(cid:82)(cid:99)(cid:97)(cid:102)(cid:108)(cid:103)(cid:97)(cid:95)(cid:106)(cid:30)(cid:76)(cid:109)(cid:114)(cid:99) High Reliability Serial EEPROMs SPI BUS Serial EEPROMs BR25□□□□family BR25L010-W series, BR25L020-W series, BR25L040-W series, BR25L080-W series, BR25L160-W series, BR25L320-W series, BR25L640-W series (cid:76)(cid:109)(cid:44)(cid:30)(cid:47)(cid:46)(cid:46)(cid:46)(cid:47)(cid:67)(cid:64)(cid:82)(cid:46)(cid:51) Description BR25L(cid:348)(cid:348)(cid:348)-W series is a serial EEPROM of SPI BUS interface method. Features · · · · · · · · · Page write · Number of 16 Byte 32 Byte pages · BR25L080-W BR25L010-W BR25L160-W Product BR25L020-W number BR25L320-W BR25L040-W BR25L640-W · · · · *1 BR25L080/160-W : SOP8, SOP-J8, SSOP-B8, TSSOP-B8 *2 BR25L320/640-W : SOP8, SOP-J8 BR25L series Power source SOP8 SOP-J8 SSOP-B8 TSSOP-B8 MSOP8 TSSOP-B8J Capacity Bit format Type voltage F FJ FV FVT FVM FVJ 1Kbit 128 X 8 BR25L010-W 1.8 ~ 5.5V 2Kbit 256 X 8 BR25L020-W 1.8 ~ 5.5V 4Kbit 512 X 8 BR25L040-W 1.8 ~ 5.5V 8Kbit 1K X 8 BR25L080-W 1.8 ~ 5.5V 16Kbit 2K X 8 BR25L160-W 1.8 ~ 5.5V 32Kbit 4K X 8 BR25L320-W 1.8 ~ 5.5V 64Kbit 8K X 8 BR25L640-W 1.8 ~ 5.5V www.rohm.com 1/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Absolute maximum ratings (Ta = 25˚C) Recommended action conditions Parameter Symbol Limits Unit Parameter Symbol Limits Unit Impressed voltage VCC -0.3 ~ +6.5 V Power source voltage VCC 1.8 ~ 5.5 V 450(SOP8) *1 Input voltage Vin 0 ~ VCC 450(SOP-J8) *2 Memory cell characteristics (Ta=25˚C, VCC=1.8 ~ 5.5V) mW Pdiesrsmipiasstiiobnle Pd 300(SSOP-B8)*3 Parameter Limits Unit 330(TSSOP-B8)*4 Min. Typ. Max. 310(MSOP8) *5 Number of data rewrite times*1 1,000,000 – – Times Data hold years *1 40 – – Years 310(TSSOP-B8J)*6 *1:Not 100% TESTED Storage Tstg -65 ~ +125 ˚C temperature range Operating Topr -40 ~ +85 ˚C Input / output capacity (Ta=25˚C, frequency=5MHz) temperature range Terminal voltage – -0.3 ~ VCC+0.3 V Parameter Symbol Conditions Min. Max. Unit (cid:162)When using at Ta = 25˚C or higher, 4.5mW (*1, *2), 3.0mW (*3), Input capacity *1 CIN VIN=GND – 8 pF 3.3mW(*4), 3.1mW (*5, *6) to be reduced per 1˚C Output capacity*1 COUT VOUT=GND – 8 pF *1:Not 100% TESTED Electrical characteristics (Unless otherwise specified, Ta = –40 ~ +85˚C, VCC = 1.8 ~ 5.5V) Limits Parameter Symbol Unit Conditions Min. Typ. Max. "H" input voltage 1 VIH1 0.7VxCC – +V0C.C3 V 1.8≤VCC≤5.5V "L" input voltage 1 VIL1 -0.3 – 0.3VxCC V 1.8≤VCC≤5.5V "L" output voltage 1 VOL1 0 – 0.4 V IOL=2.1mA(VCC=2.5V ~ 5.5V) "L" output voltage 2 VOL2 0 – 0.2 V IOL=150μA(VCC=1.8V ~ 2.5V) "H" output voltage 1 VOH1 -V0C.C5 – VCC V IOH=-0.4mA(VCC=2.5V ~ 5.5V) "H" output voltage 2 VOH2 -V0C.C2 – VCC V IOH=-100μA(VCC=1.8V ~ 2.5V) Input leak current ILI -1 – 1 μA VIN=0 ~ VCC Output leak current ILO -1 – 1 μA VOUT=0 ~ VCC,CS=VCC VCC=1.8V,fSCK=2MHz,tE/W=5ms Byte write ICC1 – – 1.0 mA Page write Write status register VCC=2.5V,fSCK=5MHz,tE/W=5ms Current consumption at write Byte write action ICC2 – – 2.0 mA Page write Write status register VCC=5.5V,fSCK=5MHz,tE/W=5ms Byte write ICC3 – – 3.0 mA Page write Write status register VCC=2.5V,fSCK=5MHz ICC4 – – 1.5 mA Read Current consumption at read Read status register action VCC=5.5V,fSCK=5MHz ICC5 – – 2.0 mA Read Read status register Standby current ISB – – 2 μA VCC=5.5V CS=HOLD=WP=VCC,SCK=SI=VCC or =GND,SO=OPEN • Radiation resistance design is not made. Block diagram VOLTAGE CS INSTRUCTION DECODE DETECTION CONTROL CLOCK SCK GENERATION WINRHIITBEITION HGIEGNHE VROATLTOARGE INSTRUCTION SI REGISTER STATUS REGISTER HOLD ARDEGDRISETSESR 7~13bit *1 ADDEDCROEDSESR 7~13bit *1 1K~64K *1 78bbiitt :: BBRR2255LL001200--WW EEPROM 9bit : BR25L040-W 10bit : BR25L080-W WP DATA READ/WRITE 11bit : BR25L160-W REGISTER 8bit AMP 8bit 12bit : BR25L320-W 13bit : BR25L640-W SO Fig.1 Block diagram www.rohm.com 2/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Pin assignment and description Terminal name Input/output Function VCC HOLD SCK SI VCC – Power source to be connected GND – All input / output reference voltage, 0V CS Input Chip select input BR25L010-W BR25L020-W SCK Input Serial clock input BR25L040-W SI Input Start bit, ope code, address, and