Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product Information in this Catalog (4) Power generation control equipment (nuclear power, Product information in this catalog is as of October 2019. All of the hydroelectric power, thermal power plant control system, etc.) contents specified herein and production status of the products listed (5) Undersea equipment (submarine repeating equipment, in this catalog are subject to change without notice due to technical underwater work equipment, etc.) improvement of our products, etc. Therefore, please check for the (6) Military equipment latest information carefully before practical application or use of our (7) Any other equipment requiring extremely high levels of safety products. and/or reliability equal to the equipment listed above Please note that TAIYO YUDEN shall not be in any way responsible *Notes: for any damages and defects in products or equipment incorporating 1. There is a possibility that our products can be used only our products, which are caused under the conditions other than those for aviation equipment that does not directly affect the safe specified in this catalog or individual product specification sheets. operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets ■ Approval of Product Specifications requirements specified separately by TAIYO YUDEN. Please Please contact TAIYO YUDEN for further details of product be sure to contact TAIYO YUDEN for further information specifications as the individual product specification sheets are before using our products for such aviation equipment. available. When using our products, please be sure to approve our 2. Implantable medical devices contain not only internal unit product specifications or make a written agreement on the product which is implanted in a body, but also external unit which is specification with TAIYO YUDEN in advance. connected to the internal unit. ■ Pre-Evaluation in the Actual Equipment and Conditions 4. Limitation of Liability Please conduct validation and verification of our products in actual Please note that unless you obtain prior written consent of TAIYO conditions of mounting and operating environment before using our YUDEN, TAIYO YUDEN shall not be in any way responsible for products. any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not ■ Limited Application intended for use by TAIYO YUDEN, or any equipment requiring 1. Equipment Intended for Use inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN The products listed in this catalog are intended for general- as described above. purpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office ■ Safety Design equipment, information and communication equipment including, When using our products for high safety and/or reliability-required without limitation, mobile phone, and PC) and other equipment equipment or circuits, please fully perform safety and/or reliability specified in this catalog or the individual product specification sheets. evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems TAIYO YUDEN has the line-up of the products intended for equipped with a redundant circuit or other system to prevent an use in automotive electronic equipment, telecommunications unsafe status in the event of a single fault for a failsafe design to infrastructure and industrial equipment, or medical devices ensure safety. classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, ■ Intellectual Property Rights please check available applications specified in this catalog Information contained in this catalog is intended to convey examples or the individual product specification sheets and use the of typical performances and/or applications of our products and is corresponding products. not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any 2. Equipment Requiring Inquiry third parties nor grant any license under such rights. Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following ■ Limited Warranty equipment (excluding intended equipment as specified in this Please note that the scope of warranty for our products is limited to catalog or the individual product specification sheets) which may the delivered our products themselves and TAIYO YUDEN shall not cause loss of human life, bodily injury, serious property damage be in any way responsible for any damages resulting from a failure and/or serious public impact due to a failure or defect of the or defect in our products. Notwithstanding the foregoing, if there is products and/or malfunction attributed thereto. a written agreement (e.g., supply and purchase agreement, quality (1) Transportation equipment (automotive powertrain control assurance agreement) signed by TAIYO YUDEN and your company, system, train control system, and ship control system, etc.) TAIYO YUDEN will warrant our products in accordance with such (2) Traffic signal equipment agreement. (3) Disaster prevention equipment, crime prevention equipment (4) Medical devices classified as GHTF Class C (Japan Class III) ■ TAIYO YUDEN’s Official Sales Channel (5) Highly public information network equipment, data- The contents of this catalog are applicable to our products which are processing equipment (telephone exchange, and base purchased from our sales offices or authorized distributors (hereinafter station, etc.) “TAIYO YUDEN’s official sales channel”). Please note that the contents (6) Any other equipment requiring high levels of quality and/or of this catalog are not applicable to our products purchased from any reliability equal to the equipment listed above seller other than TAIYO YUDEN’s official sales channel. 3. Equipment Prohibited for Use ■ Caution for Export Please do not incorporate our products into the following Some of our products listed in this catalog may require specific equipment requiring extremely high levels of safety and/or procedures for export according to“ U.S. Export Administration reliability. Regulations”,“ Foreign Exchange and Foreign Trade Control Law” (1) Aerospace equipment (artificial satellite, rocket, etc.) of Japan, and other applicable regulations. Should you have any (2) Aviation equipment *1 questions on this matter, please contact our sales staff. (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices *2 20

for General Electronic Equipment for General Electronic Equipment MULTILAYER CHIP BEAD INDUCTORS (BK ARRAY SERIES) MULTILAYER CHIP BEAD INDUCTORS（BK ARRAY SERIES） REFLOW REFLOW ■PARTS NUMBER * Operating Temp.：-55～+125℃ B K △ 3 2 1 6 4 S 6 0 1 － T △ △＝Blank space ① ② ③ ④ ⑤ ⑥ ①Series name ④Nominal impedance Code Series name Code Nominal impedance［Ω］ BK△ Multilayer chip bead inductor （example） 601 600 ②Dimensions（L×W） 102 1000 Dimensions Code Type（inch） （L×W）［mm］ ⑤Packaging 2010 2010（0804） 2.0×1.0 Code Packaging N 3216 3216（1206） 3.2×1.6 －T Taping O COISE ③Material ⑥Internal code M S PU Code Material Code Internal code OP NP 44WS Refer to impedance curves △ Standard ENTRESS 4M for material differences SIO N 4L F E R ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY R IT E L E2 B E A T D E1 IN P D W U C Standard quantity ［pcs］ T O Type L W T E E P Embossed 1 2 Paper tape R tape S BK 2010 2.0±0.15 1.0±0.15 0.45±0.05 0.25＋0.15/－0.1 0.25±0.15 0.5±0.1 4000 － （0804） （0.079±0.006） （0.039±0.006） （0.018±0.002） （0.010＋0.006/－0.004） （0.010±0.006） （0.020±0.004） BK 3216 3.2±0.2 1.6±0.2 0.8±0.1 0.35±0.2 0.3±0.2 0.8±0.1 － 4000 （1206） （0.126±0.008） （0.063±0.008） （0.031±0.004） （0.014±0.008） （0.012±0.008） （0.031±0.004） Unit：mm（inch） i_mlci_BKarray_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 111

