Reference Only Spec. No. JENF243A-0003AD-01 P.1/12 Chip Ferrite Bead BLM18□□□□□□N1□ Reference Specification 1.Scope This reference specification applies to Chip Ferrite Bead BLM18_□N Series. 2.Part Numbering (ex.) BL M 18 AG 121 S N 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk) 3.Rating Impedance (Ω) Rated DC Resistance (at 100MHz, Under Standard Current (Ω max.) Customer MURATA Testing Condition) (mA) Values Remark Part Number Part Number Initial at at After Typical Values 85℃ 125℃ Testing BLM18RK121SN1D 120±25% 120 200 0.25 0.35 BLM18RK121SN1B BLM18RK221SN1D 220±25% 220 200 0.30 0.40 BLM18RK221SN1B For BLM18RK471SN1D 470±25% 470 200 0.50 0.60 Digital BLM18RK471SN1B Interface BLM18RK601SN1D 600±25% 600 200 0.60 0.70 BLM18RK601SN1B BLM18RK102SN1D 1000±25% 1000 200 0.80 0.90 BLM18RK102SN1B BLM18PG300SN1D 20 min. 30 1000 0.05 0.10 BLM18PG300SN1B BLM18PG330SN1D 33±25% 33 3000*1 1000*1 0.025 0.050 BLM18PG330SN1B BLM18PG600SN1D 40 min. 60 1000 0.1 0.2 BLM18PG600SN1B BLM18PG121SN1D 120±25% 120 2000*1 1000*1 0.05 0.10 BLM18PG121SN1B BLM18PG181SN1D 180±25% 180 1500*1 1000*1 0.09 0.18 BLM18PG181SN1B BLM18PG221SN1D 220±25% 220 1400*1 1000*1 0.10 0.14 BLM18PG221SN1B BLM18PG331SN1D 330±25% 330 1200*1 1000*1 0.15 0.20 BLM18PG331SN1B BLM18PG471SN1D For DC 470±25% 470 1000 0.20 0.26 BLM18PG471SN1B power line BLM18KG221SN1D 220±25％ 220 2200*1 1500*1 0.050 0.060 BLM18KG221SN1B BLM18KG331SN1D 330±25％ 330 1700*1 1200*1 0.080 0.095 BLM18KG331SN1B BLM18KG471SN1D 470±25％ 470 1500*1 1000*1 0.130 0.145 BLM18KG471SN1B BLM18KG601SN1D 600±25％ 600 1300*1 1000*1 0.150 0.165 BLM18KG601SN1B BLM18KG102SN1D 1000±25％ 1000 1000*1 800*1 0.200 0.230 BLM18KG102SN1B BLM18SD220SN1D 22±25％ 22 6000*1 3500*1 0.008 0.013 BLM18SD220SN1B BLM18SG330SN1D 33±25％ 33 6000*1 3500*1 0.008 0.013 BLM18SG330SN1B MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.2/12 Impedance (Ω) Rated DC Resistance (at 100MHz, Under Standard Current (Ω max.) Customer MURATA Testing Condition) (mA) Values Remark Part Number Part Number Initial at at After Typical Values 85℃ 125℃ Testing BLM18AG121SN1D 120±25% 120 800 0.18 0.28 BLM18AG121SN1B BLM18AG151SN1D 150±25% 150 700 0.25 0.35 BLM18AG151SN1B BLM18AG221SN1D 220±25% 220 700 0.25 0.35 BLM18AG221SN1B For BLM18AG331SN1D 330±25% 330 600 0.30 0.40 general BLM18AG331SN1B use BLM18AG471SN1D 470±25% 470 550 0.35 0.45 BLM18AG471SN1B BLM18AG601SN1D 600±25% 600 500 0.38 0.48 BLM18AG601SN1B BLM18AG102SN1D 1000±25% 1000 450 0.50 0.60 BLM18AG102SN1B BLM18BB050SN1D 5±25% 5 800 0.05 0.10 BLM18BB050SN1B BLM18BA050SN1D 5±25% 5 500 0.2 0.3 BLM18BA050SN1B BLM18BB100SN1D 10±25% 10 700 0.10 0.20 BLM18BB100SN1B BLM18BA100SN1D 10±25% 10 500 0.25 0.35 BLM18BA100SN1B BLM18BB220SN1D 22±25% 22 700 0.20 0.30 BLM18BB220SN1B BLM18BA220SN1D 22±25% 22 500 0.35 0.45 BLM18BA220SN1B BLM18BB470SN1D 47±25% 47 600 0.25 0.35 BLM18BB470SN1B BLM18BD470SN1D 47±25% 47 500 0.3 0.4 BLM18BD470SN1B BLM18BA470SN1D 47±25% 47 300 0.55 0.65 BLM18BA470SN1B BLM18BB600SN1D 60±25% 60 600 0.25 0.35 For BLM18BB600SN1B high speed BLM18BA750SN1D 75±25% 75 300 0.70 0.80 signal line BLM18BA750SN1B BLM18BB750SN1D 75±25% 75 600 0.30 0.40 BLM18BB750SN1B BLM18BB121SN1D 120±25% 120 550 0.30 0.40 BLM18BB121SN1B BLM18BD121SN1D 120±25% 120 300 0.4 0.5 BLM18BD121SN1B BLM18BA121SN1D 120±25% 120 200 0.9 1.0 BLM18BA121SN1B BLM18BB141SN1D 140±25% 140 500 