serial data input BR25L080-W SO Output Serial data output BR25L160-W Hold input BR25L320-W HOLD Input Command communications may be suspended temporarily (HOLD status). BR25L640-W Write protect input WP Input Write command is prohibited. *1 CS SO WP GND Write status register command is prohibited. Fig. 2 Pin assignment diagram *1:BR25L010/020/040-W Operating timing characteristics Sync data input / output timing (Ta = -40 ~ +85˚C, unless otherwise specified, load capacity CL1 100pF) tCS tCSS Parameter Symbol 1.8≤VCC<2.5V 2.5≤VCC<5.5V Unit CS Min. Typ. Max. Min. Typ. Max. tSCKS tSCKWLtSCKWH tRC tFC SCK frequency fSCK – – 2 – – 5 MHz SCK SCK high time tSCKWH 200 – – 85 – – ns tDIS tDIH SCK low time tSCKWL 200 – – 85 – – ns SI CS high time tCS 200 – – 85 – – ns High-Z SO CS setup time tCSS 200 – – 90 – – ns Fig. 3 Input timing CS hold time tCSH 200 – – 85 – – ns SCK setup time tSCKS 200 – – 90 – – ns SI is taken into IC inside in sync with data rise edge of SCK. Input address and data from the most significant bit MSB. SCK hold time tSCKH 200 – – 90 – – ns SI setup time tDIS 40 – – 20 – – ns tCS SI hold time tDIH 50 – – 40 – – ns Data output delay time 1 tPD1 – – 150 – – 70 ns CS tCSHtSCKH Data output delay time 2 tPD2 – – 145 – – 55 ns SCK (CL2=30pF) Output hold time tOH 0 – – 0 – – ns SI tPD tOH tRO,tFO tOZ Output disable time tOZ – – 250 – – 100 ns High-Z SO HOLD setting tHFS 120 – – 60 – – ns setup time Fig. 4 Input / output timing HOLD setting SO is output in sync with data fall edge of SCK. Data is output hold time tHFH 90 – – 40 – – ns from the most significant bit MSB. HOLD release tHRS 120 – – 60 – – ns "H" setup time CS "L" HOLD release tHFStHFH tHRStHRH hold time tHRH 140 – – 70 – – ns SCK tDIS Time from HOLD tHOZ – – 250 – – 100 ns SI n+1 n n-1 to output High-Z tHOZ tHPD Time from HOLD SO Dn+1 Dn High-Z Dn Dn-1 tHPD – – 150 – – 70 ns to output change HOLD SCK *1 tRC – – 1 – – 1 μs rise time Fig. 5 HOLD timing SCK *1 tFC – – 1 – – 1 μs fall time OUTPUT *1 tRO – – 100 – – 50 ns rise time OUTPUT *1 tFO – – 100 – – 50 ns fall time Write time tE/W – – 5 – – 5 ms *1NOT 100% TESTED AC measurement conditions Limits Parameter Symbol Unit Min. Typ. Max. Load capacity 1 CL1 – – 100 pF Load capacity 2 CL2 – – 30 pF Input rise time – – – 50 ns Input fall time – – – 50 ns Input voltage – 0.2VCC/0.8VCC V Input / output judgment voltage – 0.3VCC/0.7VCC V www.rohm.com 3/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Characteristic data (The following characteristic data are Typ. values.) 6 6 1 5 5 0.8 4 4 0.6 VIH[V]3 SPEC VIL[V]3 TTTaaa===82-554˚˚0CC˚C VOL[V]0.4 TTaa==8255˚˚CC 2 2 SPEC 1 Ta=25Ta˚C=85˚C 1 0.2 Ta=-40˚C SPEC Ta=-40˚C 00 1 2 3 4 5 6 00 1 2 3 4 5 6 00 1 2 3 4 5 VCC[V] VCC[V] IOL[mA] Fig.6 "H" input voltage VIH(CS,SCK,SI,HOLD,WP) Fig.7 "L" input voltage VIL(CS,SCK,SI,HOLD,WP) Fig.8 "L" output voltage VOL-IOL(VCC=1.8V) 2 1 2.6 Ta=-40˚C Ta=-40˚C 0.8 1.8 2.4 0.6 VOH[V]1.6 SPEC TTaa==8255˚˚CC VOL[V] 0.4 SPECTa=85˚CTa=25˚C VOH[V]2.2 SPEC TaT=a8=52˚5C˚C 1.4 2 0.2 Ta=-40˚C 1.2 0 1.8 0 0.4 0.8 0 1 2 3 4 5 0 0.4 0.8 IOH[mA] IOL[mA] IOH[mA] Fig.9 "H" output voltage VOH-IOH(VCC=1.8V) Fig.10 "L" output voltage VOL-IOL(VCC=2.5V) Fig.11 "H" output voltage VOH-IOH(VCC=2.5V) VCC=2.5V 2mA 1.2 1.2 4 VCC=5.5V 3mA SPEC SPEC fSCK=5MHz 1 1 DATA=55h SPEC 3 0.8 0.8 ILI[μA]00..84 ILO[μA]00..64 ICC2,3[mA]2 SPEC Ta=-40˚CTa=25˚C Ta=85˚C Ta=85˚C 1 Ta=25˚C Ta=25˚C 0.2 0.2 Ta=-40˚C Ta=-40˚C Ta=85˚C 0 0 0 0 1 2 3 4 6 5 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.12 Input leak current ILI(CS,SCK,SI,WP,HOLD) Fig.13 Output leak current ILO(SO) Fig.14 Current consumption at WRITE operation ICC1,2,3(WRITE,PAGE WRITE,WRSR,fSCK=5MHz) BR25L010-W,BR25L020-W,BR25L040-W Vcc=2.5V 1.5mA Vcc=5.5V 2.0mA 2.5 2.5 100 fSCK=5MHz Ta=25˚C DATA=55h SPEC SPEC Ta=-40˚C 2 2 SPEC 10 Ta=85˚C ICC4,5[mA]1.51 Ta=2T5a˚C=-40˚C ISB[μA]1.51 fSCK[MHz] SPECSPEC 1 Ta=85˚C 0.5 Ta=85˚C 0.5 Ta=25˚C Ta=-40˚C 0 0 0.1 0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.15 Consumption current at READ operation Fig.16 Consumption current at standby operation ISB Fig.17 SCK frequency fSCK ICC4,5(READ,WRSR,fSK=5MHz) 250 250 250 SPEC SPEC SPEC 200 200 200 tSCKWH[ns]115000 SPEC