for General Electronic Equipment ■PARTS NUMBER ●BK 2010 Nominal impedance Measuring frequency DC Resistance Rated current Parts number EHS Impedance tolerance ［Ω］ ［MHz］ ［Ω］（max.） ［mA］（max.） BK 20104W680-T RoHS 68 ±25％ 100 0.35 100 BK 20104W121-T RoHS 120 ±25％ 100 0.40 100 BK 20104W241-T RoHS 240 ±25％ 100 0.50 100 BK 20104S121-T RoHS 120 ±25％ 100 0.30 100 BK 20104S241-T RoHS 240 ±25％ 100 0.45 100 BK 20104S431-T RoHS 430 ±25％ 100 0.55 100 BK 20104S601-T RoHS 600 ±25％ 100 0.70 100 BK 20104M121-T RoHS 120 ±25％ 100 0.30 100 BK 20104M241-T RoHS 240 ±25％ 100 0.45 100 BK 20104M431-T RoHS 430 ±25％ 100 0.55 100 BK 20104M601-T RoHS 600 ±25％ 100 0.70 100 BK 20104M102-T RoHS 1000 ±25％ 100 0.80 100 BK 20104L050-T RoHS 5 ±25％ 100 0.10 100 BK 20104L100-T RoHS 10 ±25％ 100 0.15 100 BK 20104L220-T RoHS 22 ±25％ 100 0.20 100 BK 20104L330-T RoHS 33 ±25％ 100 0.30 100 BK 20104L470-T RoHS 47 ±25％ 100 0.40 100 BK 20104L680-T RoHS 68 ±25％ 100 0.50 100 N BK 20104L121-T RoHS 120 ±25％ 100 0.70 100 O BK 20104L181-T RoHS 180 ±25％ 100 0.90 100 COISE M S ●BK 3216 PONUPP Parts number EHS Nomina［l Ωim］pedance Impedance tolerance Measur［inMgH frze］quency DC［Ω R］e（smistaaxn.）ce R［amteAd］ （cmurarxe.n）t ENTRESS BBKK 3322116644WW214211--TT RRooHHSS 214200 ±±2255％％ 110000 00..2155 110000 SIO BK 32164W431-T RoHS 430 ±25％ 100 0.35 100 N BK 32164W601-T RoHS 600 ±25％ 100 0.40 100 BK 32164S600-T RoHS 60 ±25％ 100 0.18 200 F BK 32164S121-T RoHS 120 ±25％ 100 0.18 200 E R BK 32164S241-T RoHS 240 ±25％ 100 0.30 200 R BK 32164S301-T RoHS 300 ±25％ 100 0.40 200 IT BK 32164S471-T RoHS 470 ±25％ 100 0.40 200 E BK 32164S601-T RoHS 600 ±25％ 100 0.45 200 B BK 32164S102-T RoHS 1000 ±25％ 100 0.68 100 E BK 32164M121-T RoHS 120 ±25％ 100 0.20 150 A BK 32164M241-T RoHS 240 ±25％ 100 0.35 150 D BK 32164M301-T RoHS 300 ±25％ 100 0.45 150 IN BBKK 3322116644MM640711--TT RRooHHSS 640700 ±±2255％％ 110000 00..6500 110500 D BK 32164M102-T RoHS 1000 ±25％ 100 0.80 100 U BK 32164L680-T RoHS 68 ±25％ 100 0.35 200 C BK 32164L121-T RoHS 120 ±25％ 100 0.55 200 T BK 32164L181-T RoHS 180 ±25％ 100 0.65 150 O BK 32164L241-T RoHS 240 ±25％ 100 0.75 150 R S i_mlci_BKarray_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 112 20

for General Electronic Equipment ■ ELECTRICAL CHARACTERISTICS ■BK2010 BK2010 4W680 BK2010 4W121 BK2010 4W241 BK2010 4S121 500 500 400 300 250 200 100 BK2010 4S241 BK2010 4S431 BK2010 4S601 BK2010 4M121 500 1000 1000 500 400 800 800 300 600 600 N 200 400 400 250 COOISE M S 100 200 200 POUP NP ENRES TS SIO N BK2010 4M241 BK2010 4M431 BK2010 4M601 BK2010 4M102 F 2000 2000 E R R IT E 1000 1000 B E A D IN D U C T BK2010 4L050 BK2010 4L100 BK2010 4L220 BK2010 4L330 O 100 100 200 500 R S 50 50 100 250 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 BK2010 4L470 500 250 1 10 100 1000 10000 ＊▶ TThhiiss ccaattaalloogg ccoonnttaaiinnss tthhee ttyyppicicaal ls sppeeccifiificcaattioionn o onnlyl yd dueu eto t oth teh leim liimtaittiaotnio onf sopf ascpea.c eW. hWenh yeonu y cooun csoidnesri dtheer pthuerc phuarsceh aosf eo uorf poruord pucrotsd,u pcltesa, spel ecahseec kc hoeucr ks poeucr ifipcroadtiounc.t specification sheets. FFoorr ddeettaailisl so of ef aecahc ph rpodroudctu (ccth (acrhacatrearcistteicriss tgicrasp ghr,a rpelhia, brieliltiya binifloitrym iantfioornm, parteiocanu, tpiorensc afourt iuosnes, afonrd ussoe o, na),n sde seo o uorn W), esbe es itoeu (rh twtpe:b//switwew (.htyt-ttpo:p//.cwowmw/) .otyr -CtoDp c.caotamlo/g)s .. 138 1220 mlci09_e-01 113