0.35 0.45 BLM18BB141SN1B BLM18BB151SN1D 150±25% 150 450 0.37 0.47 BLM18BB151SN1B BLM18BD151SN1D 150±25% 150 300 0.4 0.5 BLM18BD151SN1B BLM18BB221SN1D 220±25% 220 450 0.45 0.55 BLM18BB221SN1B BLM18BD221SN1D 220±25% 220 250 0.45 0.55 BLM18BD221SN1B MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.3/12 Impedance (Ω) Rated DC Resistance (at 100MHz, Under Standard Current (Ω max.) Customer MURATA Testing Condition) (mA) Initial Values Remark Part Number Part Number at at Values After Typical 85℃ 125℃ Testing BLM18BB331SN1D 330±25% 330 400 0.58 0.68 BLM18BB331SN1B BLM18BD331SN1D 330±25% 330 250 0.5 0.6 BLM18BD331SN1B BLM18BD421SN1D 420±25% 420 250 0.55 0.65 BLM18BD421SN1B BLM18BB471SN1D 470±25% 470 300 0.85 0.95 BLM18BB471SN1B BLM18BD471SN1D 470±25% 470 250 0.55 0.65 BLM18BD471SN1B For BLM18BD601SN1D 600±25% 600 200 0.65 0.75 high speed BLM18BD601SN1B signal line BLM18BD102SN1D 1000±25% 1000 200 0.85 0.95 BLM18BD102SN1B BLM18BD152SN1D 1500±25% 1500 150 1.2 1.3 BLM18BD152SN1B BLM18BD182SN1D 1800±25% 1800 150 1.5 1.6 BLM18BD182SN1B BLM18BD222SN1D 2200±25% 2200 150 1.5 1.6 BLM18BD222SN1B BLM18BD252SN1D 2500±25% 2500 150 1.5 1.6 BLM18BD252SN1B BLM18TG121TN1D 120±25% 120 200 0.25 0.3 BLM18TG121TN1B BLM18TG221TN1D For 220±25% 220 200 0.3 0.4 BLM18TG221TN1B general BLM18TG601TN1D use 600±25% 600 200 0.45 0.6 BLM18TG601TN1B (Thin type) BLM18TG102TN1D 1000±25% 1000 100 0.6 0.8 BLM18TG102TN1B BLM18SG260TN1D 26±25％ 26 6000*1 1000*1 0.007 0.012 BLM18SG260TN1B BLM18SG700TN1D 70±25％ 70 4000*1 1000*1 0.020 0.030 BLM18SG700TN1B BLM18SG121TN1D 120±25％ 120 3000*1 1000*1 0.025 0.035 BLM18SG121TN1B BLM18SG221TN1D 220±25％ 220 2500*1 1000*1 0.040 0.055 BLM18SG221TN1B BLM18SG331TN1D 330±25％ 330 1500*1 1000*1 0.070 0.085 BLM18SG331TN1B For DC BLM18SN220TN1D 22±7 22 8000*1 5000*1 0.004 0.005 power line BLM18SN220TN1B (Thin type) BLM18KG260TN1D 26±25％ 26 6000*1 4000*1 0.007 0.012 BLM18KG260TN1B BLM18KG300TN1D 30±25％ 30 5000*1 3300*1 0.010 0.015 BLM18KG300TN1B BLM18KG700TN1D 70±25％ 70 3500*1 2200*1 0.022 0.032 BLM18KG700TN1B BLM18KG101TN1D 100±25％ 100 3000*1 1900*1 0.030 0.040 BLM18KG101TN1B BLM18KG121TN1D 120±25％ 120 3000*1 1900*1 0.030 0.040 BLM18KG121TN1B MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.4/12 • Operating Temperature : -55°C to +125°C • Storage Temperature : -55°C to +125°C ) (A Ratedcurrent (*1)In case of Rated current is more than 1A, nt at85°C e Rated Current is derated as right figure urr depending on the operating temperature. dC Ratedactu1r2re5n°tC e at R 0 85 125 OperatingTemperature(°C) 4.Style and Dimensions 1.6±0.15 0.8±0.15 ■ Equivalent Circuit T 0.4 ±0.2 : Ele ctrode (Re sistance element becomes) dominant at high frequencies. BL M 18SG***TN1* 0.5±0.15 BLM18SN***TN1* 0.6±0.15 ■ Unit Mass (Typical value) BLM18TG***TN1* 0.6±0.1 B LM 1 8 * ** **SN1*:0.005g BLM18KG***TN1* 0.6±0.15 BLM18*****TN1*:0.004g BLM18*****SN1* 0.8±0.15 (in mm) 5.Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7.Specifications 7-1.Electrical Performance No. Item Specification Test Method 7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture : KEYSIGHT 16192A or the equivalent 7-1-2 DC Meet item 3. Measuring Equipment : Digital multi meter Resistance For BLM18SN_TN Measuring Equipment : YOKOGAWA 755611 or the equivalent Test Fixture : KEYSIGHT 16044A or the equivalent ＊Except resistance of the Substrate and Wire MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.5/12 7-2.Mechanical Performance No. Item Specification Test Method 7-2-1 Appearance Meet item 4. Visual Inspection and measured with Slide Calipers. and Dimensions 7-2-2 Bonding Meet Table 1. It shall be soldered on the substrate. Strength Applying Force(F) : 6.8N Table 1 Applying Time : 5s±1s Applied direction :Parallel to substrate Appearance No damage Side view Impedance Within ±30% Ｆ Change (for BLM18SN_TN Ｆ R0.5 (at 100MHz) Within ±50%) DC Meet item 3. Resistance Substrate 7-2-3 Bending It shall be soldered on the substrate. Strength Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection : 1.0mm Speed of Applying Force : 0.5mm/Ps ressurejig Keeping Time : 30s R340 F Deflection 45mm 45mm Product 7-2-4 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) 7-2-5 Resistance Meet Table 2. Pre-Heating : 150°C±10°C, 60s～90s to Soldering Solder : Sn-3.0Ag-0.5Cu Heat Table 2 Solder Temperature : 270°C±5°C Appearance No damage Immersion Time : 10s±0.5s Impedance Immersion and emersion rates : 25mm/s Within ±30% Change Then measured after exposure in the room condition for 48h±4h. (for BLM18KG (at 100MHz) Within ±40%) (for BLM18SN_TN Within ±50%) DC Meet item 3. Resistance 7-2-6 Drop Products shall be no failure after It shall be dropped on concrete or steel board. tested. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction(Total 9 times) 7-2-7 Solderability The electrodes shall be at least Flux : Ethanol solution of rosin,25(wt)% 95% covered with new solder Pre-Heating : 150°C±10°C, 60s～90s coating. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.6/12 7-3.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 7-3-1 Temperature Meet Table 3. 1 cycle: Cycle 1 step:-55 °C(+0 °C,-3 °C) / 30min±3min Table 3 2 step:Ordinary temp. / 10min to 15min 3 step:+125 °C(+3 °C,-0 °C) / 30min±3min Appearance No damage 4 step: Ordinary temp. / 10min to 15min Impedance Total of 100 cycles Within ±30% Then measured after exposure in the room condition for 48h±4h. Change (for BLM18KG (at 100MHz) Within-10%to+50%) (for BLM18SN_TN Within ±50%) DC Meet item 3. Resistance 7-3-2 Humidity Meet Table 1. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-3 Heat Life Temperature : 125°C±3°C (in case of Rated current is more than 1A, do the test at : +85 °C±3°C) Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-4 Cold Temperature : -55±2°C Resistance Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.7/12 8.Specification of Packaging 8-1.Appearance and Dimensions (8mm-wide paper tape) Part Number Type Appearance and Dimensions 1 2.0±0.05 0. 4.0±0.1 4.0±0.1 φ1.5+-00.1 75± 1. 5 BLM18RK***SN1D 0.0 3 BBLLMM1188PAGG******SSNN11DD 8mm- 85±0.1 3.5± 8.0±0. BLM18B****SN1D wide Paper tape 1. BLM18KG****N1D 4mm-pitch BLM18S****SN1D BLM18SN***TN1D 1.05±0.1 a Directionof feed Item Dimension “a” BLM18*****SN1D 1.1 max. BLM18KG***TN1D 0.85 max. BLM18SN***TN1D 2.20.±0±020..2.001.5±0 ±00.40.0.505 ±0.1 φ1.5+-00.1 5±0.1 7 1. 5 8mm- 0 BLM18SG***TN1D 0. BLM18TG***TN1D 2 mwmid-ep iPtcahp er tape ±0.1 3.5± ±0.3 5 0 1.8 8. 