tSCKWL[ns]115000 SPEC tCS[ns]115000 SPEC 50 Ta=-40˚C Ta=85˚CTa=25˚C 50 Ta=25˚C Ta=-40˚C 50 Ta=85˚CTa=2T5a˚C=-40˚C Ta=85˚C 0 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.18 tSCK high time tSCKWH Fig.19 SCK low time tSCKWL Fig.20 CS high time tCS www.rohm.com 4/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note 250 250 60 SPEC 200 SPEC SPEC 200 40 150 tCSS[ns] 100 SPEC tCSH[ns]115000 SPEC tDIS[ns] 200 SPEC 500 Ta=85˚CTaT=a2=5-˚4C0˚C 50 Ta=85˚TCa=25˚C Ta=-40˚C -20 Ta=85˚C Ta=-40˚CTa=25˚C -50 0 -40 0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.21 CS setup time tCSS Fig.22 CS hold time tCSH Fig.23 SI setup time tDIS 60 200 200 SPEC SPEC 50 SPEC 150 150 SPEC 40 tDIH[ns]30 Ta=85˚C Ta=-40˚C tPD1[ns] 100 Ta=85˚C SPEC tPD2[ns]100 Ta=85˚C 20 SPEC 50 Ta=-40˚C 50 10 Ta=25˚C Ta=25˚C Ta=25˚C Ta=-40˚C 0 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.24 SI hold time tDIH Fig.25 Data output delay time tPD1(CL=100pF) Fig.26 Data output delay time tPD2(CL=30pF) 300 150 140 SPEC SPEC 250 120 120 200 100 SPEC 90 SPEC tOZ[ns]150 SPEC tHFH[ns]8600 SPEC tHRH[ns]60 100 40 30 Ta=85˚C Ta=25˚C 20 Ta=85˚C Ta=-40˚CTa=85˚C 50 Ta=25˚C 0 Ta=25˚C Ta=-40˚C 0 Ta=-40˚C 0 -20 -30 0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.27 Output disable time tOZ Fig.28 HOLD setting hold time tHFH Fig.29 HOLD release hold time tHRH 300 160 120 SPEC SPEC SPEC 250 120 90 200 80 SPEC tHFH[ns]150 SPEC tHPD[ns]40 tRO[ns]60 SPEC 100 Ta=85˚C Ta=85˚C 0 Ta=85˚C 30 Ta=25˚C 50 Ta=25˚C Ta=25˚C Ta=-40˚C Ta=-40˚C Ta=-40˚C 0 -40 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] VCC[V] Fig.30 Time from HOLD to output High-Z tHOZ Fig.31 Time from HOLD to output change tHPD Fig.32 Output rise time tRO 120 10 SPEC 8 90 tFO[ns]60 SPEC tE/W[ms]64 Ta=-40˚CSPEC Ta=85˚C 30 Ta=25˚C Ta=25˚C 2 Ta=85˚C Ta=-40˚C 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VCC[V] VCC[V] Fig.33 Output fall time Fig.34 Write cycle time tE/W www.rohm.com 5/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Features Status registers This IC has status registers. The status registers are of 8 bits and express the following parameters. BP0 and BP1 can be set by write status register command. These 2 bits are memorized into the EEPROM, therefore are valid even when power source is turned off. Rewrite characteristics and data hold time are same as characteristics of the EEPROM. WEN can be set by write enable command and write disable command. WEN becomes write disable status when power source is turned off. R/B is for write confirmation, therefore cannot be set externally. The value of status register can be read by read status command. Status registers Product number bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 BR25L010-W - BR25L020-W 1 1 1 1 BP1 BP0 WEN R/B BR25L040-W BR25L080-W BR25L160-W - WPEN 0 0 0 BP1 BP0 WEN R/B BR25L320-W BR25L640-W Memory bit Function Contents location WP pin enable / disable designation bit This enables / disables the functions WPEN EEPROM WPEN = 0 = invalid of WP pin. WPEN = 1 = valid This designates the write disable area BP1 EEPROM EEPROM write disable block designation bit of EEPROM. Write designation areas BP0 of product numbers are shown below. Write and write status register write enable / disable status confirmation bit WEN Register WEN = 0 = prohibited WEN = 1 = permitted - Write cycle status (READY / BUSY) status confirmation bit R/B Register R-/B=0=READY - R/B=1=BUSY Write disable block setting Write disable block BP1 BP0 BR25L010-W BR25L020-W BR25L040-W BR25L080-W BR25L160-W BR25L320-W BR25L640-W 0 0 None None None None None None None 0 1 60h-7Fh C0h-FFh 180h-1FFh 300h-3FFh 600h-7FFh C00h-FFFh 1800h-1FFFh 1 0 40h-7Fh 80h-FFh 100h-1FFh 200h-3FFh 400h-7FFh 800h-FFFh 1000h-1FFFh 1 1 00h-7Fh 00h-FFh 000h-1FFh 000h-3FFh 000h-7FFh 000h-FFFh 0000h-1FFFh WP pin By setting WP = LOW, write command is prohibited. As for BR25L080, 160, 320, 640-W, only when WPEN bit is set "1", the WP pin functions become valid. And the write command to be disabled at this moment is WRSR. As for BR25L010, 020, 040-W, both WRITE and WRSR commands are prohibited. However, when write cycle is in execution, no interruption can be made. Product number WRSR