for General Electronic Equipment ■ ELECTRICAL CHARACTERISTICS ■BK3216 N O COMISE S NO POUP IS NP E ENRES S TS U SIO P N P R F E E S R R S IT IO E N B C E O A D M P IN O D N U E C N T T O S ／ R S F E R R I T E B E A D I N D U C T O R S ▶＊ T Thhiiss ccaattaalloogg ccoonnttaaiinnss tthhee ttyyppiiccaall ssppeecciifificcaattiioonn oonnlyly d duuee t oto t hteh eli mlimitaittaiotino onf osfp sapcaec. e W. hWenh eyno uy ocuo ncsoidnesird tehre tphuer cphuarcshe aosfe o ourf poruord purcotds,u pctles,a spele cahseec ckh oeucrk s opuerc ipfircoadtiuocnt. specification sheets. FFoorr ddeettaaiillss o of fe eaachc hp rpordoudcut c(ct h(acrhaacrtaecritsetircisst gicrsa pghr,a rpehlia, breilliitay binilfiotyrm inaftoiornm, aptrieocna,u ptiroencsa fuotr iuosnes, faonrd u ssoe ,o an)n, ds eseo o ounr )W, seebe s ioteu r(h wttpe:b//switwe w(h.ttyt-pto:/p/.wcowmw/). toyr- tCoDp .ccaotamlo/g) s. . 114 mlci09_e-01 1220 139

Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils（MC series F type） Metal Multilayer Chip Power Inductors (MCOILTM MC series) ■PACKAGING ①Minimum Quantity ●Tape & Reel Packaging Thickness Standard Quantity ［pcs］ Type mm（inch） Paper Tape Embossed Tape CK1608（0603） 0.8 （0.031） 4000 － 0.85（0.033） 4000 － CK2125（0805） 1.25（0.049） － 2000 0.85（0.033） 4000 － CKS2125（0805） 1.25（0.049） － 2000 CKP1608（0603） 0.8 （0.031） 4000 － CKP2012（0805） 0.9 （0.035） － 3000 CKP2016（0806） 0.9 （0.035） － 3000 0.7 （0.028） － 3000 CKP2520（1008） 0.9 （0.035） － 3000 1.1 （0.043） － 2000 LK1005（0402） 0.5 （0.020） 10000 － LK1608（0603） 0.8 （0.031） 4000 － 0.85（0.033） 4000 － LK2125（0805） 1.25（0.049） － 2000 HK0603（0201） 0.3 （0.012） 15000 － HK1005（0402） 0.5 （0.020） 10000 － HK1608（0603） 0.8 （0.031） 4000 － 0.85（0.033） － 4000 HK2125（0805） 1.0 （0.039） － 3000 HKQ0603S（0201） 0.3 （0.012） 15000 － HKQ0603U（0201） 0.3 （0.012） 15000 － AQ105（0402） 0.5 （0.020） 10000 － BK0603（0201） 0.3 （0.012） 15000 － BK1005（0402） 0.5 （0.020） 10000 － BKH0603（0201） 0.3 （0.012） 15000 － BKH1005（0402） 0.5 （0.020） 10000 － BK1608（0603） 0.8 （0.031） 4000 － 0.85（0.033） 4000 － BK2125（0805） 1.25（0.049） － 2000 BK2010（0804） 0.45（0.018） 4000 － BK3216（1206） 0.8 （0.031） － 4000 BKP0603（0201） 0.3 （0.012） 15000 － BKP1005（0402） 0.5 （0.020） 10000 － BKP1608（0603） 0.8 （0.031） 4000 － BKP2125（0805） 0.85（0.033） 4000 － MCF0605（0202） 0.3 （0.012） 15000 － MCF0806（0302） 0.4 （0.016） － 10000 MCF1210（0504） 0.55（0.022） － 5000 MCF2010（0804） 0.45（0.018） － 4000 MCEE1005（0402） 0.55（0.022） 10000 － MCEK1210(0504) 0.5 （0.020） 5000 － MCFK1608（0603） 0.6 （0.024） 4000 － MCFE1608（0603） 0.65（0.026） 4000 － MCHK1608(0603) 0.8 （0.031） 4000 － MCKK1608（0603） 1.0 （0.039） 3000 MCHK2012（0806） 0.8 （0.031） 4000 － MCKK2012（0805） 1.0 （0.039） - 3000 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E08R01

②Taping material ●Card board carrier tape Top tape CK 1608 BK 0603 CKP 1608 BK 1005 CK 2125 BK 1608 CKS 2125 BK 2125 LK 1005 BK 2010 LK 1608 BKP 0603 Base tape LK 2125 BKP 1005 HK 0603 BKP 1608 HK 1005 BKP 2125 Sprocket hole HK 1608 BKH 0603 HKQ 0603 BKH 1005 AQ 105 MCF 0605 Bottom tape Chip cavity MC 1005 MC 1210 MC 1608 Chip Filled MC 2012 Chip ●Embossed Tape Top tape CK 2125 BK 2125 CKS 2125 BK 3216 CKP 2012 MCF 0806 CKP 2016 MCF 1210 CKP 2520 MCF 2010 LK 2125 MC 1608 HK 2125 MC 2012 Sprocket hole Base tape Chip cavity Chip Filled Chip ③Taping Dimensions ●Paper tape (8mm wide) Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.05(0.138±0.002) 8.0±0.30.315±0.012) ( F 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E08R01

