BGA3018 T89 O S 1 GHz 18 dB gain wideband amplifier MMIC Rev. 3 — 26 September 2013 Product data sheet 1. Product profile 1.1 General description The BGA3018 MMIC is a wideband amplifier with internal biasing. It is designed specifically for high linearity CATV line extenders and drop amplifiers over a frequency range of 5MHz to 1006MHz. The LNA is housed in a lead free 3-pin SOT89 package. 1.2 Features and benefits  Internally biased  Noise figure of 2.1 dB  Flat gain  75  input and output impedance  High linearity with an IP3 of 40 dBm and  Operating from 5 V to 8 V supply O an IP2 of 60 dBm O 1.3 Applications  General wideband amplifiers.  CATV return amplifier; frequency ranges of 5 MHz to 300 MHz.  CATV infrastructure network driver in optical nodes (FTTx), distribution amplifiers, trunk amplifiers and line extenders in the frequency range from 40 MHz to 1006 MHz.  The product is ideally suited for applications as drop amplifiers in CATV distribution systems such as FTTH 1.4 Quick reference data Table 1. Quick refere nce data Bandwidth 40 MHz to 1006 MHz; T =25 C; typical values at V = 8V; Z =Z =75; R1=470; R2=300. amb CC S L Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 7.6 8 8.4 V CC I total supply current - 120 135 mA CC(tot) T ambient temperature 40 - +85 C amb NF noise figure f = 500 MHz - 2.1 2.6 dB P output power at 1dB gain compression 23.5 25 - dBm L(1dB) IP3 output third-order intercept point [1] 36 40 - dBm O IP2 output second-order intercept point [2] - 60 - dBm O [1] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM3) is 2f2f1, where f2=f16MHz. Input power Pi=20dBm. [2] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 1006 MHz. The intermodulation product (IM2) isf2f1, with 40MHz< f1-f2 < 1006MHz. Input power Pi=20dBm.

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 RF_OUT and biasing [1] 2 GND [2] 3 1 3 RF_IN [1] 2 3 2 1 sym130 [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA3018 - plastic surface-mounted package; exposed die pad SOT89 for good heattransfer; 3 leads OM7860 EVB 1 GHz 18 dB gain wideband amplifier application - OM7864 EVB 5 MHz to 300 MHz 18 dB reverse amplifier application - OM7868 EVB 40 MHz to 1006 MHz push-pull amplifier application - OM7861 EVB BGA301x wideband variable gain amplifier application - 4. Marking Table 4. Marking codes Type number Marking code Description BGA3018 *6Y * = W : made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage RF input AC coupled 0.6 +15 V CC P input power single tone - 20 dBm i T storage temperature 65 +150 C stg T junction temperature - 150 C j T ambient temperature 40 +85 C amb V electrostatic discharge HumanBodyModel(HBM); 2 - kV ESD voltage AccordingJEDECstandard22-A114E Charged DeviceModel(CDM); 2 - kV AccordingJEDECstandard22-C101B BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 2 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to solder point 40 K/W th(j-sp) 7. Characteristics 7.1 Forward application Table 7. Characteristics at V = 8 V CC Bandwidth 40 MHz to 1006 MHz; T =25 C; typical values at V = 8 V; Z =Z =75; amb CC S L R1=470; R2=300. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 7.6 8 8.4 V CC I total supply current - 120 135 mA CC(tot) s 2 insertion power gain 17 18 19 dB 21 SL slope straight line - 0.5 - dB sl FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 1.9 2.4 dB f = 500 MHz - 2.1 2.6 dB f = 1000 MHz - 2.5 3.0 dB RL input return loss f = 50 MHz - 18.5 - dB in f = 500 MHz - 20 - dB f = 1000 MHz - 28 - dB RL output return loss f = 50 MHz - 24 - dB out f = 500 MHz - 28 - dB f = 1000 MHz - 16 - dB P output power at 1dB 23.5 25 - dBm L(1dB) gaincompression IP3 output third-order intercept point [1] 36 40 - dBm O IP2 output second-order intercept point [2] - 60 - dBm O CTB composite triple beat [3] - 75 - dBc CSO composite second-order distortion [3] - 60 - dBc [1] The fundamental frequencies (f ) and (f ) lay between 40 MHz and 1006 MHz. The intermodulation product 1 2 (IM3) is 2f2f1, where f2=f16MHz. Input power Pi=20dBm. [2] The fundamental frequencies (f ) and (f ) lay between 40 MHz and 1006 MHz. The intermodulation product 1 2 (IM2) isf2f1, with 40MHz< f1-f2 < 1006MHz. Input power Pi=20dBm. [3] Measured with 132 NTSC channels V = 30dBmV. O BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 3 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC Table 8. Characteristics at V = 5 V CC Bandwidth 40 MHz to 1006 MHz; T =25 C; typical values at V = 5 V; Z =Z =75; amb CC S L R1=470; R2=300. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 4.75 5 5.25 V CC I total supply current - 75 85 mA CC(tot) s 2 insertion power gain - 18 - dB 21 SL slope straight line - 0.5 - dB sl FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 1.9 - dB f = 500 MHz - 2.2 - dB f = 1000 MHz - 2.5 - dB RL input return loss f = 50 MHz - 18.5 - dB in f = 500 MHz - 18.5 - dB f = 1000 MHz - 28 - dB RL output return loss f = 50 MHz - 26 - dB out f = 500 MHz - 28 - dB f = 1000 MHz - 16 - dB P output power at 1dB - 18 - dBm L(1dB) gaincompression IP3 output third-order intercept point [1] - 36 - dBm O IP2 output second-order intercept point [2] - 54 - dBm O CTB composite triple beat [3] - 70 - dBc CSO composite second-order distortion [3] - 54 - dBc [1] The fundamental frequencies (f ) and (f ) lay between 40 MHz and 1006 MHz. The intermodulation product 1 2 (IM3) is 2f2f1, where f2=f16MHz. Input power Pi=20dBm. [2] The fundamental frequencies (f ) and (f ) lay between 40 MHz and 1006 MHz. The intermodulation product 1 2 (IM2) isf2f1, with 40MHz< f1-f2 < 1006MHz. Input power Pi=20dBm. [3] Measured with 132 NTSC channels V = 30dBmV. O BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 4 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 7.2 Return application Table 9. Characteristics at V = 8 V CC Bandwidth 5 MHz to 300 MHz; T =25 C; typical values at V = 8 V; Z =Z =75; amb CC S L R1=470; R2=300. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 7.6 8 8.4 V CC I total supply current - 120 135 mA CC(tot) s 2 insertion power gain - 18 - dB 21 SL slope straight line - 0.5 - dB sl FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 1.9 - dB RL input return loss f = 5 MHz - 18.5 - dB in f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB RL output return loss f = 5 MHz - 18.5 - dB out f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB P output power at 1dB - 25 - dBm L(1dB) gaincompression IP3 output third-order intercept point [1] - 40 - dBm O IP2 output second-order intercept point [2] - 60 - dBm O [1] The fundamental frequencies (f ) and (f ) lay between 5 MHz and 300 MHz. The intermodulation product 1 2 (IM3) is 2f2f1, where f2=f16MHz. Input power Pi=20dBm. [2] The fundamental frequencies (f ) and (f ) lay between 5 MHz and 300 MHz. The intermodulation product 1 2 (IM2) isf2f1, with 40MHz<f1-f2<300MHz. Input power Pi=20dBm. BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 5 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC Table 10. Characteristics at V = 5 V CC Bandwidth 5 MHz to 300 MHz; T =25 C; typical values at V = 5 V; Z =Z =75; amb CC S L R1=470; R2=300. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 4.75 5 5.25 V CC I total supply current - 75 85 mA CC(tot) s 2 insertion power gain - 18 - dB 21 SL slope straight line - 0.5 - dB sl FL flatness of frequency response - 0.5 - dB NF noise figure f = 50 MHz - 1.9 - dB RL input return loss f = 5 MHz - 18.5 - dB in f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB RL output return loss f = 5 MHz - 18.5 - dB out f = 100 MHz - 18.5 - dB f = 200 MHz - 18.5 - dB f = 300 MHz - 18.5 - dB P output power at 1dB - 20 - dBm L(1dB) gaincompression IP3 output third-order intercept point [1] - 36 - dBm O IP2 output second-order intercept point [2] - 54 - dBm O [1] The fundamental frequencies (f ) and (f ) lay between 5 MHz and 300 MHz. The intermodulation product 1 2 (IM3) is 2f2f1, where f2=f16MHz. Input power Pi=20dBm. [2] The fundamental frequencies (f ) and (f ) lay between 5 MHz and 300 MHz. The intermodulation product 1 2 (IM2) isf2f1, with 40MHz<f1-f2<300MHz. Input power Pi=20dBm. BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 6 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 8. Application information 8.1 Forward application 40 MHz to 1006 MHz The BGA3018 can be used in other applications. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.1.1 Forward application circuit (cid:45)(cid:22) (cid:57)(cid:38)(cid:38) (cid:38)(cid:23) (cid:38)(cid:24) (cid:47)(cid:23) (cid:47)(cid:21) (cid:53)(cid:20) (cid:38)(cid:21) (cid:53)(cid:21) (cid:45)(cid:20) (cid:38)(cid:20) (cid:56)(cid:20) (cid:38)(cid:22) (cid:45)(cid:21) (cid:47)(cid:20) (cid:22) (cid:20) (cid:47)(cid:22) (cid:53)(cid:41)(cid:66)(cid:76)(cid:81) (cid:53)(cid:41)(cid:66)(cid:82)(cid:88)(cid:87) (cid:21) (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:25)(cid:25)(cid:24)(cid:25) Components are listed in Table11. Fig 1. BGA3018 application circuit All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 7 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 8.1.2 Forward application circuit board layout (cid:39) (cid:38) (cid:39) (cid:37)(cid:42)(cid:36)(cid:22)(cid:19)(cid:91)(cid:91)(cid:3)(cid:40)(cid:57)(cid:37) (cid:49) (cid:38) (cid:49) (cid:42) (cid:57) (cid:42) (cid:89)(cid:72)(cid:85)(cid:86)(cid:76)(cid:82)(cid:81)(cid:3)(cid:19)(cid:17)(cid:21) (cid:49)(cid:82)(cid:89)(cid:72)(cid:80)(cid:69)(cid:72)(cid:85)(cid:3)(cid:21)(cid:19)(cid:20)(cid:21) (cid:45)(cid:22) (cid:23)(cid:19)(cid:3)(cid:48)(cid:43)(cid:93)(cid:3)(cid:16)(cid:3)(cid:20)(cid:19)(cid:19)(cid:25)(cid:3)(cid:48)(cid:43)(cid:93) (cid:51)(cid:38)(cid:37)(cid:3)(cid:54)(cid:83)(cid:72)(cid:70)(cid:29)(cid:3)(cid:41)(cid:53)(cid:23)(cid:29)(cid:3)(cid:40)(cid:85)(cid:3)(cid:32)(cid:3)(cid:23)(cid:17)(cid:25) (cid:53)(cid:41)(cid:3)(cid:79)(cid:68)(cid:92)(cid:72)(cid:85)(cid:3)(cid:32)(cid:3)(cid:20)(cid:17)(cid:24)(cid:3)(cid:80)(cid:80)(cid:3)(cid:29)(cid:3)(cid:26)(cid:24)(cid:3)(cid:50)(cid:75)(cid:80) (cid:38)(cid:23) (cid:38)(cid:24) (cid:45)(cid:20) (cid:45)(cid:21) (cid:47)(cid:23) (cid:56)(cid:20) (cid:38)(cid:20) (cid:47)(cid:20) (cid:47)(cid:21) (cid:47)(cid:22) (cid:38)(cid:22) (cid:53)(cid:20) (cid:38)(cid:21) (cid:53)(cid:21) (cid:53)(cid:41)(cid:3)(cid:44)(cid:49) (cid:54)(cid:72)(cid:80)(cid:76)(cid:70)(cid:82)(cid:81)(cid:71)(cid:88)(cid:70)(cid:87)(cid:82)(cid:85)(cid:86) (cid:53)(cid:41)(cid:3)(cid:50)(cid:56)(cid:55) (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:25)(cid:25)(cid:24)(cid:26) PCB (Printed-Circuit Board) material = FR4; thickness = 1.5mm; size = 40mm40mm; r = 4.6; thickness of copper layer=35 m; Components are listed in Table11. Fig 2. BGA3018 application circuit board layout Table 11. List of comp onents See Figure1 and Figure2. Component Description Value Size Remarks C1, C2, C3, C4 capacitor 10 nF SMD 0402 Murata GRM155R71E103KA01D or capacitor of same quality C5 capacitor 100 pF SMD 0402 Murata GRM1555C1H101JZ01D or capacitor of same quality J1, J2 F-connector 75  - Bomar 861V509ER6 or F-connector of same quality J3 header 3-way - - Molex 90121-0763 or header of the same quality L1, L3 inductor 3.9 nH SMD 0402 Murata LQG15HS3N9S02D or inductor of same quality L2 choke - SMD 0603 Murata BLM18HD182SN1D or choke of same quality L4 inductor 880 nH SMD 1206 Murata LQH31HNR88K03L or inductor of same quality R1 resistor 470  SMD 0402 Yageo RC0402FR-07470RL or resistor of same quality R2 resistor 300  SMD 0402 Yageo RC0402FR-07300RL or resistor of same quality U1 BGA3018 - - NXP BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 8 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 8.2 Return application 5 MHz to 300 MHz The BGA3018 can be used in other applications. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.2.1 Return application circuit (cid:45)(cid:22) (cid:57)(cid:38)(cid:38) (cid:38)(cid:23) (cid:38)(cid:24) (cid:47)(cid:21) (cid:53)(cid:20) (cid:38)(cid:21) (cid:53)(cid:21) (cid:45)(cid:20) (cid:38)(cid:20) (cid:56)(cid:20) (cid:38)(cid:22) (cid:45)(cid:21) (cid:22) (cid:20) (cid:53)(cid:41)(cid:66)(cid:76)(cid:81) (cid:53)(cid:41)(cid:66)(cid:82)(cid:88)(cid:87) (cid:21) (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:25)(cid:25)(cid:24)(cid:27) Components are listed in Table11. Fig 3. BGA3018 application circuit All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 9 