Single-chip Type with Built-in FET Switching Regulator Series Output 1.5A or Less High Efficiency Step-down Switching Regulator with Built-in Power MOSFET BD9152MUV No.10027ECT14 ●Description ROHM’s high efficiency dual step-down switching regulator BD9152MUV is a power supply designed to produce a low voltage including 3.3,0.8 volts from 5.5/4.5 volts power supply line. Offers high efficiency with our original pulse skip control technology and synchronous rectifier. Employs a current mode control system to provide faster transient response to sudden change in load. ●Features 1) Offers fast transient response with current mode PWM control system. 2) Offers highly efficiency for all load range with synchronous rectifier (Pch/Nch FET) and SLLMTM (Simple Light Load Mode) 3) Incorporates soft-start function. 4) Incorporates thermal protection and ULVO functions. 5) Incorporates short-current protection circuit with time delay function. 6) Incorporates shutdown function Icc=0μA(Typ.) 7) Employs small surface mount package : VQFN020V4040 ●Application Power supply for LSI including DSP, Micro computer and ASIC ●Absolute Maximum Rating (Ta=25℃) Parameter Symbol Limit Unit Vcc Voltage VCC -0.3～+7 *1 V V -0.3～+7 V EN Voltage EN1 V -0.3～+7 V EN2 V -0.3～+7 V SW Voltage SW1 V -0.3～+7 V SW2 Pd1 0.34*2 W Pd2 0.70 *3 W Power Dissipation Pd3 1.21 *4 W Pd4 3.56*5 W Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -55～+150 ℃ Maximum Junction Temperature Tjmax +150 ℃ *1 Pd should not be exceeded. *2 IC only *3 1-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 *4 4-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 , in each layers *5 4-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers ●Operating Conditions (Ta=-40～+105℃) Limit Parameter Symbol Unit Min. Typ. Max. Vcc Voltage VCC 4.5 5.0 5.5 V VEN1 0 - 5.5 V EN Voltage VEN2 0 - 5.5 V Output Voltage range VOUT2 0.8 - 2.5 V ISW1 - - 1.5*6 A SW Average Output Current ISW2 - - 1.5*6 A *6 Pd and ASO should not be exceeded. www.rohm.com 2010.04 - Rev.C 1/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Electrical Characteristics ◎(Ta=25℃ VCC=5V, EN1=EN2=VCC ,unless otherwise specified.) Limit Parameter Symbol Unit Condition Min. Typ. Max. Standby Current ISTB - 0 10 μA EN1=EN2=0V Bias Current ICC - 500 800 μA EN Low Voltage VENL - GND 0.8 V Standby Mode EN High Voltage VENH 2 Vcc - V Active Mode EN Input Current IEN - 1 10 μA EN1=EN2=2V Oscillation Frequency FOSC 0.8 1.0 1.2 MHz RONP1 - 0.17 0.3 Ω Vcc=5V Pch FET ON Resistance RONP2 - 0.17 0.3 Ω Vcc=5V RONN1 - 0.13 0.2 Ω Vcc=5V Nch FET ON Resistance RONN2 - 0.13 0.2 Ω Vcc=5V FB1 3.25 3.3 3.35 V ±1.5% FB Reference Voltage FB2 0.788 0.8 0.812 V ±1.5% UVLO Threshold Voltage1 VUVLOL1 3.6 3.8 4.0 V Vcc=5→0V UVLO Release Voltage1 VUVLOH1 3.65 3.9 4.2 V Vcc=0→5V UVLO Threshold Voltage2 VUVLOL2 2.4 2.5 2.6 V Vcc=5→0V UVLO Release Voltage2 VUVLOH2 2.425 2.55 2.7 V Vcc=0→5V FB1 Discharge Resistance RFB1 - 20 40 Ω Vcc=5V Soft Start