Datasheet A C/DC Drivers P WM type DC/DC converter IC Included 650V MOSFET BM2Pxx4 Series General Description Features The PWM type DC/DC converter (BM2Pxx4 Series)  PWM frequency : 65kHz for AC/DC provide an optimum system for all products  PWM current mode method that include an electrical outlet.  Burst operation when load is light This IC supports both isolated and non-isolated  Frequency reduction function devices, enabling simpler design of various types of  Built-in 650V start circuit low-power electrical converters.  Built-in 650V switching MOSFET This IC built in a HV starter circuit that tolerates  VCC pin under voltage protection 650V, it contributes to low-power consumption.  VCC pin overvoltage protection With current detection resistors as external devices, a  SOURCE pin Open protection higher degree of design freedom is achieved. Since  SOURCE pin Short protection current mode control is utilized, current is restricted in  SOURCE pin Leading-Edge-Blanking function each cycle and excellent performance is demonstrated  Per-cycle over current protection circuit in bandwidth and transient response.  Soft start The switching frequency is 65 kHz. At light load, the  Secondary Over current protection circuit switching frequency is reduced and high efficiency is achieved. Package W(Typ.) x D(Typ.) x H(Max.) A frequency hopping function is also on chip, which DIP7K 9.27mm x 6.35mm x 8.63mm contributes to low EMI. Pitch 2.54mm(Typ.) We can design easily, because this IC includes the DIP7F 9.20mm x 6.35mm x 7.60mm switching MOSFET. Pitch 2.54mm(Typ.) Basic specifications  Operating Power Supply Voltage Range: VCC 8.9V to 26.0V DRAIN: to 650V  Operating Current: Normal Mode BM2P014: 0.950mA (Typ.) BM2P034: 0.775mA (Typ.) BM2P054: 0.600mA (Typ.) BM2P094: 0.500mA (Typ.) Applications Burst Mode: 0.400mA (Typ.) AC adapters and household appliances (vacuum  Oscillation Frequency: 65kHz (Typ.) cleaners, humidifiers, air cleaners, air conditioners, IH  Operating Temperature: - 40 C to +105 C cooking heaters, rice cookers, etc.)  MOSFET ON Resistance: BM2P014: 1.4Ω (Typ.) Line Up BM2P034: 2.4Ω (Typ.) BM2P054: 4.0Ω (Typ.) Product MOSFET ON resistor BM2P094: 8.5Ω (Typ.) BM2P014 1.4Ω Application circuit BM2P034 2.4Ω BM2P054 4.0Ω BM2P094 8.5Ω +FUSE 85-2A6C5Vac Filter BDriioddgee - 7 6 5 DRAINDRAIN VCC ERROR SOURCE N.C. GND FB AMP 1 2 3 4 Figure 1. Application circuit ○Product structure: Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays .w ww.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/20 TSZ22111 • 14 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Absolute Maximum Ratings (Ta=25C ) Parameter Symbol Rating Unit Conditions Maximum applied voltage 1 Vmax1 -0.3 to 30 V VCC Maximum applied voltage 2 Vmax2 -0.3 to 6.5 V SOURCE, FB Maximum applied voltage 3 V max3 650 V DRAIN P =10us, Duty cycle=1% Drain current pulse I 10.40 A W DP (BM2P014) P =10us, Duty cycle=1% Drain current pulse I 5.20 A W DP (BM2P034) P =10us, Duty cycle=1% Drain current pulse I 2.60 A W DP (BM2P054) P =10us, Duty cycle=1% Drain current pulse I 1.30 A W DP (BM2P094) Allowable dissipation Pd 2000 mW Operating temperature range Topr -40 to +105 oC MAX junction temperature T 150 oC JMAX Storage temperature range Tstr -55 to +150 oC (Note1): When mounted (on 74.2 mm × 74.2 mm x 1.6 mm thick, glass epoxy on double-layer substrate). Reduce to 16 mW/C when Ta = 25C or above. Operating Conditions (Ta=25C ) Parameter Symbol Rating Unit Conditions Power supply voltage range 1 V 8.9 to 26.0 V VCC pin voltage CC Power supply voltage range 2 V to 650 V DRAIN pin voltage DRAIN Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V) Specifications Parameter Symbol Unit Conditions Min Typ Max [MOSFET Block] Between drain and V 650 - - V I =1mA / V =0V source voltage (BR)DDS D GS Drain leak current I - - 100 uA V =650V / V =0V DSS DS GS I =0.25A / V =10V On resistance R - 1.4 2.0 Ω D GS DS(ON) (BM2P014) I =0.25A / V =10V On resistance R - 2.4 3.6 Ω D GS DS(ON) (BM2P034) I =0.25A / V =10V On resistance R - 4.0 5.5 Ω D GS DS(ON) (BM2P054) I =0.25A / V =10V On resistance R - 8.5 12.0 Ω D GS