DDaattaasshheeeett D/A Converters Standard 8bit 10ch/12c h BH2223FV BH2221FV General Description Key Specifications BH2223FV and BH2221FV are high performance 8bit  VCC Power Source Voltage Range: 2.7V to 5.5V R-2R-type D/A converters with 10 and 12 channel  VDD Power Source Voltage Range: 2.7V to VCC outputs, respectively.  Current Consumption: A built-in RESET function ensures that the output BH2223FV: 1.1mA(Typ) voltage at all channels is LOW during power up and a BH2221FV: 1.6mA(Typ) broad power supply voltage range (2.7V - 5.5V)  Differential Non Linearity Error: ±1.0LSB provides design flexibility.  Integral Non Linearity Error: ±1.5LSB  Output Current Performance: ±1.0mA Features  Settling Time: 100µs(Min) ■ Built-in RESET function  Data Transfer Frequency: 10MHz(Max) ■ High speed output response characteristics  Action Temperature Range: -20°C to +85°C ■ 3-line serial interface Packages W(Typ) x D(Typ) x H(Max) Applications DVCs, DSCs, DVDs, CD-Rs, CD-RWs SSOP-B16 5.00mm x 6.40mm x 1.35mm SSOP-B20 6.50mm x 6.40mm x 1.45mm Lineup Number of channels Input method Data latch method Package Orderable Part Number 10ch SSOP-B16 Reel of 2500 BH2223FV-E2 CMOS LD method 12ch SSOP-B20 Reel of 2500 BH2221FV-E2 ○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 1/15 TSZ22111・14・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Pin Descriptions / Block Diagrams (BH2223FV) TOP VIEW Terminal Terminal Function name 1 AO2 VCC 2 AO3 AO2 1 VCC R2R REG 16 GND VCC VCC 3 AO4 AO3 2 VCC R2R REG REG R2R VCC 15 AO1 4 AO5 5 AO6 Analog output terminal AO4 3 VCC R2R VCCR EG SeriaVl CC 14 DI 6 AO7 VCC Interface AO5 4 VCC R2R REG 13 CLK 7 AO8 8 AO9 AO6 5 VCC R2R VCCR EG VCC 12 LD Power ON 9 VCC Power source terminal VCC Reset 1 AO7 6 VCC R2R REG 11 NC 10 AO10 Analog output terminal VCC VCC 11 NC Not connected yet AO8 7 VCC R2R REG REG R2R VCC 10 AO10 12 LD Serial data load input terminal VCC AO9 8 VCC R2R REG 9 VCC 13 CLK Serial clock input terminal 14 DI Serial data input terminal Figure 1. BH2223FV 15 AO1 Analog output terminal 16 GND Ground terminal (BH2221FV) Terminal Terminal Function name 1 NC Not connected yet TOP VIEW 2 AO3 3 AO4 NC 1 20 GND 4 AO5 VDD VDD AO3 2 VCC R2R REG REG R2R VCC 19 AO2 5 AO6 Analog output terminal VDD VDD 6 AO7 AO4 3 VCC R2R REG REG R2R VCC 18 AO1 7 AO8 AO5 4 VCC R2RV DDR EG VCC 17 DI 8 AO9 Serial VDD Interface 9 AO10 AO6 5 VCC R2R REG 16 CLK D/A converter standard 10 VDD power source terminal AO7 6 VCC R2RV DDR EG VCC 15 LD Power ON 11 VCC Power source terminal VDD Reset AO8 7 VCC R2R REG 14 NC 12 AO11 Analog output terminal VDD VDD 13 AO12 AO9 8 VCC R2R REG REG R2R VCC 13 AO12 14 NC Not connected yet VDD VDD AO10 9 VCC R2R REG REG R2R VCC 12 AO11 15 LD Serial data 16 CLK Serial clock input terminal VDD 10 11 VCC 17 DI Serial data input terminal 18 AO1 Analog output terminal 19 AO2 Figure 2. BH2221FV 20 GND Ground terminal www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 2/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Rating Unit Remark Power Source Voltage VCC -0.3 to +7.0 V Terminal Voltage