Time TSS 0.4 0.8 1.6 ms Timer Latch Time TLATCH 1.0 2.0 4.0 ms SCP/TSD ON VSCP1 - 1.65 2.4 V FB1=3.3→0V Output Short circuit Threshold Voltage VSCP2 - 0.4 0.56 V FB2=0.8→0V www.rohm.com 2010.04 - Rev.C 2/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Block Diagram, Application Circuit 【BD9152MUV】 PVCC 4.0±0.1 FB1 CCuormrepnt Current EN1 Gm Amp R Q Sense/ 1 S Protect SW1 0. D9152 Slope1 ± + 0 EN1 AGND Soft 4. Start1 Driver Lot No. Logic PGND1 x. ITH1 SC P1 a M S 0 1. 32 CLK1 UVL O1 0.082 S.1±0.1 +0.00.02-0.0(0.22) VR EF OS CCLK2 STCSPD/ UVL O2 C10.220 1 5 6 1 SC P2 PVCC ±0. ±0. CCuorrmepnt Current 0.4 1615 11102.1 FB2 Gm Amp RS Q PSreontseec/t SW2 1.0 Slope2 + 0.5 0.25+-00..0045 EN2 SStaorftt2 CLK2 Driver (Unit : mm) Logic PGND2 ITH2 Fig.1 BD9152MUV TOP View AGND Fig.2 BD9152MUV Block Diagram ●Pin No. & function table Pin Pin Pin Pin Function Function No. name No. name Ch1 GmAmp output pin/ 1 PGND2 Ch2 Lowside source pin 11 ITH1 Connected phase compensation capacitor 2 PVcc Highside FET source pin 12 AGND Ground 3 PVcc Highside FET source pin 13 N.C. Non Connection 4 PVcc Highside FET source pin 14 AVcc VCC power supply input pin Ch1 GmAmp output pin/Connected phase 5 PGND1 Ch1 Lowside source pin 15 ITH2 compensation capacitor 6 PGND1 Ch1 Lowside source pin 16 FB2 Ch2 output voltage detect pin 7 SW1 Ch1 Pch/Nch FET drain output pin 17 EN2 Ch2 Enable pin(High Active） 8 SW1 Ch1 Pch/Nch FET drain output pin 18 SW2 Ch2 Pch/Nch FET drain output pin 9 EN1 Ch1 Enable pin(High Active) 19 SW2 Ch2 Pch/Nch FET drain output pin 10 FB1 Ch1 output voltage detect pin 20 PGND2 Ch2 Lowside source pin www.rohm.com 2010.04 - Rev.C 3/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Characteristics data 3.5 3.5 3.5 Ta=25℃ 3.0 Io=1.5A 3.0 【VOUT1=3.3V】 3.0 【VOUT1=3.3V】 OUTPUT VOLTAGE:VOUT[V]01122.....50505 【【VVOOUUTT21==13..23VV】】 OUTPUT VOLTAGE:VOUT[V]01122.....50505 【VOUT2=1.2VTIoVaC=】=C02 A=55℃V OUTPUT VOLTAGE:VOUT[V]01122.....50505 【VOUT2=1.2V】 VTaC=C2=55℃V 0.0 0.0 0.0 0 1 2 3 4 5 0 1 2 3 4 5 0 1 2 3 4 INPUT VOLTAGE:VCC[V] EN VOLTAGE:VEN[V] OUTPUT CURRENT:IOUT[A] Fig.3 VCC – VOUT1,VOUT2 Fig.4 VEN - VOUT Fig.5 IOUT - VOUT 3.40 1.25 100 【VOUT1=3.3V】 【【VVOOUUTT22==11.2.2VV設】定 】 90 【VOUT1=3.3V】 OUT[V]3.35 OUT[V]1.23 %] 7800 【VOUT2=2.5V】 TAGE:V3.30 TAGE:V1.20 ηNCY:[ 5600 【VOUT2=1.5V】 VOL VOL CIE 40 T T FI 【VOUT2=1.2V】 PU PU EF 30 T3.25 T1.18 OU VIoC=C0A= 5V OU VIoC=C0A= 5V 1200 VTaC=C2=55℃V 3.20 1.15 0 -40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80 10 1【00VOUT2=1.01V0】00 10000 TEMPERATURE:Ta[℃] TEMPERATURE:Ta[℃] OUTPUT CURRENT:IOUT[mA] Fig. 6 Ta-VOUT1 Fig. 7 Ta-VOUT2 Fig.8 Efficiency 1.2 1.1 200 VCC=5V PMOS 175 1.0 QUENCY:F[MHz]OSC000...468 QUENCY:F[MHz]OSC0.19 ΩRESISTANCE:R[m]ON 11102570505 NMOS FRE FRE0.8 ON 50 0.2 VCC=5V Ta=25℃ 25 0.0 0.7 0 -40 -20 0 20 40 60 80 4.5 4.75 5 5.25 5.5 -40 -20 0 20 40 60 80 100 TEMPERATURE:Ta[℃] INPUT VOLTAGE:VCC[V] TEMPERATURE:Ta[℃] Fig.9 Ta- Fosc Fig.10 VCC-Fosc Fig.11 Ta – RONN, RONP 