DS(ON) (BM2P094) www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 2/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Electrical Characteristics of Control IC part (Unless otherwise noted, Ta = 25C, VCC = 15 V) Specifications Parameter Symbol Unit Conditions Min Typ Max [Circuit current] BM2P014 FB=2.0V Circuit current (ON) 1 I 700 950 1200 μA ON1 ( at pulse operation) BM2P034 FB=2.0V Circuit current (ON) 1 I 550 775 1050 μA ON1 (at pulse operation) BM2P054 FB=2.0V Circuit current (ON) 1 I 410 600 790 μA ON1 (at pulse operation) BM2P094 FB=2.0V Circuit current (ON) 1 I 350 500 650 μA ON1 (at pulse operation) Circuit current (ON) 2 I - 400 500 μA FB=0.0V(at burst operation) ON2 [VCC protection function] VCC UVLO voltage 1 V 12.50 13.50 14.50 V VCC rises UVLO1 VCC UVLO voltage 2 V 7.50 8.20 8.90 V VCC falls UVLO2 VCC UVLO hysteresis V - 5.30 - V V V V UVLO3 UVLO3= UVLO1- UVLO2 VCC OVP voltage 1 V 26.0 27.5 29.0 V VCC rises OVP1 VCC OVP voltage 2 V 23.5 V VCC falls OVP2 Latch released VCC voltage V - V -0.5 - V LATCH UVLO2 VCC Recharge start voltage V 7.70 8.70 9.70 V CHG1 VCC Recharge stop voltage V 12.00 13.00 14.00 V CHG2 Latch mask time T 50 100 150 us LATCH Thermal shut down temperature T 118 145 - C Control IC SD [PWM type DCDC driver block] Oscillation frequency 1 F 60 65 70 KHz FB=2.00V SW1 Oscillation frequency 2 F 20 25 30 KHz FB=0.40V SW2 Frequency hopping width 1 F - 4.0 - KHz FB=2.0V DEL1 Hopping fluctuation frequency F 75 125 175 Hz CH Soft start time 1 T 0.30 0.50 0.70 ms SS1 Soft start time 2 T 0.60 1.00 1.40 ms SS2 Soft start time 3 T 1.20 2.00 2.80 ms SS3 Soft start time 4 T 4.80 8.00 11.20 ms SS4 Maximum duty D 68.0 75.0 82.0 % max FB pin pull-up resistance R 23 30 37 kΩ FB ΔFB / ΔCS gain Gain - 4.00 - V/V FB burst voltage V 0.300 0.400 0.500 V FB falls BST FB voltage of V 1.100 1.250 1.400 V starting Frequency reduction mode DLT FB OLP voltage 1a V 2.60 2.80 3.00 V Overload is detected (FB rise) FOLP1A FB OLP voltage 1b V - 2.60 - V Overload is detected (FB drop) FOLP1B FB OLP ON timer T 40 64 88 ms FOLP1 FB OLP Start up timer T 26 32 38 ms FOLP1b FB OLP OFF timer T 358 512 666 ms FOLP2 [Over current detection block] Overcurrent detection voltage V 0.380 0.400 0.420 V Ton=0us CS Overcurrent detection voltage SS1 VCS_SS1 - 0.100 - V 0[ms] ~ TSS1[ms] Overcurrent detection voltage SS2 VCS_SS2 - 0.150 - V TSS1 [ms] ~ TSS2 [ms] Overcurrent detection voltage SS3 VCS_SS3 - 0.200 - V TSS2 [ms] ~ TSS3[ms] Overcurrent detection voltage SS4 VCS_SS4 - 0.300 - V TSS3 [ms] ~ TSS4 [ms] Leading Edge Blanking Time T - 250 - ns LEB Over current detection AC Voltage K 12 20 28 mV/us compensation factor CS SOURCE pin V 0.020 0.050 0.080 V short protection voltage CSSHT [Start circuit block] Start current 1 I 0.100 0.500 1.000 mA VCC= 0V START1 Start current 2 I 1.000 3.000 6.000 mA VCC=10V START2 Inflow current from Drain pin OFF current I - 10 20 uA after UVLO released UVLO. START3 When MOSFET is OFF Start current switching voltage V 0.800 1.500 2.100 V SC www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 3/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series PIN DESCRIPTIONS Table 1 Pin Description ESD Diode NO. Pin Name I/O Function VCC GND 1 SOURCE I/O MOSFET SOURCE pin ○ ○ 2 N.C. - - - - 3 GND I/O GND pin ○ - 4 FB I Feedback signal input pin - ○ 5 VCC I Power supply input pin - ○ 6 DRAIN I/O MOSFET DRAIN pin - - 7 DRAIN I/O MOSFET DRAIN pin - - I/O Equivalent Circuit Diagram 7 DRAIN 6 DRAIN 5 VCC DRAIN DRAIN Internal Internal VCC Circuit Circuit Internal MOSFET Internal MOSFET SOURCE SOURCE 1 SOURCE 2 N.C. 3 GND 4 FB VREF VREF SOURCE GND FB RFB Figure 2 I/O Equivalent Circuit Diagram www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 4/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Block Diagram + VH VO FUSE AC Filter Diode CM Bridge Vs - Cvcc VCC DRAIN VCC DRAIN DRDARINAIN 5 6 7 VCC UVLO + /1 38..52VV - 4.0V Starter VCC OVP Line Reg + - 12V Clamp 10uA Circuit 2273.5.5VV/ Internal Block S R Q DRIVER PWM Control 4.0V 4.0V FB 30k OLP 4 - 6342mmss 1M + Timer Current SOURCE Limiter Leading Edge Burst + Blanking 1 Comparator - (typ=250ns) - + Rs Soft Start CoAmCpe