WRITE BR25L010-W Prohibition Prohibition BR25L020-W possible possible BR25L040-W BR25L080-W BR25L160-W Prohibition possible but Prohibition BR25L320-W WPEN bit "1" impossible BR25L640-W HOLD pin By HOLD pin, data transfer can be interrupted. When SCK = "1", by making HOLD from "1" into "0", data transfer to EEPROM is interrupted. When SCK = "0", by making HOLD from "0" into "1", data transfer is restarted. www.rohm.com 6/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Command mode Ope code BR25L080-W Command Contents BR25L010-W BR25L160-W BR25L040-W BR25L020-W BR25L320-W BR25L640-W WREN Write enable Write enable command 0000 * 110 0000 * 110 0000 0110 WRDI Write disable Write disable command 0000 * 100 0000 * 100 0000 0100 READ Read Read command 0000 * 011 0000 A8011 0000 0011 WRITE Write Write command 0000 * 010 0000 A8010 0000 0010 Status register read RDSR Read status register 0000 * 101 0000 * 101 0000 0101 command Status register write WRSR Write status register 0000 * 001 0000 * 001 0000 0001 command Timing chart 1. Write enable (WREN) / disable (WRDI) cycle 1.WREN (WRITE ENABLE) : Write enable CS SCK 0 1 2 3 4 5 6 7 SI 0 0 0 0 * 1 1 1 0 High-Z SO *1 BR25L010/020/040-W=Don't care Fig. 35 Write enable command BR25L080/160/320/640-W=“0” input 1.WRDI (WRITE DISABLE) : Write disable CS SCK 0 1 2 3 4 5 6 7 SI 0 0 0 0 *1 1 0 0 High-Z SO *1 BR25L010/020/040-W=Don't care Fig. 36 Write disable BR25L080/160/320/640-W=“0” input This IC has write enable status and write disable status. It is set to write enable status by write enable command, and it is set to write disable status by write disable command. As for these commands, set CS LOW, and then input the respective ope codes. The respective commands accept command at the 7-th clock rise. Even with input over 7 clocks, command becomes valid. When to carry out write and write status register command, it is necessary to set write enable status by the write enable command. If write or write status register command is input in the write disable status, commands are cancelled. And even in the write enable status, once write and write status register command is executed once, it gets in the write disable status. After power on, this IC is in write disable status. www.rohm.com 7/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note 2. Read command (READ) CS Product Address number length SCK 0 1 2 3 4 5 6 7 8 9 10 11 14 15 16 17 22 BR25L010-W A6-A0 SI 0 0 0 0 * 1 0 1 1 A7 A6 A5 A4 A1 A0 BR25L020-W A7-A0 High-Z BR25L040-W A8-A0 SO D7 D6 D2 D1 D0 Fig. 37 Read command (BR25L010/020/040-W)* 1 BR25L010/020-W=Don't care BR25L040-W=A8 CS Product Address SCK 0 1 2 3 4 5 6 7 8 23 24 30 number length BR25L080-W A9-A0 SI 0 0 0 0 0 0 1 1 * * * A12 A1 A0 BR25L160-W A10-A0 SO High-Z D7 D6 D2 D1 D0 BR25L320-W A11-A0 * =Don't care BR25L640-W A12-A0 Fig. 38 Read command (BR25L080/160/320/640-W) By read command, data of EEPROM can be read. As for this command, set CS LOW, then input address after read ope code. EEPROM starts data output of the designated address. Data output is started from SCK fall of 15/23*1 clock, and from D7 to D0 sequentially. This IC has increment read function. After output of data for 1 byte (8 bits), by continuing input of SCK, data of the next address can be read. Increment read can read all the addresses of EEPROM. After reading data of the most significant address, by continuing increment read, data of the most insignificant address is read. * =Don't care * 1 BR25L010/020/040-W=15 clocks BR25L080/160/320/640-W=23 clocks 3. Write command (WRITE) Product Address CS number length SCK 0 1 2 3 4 5 6 7 8 15 16 22 23 BR25L010-W A6-A0 BR25L020-W A7-A0 SI 0 0 0 0 * 1 0 1 0 A7 A6 A5 A4 A1 A0 D7 D6 D2 D1 D0 BR25L040-W A8-A0 SO High-Z * 1 BR25L010/020-W=Don't care Fig.39 Write command (BR25L010/020/040-W) BR25L040-W=A8 CS Product Address number length SCK 0 1 2 3 4 5 6 7 8 23 24 30 31 BR25L080-W A9-A0 SI 0 0 0 0 0 0 1 0 * * * A12 A1 A0 D7 D6 D2 D1 D0 BR25L160-W A10-A0 BR25L320-W A11-A0 SO High-Z * =Don't care BR25L640-W A12-A0 Fig.40 Write command (BR25L080/160/320/640-W) By write command, data of EEPROM can be written. As for this command, set CS LOW, then input address and