2.0 600 1.8 VCC=5V,Ta=25℃ 1.6 A]500 μ VEN[V]11..24 NT:I[CC400 EN1=E2 TAGE:1.0 URRE300 N VOL00..68 UIT C200 VOUT1 E VCC=5V RC VCC=5V VOUT2 0.4 CI100 0.2 0.0 0 -40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80 TEMPERATURE:Ta[℃] TEMPERATURE:Ta[℃] Fig.12 Ta－EN1,EN2 Fig.13 Ta－Icc Fig.14 Soft start wave form (Io=0mA) www.rohm.com 2010.04 - Rev.C 4/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Characteristics data VCC=5V,Ta=25℃ VCC=5V,Ta=25℃ VCC=5V,Ta=25℃ SW1 SW1 EN1=E2 VOUT1 VOUT1 VOUT1 VOUT2 Fig.15 Soft start wave form Fig.16 SW1 wave form Fig.17 SW1 wave form (Io=1.5A) (Io=0mA) (Io=1.5A) VCC=5V,Ta=25℃,VOUT2=1.2V VCC=5V,Ta=25℃,VOUT2=1.2V VCC=5V,Ta=25℃ SW2 VOUT1 VOUT2 IOUT1 Fig.18 SW2 wave form Fig.19 SW2 wave form Fig.20 VOUT1 transient responce (Io=0mA) (Io=1.5A) (Io0.5A→1.5A / usec) VCC=5V,Ta=25℃ VCC=5V,Ta=25℃,VOUT2=1.2V VCC=5V,Ta=25℃,VOUT2=1.2V VOUT2 VOUT2 IOUT2 IOUT2 Fig.21 VOUT1 transient responce Fig.22 VOUT2 transient responce Fig.23 VOUT2 transient responce (Io1.5A→0.5A/ usec) (Io0.5A→1.5A/ usec) (Io1.5A→0.5A/ usec) www.rohm.com 2010.04 - Rev.C 5/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Information on advantages Advantage 1：Offers fast transient response with current mode control system. Conventional product (Load response IO=0.5A→1.5A) BD9152MUV (Load response IO=1.5A→0.5A) VOUT1 VOUT1 IOUT IOUT Fig.24 Transient response Advantage 2： Offers high efficiency for all load range. ・For lighter load: Utilizes the current mode control mode called SLLM for lighter load, which reduces various dissipation such as switching dissipation (P ), gate charge/discharge dissipation, ESR dissipation of output capacitor (P ) and on-resistance SW ESR dissipation (P ) that may otherwise cause degradation in efficiency for lighter load. RON Achieves efficiency improvement for lighter load. ・For heavier load: Utilizes the synchronous rectifying mode and the low on-resistance MOS FETs incorporated as power transistor. ON resistance of Highside MOS FET : 170mΩ(Typ.) 100 SLLM ON resistance of Lowside MOS FET : 130mΩ(Typ.) %] η[ ② ncy 50 ① PWM cie ①inprovement by SLLM system Achieves efficiency improvement for heavier load. Effi 0 ②improvement by synchronous rectifier 0.001 0.01 0.1 1 Output current Io[A] Offers high efficiency for all load range with the improvements mentioned above. Fig.25 Efficiency Advantage 3：・Supplied in smaller package due to small-sized power MOS FET incorporated. ・Output capacitor Co required for current mode control: 22μF ceramic capacitor ・Inductance L required for the operating frequency of 1 MHz: 2.2μH inductor ・Incorporates FET + Boot strap diode Reduces a mounting area required. L1 VOUT1 20mm COUT1 FB1 EN1 SW1 SW1 PGND1 COUT1 CIN1 COUT2 ITH1 PGND1 RITH1 AGND PVcc CIN1 N.C. PVcc 15mm AVcc PVcc CIN2 ITH2 PGND2 L1 R1 L2 RITH2 FB2 EN2 SW2 SW2 PGND2 COUT2 RITH1 RITH2 R2 CITH1 CITH2 VOUT2 L2 R2 R1 Fig.26 Example application www.rohm.com 2010.04 - Rev.C 6/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Operation