Innspauttion PWM Comparator MAX - DUTY + GND Frequency 3 + OSC Hopping (65kHz) Slope Compensation FeedBack With Isolation Figure 3. Block Diagram www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 5/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Description of Blocks (1) Start circuit (DRIAN: 6,7pin) This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting. After starting, consumption power is idling current I (typ=10uA ) only. START3 Reference values of Starting time are shown in Figure-7. When Cvcc=10uF it can start less than 0.1 sec. + FUSE AC Diode 85-265Vac Bridge - DRAIN Starter SW1 VCC Cvcc + - VCCUVLO Figure 4. Block diagram of start circuit 1.0 0.9 ISTART2 0.8 A] ent [m e [s] 00..67 Curr Tim 00..45 art Up Start 00..23 St 0.1 ISTART1 0.0 ISTART3 0 5 10 15 20 25 30 35 40 45 50 0 Vsc 10V VUVLO1 C [μF] VCC VCCVoltage[V] Figure 5. Start current vs VCC voltage Figure 6. Start time (reference value) * Start current flows from the DRAIN pin ex) Consumption power of start circuit only when the Vac=100V PVH=100V*√2*10uA=1.41mW ex) Consumption power of start circuit only when the Vac=240V PVH=240V*√2*10uA=3.38mW www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 6/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series (2) Start sequences (Soft start operation, light load operation, and auto recovery operation during overload protection) Start sequences are shown in Figure 7. See the sections below for detailed descriptions. VH VCC=13.5V VCC(1pin) VCC=8.2V Within FB OLP ON Internal REF 32ms 64ms Pull Up FB(8pin) Vout Over Load Normal Load Light LOAD Iout Burst mode Switching stop SSwwiticthiinngg Soft Start A BC D E F G H I Figure 7. Start sequences Timing Chart A: Input voltage VH is applied B: This IC starts operation when VCC pin voltage rises and VCC > V (13.5 V typ).Switching function starts when UVLO1 other protection functions are judged as normal. Until the secondary output voltage becomes constant level, VCC voltage drops because of the VCC consumption current. VCC recharge function start if VCC voltage < V (8.7V CHG1 typ ) C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current. D: When the switching operation starts, VOUT rises.The output voltage become to stable state, VCC voltage also become to stable state through auxiliary winding.Please set the rated voltage within the T period (32ms typ) FOLP1b from VCC voltage > V . UVLO1 E: During a light load, if it reaches FB voltage < V (= 0.4Vtyp), the IC starts burst operation to keep power BST consumption low.During burst operation, it becomes low-power consumption mode. F: When the FB Voltage＞V (=2.8V typ ), it becomes a overload operation. FOLP1A G: When FB pin voltage keeps V (= 2.8V typ) at or above T (64ms typ), the overload protection function is FOLP1A FOLP1 triggered and switching stops 64ms later. if the FB pin voltage becomes FB<VFOLP1B even once, the IC’s FB OLP timer is reset. H: If the VCC voltage drops to VCC < V (8.2Vtyp) or below, restart is executed. UVLO2 I: The IC’s circuit current is reduced and the VCC pin value rises. (Same as B) www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 7/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series (3) VCC pin protection function This IC built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC voltage. VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage. VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at dropping the VCC voltage. (3-1) VCC UVLO / VCC OVP function VCCUVLO is auto recovery protection. VCCOVP is auto recovery protection. And they have voltage hysteresis. Refer to the operation figure-8. Switching is stopped by the VCCOVP function when VCC pin voltage > Vovp1 (typ=27.5V), and Switching is restart when VCC pin voltage < Vovp2 (typ=23.5V) VH VVOoVvPp11=V27O.5VVPt1yp VVOoVvPp22=V23O.5VVPt2yp VCVCUuVvLlOo11V=1U3V.5LVOty1p VCC VVCcHhGg22=13V.0VCtHyGp2 VVCcHhGg11= 8.7VVCtyHpG1 VVCUCVuLOvl2o 2= V8.2UVVtLyOp2 Time ON ON OFF VCC UVLO ON VCC OVP OFF OFF ON ON VCC Charge OFF Function ON OUT OFF Switching OFF Time A B C D E F G H I J A Figure 8. VCC UVLO / OVP Timing Chart A: DRAIN voltage input, VCC pin