Thickness Chip cavity Insertion Pitch Tape Thickness Type mm（inch） Ａ Ｂ Ｆ Ｔ 1.0±0.2 1.8±0.2 4.0±0.1 1.1max CK1608（0603） 0.8 （0.031） （0.039±0.008） （0.071±0.008） （0.157±0.004） （0.043max） 1.5±0.2 2.3±0.2 4.0±0.1 1.1max CK2125（0805） 0.85（0.033） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.043max） 1.5±0.2 2.3±0.2 4.0±0.1 1.1max CKS2125（0805） 0.85（0.033） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.043max） 1.0±0.2 1.8±0.2 4.0±0.1 1.1max CKP1608（0603） 0.8 （0.031） （0.039±0.008） （0.071±0.008） （0.157±0.004） （0.043max） 0.65±0.1 1.15±0.1 2.0±0.05 0.8max LK1005（0402） 0.5 （0.020） （0.026±0.004） （0.045±0.004） （0.079±0.002） （0.031max） 1.0±0.2 1.8±0.2 4.0±0.1 1.1max LK1608（0603） 0.8 （0.031） （0.039±0.008） （0.071±0.008） （0.157±0.004） （0.043max） 1.5±0.2 2.3±0.2 4.0±0.1 1.1max LK2125（0805） 0.85（0.033） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.043max） 0.40±0.06 0.70±0.06 2.0±0.05 0.45max HK0603（0201） 0.3 （0.012） （0.016±0.002） （0.028±0.002） （0.079±0.002） （0.018max） 0.65±0.1 1.15±0.1 2.0±0.05 0.8max HK1005（0402） 0.5 （0.020） （0.026±0.004） （0.045±0.004） （0.079±0.002） （0.031max） 1.0±0.2 1.8±0.2 4.0±0.1 1.1max HK1608（0603） 0.8 （0.031） （0.039±0.008） （0.071±0.008） （0.157±0.004） （0.043max） 0.40±0.06 0.70±0.06 2.0±0.05 0.45max HKQ0603S（0201） 0.3 （0.012） （0.016±0.002） （0.028±0.002） （0.079±0.002） （0.018max） 0.40±0.06 0.70±0.06 2.0±0.05 0.45max HKQ0603U（0201） 0.3 （0.012） （0.016±0.002） （0.028±0.002） （0.079±0.002） （0.018max） 0.75±0.1 1.15±0.1 2.0±0.05 0.8max AQ105（0402） 0.5 （0.020） （0.030±0.004） （0.045±0.004） （0.079±0.002） （0.031max） 0.40±0.06 0.70±0.06 2.0±0.05 0.45max BK0603（0201） 0.3 （0.012） （0.016±0.002） （0.028±0.002） （0.079±0.002） （0.018max） 0.65±0.1 1.15±0.1 2.0±0.05 0.8max BK1005（0402） 0.5 （0.020） （0.026±0.004） （0.045±0.004） （0.079±0.002） （0.031max） 1.0±0.2 1.8±0.2 4.0±0.1 1.1max BK1608（0603） 0.8 （0.031） （0.039±0.008） （0.071±0.008） （0.157±0.004） （0.043max） 1.5±0.2 2.3±0.2 4.0±0.1 1.1max BK2125（0805） 0.85（0.033） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.043max） 1.2±0.1 2.17±0.1 4.0±0.1 0.8max BK2010（0804） 0.45（0.018） （0.047±0.004） （0.085±0.004） （0.157±0.004） （0.031max） 0.40±0.06 0.70±0.06 2.0±0.05 0.45max BKP0603（0201） 0.3 （0.012） （0.016±0.002） （0.028±0.002） （0.079±0.002） （0.018max） 0.65±0.1 1.15±0.1 2.0±0.05 0.8max BKP1005（0402） 0.5 （0.020） （0.026±0.004） （0.045±0.004） （0.079±0.002） （0.031max） 1.0±0.2 1.8±0.2 4.0±0.1 1.1max BKP1608（0603） 0.8 （0.031） （0.039±0.008） （0.071±0.008） （0.157±0.004） （0.043max） 1.5±0.2 2.3±0.2 4.0±0.1 1.1max BKP2125（0805） 0.85（0.033） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.043max） 0.40±0.06 0.70±0.06 2.0±0.05 0.45max BKH0603（0201） 0.3 （0.012） （0.016±0.002） （0.028±0.002） （0.079±0.002） （0.018max） 0.65±0.1 1.15±0.1 2.0±0.05 0.8max BKH1005（0402） 0.5 （0.020） （0.026±0.004） （0.045±0.004） （0.079±0.002） （0.031max） 0.62±0.03 0.77±0.03 2.0±0.05 0.45max MCF0605（0202） 0.3 （0.012） （0.024±0.001） （0.030±0.001） （0.079±0.002） （0.018max） 1.1±0.05 1.9±0.05 4.0±0.1 0.72max MCFK1608（0603） 0.6 （0.024） （0.043±0.002） （0.075±0.002） （0.157±0.004） (0.028max) 0.8±0.05 1.3±0.05 2.0±0.05 0.64max MCEE1005（0402） 0.55（0.021） (0.031±0.002) (0.051±0.002) （0.079±0.002） (0.025max) 1.3±0.1 1.55±0.1 4.0±0.1 0.64max MCEK1210（0504） 0.5 （0.020） （0.051±0.004） （0.061±0.004） （0.157±0.004） (0.025max) 1.1±0.05 1.9±0.05 4.0±0.1 0.72max MCFK1608（0603） 0.6 （0.024） （0.043±0.002） （0.075±0.002） （0.157±0.004） (0.028max) 1.1±0.05 1.9±0.05 4.0±0.1 0.72max MCFE1608（0603） 0.65（0.026） （0.043±0.002） （0.075±0.002） （0.157±0.004） (0.028max) 1.2±0.05 2.0±0.05 4.0±0.1 0.9max MCHK1608（0603） 0.8 （0.031） （0.047±0.002） （0.079±0.002） （0.157±0.004） (0.035max) 1.65±0.1 2.4±0.1 4.0±0.1 0.9max MCHK2012（0805） 0.8 （0.031） （0.065±0.004） （0.094±0.004） （0.157±0.004） （0.035max） Unit : mm（inch） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E08R01