data after write ope code. Then, by making CS HIGH, the EEPROM starts writing. The write time of EEPROM requires time of tE/W (Max 5ms). During tE/W, other than status read command is not accepted. Start CS after taking the last data (D0), and before the next SCL clock starts. At other timing, write command is not executed, and this write command is cancelled. This IC has page write function, and after input of data for 1 byte (8 bits), by continuing data input without starting CS, data up to 16/32*1 bytes can be written for one tE/W. In page write, the insignificant 4/5*2 bit of the designated address is incremented internally at every time when data of 1 byte is input, and data is written to respective addresses. When data of the maximum bytes or higher is input, address rolls over, and previously input data is overwritten. * 1 BR25L010/020/040-W=16 bytes at maximum BR25L080/160/320/640-W=32 bytes at maximum * 2 BR25L010/020/040-W=Insignificant 4 bits BR25L080/160/320/640-W=Insignificant 5 bits www.rohm.com 8/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note 4. Status register write / read command CS SCK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 SI 0 0 0 0 * 0 0 1 * * * * BP1 BP0 * * High-Z SO * =Don't care Fig.41 Status register write command (BR25L010/020/040-W) CS SCK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 SI 0 0 0 0 0 0 0 1 WPEN * * * BP1 BP0 * * High-Z SO * =Don't care Fig.42 Status register write command (BR25L080/160/320/640-W) Write status register command can write status register data. The data the can be written by this command are 2 bits *1, that is, BP1 (bit3) and BP0 (bit2) among 8 bits of status register. By BP1 and BP0, write disable block of EEPROM can be set. As for this command, set CS LOW, and input ope code of write status register, and input data. Then, by making CS HIGH, EEPROM starts writing. Write time requires time of tE/W as same as write. As for CS rise, start CS after taking the last data bit (bit0), and before the next SCK clock starts. At other timing, command is cancelled. Write disable block is determined by BP1 and BP0, and the block can be selected from 1/4 of memory array, 1/2, and entire memory array. (Refer to the write disable block setting table.) To the write disabled block, write cannot be made, and only read can be made. * 3 bits including BR25L080, 160, 320, 640-W WPEN (bit7) CS SCK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SI 0 0 0 0 * 1 0 1 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 High-Z SO 1 1 1 1 BP1 BP0 WEN R/B * =Don't care Fig.43 Status register read command (BR25L010/020/040-W) CS SCK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SI 0 0 0 0 0 1 0 1 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 SO High-Z WPEN 0 0 0 BP1 BP0 WEN R/B Fig.44 Status register read command (BR25L080/160/320/640-W) www.rohm.com 9/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note At standby Current at standby Set CS "H", and be sure to set SCK, SI, WP, HOLD input "L" or "H". Do not input intermediate electric potential. Timing As shown in Fig. 45, at standby, when SCK is "H", even if CS is fallen, SI status is not read at fall edge. SI status is read at SCK rise edge after fall of CS. At standby and at power ON/OFF, set CS "H" status. Even if CS is fallen at SCL = SI = "H", SI status is not read at that edge. CS Command start here. SI is read. SCK 0 1 2 SI Fig.45 Operating timing WP cancel valid area WP is normally fixed to "H" or "L" for use, but when WP is controlled so as to cancel write status register command and write command, pay attention to the following WP valid timing. While write or write status register command is executed, by setting WP = "L" in cancel valid area, command can be cancelled. The area from command ope code before CS rise at internal automatic write start becomes the cancel valid area. However, once write is started, any input cannot be cancelled. WP input becomes Don't Care, and cancellation becomes invalid. SCK 15 16 CS tE/W Ope code Data data write time WP cancel invalid area WP cancel invalid area WP cancel invalid area invalid Fig.46 WP valid timing (WRSR) tE/W Ope code Address Data data write