voltage starts rising. B: VCC>V , DC/DC operation starts UVLO1 C: VCC< V , VCC charge function operates and the VCC voltage rises. CHG1 D: VCC > V VCC charge function is stopped. CHG2, E: VCC > V continues T (typ =100us), switching is stopped by the VCCOVP function. OVP1, LATCH F: VCC < V , Switching operation restarts OVP2 G: VH is OPEN.VCC Voltage is fall. H: Same as C. I: Same as D. J: VCC<V , Switching is stopped by the VCC UVLO function UVLO2 www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 8/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series (3-2) VCC Charge function After VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin voltage drops to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit. By this operation, this IC doesn’t occur to start failure. When VCC pin voltage rises to VCC >VCHG2, charge is stopped. The operations are shown in figure 9. VH V UVLO1 V CHG2 VCC V CHG1 V UVLO2 Switching VH charge charge charge charge charge OUTPUT voltage A B C D E F G H Figure 9. Charge operation VCC pin charge operation A: DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function. B: VCC > V VCC UVLO function releases, VCC charge function stops, DC/DC operation starts. UVLO1, C: When DC/DC operation starts, the VCC voltage drops. D: VCC < V VCC recharge function operates and VCC pin voltage rises. CHG1, E: VCC > V VCC recharge function stops. CHG2, F: VCC < V VCC recharge function operates and VCC pin voltage rises. CHG1, G: VCC > V VCC recharge function stops. CHG2, H: After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes. www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 9/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series (4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst) This IC is current mode PWM control. An internal oscillator sets a fixed switching frequency (65kHz typ). This IC is integrated switching frequency hopping function which changes the switching frequency to fluctuate as shown in Figure 10 below. The fluctuation cycle is 125 Hz typ. Switching Frequency [kHz] 500us 69 68 67 66 65 64 63 62 61 125 Hz(8ms) Time Figure 10. Frequency hopping function Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ). With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur. As a countermeasure to this, this IC is built in slope compensation circuits. This IC is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the load is light. FB pin is pull up by R (30 kΩ typ). FB FB pin voltage is changed by secondary output voltage (secondary load power). FB pin is monitored, burst mode operation and frequency detection start. Figure 11 shows the FB voltage, and switching frequency, DCDC operation • mode1 : Burst operation • mode2 : Frequency reduction operation. • mode3 : Fixed frequency operation.(operate at the max frequency) • mode4 : Over load operation.(detect the over load state and stop the pulse operation) Y mode1 mode2 mode3 mode4 65kHz 25kHz X 0.40V 1.25V 2.00V 2.80V FB [V] Figure 11. Switching operation state changes by FB pin voltage www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 10/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series (5) Over Current limiter This IC is built in Over Current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is stopped. It is also built in AC voltage compensation function. This is the function which compensates the maximum power as the AC voltage’s change by increasing over current limiter with time. Shown in figure-12, 13, and 14. 65kHz(15.3us) 65kHz(15.3us) ON ON @[DACC/1D0C0V] OFF OFF @[DACC/1D0C0V] OFF OFF ON ON @[DACC/2D4C0V] OFF OFF @[DACC/1D0C0V] OFF OFF Iepak(AC)@Vin=240V Iepak(AC)@Vin=240V Iepak(AC)@Vin=100V Iepak(AC)@Vin=100V Iepak(DC)= included conpensation Iepak(DC)＝Constant Tdelay Tdelay Tdelay Primary Peak Current Tdelay Primary Peak Current Figure 12. No AC voltage compensation function Figure13. built-in AC compensation voltage Primary peak current is decided as the formula below. Primary peak current: Ipeak = Vs./Rs + Vdc/Lp*Tdelay Vcs: Over current limiter voltage internal IC, Rs: Current detection resistance, Vdc input DC voltage, Lp: Primary inductance, Tdelay: delay time after detection of over current limiter Y CS Limitter[V] 0.704V +20mV/us 0.552V 0.400V X 0.0 7.6us 15.3us Time [us] Figure 14. Over current limiter voltage (6) L.E.B period When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current. Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the on-chip LEB (Leading Edge Blanking) function. www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 11/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series (7) SOURCE pin (1pin) short protection function When the SOURCE pin (1pin) is shorted, this IC is over heat. This IC built in short protection function to prevent destroying. (8) SOURCE pin (1pin) open protection If the SOURCE pin becomes OPEN this IC may be damaged. To prevent to be damaged, this IC built in OPEN protection circuit (auto recovery protection ). (9) Output over load protection function (FB OLP Comparator ) The output overload protection function monitors the secondary output load status at the FB pin, and stops switching when an overload occurs. In case of an overload, the output voltage is reduced and current no longer flows to the photo coupler, so the FB pin voltage rises. When the FB pin voltage > V (2.8 V typ) continuously for the period FOLP1A T (64ms typ), it is judged as an overload and stops switching. FOLP1 When the FB pin > V (2.8 V typ), if the voltage goes lower than V (2.6V typ) during the period T (64ms FOLP1A FOLP1B FOLP1 typ), the overload protection timer is reset. The switching operation is performed during this period T (64ms typ). FOLP1 At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V (2.8 V typ) FOLP1A or above. Therefore, at startup the FB voltage must be set to go to V (2.6 V typ) or below during the period T FOLP1B FOLP1 (64ms typ), and the secondary output voltage’s start time must be set within the period T (64ms typ) following FOLP1 startup of the IC. Recovery from the once detection of FBOLP, after the period T (512 ms typ) FOLP2 FB VFOLP1A VH charge charge charge 64ms 64ms Switching VUVLO1 512ms 512ms VCHG2 VCC VCHG1 VUVLO2 A B C D E F GH Figure 15. Over load protection (Auto recovery) A: The FBOLP comparator detects over load for FB>V FOLP1A B: If the State of A continues for the period T (64ms typ), it is judged as an overload and stops switching after 64ms. FOLP1 C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches < V , the VCC charge function operates so the VCC pin voltage rises. CHG1 D: VCC charge function stops when VCC pin voltage > V CHG2 E: If T (typ =512ms ) go on from B point, Switching function starts on soft start. FOLP2 F: If T (typ=64ms ) go on from E point to continues a overload condition (FB>V Switching function stops at F FOLP1 FOLP1A), point. G: While switching stops VCC pin voltage drops to < V VCC charge function operates and VCC pin voltage rises. CHG1, H: If VCC pin (5pin) voltage becomes over V by the VCC charge function, VCC charge function operation stops. CHG2 www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 12/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Operation mode of protection circuit Operation mode of protection functions are shown in table2. Table2 Operation mode of protection circuit Function Operation mode VCC Under Voltage Locked Out Auto recovery VCC Over Voltage Protection Auto recovery TSD Latch (with 100us timer ) FB Over Limited Protection Auto recovery (with 64ms timer ) SOURCE Open Protection Auto recovery Sequence The sequence diagram is show in Fig 16. All condition transits OFF Mode VCC<8.2V ALL MODE VCC< 8 .2 V OFF MODE VCC > 13 .5 V Soft Start 1 Time >0 . 5 ms Soft Start 2 Time > 1. 0 ms Soft Start 3 Time >2 . 0 ms VCC < 7 .7 V ( PVuClsCe OSVtoPp ) Soft Start SOURCE OPEN ( Pulse Stop ) Time >8 . 0m s VCC < 23. 5 V NORMAL OFFFB OTILMPE R VCC >2 7 .5 V OPEN ( 512 ms ) Temp>145℃ Normal MODE LAT(C PHul sOeF SFt oMpO ) DE FB >2 . 80 V FB > 2 .8 0 V FB< 2 . 60 V FB < 0 .4 0 V FB> 0. 40 V PULSE OFF ( 64 ms ) (O PLuPls eM SOtDopE ) Burst MODE ( Pulse OFF ) Figure 16. The sequence diagram www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 13/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Thermal loss The thermal design should set operation for the following conditions. (Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.) 