Reference Only Spec. No. JENF243A-9106K-01 P.1/9 Chip Ferrite Bead BLM41□□□□□SH1L Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM41_SH Series based on AEC-Q200. 2. Part Numbering (ex.) BL M 41 PG 600 S H 1 L (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (4)Characteristics (7)Category(for Automotive Electronics) (2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit (3)Dimension (L×Ｗ) (6)Performance (9)Packaging (L:Taping) 3. Rating Impedance (Ω) DC Resistance (at 100MHz,Under Standard Rated Current (Ω) max. (*1) Testing Condition) (mA) (*2) (refer to below Customer MURATA (*1) comment) ESD Rank Part Number Part Number 6:25kV (refer to below comment) Initial Values at at Values After Typical 85℃ 125℃ Testing *2 *2 BLM41PG600SH1L 30 min. 60 0.009 0.018 6000 3700 *2 *2 BLM41PG750SH1L 45 min. 75 0.015 0.03 3500 2450 *2 *2 BLM41PG181SH1L 180±25% 180 0.02 0.04 6 3500 2110 *2 *2 BLM41PG471SH1L 470±25% 470 0.05 0.10 2000 1350 *2 *2 BLM41PG102SH1L 1000±25% 1000 0.09 0.18 1500 1000 • Operating Temperature: -55°C to +125°C • Storage Temperature: -55°C to +125°C (*1) Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa ) A (*2) In case of Rated current is more than *1, nt( 85℃x DescribetheRatedcurrentasx[A] dReapteedn dCinugrr oenn tt hise d oepraetreadti nags treigmhpt efirgauturere . urre incaseofmorethan1A. C d 125℃1 e at R 0 85 125 4. Style and Dimensions OperatingTemperature(°C) 4.5±0.2 1.6±0.2 ■ Equivalent Circuit 2 0. ± 1.6 0.7±0.3 ( ) Resistance element becomes dominant at high frequencies. : Electrode ■ Unit Mass (Typical value) (in mm) 0.050g MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.2/9 5. Marking No marking. 6. Specifications 6-1. Electrical Performance No. Specification Test Method 7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz Measuring Equipment : Agilent 4291A or the equivalent Test Fixture : Agilent 16192A or the equivalent 7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter 6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/ FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 Murata Specification / Deviation No. Stress Test Method 3 High 1000hours at 125 deg C Meet Table A after testing. Temperature Set for 24hours at room Table A Exposure temperature, then Appearance No damage measured. Impedance Change Within ±30% (at 100MHz) DC Meet item 3. Resistance 4 Temperature Cycling 1000cycles Meet Table A after testing. -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. 5 Destructive Per EIA469 No defects Physical Analysis No electrical tests 7 Biased Humidity 1000hours at 85 deg C, Meet Table A after testing. 85%RH Apply max rated current. 8 Operational Life Apply 125 deg C Meet Table A after testing. 1000hours If the rated current of parts exceed 1A, Set for 24hours at room the operating temperature should be 85 deg C. temperature, then measured 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 4 No defects （Style and Dimensions） 12 Resistance to Solvents Per MIL-STD-202 Method Not Applicable 215 13 Mechanical Shock Per MIL-STD-202 Method Meet Table A after testing. 213 Condition F: 1500g’s(14.7N)/0.5ms/ Half sine 14 Vibration 5g's(0.049N) for 20 Meet Table A after testing. minutes, 12cycles each of 3 orientations Test from 10-2000Hz. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.3/9 AEC-Q200 Murata Specification / Deviation No. Stress Test Method 15 Resistance Solder temperature Pre-heating:150C +/-10 deg,60s to 90s to Soldering Heat 260C+/-5 deg C Meet Table A after testing. Immersion time 10s 17 ESD Per AEC-Q200-002 Meet Table A after testing. ESD Rank: Refer to Item 3. Rating 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Measured : Impedance No defects Characterization 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Meet Table A after testing. Deflection 2mm(min) 60s minimum holding time 22 Terminal Strength Per AEC-Q200-006 No defects A force of 17.7N for 60sec 30 Electrical Per ISO-7637-2 Not Applicable Transient Conduction MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.4/9 7. Specification of Packaging 7-1. Appearance and Dimensions (12mm-wide plastic tape) 1 4.0±02..10±0.40.50±0.1 φ1.5+-00.1 75±0. 0.3±0.11.75±0.1 1. 5 0 ±0. 0.3 1 5 ± ±0. 5. 2.0 8 1 4. 