●Embossed Tape (8mm wide) Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） A B 3.5±0.05(0.138±0.002) 8.0±0.30.315±0.012) ( F 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) Thickness Chip cavity Insertion Pitch Tape Thickness Type mm（inch） Ａ Ｂ Ｆ K T 1.5±0.2 2.3±0.2 4.0±0.1 2.0 0.3 CK2125（0805） 1.25（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079） （0.012） 1.5±0.2 2.3±0.2 4.0±0.1 2.0 0.3 CKS2125（0805） 1.25（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079） （0.012） 1.55±0.2 2.3±0.2 4.0±0.1 1.3 0.3 CKP2012（0805） 0.9 （0.035） （0.061±0.008） （0.091±0.008） （0.157±0.004） （0.051） （0.012） 1.8±0.1 2.2±0.1 4.0±0.1 1.3 0.25 CKP2016（0806） 0.9 （0.035） （0.071±0.004） （0.087±0.004） （0.157±0.004） （0.051） （0.01） 1.4 0.7 （0.028） （0.055） 1.4 0.9 （0.035） 2.3±0.1 2.8±0.1 4.0±0.1 （0.055） 0.3 CKP2520（1008） （0.091±0.004） （0.110±0.004） （0.157±0.004） 1.7 （0.012） 1.1 （0.043） （0.067） 1.7 1.1 （0.043） （0.067） 1.5±0.2 2.3±0.2 4.0±0.1 2.0 0.3 LK2125（0805） 1.25（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079） （0.012） 1.5 0.85（0.033） 1.5±0.2 2.3±0.2 4.0±0.1 （0.059） 0.3 HK2125（0805） （0.059±0.008） （0.091±0.008） （0.157±0.004） 2.0 （0.012） 1.0 （0.039） （0.079） 1.5±0.2 2.3±0.2 4.0±0.1 2.0 0.3 BK2125（0805） 1.25（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079） （0.012） 1.9±0.1 3.5±0.1 4.0±0.1 1.4 0.3 BK3216（1206） 0.8 （0.031） （0.075±0.004） （0.138±0.004） （0.157±0.004） （0.055） （0.012） 0.75±0.05 0.95±0.05 2.0±0.05 0.55 0.3 MCF0806（0302） 0.4 （0.016） （0.030±0.002） （0.037±0.002） （0.079±0.002） （0.022） （0.012） 1.15±0.05 1.40±0.05 4.0±0.1 0.65 0.3 MCF1210（0504） 0.55（0.022） （0.045±0.002） （0.055±0.002） （0.157±0.004） （0.026） （0.012） 1.1±0.1 2.3±0.1 4.0±0.1 0.85 0.3 MCF2010（0804） 0.45（0.018） （0.043±0.004） （0.091±0.004） （0.157±0.004） （0.033） （0.012） 1.1±0.1 1.95±0.1 4.0±0.1 1.4 0.25 MCKK1608（0603） 1.0 （0.039） （0.043±0.004） （±0.004） （0.157±0.004） （0.055） （0.01） 1.55±0.1 2.35±0.1 4.0±0.1 1.35 0.25 MCKK2012（0805） 1.0 （0.039） （0.061±0.004） （0.093±0.004） （0.157±0.004） （0.053） （0.010） Unit : mm（inch） ④LEADER AND BLANK PORTION Blank portion Chip cavity Blank portion Leader 160mm or more 100mm or more (6.3inches or more) (3.94inches or more) 400mm or more Direction of tape feed (15.7inches or more) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E08R01

⑤Reel Size t E C B A R D W A B C D E R φ178±2.0 φ50 or more φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0 t W 4mm width tape 1.5max. 5±1.0 8mm width tape 2.5max. 10±1.5 (Unit : mm) ⑥Top tape strength The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below. Pull direction 0～15° Top tape Base tape ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E08R01

Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils（MC series F type） Metal Multilayer Chip Power Inductors (MCOILTM MC series) ■RELIABILITY DATA 1. Operating Temperature Range BK series －55～＋125℃ BKH series BKP series －55～＋85℃ MCF series －40～＋85℃ CK series CKS series －40～＋85℃ Specified Value CKP series LK series HK0603, HK1005 －55～＋125℃ HK1608, HK2125 －40～＋85℃ HKQ0603 －55～＋125℃ AQ105 MCOILTM MC series －40～＋125℃（Including self-generated heat） 2. Storage Temperature Range BK series －55～＋125℃ BKH series BKP series －55～＋85℃ MCF series －40～＋85℃ CK series CKS series －40～＋85℃ Specified Value CKP series LK series HK0603, HK1005 －55～＋125℃ HK1608, HK2125 －40～＋85℃ HKQ0603 －55～＋125℃ AQ105 MCOILTM MC series －40～＋85℃ 3. Rated Current BK series The temperature of the element is increased within 20℃. BKH series BKP series The temperature of the element is increased within 40℃ MCF series Refer to each specification. CK series The temperature of the element is increased within 20℃. CKS series CKP series The temperature of the element is increased within 40℃ Specified Value LK series The decreasing-rate of inductance value is within 5 % HK0603, HK1005 HK1608, HK2125 The decreasing-rate of inductance value is within 5 %, or the temperature of the element is HKQ0603 increased within 20℃ AQ105 Idc1: The decreasing-rate of inductance value is within 30 % MCOILTM MC series Idc2: The temperature of the element is increased within 40℃ ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

