permanent damage to the device. These are stress ratings only and operation of the device Right to make changes(cid:190) Philips Semiconductors attheseoratanyotherconditionsabovethosegiveninthe reservestherighttomakechanges,withoutnotice,inthe Characteristicssectionsofthespecificationisnotimplied. products, including circuits, standard cells, and/or Exposure to limiting values for extended periods may software, described or contained herein in order to affect device reliability. improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for Application information(cid:190) Applications that are theuseofanyoftheseproducts,conveysnolicenceortitle described herein for any of these products are for under any patent, copyright, or mask work right to these illustrative purposes only. Philips Semiconductors make products,andmakesnorepresentationsorwarrantiesthat norepresentationorwarrantythatsuchapplicationswillbe these products are free from patent, copyright, or mask suitable for the specified use without further testing or work right infringement, unless otherwise specified. modification. 2001May18 5

Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor NOTES 2001May18 6

Philips Semiconductors Product specification N-channel enhancement mode BSP122 vertical D-MOS transistor NOTES 2001May18 7

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