Reference Only Spec. No. JENF243A-0004Q-01 P1/8 GHz Noise Suppression Chip Ferrite Bead BLM18H□□□□SN1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM18H_SN Series. 2. Part Numbering (ex.) BL M 18 HG 601 S N 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk) 3. Rating Impedance (Ω) (Note) DC Resistance Rated Current (Under Standard Testing Condition) (Ω max. ) Customer MURATA (mA) Remark Part Number Part Number at 1GHz Values at at Initial at 100MHz After Typical 85℃ 125℃ Values Testing BLM18HE601SN1D 600±25% 300 min. 600 800*1 600*1 0.25 0.30 BLM18HE601SN1B For BLM18HE102SN1D 1000±25% 500 min. 1000 600*1 500*1 0.35 0.40 Large BLM18HE102SN1B Current BLM18HE152SN1D 1500±25% 750 min. 1500 500*1 400*1 0.50 0.55 BLM18HE152SN1B BLM18HG471SN1D 470±25% 400 min. 600 200 0.85 0.95 BLM18HG471SN1B For BLM18HG601SN1D 600±25% 450 min. 700 200 1.0 1.1 general BLM18HG601SN1B use BLM18HG102SN1D 1000±25% 750 min. 1000 100 1.6 1.7 BLM18HG102SN1B BLM18HD471SN1D 470±25% 700 min. 1000 100 1.2 1.3 BLM18HD471SN1B BLM18HD601SN1D 600±25% 850 min. 1200 100 1.5 1.6 BLM18HD601SN1B BLM18HD102SN1D 1000±25% 1100 min. 1700 50 1.8 1.9 For BLM18HD102SN1B high speed BLM18HB121SN1D 120±25% 500±40% 200 0.5 0.6 signal line BLM18HB121SN1B BLM18HB221SN1D 220±25% 1100±40% 100 0.8 0.9 BLM18HB221SN1B BLM18HB331SN1D 330±25% 1600±40% 50 1.2 1.3 BLM18HB331SN1B BLM18HK331SN1D 330±25% 400±40% 200 0.5 0.6 BLM18HK331SN1B BLM18HK471SN1D 470±25% 600±40% 200 0.7 0.8 For BLM18HK471SN1B Digital BLM18HK601SN1D 600±25% 700±40% 100 0.9 1.0 Interface BLM18HK601SN1B BLM18HK102SN1D 1000±25% 1200±40% 50 1.5 1.6 BLM18HK102SN1B • Operating Temperature : -55°C to +125°C ) • Storage Temperature : -55°C to +125°C (A Ratedcurrent nt at85°C e (Note) As for the Rated current marked with *1, urr C Ratedcurrent Rated Current is derated as right figure d at125°C depending on the operating temperature. ate R 0 85 125 OperatingTemperature(°C) MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P2/8 4. Style and Dimensions 1.6±0.15 0.8±0.15 ■ Equivalent Circuit 5 1 0. ± 8 0. 0.4±0.2 ( ) Resistance element becomes dominant at high frequencies. : Electrode ■ Unit Mass (Typical value) (in mm) 0.005g 5. Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7. Specifications 7-1. Electrical Performance No. Item Specification Test Method 7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent 7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item Specification Test Method 7-2-1 Appearance and Meet item 4. Visual Inspection and measured with Slide Calipers. Dimensions 7-2-2 Bonding Meet Table 1. It shall be soldered on the substrate. Strength Applying Force(F) : 6.8N Table 1 Applying Time : 5s±1s Appearance No damage Applied direction:Parallel to substrate Side view Impedance Change Within ±30% Ｆ Ｆ (at 100MHz) R0.5 DC Meet item 3. Resistance Substrate 7-2ｰ3 Bending It shall be soldered on the substrate. Strength Substrate: Glass-epoxy 100mm×40mm×1.0mm Deflection : 2.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressurejig R340 F Deflection 45mm 45mm Product MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P3/8 No. Item Specification Test Method 7-2ｰ4 Vibration Meet Table 1. It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) 7-2-5 Resistance Pre-Heating : 150°C±10°C, 60s～90s to Soldering Solder : Sn-3.0Ag-0.5Cu Heat Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. 7-2ｰ6 Drop Products shall be no failure It shall be dropped on concrete or steel board. after tested. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction (Total 9 times) 7-2-7 Solderability The electrodes shall be at Flux : Ethanol solution of rosin,25(wt)% least 95% covered with new Pre-Heating : 150°C±10°C, 60s～90s solder coating. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 7-3-1 Temperature Meet Table 1. 1 cycle: Cycle 1 step:-55 °C(+0 °C,-3 °C) / 30min±3min 2 step:Ordinary temp. / 10min to 15min 3 step:+125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. 7-3-2 Humidity Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-3 Heat Life Meet Table 2. Temperature : 125°C±3°C Table 2 Applying Current : Rated Current (at 125°C) Appearance No damage Time : 1000h(+48h,-0h) Impedance Within ±30% Then measured after exposure in the room condition for 48h±4h. Change (for BLM18HE (at 100MHz) Within ±40%) DC Meet item 3. Resistance 7-3-4 Cold Meet Table 1. Temperature : -55±2°C Resistance Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P4/8 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide paper tape) 1 2.0±0.05 0. 4.0±0.1 4.0±0.1 φ1.5+-00.1 75± 1. 5 0 0. 3 85±0.1 3.5± 8.0±0. 1. 1.05±0.1 1.1max. (in mm) Direction of feed (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point The base tape and top tape have no spliced point (4) Cavity There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength (1) Pull Strength Top tape 5N min. Bottom tape Toptape 165to180degree (2) Peeling off force of Top tape F 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min Bottomtape Basetape 8-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS marking (∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (∗2) , Quantity , etc) MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P5/8 (6) Dimensions of reel and taping(leader-tape, trailer-tape) Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Toptape φ13.0±0.2 φ60±10 φ21.0±0.8 9±1 Directionoffeed 0 13±1.4 φ180±0 3 (in mm) 8-4. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) Label (Reel) W D H H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. D W 9. ! Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment (7)Traffic signal equipment (8)Transportation equipment (vehicles, trains, ships, etc.) (9)Data-processing equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing • Standard land dimensions (Flow and Reflow soldering) ChipFerriteBead Soldering a b c c Flow 0.8 2.5 0.7 Reflow 0.7 2.0 0.7 a SolderResist (in mm) b Pattern 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P6/8 (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time.(s) Standard Profile Limit Profile Pre-heating 150°C, 60s min. Heating 250°C, 4s~6s 265°C±3°C, 5s max. Cycle of flow 2 times 2 times □Reflow soldering profile Temp. 260℃ (℃) 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C~180°C, 90s±30s Heating above 220°C, 30s~60s above 230°C, 60s max. Peak temperature 245°C±3°C 260°C, 10s Cycle of reflow 2 times 2 times MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P7/8 10-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Soldering iron output: 80W max. • Tip temperature: 350°C max. • Tip diameter:φ3mm max. • Soldering time : 3(+1,-0) seconds. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. UpperLimit Recommendable 1/3T≦t≦T t (T: Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. <Products direction> a Products shall be located in the sideways b direction (Length: a<b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Perforation B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A-0004Q-01 P8/8 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W/l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3)Cleaner 1.Cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.