Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor FEATURES SYMBOL QUICK REFERENCE DATA • Very low threshold voltage d V = 20 V DS • Fast switching • Logic level compatible I = 1.05 A D • Subminiature surface mount package R £ 250 mW (V = 2.5 V) g DS(ON) GS V ‡ 0.4 V GS(TO) s GENERAL DESCRIPTION PINNING SOT23 N-channel, enhancement mode, PIN DESCRIPTION logic level, field-effect power transistor.Thisdevicehasverylow 1 gate 3 threshold voltage and extremely Top view fast switching making it ideal for 2 source battery powered applications and highspeeddigitalinterfacing. 3 drain The BSH105 is supplied in the 1 2 SOT23 subminiature surface mountingpackage. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V Drain-source voltage - 20 V DS V Drain-gate voltage R = 20 kW - 20 V DGR GS V Gate-source voltage - – 8 V GS I Drain current (DC) T = 25 ˚C - 1.05 A D a T = 100 ˚C - 0.67 A a I Drain current (pulse peak value) T = 25 ˚C - 4.2 A DM a P Total power dissipation T = 25 ˚C - 0.417 W tot a T = 100 ˚C - 0.17 W a T , T Storage & operating temperature - 55 150 ˚C stg j THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R Thermal resistance junction to FR4 board, minimum 300 - K/W th j-a ambient footprint August 1998 1 Rev 1.000

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor ELECTRICAL CHARACTERISTICS T= 25˚C unless otherwise specified j SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V Drain-source breakdown V = 0 V; I = 10 m A 20 - - V (BR)DSS GS D voltage V Gate threshold voltage V = V ; I = 1 mA 0.4 0.57 - V GS(TO) DS GS D T = 150˚C 0.1 - - V j R Drain-source on-state V = 4.5 V; I = 0.6 A - 140 200 mW DS(ON) GS D resistance V = 2.5 V; I = 0.6 A - 180 250 mW GS D V = 1.8 V; I = 0.3 A - 240 300 mW GS D V = 2.5 V; I = 0.6 A; T = 150˚C - 270 375 mW GS D j g Forward transconductance V = 16 V; I = 0.6 A 0.5 1.6 - S fs DS D I Gate source leakage current V = – 8 V; V = 0 V - 10 100 nA GSS GS DS I Zero gate voltage drain V = 16 V; V = 0 V; - 50 100 nA DSS DS GS current T = 150˚C - 1.3 10 m A j Q Total gate charge I = 1 A; V = 20 V; V = 4.5 V - 3.9 - nC g(tot) D DD GS Q Gate-source charge - 0.4 - nC gs Q Gate-drain (Miller) charge - 1.4 - nC gd t Turn-on delay time V = 20 V; I = 1 A; - 2 - ns d on DD D t Turn-on rise time V = 8 V; R = 6 W - 4.5 - ns r GS G t Turn-off delay time Resistive load - 45 - ns d off t Turn-off fall time - 20 - ns f C Input capacitance V = 0 V; V = 16 V; f = 1 MHz - 152 - pF iss GS DS C Output capacitance - 71 - pF oss C Feedback capacitance - 33 - pF rss REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS T = 25˚C unless otherwise specified j SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I Continuous reverse drain T = 25 ˚C - - 1.05 A DR a current I Pulsed reverse drain current - - 4.2 A DRM V Diode forward voltage I = 0.5 A; V = 0 V - 0.74 1 V SD F GS t Reverse recovery time I = 0.5 A; -dI /dt = 100 A/m s; - 27 - ns rr F F Q Reverse recovery charge V = 0 V; V = 16 V - 19 - nC rr GS R August 1998 2 Rev 1.000

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor Normalised Power Dissipation, PD (%) Peak Pulsed Drain Current, IDM (A) BSH105 120 1000 100 D = 0.5 100 80 0.2 0.1 0.05 60 10 0.02 P D = tp/T D tp 40 single pulse 1 20 T 0 0.1 0 25 50 75 100 125 150 1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+01 Ambient Temperature, Ta (C) Pulse width, tp (s) Fig.1. Normalised power dissipation. Fig.4. Transient thermal impedance. PD% = 100(cid:215)P/P = f(T) Z = f(t); parameter D = t/T D D 25 ˚C a th j-a p Normalised Drain Current, ID (%) Drain Current, ID (A) BSH105 120 5 4.5V 4.5 2.5V 100 4 Tj = 25 C 2.1 V 80 3.5 3 60 2.5 VGS = 1.9 V 40 2 1.7 V 1.5 20 1 1.5 V 1.3 V 0.5 0 1.1 V 0 25 50 75 100 125 150 0 0 0.5 1 1.5 2 Ambient Temperature, Ta (C) Drain-Source Voltage, VDS (V) Fig.2. Normalised continuous drain current. Fig.5. Typical output characteristics, T = 25 ˚C. j ID% = 100(cid:215)I/I = f(T); conditions: V ‡ 4.5 V I = f(V ); parameter V D D 25 ˚C a GS D DS GS Drain-Source On Resistance, RDS(on) (Ohms) BSH105 100 Peak Pulsed Drain Current, IDM (A) BSH105 0.5 1.5 V 1.7 V 1.9 V 2.1 V 0.45 0.4 10 RDS(on) = VDS/ ID 0.35 tp = 100 us 0.3 2.5 V 1 1 ms 0.25 10 ms 0.2 VGS = 4.5 V 100 ms 0.15 0.1 d.c. 0.1 0.05 Tj = 25 C 0.01 0 0.1 1 10 100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Drain-Source Voltage, VDS (V) Drain Current, ID (A) Fig.3. Safe operating area. T = 25 ˚C Fig.6. Typical on-state resistance, T = 25 ˚C. a j I & I = f(V ); I single pulse; parameter t R = f(I); parameter V D DM DS DM p DS(ON) D GS August 1998 3 Rev 1.000