1.9±0.1 φ1.5+-00.3 Directionof feed (in mm) *Dimension of the Cavity is measured at the bottom side. (1) Taping Products shall be packaged in the each embossed cavity of 12mm-wide, 4mm-pitch and plastic tape continuously and sealed by cover tape. (2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed. (3) Spliced point:The base tape and top tape have no spliced point. (4) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 7-2. Tape Strength (1) Pull Strength Plastic tape 5N min. Cover tape 10N min. (2) Peeling off force of Cover tape 165to180degree F Covertape 0.2N to 0.7N (Minimum value is typical.) *Speed of Peeling off:300mm/min Plastictape 7-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel : 2500 pcs. / reel (2) There shall be leader-tape(cover tape only and empty tape ) and trailer- tape(empty tape) as follows. (3) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (4) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2), Quantity, etc) MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.5/9 (5) Dimensions of reel and taping (leader-tape, trailer-tape) Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Covertape φ13.0±0.2 φ60+1 -0 φ21.0±0.8 Directionof feed 13.0+1 -0 17.0±1.4 φ180+0 -3 (inmm) 7-4. Specification of Outer Case Outer Case Dimensions Label Standard Reel Quantity in Outer Case (mm) (Reel) H W D H 186 186 93 3 D ∗ Above Outer Case size is typical. It depends on a quantity of an W order. 8. ！ Caution 8-1. Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3. Fail Safe Be sure to provide an appropreate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains,ships,etc.) (4)Power plant control equipment (9)Applications of similar complexity and /or reliability requirements (5)Medical equipment to the applications listed in the above MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.6/9 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1. Land pattern designing • Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead Rated Land pad thickness and Current dimension a (A) 18µm 35µm 70µm 1.5/2 1.2 1.2 1.2 3.5 2.4 1.2 1.2 1.2 ａ 6 6.4 3.3 1.65 (in mm) *The excessive heat by land pads may cause 3.0 Solder Resi s t deterioration at joint of products with substrate. 6.0 Pﾟattern • Land dimensions on Flow soldering for 2.5mm pitch mounting ChipFerriteBead *Taking land pad thickness and rated current into account. a b c d e 3.0 6.0 1.2 1.8 1.5 (in mm) h e a e pitc b c *The pattern shall be designed to above drawing to m d prevent causing the solder bridge when products m 2.5 c are mounted by 2.5mm pitch flow soldering. e a e SolderResist b d Pattern MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.7/9 9-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%.) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time.(s) Standard Profile Limit Profile Pre-heating 150℃、60s min. Heating 250℃、4～6s 265℃±3℃、5s max. Cycle of flow 2 times 2 times □Reflow soldering profile Temp. 260℃ (℃) 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150～180°C、90s±30s Heating above 220°C、30s～60s above 230°C、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.8/9 9-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Soldering iron output: 80W max. • Tip temperature: 350°C max. • Tip diameter:φ3mm max. • Soldering time : 3(+1,-0) seconds. • Times : 2times max. Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 9-4. Solder Volume Solder shall be used not to be exceed as shown below. UpperLimit Recommendable 1/3T≦t≦T t (T: Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 9-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. <Products direction> a Products shall be located in the sideways b < direction (Length: a b) to the mechanical stress. 〈Poor example〉 〈Goodexample 〉 (2) Products location on P.C.B. separation. Products (A, B, C, D) shall be located carefully Seam B C so that products are not subject to the mechanical stress due to warping the board. D Because they may be subjected the mechanical b A stress in order of A>C>B ≅ D. Slit Length:a<b a 9-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin.In prior to use, please make the reliability evaluation with the product mounted in your application set. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-9106K-01 P.9/9 9-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 20W/ max. Frequency:28kHz to 40kHz Time: 5 min max. (3) Cleaner 1.Alternative cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9-11. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10 . ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.