0.9max. 1.05±0.1 DirectionofFeed (in mm) (1) Taping Products shall be packaged in the cavity of the base tape continuously and sealed by top tape and bottom tape. (2) Sprocket hole:The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2.Tape Strength (1)Pull Strength Top tape 5N min. Bottom tape 165to180degree Toptape (2)Peeling off force of Top tape F 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min Bottomtape Basetape MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.8/12 8-3.Taping Condition (1)Standard quantity per reel Type Quantity per 180mm reel BLM18(except BLM18SG/BLM18TG) 4000 pcs. / reel BLM18SG/BLM18TG 10000 pcs. / reel (2)There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS Marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS discrimination(∗2), Quantity, etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) Trailer 2.0±0.5 160min. Leader Label 190min. 210min. Emptytape Toptape φ13.0±0.2 φ60+-10 φ21.0±0.8 Directionof feed 9.0+1 -0 13.0±1.4 φ180+-30 (in mm) 8-4. Specification of Outer Case Outer Case Dimensions Label Standard Reel Quantity in Outer Case (mm) (Reel) H W D H 186 186 93 5 D ∗ Above Outer Case size is typical. It depends on a quantity of an W order. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.9/12 9. Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (vehicles,trains,ships,etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1.Land pattern designing • Standard land dimensions < For BLM18 series (except BLM18P/BLM18S/BLM18K type) > ChipFerriteBead Type Soldering a b c c BLM18 (except18P/18S/ Flow 0.8 2.5 0.7 BLM18K type) Reflow 0.7 2.0 0.7 a SolderResist (in mm) b Pattern < For BLM18P/BLM18S/BLM18K type > ChipFerriteBead Rated Land pad thickness Type Current Soldering a b c and dimension d (A) 18µm 35µm 70µm c d 0.5 to 1.5 0.7 0.7 0.7 BLM18P Flow Flow 1.7 to 2.5 1.2 0.7 0.7 BLM18S Flow/ 0.8 2.5 3 to 4 0.7 2.4 1.2 0.7 BLM18K Reflow Reflow Reflow 5 to 6 0.7 2.0 6.4 3.3 1.65 a BLM18SN 8 - 6.4 3.3 b (in mm) SolderResist ∗The excessive heat by land pads may cause deterioration Pattern at joint of products with substrate. 10-2.Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.10/12 (3)soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time.(s) Standard Profile Limit Profile Pre-heating 150℃、60s min. Heating 250℃、4～6s 265℃±3℃、5s max. Cycle of flow 2 times 2 times □Reflow soldering profile T(e℃mp). 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150～180°C 、90s±30s Heating above 220°C、30s～60s above 217°C、60s~150s Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times 10-3.Reworking with soldering iron • Pre-heating: 150°C, 1 min • Soldering iron output: 80W max. • Tip temperature: 350°C max. • Tip diameter:φ3mm max. • Soldering time : 3(+1,-0) seconds. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4.Solder Volume Solder shall be used not to be exceeded as shown below. UpperLimit Recommendable 1/3T≦t≦T t (T: Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.11/12 10-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. <Products direction> a Products shall be located in the sideways b direction (Length: a<b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Perforation B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0003AD-01 P.12/12 10-9.Cleaning Conditions Products shall be cleaned on the following conditions. (1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3)Cleaner 1.Alternative cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11 . Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.