4. Impedance BK series BKH series Specified Value Refer to each specification. BKP series MCF series BK0603Series, BKP0603Series, BKH Series Measuring frequency : 100±1MHz Measuring equipment : 4991A（or its equivalent） Measuring jig : 16193A（or its equivalent） BK1005Series, BKP1005Series ,BKH1005Series Measuring frequency : 100±1MHz Measuring equipment : 4291A（or its equivalent） Measuring jig : 16192A（or its equivalent）, HW:16193A（or its equivalent） Test Methods and BK1608・2125Series, BKP1608・2125Series Remarks Measuring frequency : 100±1MHz Measuring equipment : 4291A（or its equivalent）, 4195A（or its equivalent） Measuring jig : 16192A（or its equivalent）, HW:16193A（or its equivalent） BK2010・3216Series Measuring frequency : 100±1MHz Measuring equipment : 4291A（or its equivalent）, 4195A（or its equivalent） Measuring jig : 16192A（or its equivalent） MCF Series Measuring frequency : 100±1MHz Measuring equipment : 4291A（or its equivalent） 5. Inductance CK series CKS series CKP series LK series Specified Value HK0603, HK1005 Refer to each specification. HK1608, HK2125 HKQ0603 AQ105 MCOILTM MC series CK、CKS、LK Series Measuring frequency : Refer to each specification. Measuring equipment /jig : 1608,2125⇒4294A＋16092A（or its equivalent） 1005⇒4291A＋16193A（or its equivalent） Measuring current : 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms CKP、MCOILTM MC Series Measuring frequency : 1MHz Measuring equipment : 4285A（or its equivalent） Test Methods and HK0603、HK1005、AQ Series Remarks Measuring frequency : 100MHz Measuring equipment /jig : HK0603⇒ E4991A+16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent） HK1005⇒ 4291A＋16193A（or its equivalent） HK1608、HK2125 Series Measuring frequency : ～100nH⇒100MHz 、120nH～⇒50MHz Measuring equipment /jig : 4291A＋16092A（or its equivalent） HKQ Series Measuring frequency : 500MHz Measuring equipment /jig : E4991A＋16197A（or its equivalent） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

6. Q CK series CKS series － CKP series LK series Specified Value HK0603, HK1005 HK1608, HK2125 Refer to each specification. HKQ0603 AQ105 MCOILTM MC series － LK Series Measuring frequency : Refer to each specification. Measuring equipment /jig : 1608,2125⇒4294A＋16092A（or its equivalent） 1005⇒4291A＋16193A（or its equivalent） Measuring current : 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms HK0603、HK1005、AQ Series Test Methods and Measuring frequency : 100MHz Remarks Measuring equipment /jig : HK0603⇒E4991A＋16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent） HK1005⇒4291A＋16193A（or its equivalent） HK1608、HK2125 Series Measuring frequency : ～100nH⇒100MHz 、120nH～⇒50MHz Measuring equipment /jig : 4291A＋16092A（or its equivalent） HKQ Series Measuring frequency : 500MHz Measuring equipment /jig : E4991A＋16197A（or its equivalent） 7. DC Resistance BK series BKH series BKP series MCF series CK series CKS series Specified Value CKP series Refer to each specification. LK series HK0603, HK1005 HK1608, HK2125 HKQ0603 AQ105 MCOILTM MC series Test Methods and Measuring equipment：IWATSU VOAC7512, HIOKI RM3545 (or its equivalent) Remarks 8. Self Resonance Frequency（SRF） BK series BKH series － BKP series MCF series CK series Refer to each specification. CKS series Specified Value CKP series － LK series HK0603, HK1005 HK1608, HK2125 Refer to each specification. HKQ0603 AQ105 MCOILTM MC series － LK、CK Series : Measuring equipment : 4195A（or its equivalent） Test Methods and Measuring jig : 16092A（or its equivalent） Remarks HK、HKQ、AQ Series : Measuring equipment : 8719C（or its equivalent） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

9. Resistance to Flexure of Substrate BK series BKH series BKP series MCF series CK series CKS series Specified Value CKP series No mechanical damage. LK series HK0603, HK1005 HK1608, HK2125 HKQ0603 AQ105 MCOILTM MC series Warp : 2mm（BK Series、BKP、BKH1005、CK、CKS、CKP、LK、HK、HKQ0603S、HKQ0603U、AQ Series、MCF1210、MC Series） : 1mm（BKH0603、MCF Series without 1210 size,） Testing board : glass epoxy-resin substrate Thickness : 0.8mm 20 Test Methods and Remarks R-230 Board Warp Deviation±1 45 45 （Unit：mm） 10. Solderability BK series BKH series BKP series MCF series CK series CKS series Specified Value CKP series At least 90％ of terminal electrode is covered by new solder. LK series HK0603, HK1005 HK1608, HK2125 HKQ0603 AQ105 MCOILTM MC series Solder temperature ：230±5℃ (JIS Z 3282 H60A or H63A) Test Methods and Solder temperature ：245±3℃ (Sn/3.0Ag/0.5Cu) Remarks Duration ：4±1 sec. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

11. Resistance to Soldering BK series Appearance：No significant abnormality BKH series Impedance change：Within ±30％ BKP series Appearance：No significant abnormality MCF series Impedance change：Within ±20％ Appearance：No significant abnormality CK series Inductance change： R10～4R7⇒Within ±10％、 6R8～100⇒Within ±15％ Appearance：No significant abnormality CKS series Inductance change：Within ±20％ Appearance：No significant abnormality Specified Value CKP series Inductance change：Within ±30％ Appearance：No significant abnormality LK series Inductance change：1005⇒Within ±15％ 1608,2125⇒ 47N～4R7: Within ±10％ 5R6～330: Within ±15％ HK0603, HK1005 HK1608, HK2125 Appearance：No significant abnormality HKQ0603 Inductance change： Within ±5％ AQ105 Appearance：No significant abnormality MCOILTM MC series Inductance change： Within ±10％ Solder temperature ：260±5℃ Duration ：10±0.5 sec. Test Methods and Preheating temperature ：150 to 180℃ Remarks Preheating time ：3 min. Flux ：Immersion into methanol solution with colophony for 3 to 5 sec. Recovery ：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1） (Note 1) When there a re questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition. 12. Thermal Shock BK series Appearance：No significant abnormality BKH series Impedance change： Within ±30％ BKP series Appearance：No significant abnormality MCF series Impedance change： Within ±20％ CK series Appearance：No significant abnormality CKS series Inductance change：Within ±20％ Appearance：No significant abnormality CKP series Specified Value Inductance change： Within ±30％ Appearance：No significant abnormality LK series Inductance change： Within ±10％ Q change： Within ±30％ HK0603, HK1005 HK1608, HK2125 Appearance：No significant abnormality HKQ0603 Inductance change： Within ±10％ Q change： Within ±20％ AQ105 Appearance：No significant abnormality MCOILTM MC series Inductance change： Within ±10％ Conditions for 1 cycle Step temperature（℃） time（min.） 1 Minimum operating temperature ＋0/－3 30±3 Test Methods and 2 Room temperature 2～3 Remarks 3 Maximum operating temperature ＋3/－0 30±3 4 Room temperature 2～3 Number of cycles：5 Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1） (Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