time WP cancel invalid area WP cancel invalid area WP cancel invalid area invalid valid Fig.47 WP valid timing (WRITE) HOLD pin By HOLD pin, command communication can be stopped temporarily. (HOLD status) The HOLD pin carries out command communications normally when it is HIGH. To get in HOLD status, at command communication, when SCK = LOW, set the HOLD pin LOW. At HOLD status, SCK and SI become Don't Care, and SO becomes high impedance (High-Z). To release the HOLD status, set the HOLD pin HIGH when SCK = LOW. After that, communication can be restarted from the point before the HOLD status. For example, when HOLD status is made after A5 address input at read, after release of HOLD status, by starting A4 address input, read can be restarted. When in HOLD status, leave CS LOW. When it is set CS = HIGH in HOLD status, the IC is reset, therefore communication after that cannot be restarted. www.rohm.com 10/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Method to cancel each command READ Ope code Address Data (cid:162) Method to cancel : cancel by CS = "H" 8 bits 8 bits/16bits 8 bits Cancel available in all areas of read mode Fig.48 READ cancel valid timing RDSR Ope code Data (cid:162) Method to cancel : cancel by CS = "H" 8 bits 8 bits Cancel available in all areas of read mode Fig.49 RDSR cancel valid timing WRITE, PAGE WRITE a :Ope code, address input area. Ope code Address Data (n) tE/W Cancellation is available by CS = "H". 8 bits 8 bits 8 bits b :Data input area (D7 ~ D1 input area) a b d Cancellation is available by CS = "H". c c : Data input area (D0 area) Fig.50 WRITE cancel valid timing When CS is started, write starts. After CS rise, cancellation cannot be made by any means. d :tE/W area SCK Cancellation is available by CS = "H". However, when write starts (CS is started) in the area c, cancellation SI D7 D6 D5 D4 D3 D2 D1 D0 cannot be made by any means. And, by inputting on b c SCK clock, cancellation cannot be made. In page write mode, there is write enable area at every 8 clocks. Note 1) If Vcc is made OFF during write execution, designated address data is not guaranteed, therefore write it once again. Note 2) If CS is started at the same timing as that of the SCK rise, write execution / cancel becomes unstable, therefore, it is necessary to fall in SCK = "L" area. As for SCK rise, assure timing of tCSS / tCSH or higher. WRSR SCK 14 15 16 17 a : From ope code to 15 clock rise Cancel by CS = "H". SI D1 D0 b :From 15 clock rise to 16 clock rise (write enable area) a b c When CS is started, write starts. After CS rise, cancellation cannot be made by any Ope code Address tE/W means. 8 bit 8 bit c : After 16 clock rise a c Cancel by CS = "H". However, when write starts (CS is b started) in the area b, cancellation cannot be made by Fig.51 WRSR cancel valid timing any means. And, by inputting on SCK clock, cancellation cannot be made. Note 1) If Vcc is made OFF during write execution, designated address data is not guaranteed, therefore write it once again. Note 2) If CS is started at the same timing as that of the SCK rise, write execution / cancel becomes unstable, therefore, it is necessary to fall in SCK = "L" area. As for SCK rise, assure timing of tCSS/tCSH or higher. WREN/WRDI a : From ope code to clock rise, cancel by CS = "H". SCK 7 8 9 b : Cancellation is not available when CS is started after 7 clock. a b Ope code 8 bit a b Fig.52 WREN / WRDI cancel valid timing www.rohm.com 11/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note High speed operation In order to realize stable high speed operations, pay attention to the following input / output pin conditions. Input pin pull up, pull down resistance When to attach pull up, pull down resistance to EEPROM input pin, select an appropriate value for the microcontroller VOL, IOL from VIL characteristics of this IC. Pull up resistance VCC - VOLM RPU ≥ IOLM Microcontroller IOHM EEPROM VOLM ≤ VILE VOLM VILE Example) When Vcc = 5V, VILM = 1.5V, VOLM = 0.4V, IOLM = 2mA, from the equation , "L" output "L" input 5-0.4 Fig.53 Pull up resistance RPU≥ 2 X 10-3 RPU≥ 2.3[kΩ] With the value of Rpu to satisfy the above equation, VOLM becomes 0.4V or higher, and with