1. The ambient temperature Ta must be 105°C or less. 2. The IC’s loss must be within the allowable dissipation Pd. The thermal abatement characteristics are as follows. (PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy on double-layer substrate) 3000 2500 2000 1500 W] m Pd[ 1000 500 0 0 25 50 75 100 125 150 Ta[℃] Figure 17. Thermal Abatement Characteristics www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 14/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Ordering Information B M 2 P x x 4 MOSFET ON Resistor 01: 1.4 Ω 03: 2.4 Ω 05: 4.0 Ω 09: 8.5 Ω Making Diagram DIP7K (TOP VIEW) DIP7F (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number Part Number Marking Product Name MOSFET ON resistor BM2P014 BM2P014 1.4 Ω BM2P034 BM2P034 2.4 Ω BM2P054 BM2P054 4.0 Ω BM2P094 BM2P094 8.5 Ω www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 15/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Physical Dimension and Packing Information Package Name DIP7K www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 16/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Physical Dimension and Packing Information Package Name DIP7F www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 17/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the GND and supply lines of the digital and analog blocks to prevent noise in the GND and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to GND at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. GND Voltage Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition. 4. GND Wiring Pattern When using both small-signal and large-current GND traces, the two GND traces should be routed separately but connected to a single GND at the reference point of the application board to avoid fluctuations in the small-signal GND caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The GND lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, GND the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 18/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or GND line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B B Pin B C Pin A E P+ P P+ P+ N P P+ B C N N N N Parasitic N N N E Elements Parasitic P Substrate P Substrate Elements GND GND GND GND Parasitic Parasitic N Region Elements Elements close-by Figure 18. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 19/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

BM2Pxx4 Series Revision History date Rev. No. Revision Point 2012.07.19 001 New Release P7 An explanation for Figure7 P8 An explanation for VCC_UVLO/VCC_OVP function An explanation for Figure8 2013.11.18 006 P11 An explanation for Over Current limiter P12 An explanation for Output over load protection function An explanation for Figure15 P13 Figure16 P13 Operation mode of protection circuit 2015.05.15 007 P13 Sequence P5 Figure3 P7 An explanation of Start sequence P8 An explanation of VCC pin protection function P8 An explanation of VCC UVLO / VCC OVP function 2015.09.24 008 P9 An explanation of VCC Charge function P11 An explanation of Over Current Limiter P12 An explanation of Output over load protection function P1 An explanation of package height P2 Format for Electrical Characteristics of MOSFET P3 Format for Electrical Characteristics of Control IC P3 An explanation of Thermal shut down temperature 2017.03.07 009 P7 An explanation of Start sequences P8 An explanation of Figure8 P9 An explanation of VCC pin protection function P12 An explanation of OUTPUT over load protection function P1 Add the division of product name 2019.04.22 010 P1 Add the package variation and modify the size P16, P17 Modify the physical dimension and packing information www.rohm.com TSZ02201-0F2F0A200070-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 20/20 TSZ22111 • 15 • 001 22.Apr.2019 Rev.010

Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved.

Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

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