13. Damp Heat（ Steady state） BK series Appearance：No significant abnormality BKH series Impedance change： Within ±30％ BKP series Appearance：No significant abnormality MCF series Impedance change： Within ±20％ CK series Appearance：No significant abnormality CKS series Inductance change： Within ±20％ Appearance：No significant abnormality CKP series Inductance change： Within ±30％ Specified Value Appearance：No significant abnormality LK series Inductance change： 1005,1608⇒Within ±10％ 2125⇒Within ±20％ Q change： Within ±30％ HK0603, HK1005 HK1608, HK2125 Appearance：No significant abnormality HKQ0603 Inductance change： Within ±10％ Q change： Within ±20％ AQ105 Appearance：No significant abnormality MCOILTM MC series Inductance change： Within ±10％ BK、BKP、BKH、LK、CK、CKS、CKP、MCF Series： Temperature ：40±2℃ Humidity ：90 to 95％RH Duration ：500 +24/-0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） Test Methods and Remarks HK、HKQ、AQ、MCOILTM MC series： Temperature ：60±2℃ Humidity ：90 to 95％RH Duration ：500 +24/-0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） (Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

14. Loading under Damp Heat BK series Appearance：No significant abnormality BKH series Impedance change： Within ±30％ BKP series MCF series － CK series Appearance：No significant abnormality CKS series Inductance change： Within ±20％ Appearance：No significant abnormality CKP series Inductance change： Within ±30％ Appearance：No significant abnormality Inductance change： 1005⇒Within ±10％ Specified Value 1608⇒0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ± LK series 15％ 2125⇒Within ±20％ Q change： Within ±30％ HK0603, HK1005 HK1608, HK2125 Appearance：No significant abnormality HKQ0603 Inductance change： Within ±10％ Q change： Within ±20％ AQ105 Appearance：No significant abnormality MCOILTM MC series※ Inductance change： Within ±10％ BK、BKP、BKH、LK、CK、CKS、CKP Series： Temperature ：40±2℃ Humidity ：90 to 95％RH Applied current ：Rated current Duration ：500 +24/-0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） Test Methods and Remarks HK、HKQ、AQ、MCOILTM MC Series： Temperature ：60±2℃ Humidity ：90 to 95％RH Applied current ：Rated current ※MC series ; Idc2max Duration ：500 +24/-0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） Note on standard con dition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

15. Loading at High Temperature BK series Appearance：No significant abnormality BKH series Impedance change： Within ±30％ BKP series Appearance：No significant abnormality MCF series Impedance change： Within ±20％ CK series Appearance：No significant abnormality CKS series Inductance change： Within ±20％ Appearance：No significant abnormality CKP series Inductance change： Within ±30％ Appearance：No significant abnormality Specified Value Inductance change： 1005⇒Within ±10％ 1608⇒0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ± LK series 15％ 2125⇒Within ±20％ Q change： Within ±30％ HK0603, HK1005 HK1608, HK2125 Appearance：No significant abnormality HKQ0603 Inductance change： Within ±10％ Q change： Within ±20％ AQ105 Appearance：No significant abnormality MCOILTM MC series※ Inductance change： Within ±10％ Temperature : Maximum operating temperature Test Methods and Applied current ：Rated current ※MC series ; Idc2max Remarks Duration ：500 +24/-0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1） Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E08R01

Precautions on the use of Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils（MC series F type） ■PRECAUTIONS 1. Circuit Design ◆Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly Precautions differentiated from components used in general purpose applications. ◆Operating Current（Verification of Rated current） 1. The operating current including inrush current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design ◆Pattern configurations（Design of Land-patterns） 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: （1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. （2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's Precautions soldering point is separated by solder-resist. （3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. ◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards） 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. ◆Pattern configurations（Design of Land-patterns） 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets which extend above the component end terminations）. Examples of improper pattern designs are also shown. （1） Recommended land dimensions for a typical chip inductor land patterns for PCBs Land pattern ●Recommended land dimensions for Multilayer inductor Chip inductor Solder-resist Wave-soldering （Unit：mm） Type 1608 2012 2125 2016 2520 3216 C L 1.6 2.0 2.0 2.0 2.5 3.2 Size W 0.8 1.25 1.25 1.6 2.0 1.6 B A B A 0.8～1.0 1.0～1.4 1.0～1.4 1.0～1.4 1.0～1.4 1.8～2.5 B 0.5～0.8 0.8～1.5 0.8～1.5 0.8～1.5 0.6～1.0 0.8～1.7 Chip inductor C 0.6～0.8 0.9～1.2 0.9～1.2 1.3～1.6 1.6～2.0 1.2～1.6 W Reflow-soldering （Unit：mm） L Technical Type 0603 1005 105 1608 2012 2125 2016 2520 3216 considerations L 0.6 1.0 1.0 1.6 2.0 2.0 2.0 2.5 3.2 Size W 0.3 0.5 0.6 0.8 1.25 1.25 1.6 2.0 1.6 A 0.20～0.30 0.45～0.55 0.50～0.55 0.8～1.0 0.8～1.2 0.8～1.2 0.8～1.2 1.0～1.4 1.8～2.5 B 0.20～0.30 0.40～0.50 0.30～0.40 0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.0 0.6～1.5 C 0.25～0.40 0.45～0.55 0.60～0.70 0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.8～2.2 1.2～2.0 ●Recommended land dimension for Array type c d (Unit：mm） Type 2010 3216 L 2.0 3.2 a Size W 1.0 1.6 b W a 0.5～0.6 0.7～0.9 b 0.5～0.6 0.8～1.0 a c 0.2～0.3 0.4～0.5 d 0.5 0.8 L ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E08R01