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor Drain Current, ID (A) BSH105 3 Threshold Voltage, VGS(to), (V) 1 VDS > ID X RDS(on) 2.5 0.9 0.8 typical 2 0.7 0.6 1.5 0.5 0.4 minimum 1 0.3 150 C Tj = 25 C 0.2 0.5 0.1 0 0 0 25 50 75 100 125 150 0 0.5 1 1.5 2 2.5 3 Gate-Source Voltage, VGS (V) Junction Temperature, Tj (C) Fig.7. Typical transfer characteristics. Fig.10. Gate threshold voltage. I = f(V ) V = f(T); conditions: I = 1 mA; V = V D GS GS(TO) j D DS GS Drain Current, ID (A) BSH105 Transconductance, gfs (S) BSH105 1E+00 4 VDS = 5 V 1E-01 Tj = 25 C 3.5 3 1E-02 2.5 1E-03 2 1E-04 1.5 1 1E-05 0.5 1E-06 0 0 0.5 1 1.5 2 2.5 3 1E-07 0 0.2 0.4 0.6 0.8 1 Drain Current, ID (A) Gate-Source Voltage, VGS (V) Fig.8. Typical transconductance, T = 25 ˚C. Fig.11. Sub-threshold drain current. j g = f(I) I = f(V ; conditions: T = 25 ˚C fs D D GS) j Normalised Drain-Source On Resistance Capacitances, Ciss, Coss, Crss (pF) BSH105 1.8 1000 1.7 RDS(ON) @ Tj 1.6 RDS(ON) @ 25C 1.5 2.5 V 1.4 VGS = 4.5 V Ciss 1.3 100 1.2 1.8 V Coss 1.1 1 Crss 0.9 0.8 10 0 25 50 75 100 125 150 0.1 1 10 100 Junction Temperature, Tj (C) Drain-Source Voltage, VDS (V) Fig.9. Normalised drain-source on-state resistance. Fig.12. Typical capacitances, C , C , C . iss oss rss R /R = f(T) C = f(V ); conditions: V = 0 V; f = 1 MHz DS(ON) DS(ON)25 ˚C j DS GS August 1998 4 Rev 1.000

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor Gate-source voltage, VGS (V) BSH105 Source-Drain Diode Current, IF (A) BSH105 10 -5 VDD = 20 V 9 RD = 20 Ohms -4.5 8 Tj = 25 C -4 7 -3.5 6 -3 5 -2.5 150 C 4 -2 Tj = 25 C -1.5 3 -1 2 -0.5 1 0 0 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 0 2 4 6 8 Gate charge, QG (nC) Drain-Source Voltage, VSDS (V) Fig.13. Typical turn-on gate-charge characteristics. Fig.14. Typical reverse diode current. V = f(Q) I = f(V ); conditions: V = 0 V; parameter T GS G F SDS GS j August 1998 5 Rev 1.000

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor MECHANICAL DATA Plastic surface mounted package; 3 leads SOT23 D B E A X HE vM A 3 Q A A1 1 2 c e1 bp wM B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mAa1x. bp c D E e e1 HE Lp Q v w mm 10..19 0.1 00..4388 00..1059 32..08 11..42 1.9 0.95 22..51 00..4155 00..5455 0.2 0.1 VOEURTSLIIONEN IEC JEDEC REFERENCES EIAJ PERUORJOEPCETAIONN ISSUE DATE SOT23 97-02-28 Fig.15. SOT23 surface mounting package. Notes 1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling. 2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18. 3. Epoxy meets UL94 V0 at 1/8". August 1998 6 Rev 1.000

Philips Semiconductors Product specification N-channel enhancement mode BSH105 MOS transistor DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (cid:211) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1998 7 Rev 1.000