Reference Only Spec. No. JENF243A–0008N-01 P 1 / 9 Chip Ferrite Bead Array BLA31□□□□□SN4□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead Array BLA31 Series used for electronic machinery. 2. Part Numbering (ex.) BL A 31 AG 121 S N 4 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (6)Performance (2)Type (7)Category (3)Dimension (L×Ｗ) (8)Numbers of Circuit (4)Characteristics (9)Packaging (D:Taping / B:Bulk) (5)Typical Impedance at 100MHz 3. Rating DC Resistance Impedance () Insulation Rated ( max. ) Customer MURATA at 100MHz , Resistance Current Initial Values Remark Part Number Part Number Under Standard between (mA) Values After Testing Condition) Elements Testing BLA31AG300SN4D 30±25% 200 0.10 0.20 BLA31AG300SN4B BLA31AG600SN4D 60±25% 200 0.15 0.25 BLA31AG600SN4B BLA31AG121SN4D 120±25% 150 0.20 0.30 For BLA31AG121SN4B general BLA31AG221SN4D 220±25% 150 0.25 0.35 use BLA31AG221SN4B BLA31AG601SN4D 600±25% 100 0.35 0.45 BLA31AG601SN4B BLA31AG102SN4D 100M 1000±25% 50 0.45 0.55 BLA31AG102SN4B min. BLA31BD121SN4D 120±25% 150 0.30 0.40 BLA31BD121SN4B BLA31BD221SN4D 220±25% 150 0.35 0.45 For BLA31BD221SN4B high BLA31BD471SN4D 470±25% 100 0.40 0.50 speed BLA31BD471SN4B signal BLA31BD601SN4D 600±25% 100 0.45 0.55 line BLA31BD601SN4B BLA31BD102SN4D 1000±25% 50 0.55 0.65 BLA31BD102SN4B · Operating Temperature : -55°C to +125°C · Storage Temperature : -55°C to +125°C MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 2 / 9 4. Style and Dimensions ■ Equivalent Circuit 0.3±0.2 1.6±0.2 3.2±0.2 2 0.8±0. :Electrode 0.8 0.4±0.2 ±0.1 (inmm) No polarity ■ Unit Mass (Typical value) 0.018g 5. Marking No marking. 6. Standard Testing Conditions  Unless otherwise specified   In case of doubt  Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7. Electrical Performance No. Item Specification Test Method 7.1 Impedance Meet item 3. Measuring Frequency : 100 MHz ± 1 MHz Measuring Equipment : Agilent 4291A or the equivalent (OSC = 0.05 V) Test Fixture : Agilent 16192A 7.2 DC Resistance Measuring Equipment : Digital multi meter 7.3 Insulation Resistance Measuring Voltage : 5 V(DC) between Elements Measuring Time : 1 min max. 8. Mechanical Performance No. Item Specification Test Method 8.1 Appearance and Meet item 4. Visual Inspection and measured with Slide Calipers. Dimensions 8.2 Bonding Meet Table 1. It shall be soldered on the substrate. Strength Applying Force(F) : 9.8 N Table 1 Applying Time : 5s ± 1s Appearance No damage Product F Impedance Change Within ±30% (at 100MHz) DC Meet item 3. Resistance Substrate 8.3 Bending It shall be soldered on the substrate. Strength Substrate : Glass-epoxy substrate (100mm  40mm  1.0mm) Deflection : 2.0 mm Speed of Applying Force : 0.5 mm / s Keeping Time : 30 s Pressurejig R340 F Deflection 45mm 45mm Product MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 3 / 9 No. Item Specification Test Method 8.4 Solderability The electrodes shall be atleast Flux : Ethanol solution of rosin, 25 (wt)% 95% covered with new solder Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s coating. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 °C ± 5 °C Immersion Time 3 s ± 1 s Immersion and emersion rates : 25mm / s 8.5 Resistance Meet Table 1. Flux : Ethanol solution of rosin, 25 (wt)% to Soldering Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s Heat Solder Sn-3.0Ag-0.5Cu Solder Temperature : 270 °C ± 5 °C Immersion Time : 10 s ± 1 s Immersion and emersion rates : 25mm / s Then measured after exposure in the room condition for 48h ± 4h. 8.6 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5 mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. 8.7 Drop Products shall be no failure It shall be dropped on concrete or steel board. after tested. Method : free fall Height : 75 cm Attitude from which the product is dropped : 3 directions The Number of Time : 3 times for each direction (Total 9 times) 9 . En v iro n m en ta l P e rfo rm a n ce (It sh al l b e s ol de red o n the s ub str at e.) No. Item Specification Test Method 9.1 Temperature Meet Table 1. 1 cycle: Cycle 1 step : -55 °C(+0 °C,-3 °C) / 30min ± 3min 2 step : Ordinary temp. / 10min to 15min 3 step : +125 °C(+3 °C,-0 °C) / 30min ± 3min 4 step:Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h ± 4h. 9.2 Humidity Temperature : 40 °C ± 2 °C Humidity : 90 %(RH) to 95 %(RH) Time : 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h ± 4h. 9.3 Heat Life Temperature : 125 °C ± 3 °C Applying Current : Rated Current Time : 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h ± 4h. 9.4 Cold Resistance Temperature : - 55 ± 2 °C Time : 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h ± 4h. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 4 / 9 10. Specification of Packaging 10.1. Appearance and Dimensions (8mm-wide paper tape) 2.0±0.1 0.1 4.0±0.1 4.0±0.1 1.5±0.1 5± 0 7 1. 1 1 5±0. 0.3 4±0. 3. 8.0± 3. 1.8±0.1 1.1max. Directionof feed (inmm) (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.2. Tape Strength (1) Pull Strength Top tape 5N min. Bottom tape Toptape 165to180degree F (2) Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.)  Speed of Peeling off : 300mm / min Bottomtape Basetape 10.3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel : 4000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc) 1) « Expression of Inspection No. » □□ OOOO  (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 5 / 9 (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (2) , Quantity , etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Toptape 13.0±0.2 60±10 21.0±0.8 Directionoffeed 9±1 0 13±1.4 180±03 (in mm) 10-4. Specification of Outer Case Outer Case Dimensions Label Standard Reel Quantity in Outer Case (mm) (Reel) H W D H 186 186 93 5 D Above Outer Case size is typical. It depends on a quantity of an order. W 11. ！ Caution 11.1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 11.2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (vehicles, trains, ships, etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Application of similar complexity and/or with reliability requirements to the applications listed in the above. 12. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 6 / 9 12.1. Land pattern designing · Standard land dimensions (Flow and Reflow soldering) 0.4 0.8  The excessive heat by land pads may cause Pattern deterioration at joint of products with substrate. 0.8 Product Solderresist 2.2to2.6 (inmm) 12.2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux(with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 µm Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. (2) Soldering conditions · Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 °C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. · Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. □Flow soldering profile Temp. (℃) 265±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time.(s) Standard Profile Limit Profile Pre-heating 150°C , 60s min. Heating 250°C、4~6s 265±3°C、5s max. Cycle of flow 2 times 2 times MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 7 / 9 □Reflow soldering profile Temp. 260℃ (℃) 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s〜60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150〜180°C 、90s±30s Heating above 220°C、30s〜60s above 230°C、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times 12.3. Reworking with soldering iron · Pre-heating : 150 °C , 1 min · Soldering iron output : 80 W max. · Tip temperature: 350°C max. · Tip diameter :  3mm max. · Soldering time : 3 (+1, -0) seconds. ·Times : 2times max. Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 12.4. Solder Volume Solder shall be used not to be exceeded as shown below. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. UpperLimit Recommendabl t 1/3T≦t≦T (T:Chipthickness) 12.5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. <Products direction> a Products shall be located in the sideways b direction (Length : a < b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2) Products location on P.C.B. separation. Products (A,B,C,D) shall be located carefully C Seam B so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical b A D stress in order of A > C > B  D. Slit Length:ab a 12.6. Potential between Elements Products should be used within 5 V (DC) between elements. When the products are used the excessive voltage over 5 V (DC) , it may cause breaking of inner electrode and / or decreasing of insulation resistance between elements. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 8 / 9 12.7. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 12.8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60 °C max. (40 °C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28 kHz to 40 kHz Time : 5 min max. (3) Cleaner 1.Cleaner · Isopropyl alcohol (IPA) 2.Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 12.9.Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 12.10. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 12.11. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 12.12. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ·Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity ·Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ·Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243A–0008N-01 P 9 / 9 13. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.