●Recommended land dimension for Multilayer common mode choke coil （Unit：mm） （Unit：mm） c c Type 0605 0806 Type 1210 Size WL 00..6550 00..8655 a a Size WL 11.2.05 a a 0.27～0.30 0.25～0.35 b d W a 0.45～0.55 b d W b 0.17～0.20 0.25～0.35 b 0.7～0.8 c 0.20～0.26 0.25～0.35 a c 0.25～0.35 d 0.4 0.5 L d 0.55 a L （2） Examples of good and bad solder application Item Not recommended Recommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded Solder-resist components near mounted components Solder-resist Horizontal component placement ◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards） 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended Recommended Position the component at a right angle to the direction of Deflection of the board the mechanical stresses that are anticipated. 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. E D Perforation C A B Slit Magnitude of stress A＞B＝C＞D＞E 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E08R01

3. Considerations for automatic placement ◆Adjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. ◆Selection of Adhesives Precautions 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. ◆Adjustment of mounting machine 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: （1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. （2） The pick-up pressure should be adjusted between 1 and 3N static loads. （3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Item Improper method Proper method chipping Single-sided mounting or cracking supporting pins or back-up pins Double-sided mounting chipping supporting pins or cracking or back-up pins Technical 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical considerations impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. ◆Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. （1） Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly. f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. （2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. ［Recommended conditions］ Amount of adhesives After inductors are bonded Figure 0805 case sizes as examples a a a 0.3mm min b b 100～120μm c Area with no adhesive c c ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E08R01

4. Soldering ◆Selection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; （1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong acidity content should not be applied. Precautions （2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. （3） When using water-soluble flux, special care should be taken to properly clean the boards. ◆Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak temperature when you use lead-free paste. ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. ◆Soldering 1-1. Preheating when soldering Preheating: Inductors shall be preheated sufficiently, and the temperature difference between the inductors and solder shall be within 130°C. Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃. Inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. ［Reflow soldering］ 【Recommended condition for Pb-free soldering】 Caution 300 1. Solder (fillet) should wet up to 1/2 to 1/3 of the thickness of an inductor Peak ideally as shown below: 260℃ Max. Within 10sec. 1/2T～1/3T ） Inductor e（℃ 200 Slow Solder T atur cooling PC board er 2. Because excessive dwell time can detrimentally affect solderability, p m 100 soldering duration shall be kept as close to recommended time as possible. e T Preheating150℃ Heating above 3. The allowable number of reflow soldering is two (2) times. 60sec. Min. 230℃ Technical 40sec. Max. considerations 0 ［Wave soldering］ 【Recommended condition for Pb-free soldering】 Caution 300 1. Make sure the inductors are preheated sufficiently. Peak 2. The temperature difference between the inductor and melted solder 260℃ Max. Within 10sec. should be within 130℃. ℃） 200 120sec. Min. 3. Cooling after soldering should be as gradual as possible. （ 4. The allowable number of wave soldering is one (1) time. ure Slow 5. Wave soldering must not be applied to the inductors designated as for at Preheating cooling mper 100 150℃ reflow soldering only. e T 0 ［Hand soldering］ 【Recommended condition for Pb-free soldering】 Caution 400 1. It is recommended to use a 20W soldering iron with a maximum tip Peak diameter of 1.0 mm. 350℃ Max. Within 3sec. 2. The soldering iron shall not directly touch inductors 300 ） ⊿T 3. The allowable number of hand soldering is one (1) time （℃ Slow cooling ure 200 at er Preheating mp 100 150℃ Min. e T 60sec. Min. 0 （※⊿Ｔ≦150℃） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E08R01

5. Cleaning ◆Cleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux Precautions used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.） 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. ◆Cleaning conditions 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties（especially insulation resistance）. 2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors. Technical In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking considerations of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions should be carefully checked; Ultrasonic output 20W/ℓ or less Ultrasonic frequency 40kHz or less Ultrasonic washing period 5 min. or less 6. Resin coating and mold 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. Precautions 2. Thermal expansion and thermal shrinkage characteristics of resins may lead to the deterioration of inductors’ performance. 3. When a resin hardening temperature is higher than inductor operating temperature, the stresses generated by the excessive heat may lead to damage in inductors. 7. Handling ◆Breakaway PC boards（splitting along perforations） 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. ◆General handling precautions ・Always wear static control bands to protect against ESD. ・ Keep the inductors away from all magnets and magnetic objects. ・ Use non-magnetic tweezers when handling inductors. Precautions ・ Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded. ・ Keep bare hands and metal products（i.e., metal desk）away from inductor electrodes or conductive areas that lead to chip electrodes. ・ Keep inductors away from items that generate magnetic fields such as speakers or coils. ◆Mechanical considerations Be careful not to subject the inductors to excessive mechanical shocks. （1） If inductors are dropped on the floor or a hard surface they should not be used. （2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions ◆Storage To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Precautions Ambient temperature: 30℃ or below Humidity: 70% RH or below The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time passes, so inductors should be used within 6 months from the time of delivery. ・Inductor should be kept where no chlorine or sulfur exists in the air. ◆Storage Technical If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of considerations terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E08R01

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