VILE (= 1.5V), the equation is also satisfied. And, in order to prevent malfunction, mistake write at power ON/OFF, be sure to make CS pull up. Pull down resistance VOHM EEPROM RPD ≥ IOHM VOHM VIHE VOHM ≥ VIHE IOHM Example) When Vcc = 5V, VOHM = Vcc - 0.5V, IOHM = 0.4mA, VIHM = Vcc X 0.7V, from the equation , Fig.54 Pull down resistance 5-0.5 RPD≥ 0.4 X 10-3 RPD≥ 11.3[kΩ] Further, by amplitude VIHE, VILE of signal input to EEPROM, operation speed changes. By inputting signal of amplitude of VCC / GND level to input, more stable high speed operations can be realized. On the contrary, when amplitude of 0.8VCC / 0.2VCC is input, operation speed becomes slow. www.rohm.com 12/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note In order to realize more stable high speed operation, it is recommended to make the values of RPU, RPD as large as possible, and make the amplitude of signal input to EEPROM close to the amplitude of VCC / GND level. (*1 At this moment, operating timing guaranteed value is guaranteed.) tPD-VIL characteristics 80 75 70 D [ns] tP 65 60 TVaCC==215.8°VC VIH=VCC 55 CL=100pF 0 0.2 0.4 0.6 0.8 1 VIL[V] Fig.55 VIL dependency of data output delay time SO load capacity condition Load capacity of SO output pin affects upon delay characteristic of SO output. (Data output delay time, time from HOLD to High-Z) In order to make output delay characteristic into higher speed, make SO load capacity small. In concrete, "Do not connect many devices to SO bus", "Make the wire between the controller and EEPROM short", and so forth. tPD-CL characteristics 80 VCC=1.8V Ta=25°C VIH/VIL=0.8VCC/0.2VCC EEPROM 70 SO D [ns]60 CL P t 50 40 0 20 40 60 80 100 120 CL [V] Fig.56 SO load dependency of data output delay time Other cautions Make the wire length from the microcontroller to EEPROM input signal same length, in order to prevent setup / hold violation to EEPROM, owing to difference of wire length of each input. www.rohm.com 13/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Equivalent circuit Output circuit SO OEint. Fig.57 SO output equivalent circuit Input circuit RESETint. CS Fig.58 CS input equivalent circuit SCK SI Fig.59 SCK input equivalent circuit Fig.60 SI input equivalent circuit HOLD WP Fig.61 HOLD input equivalent circuit Fig.62 WP input equivalent circuit www.rohm.com 14/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Notes on power ON/OFF At power ON/OFF, set CS "H" (= VCC). When CS is "L", this IC gets in input accept status (active). If power is turned on in this status, noises and the likes may cause malfunction, mistake write or so. To prevent these, at power ON, set CS "H". (When CS is in "H" status, all inputs are canceled.) Vcc Vcc GND Vcc CS GND Good example Bad example Fig.63 CS timing at power ON/OFF (Good example) CS terminal is pulled up to VCC. At power OFF, take 10ms or higher before re supply. If power is turned on without observing this condition, the IC internal circuit may not be reset, which please note. (Bad example) CS terminal is "L" at power ON/OFF. In this case, CS always becomes "L" (active status), and EEPROM may have malfunction, mistake write owing to noises and the likes. Even when CS input is High-Z, the status becomes like this case, which please note. POR circuit This IC has a POR (Power On Reset) circuit as mistake write countermeasure. After POR action, it gets in write disable status. The POR circuit is valid only when power is ON, and does not work when power is OFF. When power is ON, if the recommended conditions of the following tR, tOFF, and Vbot are not satisfied, it may become write enable status owing to noises and the likes. tR VCC Recommended conditions of tR, tOFF, Vbot tR tOFF Vbot 10ms or below 10ms or higher 0.3V or below tOFF Vbot 100ms or below 10ms or higher 0.2V or below 0 Fig.64(cid:30)(cid:30)(cid:80)(cid:103)(cid:113)(cid:99)(cid:30)(cid:117)(cid:95)(cid:116)(cid:99)(cid:100)(cid:109)(cid:112)(cid:107) Noise countermeasures Vcc noise (bypass capacitor) When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (0.1µF) between IC Vcc and GND. At that moment, attach it as close to IC as possible. And, it is also recommended to attach a bypass capacitor