VIN -0.3 to VCC V Storage Temperature Range Tstg -55 to +125 °C 0.65 (Note 1) W BH2221FV Power Dissipation Pd 0.45 (Note 2) W BH2223FV (Note 1) Derated at 6.5mW/°C at Ta>25°C (Note 2) Derated at 4.5mW/°C at Ta>25°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25°C) Rating Parameter Symbol Unit Remark Min Typ Max VCC Power Source Voltage VCC 2.7 - 5.5 V (Note 3) VDD Power Source Voltage VDD 2.7 - VCC V (Note 3) Terminal Input Voltage Range VIN 0 - VCC V - Analog Output Current IOUT -1.0 0 +1.0 mA - Action Temperature Range Topr -20 - +85 °C - Serial Clock Frequency fSCLK - 1.0 10.0 MHz - Limit Load Capacitance CL - - 0.1 µF - (Note 3) Set the power source voltage so that VCC ≥ VDD. Electrical Characteristics (Unless otherwise specified, VCC=3.0V, VDD=3.0V, RL=OPEN, CL=0pF, Ta=25°C) Limit Parameter Symbol Unit Conditions Min Typ Max <Current Consumption> CLK=1MHz, 80H Setting VCC System ICC - 0.6 1.5 mA BH2221FV VDD System IDD - 1.0 2.0 mA VCC System ICC - 1.1 2.5 mA BH2223FV <Logic Interface> L input Voltage VIL GND - 0.2VCC V H input Voltage VIH 0.8VCC - VCC V Input Current IIN -10 - +10 µA <Buffer Amplifier> VZS1 GND - 0.1 V 00H setting, at no load Output Zero Scale Voltage VZS2 GND - 0.3 V 00H setting, IOH=1.0mA VFS1 VCC-0.1 - VCC V FFH setting, at no load Output Full Scale Voltage VFS2 VCC-0.3 - VCC V FFH Setting, IOL=1.0mA <D/A Converter Precision> Differential Non Linearity Error DNL -1.0 - +1.0 LSB Input code 02H to FDH Integral Non Linearity Error INL -1.5 - +1.5 LSB Input code 02H to FDH VCC Power Source Voltage Rise Time trVCC 100 - - µs VCC=0V to 2.7V Power ON Reset Release Voltage VPOR - 1.9 - V www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 3/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Timing Chart (VCC = 3.0V, VDD = 3.0V, RL = OPEN, CL = 0pF, Ta = 25°C, unless otherwise specified.) Limit Parameter Symbol Unit Conditions Min Typ Max CLK L Level Time tCLKL 50 - - ns CLK H Level Time tCLKH 50 - - ns DI Setup Time tsDI 20 - - ns DI Hold Time thDI 40 - - ns LD Setup Time tsLD 50 - - ns LD Hold Time thLD 50 - - ns LD H Level Time tLDH 50 - - ns Output Settling Time tOUT - - 100 µs CL=50pF, RL=10kΩ t t CLKL CLKH 0.8V CLK C 0.2VCC CC L DI KD LAST DATA 0.8VCC I 0.2VCC tsDI thDI tLDH thLD tsLD 0.8VCC LD L 0.2VCC D 90% Analog output 10% t OUT Figure 3 www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 4/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Typical Performance Curves 1.8 0.9 A] A] m 1.6 m 0.8 A] C[ 1.4 A] C[ 0.7 mC mC 85°C [CT:I 1.2 [DT:I 0.6 ent : ICREN 1.0 8255°°CC ent : IDREN 0.5 -2205°°CC urrUR 0.8 urrUR 0.4 cuit CT C 0.6 -20°C cuit CT C 0.3 CirUI 0.4 CirUI 0.2 C C R R CI 0.2 CI 0.1 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 SUPPSuLpYp lVy OVoLltTagAeG : EVC:VC C[VC] [V] SUPSPupLpYly VVOoltLaTgeA G: VED:DV [CV]C [V] Figure 4. Circuit Current vs Supply Voltage Figure 5. Circuit Current vs Supply Voltage (VCC Active Current Consumption) (VDD Active Current Consumption) 3000 B] 0.4 V] o[mV] 2500 VCC or VDD=3.0V NL [LS 0.3 VCC or VDD=3.0V mV D 0.2 e : V [OUTTAGE: 2000 y Error : LSB] 0.1 put VoltagUT VOL 11050000 on LinearitDNL [ -00..01 utP N -0.2 OT al OU 500 enti -0.3 r e 0 Diff -0.4 0 64 128 192 0 64 128 192 256 Input Code [dec] Input Code [dec] INPUT CODE [dec] INPUT CODE [dec] Figure 6. Output Voltage vs Input Code Figure 7. Differential Non Linearity Error vs Input Code www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 5/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Typical Performance Curves – continued 1.0 B] 0.25 S SB] 0.8 VCC or VDD=3.0V L [L L 0.6 N 0.20 earity Error : INL [NL [LSB] -0000....2024 Linearity Error : DNL [LSB] 00..1105 nI n D Li o n -0.4 N No al al -0.6 enti 0.05 gr -0.8 er nte Diff I -1.0 0.00 0 64 128 192 256 0.0 1.0 2.0 3.0 4.0 5.0 6.0 INPInUpuTt CCoOdDe E[d e[dc]e c] SUPPSLuYpp Vly OVoLltTaAgeG : EVC:VC C[VC] [V] Figure 8. Integral Non Linearity Error vs Input Code Figure 9. Differential Non Linearity Error vs Supply Voltage ] 0.45 mV 160.0 L [LSB] 00..3450 E:ZS[mV] 140.0 8255°°CC n Linearity Error : ININL [LSB] 0000....12235050 CALE VOLTAGcale Voltage : V [ZS2 1102680000....0000 -20°C o SS 40.0 egral N 00..0150 ERO Zero 20.0 IL=1.0mA nt Z I 0.00 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 SUPSPuLpYply V VOoltLa TgeA :G VECC: V[VC] C[V] SUPSPuLpYpl yV VOolLtaTgeA :G VECC: V[VC] C[V] Figure 10. Integral Non Linearity Error vs Supply Voltage Figure 11. Output Zero Scale Voltage vs Supply Voltage www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 6/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Typical Performance Curves – continued ] V 0 3.0 m IL=1.0mA [mV] E:FS[2 -20 V] OR[V] 2.5 Full Scale Voltage : VL SCALE VOLTAGFS ---864000 -228055°°°CCC Reset Voltage : V[POR ESET VOLTAGE:VP 0112....5050 L R U F -100 0.0 -50 -25 0 25 50 75 100 0.0 1.0 2.0 3.0 4.0 5.0 6.0 TEMPARATURE:Ta[℃] SUPSPupLpYly VVOoltLaTgeA :G VECC: V[VC] C[V] Temperature : Ta [°C] Figure 12. Output Full Scale Voltage vs Supply Voltage Figure 13. Reset Release Voltage vs Temperature 100 ] 3.0 V H[ µs] UT[µs] 80 V [V] IHVIL,VI 22..05 [E:tOOUT 60 -2205°°CC V, ILGE: Settling Time : tSETTLING TIM 2400 85°C Input Voltage : PUT VOLTA 011...505 VVIHIL N I 0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 SUPSuPpLpYly VVoOltaLgTeA : GVCEC: V[VD] D[V] SUPSPuLpYply V VOolLtaTgAe G: VEC:CV [VD] D[V] Figure 14. Settling Time vs Supply Voltage Figure 15. Input Voltage vs Supply Voltage www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 7/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Application Information Operation Description The Serial Control Interface is 3-line serial interface 1) LD, 2) CLK and 3) DI. Every command is composed of 12 bits data sent through DI line (MSB first). DI data is read every rising edge of the CLK. That should be while LD is LOW. Last 12 bits of data are latched while LD is HIGH. L LD 1. D 2. 3. 4. 5. 1 6. 2 7. 3 8. 4 9. 5 10. 6 11. 7 12. 