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BPX43-4/5产品简介:
ICGOO电子元器件商城为您提供BPX43-4/5由OSRAM SYLVANIA设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 BPX43-4/5价格参考¥19.05-¥39.04。OSRAM SYLVANIABPX43-4/5封装/规格:光学传感器 - 光电晶体管, Phototransistor 880nm Top View TO-206AA, TO-18-3 Metal Can。您可以下载BPX43-4/5参考资料、Datasheet数据手册功能说明书,资料中有BPX43-4/5 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | PHOTOTRANSISTOR NPN 880NM TO-18 |
产品分类 | |
品牌 | OSRAM Opto Semiconductors Inc |
数据手册 | |
产品图片 | |
产品型号 | BPX43-4/5 |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | * |
产品目录绘图 | |
产品目录页面 | |
其它名称 | 475-1074 |
功率-最大值 | 220mW |
安装类型 | 通孔 |
封装/外壳 | TO-206AA,TO-18-3 金属罐 |
朝向 | 顶视图 |
标准包装 | 1,000 |
波长 | 880nm |
电压-集射极击穿(最大值) | 50V |
电流-暗(Id)(最大值) | 300nA |
电流-集电极(Ic)(最大值) | 50mA |
视角 | 30° |
2016-01-04 Silicon NPN Phototransistor Version 1.3 BPX 43 Features: • Spectral range of sensitivity: (typ) 450 ... 1100 nm • Package: Metal Can (TO-18), hermetically sealed • Special: Base connection • Suitable up to 125°C • High linearity • Available in groups Applications • Photointerrupters • Industrial electronics • For control and drive circuits Ordering Information Type: Photocurrent Ordering Code I [µA] PCE λ = 950 nm, E = 0.5 mW/cm2, e V = 5 V CE BPX 43 ≥ 800 Q62702P0016 BPX 43-3/4 1250 ... 4000 Q62702P3581 BPX 43-4 2000 ... 4000 Q62702P0016S004 BPX 43-4/5 ≥ 2000 Q62702P3582 BPX 43-5 ≥ 3200 Q62702P0016S005 Note: Only one bin within one packing unit (variation less than 2:1) 2016-01-04 1
Version 1.3 BPX 43 Maximum Ratings (T = 25 °C) A Parameter Symbol Values Unit Operating and storage temperature range T ; T -40 ... 125 °C op stg Collector-emitter voltage V 50 V CE Collector current I 50 mA C Collector surge current I 200 mA CS (τ < 10 µs) Emitter-base voltage V 7 V EB Total Power dissipation P 220 mW tot Thermal resistance R 450 K / W thJA ESD withstand voltage V 2000 V ESD (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) Characteristics (T = 25 °C) A Parameter Symbol Values Unit Wavelength of max. sensitivity (typ) λ 880 nm S max Spectral range of sensitivity (typ) λ (typ) 450 nm 10% ... 1100 Radiant sensitive area (typ) A 0.675 mm2 Dimensions of chip area (typ) L x W (typ) 1.02 x mm x 1.02 mm Half angle (typ) ϕ ± 15 ° Photocurrent of collector-base photodiode (typ) I 11 μA PCB (λ = 950 nm, E = 0.5 mW/cm2, V = 5 V) e CB Photocurrent of collector-base photodiode (typ) I 35 μA PCB (E = 1000 lx, Std. Light A, V = 5 V) V CB Capacitance (typ) C 23 pF CE (V = 0 V, f = 1 MHz, E = 0) CE Capacitance (typ) C 39 pF CB (V = 0 V, f = 1MHz, E = 0) CB Capacitance (typ) C 47 pF EB (V = 0 V, f = 1MHz, E = 0) EB Dark current (typ (max)) I 20 (≤ 100) nA CE0 (V = 20 V) CE 2016-01-04 2
Version 1.3 BPX 43 Grouping (T = 25 °C, λ = 950 nm) A Group Min Photocurrent Max Photocurrent Typ Photocurrent Rise and fall time E = 0.5 mW/cm2, E = 0.5 mW/cm2, E = 1000 lx, Std. I = 1 mA, V = 5 e e V C CC V = 5 V V = 5 V Light A, V = 5 V V, R = 1 kΩ CE CE CE L I [µA] I [µA] I [µA] t, t [µs] PCE, min PCE, max PCE r f BPX 43-2 800 1600 3800 9 BPX 43-3 1250 2500 6000 12 BPX 43-4 2000 4000 9500 15 BPX 43-5 3200 15000 18 Group Collector-emitter saturation Current gain voltage I = I x 0.3, E = 0.5 mW/cm2, V = 5 V C PCEmin e CE E = 0.5 mW/cm2 e V [mV] I / I CEsat PCE PCB BPX 43-2 200 110 BPX 43-3 220 170 BPX 43-4 240 270 BPX 43-5 260 430 Note.: I is the min. photocurrent of the specified group. PCEmin 2016-01-04 3
Version 1.3 BPX 43 Relative Spectral Sensitivity 1) page 9 Photocurrent 1) page 9 S = f(λ) I = f(E ), V = 5 V rel PCE e CE Collector Current 1) page 9 Collector Current 1) page 9 I = f(V ), I = Parameter I = f(V ), I = Parameter C CE B C CE B 2016-01-04 4
Version 1.3 BPX 43 Photocurrent 1) page 9 Dark Current 1) page 9 I / I (25°C)= f(T ), V = 5 V I = f(V ), E = 0 PCE PCE A CE CEO CE Dark Current 1) page 9 Collector-Base Capacitance 1) page 9 I = f(T ), E = 0 C = f(V ), f = 1 MHz, E = 0 CEO A CB CB 2016-01-04 5
Version 1.3 BPX 43 Collector-Emitter Capacitance 1) page 9 Emitter-Base Capacitance 1) page 9 C = f(V ), f = 1 MHz, E = 0 C = f(V ), f = 1 MHz, E = 0 CE CE EB EB Power Consumption P = f(T ) tot A 2016-01-04 6
Version 1.3 BPX 43 Directional Characteristics 1) page 9 S = f(ϕ) rel Package Outline Radiant 3) Chip position sensitive area 0.04 5) (2.7 (0.106)) 0.189) 0.181) 1.1 (0.9 (0.03 E C B 8 ( 6 ( ø0.45 (0.018) ø4. ø4. 0.9 (01..013 (0.043) 54 (0.100)spacing 5) 2. 14.5 (0.571) 5.1 (0.201) ø5.6 (0.220) 12.5 (0.492) 4.8 (0.189) ø5.3 (0.209) 6.2 (0.244) 5.4 (0.213) GMOY6019 Dimensions in mm (inch). Package Metal Can (TO-18), hermetically sealed 2016-01-04 7
Version 1.3 BPX 43 Approximate Weight: 0.3 g TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C Continuous line: typical process First wave Second wave Dotted line: process limits ∆T< 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C ca. 5 K/s 120 ˚C Typical 100 100 ˚C 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-01-04 8
Version 1.3 BPX 43 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-01-04 9
Version 1.3 BPX 43 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2016-01-04 10