between board Vcc and GND. SCK noise When the rise time (tR) of SCK is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. To avoid this, a Schmitt trigger circuit is built in SCK input. The hysteresis width of this circuit is set about 0.2V, if noises exist at SCK input, set the noise amplitude 0.2Vp-p or below. And it is recommended to set the rise time (tR) of SCK 100ns or below. In the case when the rise time is 100ns or higher, take sufficient noise countermeasures. Make the clock rise, fall time as small as possible. WP noise During execution of write status register command, if there exist noises on WP pin, mistake in recognition may occur and forcible cancellation may result, which please note. To avoid this, a Schmitt trigger circuit is built in WP input. In the same manner, a Schmitt trigger circuit is built in SI input and HOLD input too. Cautions on use (1) Described numeric values and data are design representative values, and the values are not guaranteed. (2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI. (3) Absolute maximum ratings If the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded, LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to LSI. (4) GND electric potential Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of GND terminal. (5) Heat design In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin. (6) Terminal to terminal short circuit and wrong packaging When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in the case of short circuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be destructed. (7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. www.rohm.com 15/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

BR25L010-W, BR25L020-W, BR25L040-W, BR25L080-W, BR25L160-W, BR25L320-W, BR25L640-W Technical Note Selection of order type B R 2 5 L 0 1 0 F - W E 2 Rohm type BUS type Operating temperature Capacity Package type Double cell Package specifications name 25:SPI 010=1K E2 : reel shape emboss taping F : SOP8 020=2K TR : reel shape emboss taping 040=4K FJ : SOP-J8 (MSOP8 package only) F V : SSOP-B8 080=8K FV :TSSOP-B8 160=16K 320=32K FV M : MSOP8 640=64K FVJ :TSSOP-B8J Package specifications SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J <External appearance> <Package specifications>SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J (cid:129) SOP8 (cid:129) SOP-J8 (cid:129) SSOP-B8 (cid:129) TSSOP-B8 (cid:129) TSSOP-B8J Package type Emboss taping ±±1.50.16.20.3±4.40.20.11 1.5182.700±.402.2±450.1 00.0.3Min..117+-00..105 ±±6.00.31.3750.1±3.90.20.175 1.08124.7.49722±±0630.2.541 00.45Min.0.2.1±0.16.40.3(cid:314)1.150.1(cid:314)(04.40.2(cid:314).50.123).180(cid:314)00.450.62.522(cid:314)0.01.0.3Min.01.51(cid:314)0.1 6.40.2±1.00.1±4.40.1±0.10.05±318.0±045.001..264550+-.0.50.15±0000..8.0011.00.2±54S45+-00..0053±4.90.2±0.850.05±3.00.1±0.10.0531.80±0045.(0.16.U352n+-0i000.450.15±.t00.. 0.081:540.950.2± 4Sm5+-m00..0053) PPaa*cc kkFaaoggeer qdouirreadcntetiiotyrning1234, (o2EsWu52pt0h eb0Re1234ypcne ci etfthsyhlee a rri1234 egnehutl mihsPa big1234nnred iNp,r p oNoe.o1fd1234 . 1mb ypu itnlht ieo1234p fl letehfste h Popa1234urfnol ldtidnh,u geac ns t1234 pdiids ae tahctek t ahtaegp elee fiqts tupoaupln.l)etdity. MSOP8 <Package specifications> MSOP8 <External appearance> Package type Emboss taping 0.9Max.±4.0 0.2±00.75 0.05.4±±2.8 0.10.08 0.057520.918.6 ±5 045.10.02.20+-800 S..00±0.29 0.15054.±10.6 0.2450+-.0008..00 M53 PPaacckkaaggee qduireacnttiiotyn (cid:433)(cid:433)(cid:433)3T(o(cid:433)(cid:433)W0uR(cid:433)(cid:433)0th 0beypn c tthshee(cid:433)(cid:433)(cid:433) rri(cid:433)(cid:433)egeh(cid:433)(cid:433)lt ihsa gnrdi(cid:433)(cid:433)(cid:433)p, pN(cid:433)(cid:433)eo(cid:433)(cid:433)d. 1b yp itnh (cid:433)(cid:433)(cid:433)eo f(cid:433)(cid:433)l eth(cid:433)(cid:433)fte h parnodd,(cid:433)(cid:433)(cid:433)u ac(cid:433)(cid:433)nt di(cid:433)(cid:433)s t haet tthaep eri gish tp tuolple.)d Pin No.1 Pulling side Reel (Unit : mm) * For ordering, specify a number of multiples of the package quantity. www.rohm.com 16/16 2010.07 - Rev. B © 2010 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.

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