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 8.2.2 Return application circuit board layout (cid:39) (cid:38) (cid:39) (cid:37)(cid:42)(cid:36)(cid:22)(cid:19)(cid:91)(cid:91)(cid:3)(cid:40)(cid:57)(cid:37) (cid:49) (cid:38) (cid:49) (cid:42) (cid:57) (cid:42) (cid:89)(cid:72)(cid:85)(cid:86)(cid:76)(cid:82)(cid:81)(cid:3)(cid:19)(cid:17)(cid:22) (cid:49)(cid:82)(cid:89)(cid:72)(cid:80)(cid:69)(cid:72)(cid:85)(cid:3)(cid:21)(cid:19)(cid:20)(cid:21) (cid:45)(cid:22) (cid:24)(cid:3)(cid:48)(cid:43)(cid:93)(cid:3)(cid:16)(cid:3)(cid:22)(cid:19)(cid:19)(cid:3)(cid:48)(cid:43)(cid:93) (cid:51)(cid:38)(cid:37)(cid:3)(cid:54)(cid:83)(cid:72)(cid:70)(cid:29)(cid:3)(cid:41)(cid:53)(cid:23)(cid:29)(cid:3)(cid:40)(cid:85)(cid:3)(cid:32)(cid:3)(cid:23)(cid:17)(cid:25) (cid:53)(cid:41)(cid:3)(cid:79)(cid:68)(cid:92)(cid:72)(cid:85)(cid:3)(cid:32)(cid:3)(cid:20)(cid:17)(cid:24)(cid:3)(cid:80)(cid:80)(cid:3)(cid:29)(cid:3)(cid:26)(cid:24)(cid:3)(cid:50)(cid:75)(cid:80) (cid:45)(cid:20) (cid:38)(cid:23) (cid:45)(cid:21) (cid:38)(cid:24) (cid:56)(cid:20) (cid:47)(cid:21) (cid:38)(cid:20) (cid:38)(cid:22) (cid:53)(cid:20) (cid:38)(cid:21) (cid:53)(cid:21) (cid:53)(cid:41)(cid:3)(cid:44)(cid:49) (cid:54)(cid:72)(cid:80)(cid:76)(cid:70)(cid:82)(cid:81)(cid:71)(cid:88)(cid:70)(cid:87)(cid:82)(cid:85)(cid:86) (cid:53)(cid:41)(cid:3)(cid:50)(cid:56)(cid:55) (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:25)(cid:25)(cid:24)(cid:28) PCB (Printed-Circuit Board) material = FR4; thickness = 1.5mm; size = 40mm40mm; r = 4.6; thickness of copper layer=35 m; Components are listed in Table11. Fig 4. BGA3018 application circuit board layout Table 12. List of comp onents See Figure1 and Figure2. Component Description Value Size Remarks C1, C2, C3, C4 capacitor 10 nF SMD 0402 Murata GRM155R71E103KA01D or capacitor of same quality C5 capacitor 100 pF SMD 0402 Murata GRM1555C1H101JZ01D or capacitor of same quality J1, J2 F-connector 75  - Bomar 861V509ER6 or F-connector of same quality J3 header 3-way - - Molex 90121-0763 or header of the same quality L2 inductor 22 H SMD 1206 Murata LQH31CN220K03L or inductor of same quality R1 resistor 470  SMD 0402 Yageo RC0402FR-07470RL or resistor of same quality R2 resistor 300  SMD 0402 Yageo RC0402FR-07300RL or resistor of same quality U1 BGA3018 - - NXP BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 10 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 9. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 D B A bp3 E HE Lp 1 2 3 bp2 c w M B bp1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp1 bp2 bp3 c D E e e1 HE Lp w 1.6 0.48 0.53 1.8 0.44 4.6 2.6 4.25 1.2 mm 3.0 1.5 0.13 1.4 0.35 0.40 1.4 0.23 4.4 2.4 3.75 0.8 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 06-03-16 SOT89 TO-243 SC-62 06-08-29 Fig 5. Package outline SOT89 (SC-62) BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 11 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 10. Abbreviations Table 13. Abbreviations Acronym Description CATV Community Antenna TeleVision FTTH Fiber To The Home FTTx Fiber To The “x” LNA Low-Noise Amplifier MMIC Monolithic Microwave Integrated Circuit 11. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA3018 v.3 20130926 Product data sheet - BGA3018 v.2 Modifications: • Table3 on page2: Evaluation boards have been added. BGA3018 v.2 20130415 Product data sheet - BGA3018 v.1 BGA3018 v.1 20130319 Preliminary data sheet - - BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 12 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. 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It is customer’s sole responsibility to determine whether the NXP data sheet shall define the specification of the product as agreed between Semiconductors product is suitable and fit for the customer’s applications and NXP Semiconductors and its customer, unless NXP Semiconductors and products planned, as well as for the planned application and use of customer have explicitly agreed otherwise in writing. In no event however, customer’s third party customer(s). Customers should provide appropriate shall an agreement be valid in which the NXP Semiconductors product is design and operating safeguards to minimize the risks associated with their deemed to offer functions and qualities beyond those described in the applications and products. Product data sheet. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the 12.3 Disclaimers customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Limited warranty and liability — Information in this document is believed to Semiconductors products in order to avoid a default of the applications and be accurate and reliable. However, NXP Semiconductors does not give any the products or of the application or use by customer’s third party representations or warranties, expressed or implied, as to the accuracy or customer(s). NXP does not accept any liability in this respect. completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC60134) will cause permanent source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in In no event shall NXP Semiconductors be liable for any indirect, incidental, the Recommended operating conditions section (if present) or the punitive, special or consequential damages (including - without limitation - lost Characteristics sections of this document is not warranted. Constant or profits, lost savings, business interruption, costs related to the removal or repeated exposure to limiting values will permanently and irreversibly affect replacement of any products or rework charges) whether or not such the quality and reliability of the device. damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the changes to information published in this document, including without purchase of NXP Semiconductors products by customer. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 13 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC Export control — This document as well as the item(s) described herein product for such automotive applications, use and specifications, and (b) may be subject to export control regulations. Export might require a prior whenever customer uses the product for automotive applications beyond authorization from competent authorities. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Quick reference data — The Quick reference data is an extract of the liability, damages or failed product claims resulting from customer design and product data given in the Limiting values and Characteristics sections of this use of the product for automotive applications beyond NXP Semiconductors’ document, and as such is not complete, exhaustive or legally binding. standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly Translations — A non-English (translated) version of a document is for states that this specific NXP Semiconductors product is automotive qualified, reference only. The English version shall prevail in case of any discrepancy the product is not suitable for automotive use. It is neither qualified nor tested between the translated and English versions. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 12.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGA3018 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 September 2013 14 of 15

BGA3018 NXP Semiconductors 1 GHz 18 dB gain wideband amplifier MMIC 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Forward application . . . . . . . . . . . . . . . . . . . . . 3 7.2 Return application. . . . . . . . . . . . . . . . . . . . . . . 5 8 Application information. . . . . . . . . . . . . . . . . . . 7 8.1 Forward application 40 MHz to 1006 MHz . . . . 7 8.1.1 Forward application circuit . . . . . . . . . . . . . . . . 7 8.1.2 Forward application circuit board layout. . . . . . 8 8.2 Return application 5 MHz to 300 MHz . . . . . . . 9 8.2.1 Return application circuit . . . . . . . . . . . . . . . . . 9 8.2.2 Return application circuit board layout . . . . . . 10 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 11 10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 Contact information. . . . . . . . . . . . . . . . . . . . . 14 14 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 September 2013 Document identifier: BGA3018

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