8 9 1 1 1 CLK 0 1 2 DI X D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X Figure 16 Data Settings D0 D1 D3 D3 D4 D5 D6 D7 Setting 0 0 0 0 0 0 0 0 GND 1 0 0 0 0 0 0 0 (VCC or VDD-GND)/256x1 0 1 0 0 0 0 0 0 (VCC or VDD-GND)/256x2 1 1 0 0 0 0 0 0 (VCC or VDD-GND)/256x3 0 0 1 0 0 0 0 0 (VCC or VDD-GND)/256x4 0 1 1 1 1 1 1 1 (VCC or VDD-GND)/256x254 1 1 1 1 1 1 1 1 (VCC or VDD-GND)/256x255 Channel Settings D8 D9 D10 D11 BH2223FV BH2221FV 0 0 0 0 Not used Not used 0 0 0 1 AO1 AO1 0 0 1 0 AO2 AO2 0 0 1 1 AO3 AO3 0 1 0 0 AO4 AO4 0 1 0 1 AO5 AO5 0 1 1 0 AO6 AO6 0 1 1 1 AO7 AO7 1 0 0 0 AO8 AO8 1 0 0 1 AO9 AO9 1 0 1 0 AO10 AO10 1 0 1 1 Not used AO11 1 1 0 0 Not used AO12 1 1 0 1 Not used Not used 1 1 1 0 Not used Not used 1 1 1 1 Not used Not used www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 8/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Power Dissipation ① SSOP-B20(BH2221FV) ② SSOP-B16(BH2223FV) 70 0.07 ① W] 60 0.06 d [ 500.05 P n : W] 4 00.04 ② atio[m sipD 300.03 DisP er 200.02 w o P 100.01 0 0 25 50 75 100 125 TemperTaatu r[e℃ : T]a [°C] Mounted on a 70mm x 70mm x 1.6mm FR4 glass epoxy board (copper foil area 3% or below) I/O Equivalent Circuit Terminal Equivalent Circuit Terminal Equivalent Circuit VCC V VCC V VCC V VCC V C C C C C C C C AO1 DI to CLK AO12 LD G GND G G G GND N N GND N GND N D D D D www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 9/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 10/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B B Pin B C Pin A E P+ P P+ P+ N P P+ B C N N N N Parasitic N N N E Elements Parasitic P Substrate P Substrate Elements GND GND GND GND Parasitic Parasitic N Region Elements Elements close-by Figure 17. Example of monolithic IC structure 13. Reset Function The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons. Therefore, set the time constant so as to satisfy the power source rise time. www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 11/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Ordering Information B H 2 2 2 x F V - E 2 Part Number Package Packaging and forming specification 2223 FV: SSOP-B16 E2: Embossed tape and reel 2221 : SSOP-B20 Marking Diagrams SSOP-B16 (TOP VIEW) SSOP-B20 (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Part Number Part Number Marking BH2223FV-E2 H2223 BH2221FV-E2 H2221FV www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 12/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Physical Dimension, Tape and Reel Information Package Name SSOP-B16 www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 13/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Physical Dimension, Tape and Reel Information – continued Package Name SSOP-B20 www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 14/15 TSZ22111・15・001 06.Nov.2015 Rev.001

BH2223FV BH2221FV Revision History Date Revision Changes 06.Nov.2015 001 New Release www.rohm.com TSZ02201-0M2M0GZ15060-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 15/15 TSZ22111・15・001 06.Nov.2015 Rev.001

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.002 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.002 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: R OHM Semiconductor: BH2221FV-E2 BH2223FV-E2