BD9152MUV is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes SLLM (Simple Light Load Mode) operation for lighter load to improve efficiency. ○Synchronous rectifier It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC, and its P.N junction shoot-through protection circuit limits the shoot-through current during operation, by which the power dissipation of the set is reduced. ○Current mode PWM control Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback. ・PWM (Pulse Width Modulation) control The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a highside MOS FET (while a lowside MOS FET is turned OFF), and an inductor current I increases. The current comparator (Current Comp) receives two signals, L a current feedback control signal (SENSE: Voltage converted from I ) and a voltage feedback control signal (FB), and L issues a RESET signal if both input signals are identical to each other, and turns OFF the highside MOS FET (while a lowside MOS FET is turned ON) for the rest of the fixed period. The PWM control repeat this operation. ・SLLM (Simple Light Load Mode) control When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn OFF with the device held operated in normal PWM control loop, which allows linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current Comp, it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching is tuned OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces the switching dissipation and improves the efficiency. SENSE Current Comp VOUT RESET Level R Q IL Shift FB SET S Driver VOUT Gm Amp. Logic SW Load OSC ITH Fig.27 Diagram of current mode PWM control CCurormenpt PVCC SENSE CCurormenpt PSVECNCSE FB FB SET GND SET GND RESET GND RESET GND SW GND SW IL IL(AVE) GND IL 0A VOUT VOUT(AVE) VOUT VOUT(AVE) Not switching Fig.28 PWM switching timing chart Fig.29 SLLMTM switching timing chart www.rohm.com 2010.04 - Rev.C 7/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Description of operations ・Soft-start function EN terminal shifted to “High” activates a soft-starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ・Shutdown function With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0µF (Typ.). ・UVLO function Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied. And the hysteresis width of 50mV (Typ.) is provided to prevent output chattering. Each the outputs have UVLO. It is possible to set output sequence easy. Hysteresis VCC 100mV Hysteresis 50mV EN1,2 VOUT1 TSS TSS TSS discharge ON discharge ON discharge ON discharge ON VOUT2 Natural discha rge Natural discharge Natural discharge TSS TSS TSS Ch1 Standby mode C h2 Ch1 Standby mode Standby mode Standby mode Ch1, Ch2 Ch1, Ch2 Ch1 : standby mode Ch1, Ch2 Ch1, Ch2 Ch2 Standby mode Operating mode Ch2 : Operating mode Operating mode Operating mode Standby mode UVLO2 UVLO1 UVLO1 UVLO1 UVLO2 EN EN UVLO1 UVLO2 Fig.30 Soft start, Shutdown, UVLO timing chart www.rohm.com 2010.04 - Rev.C 8/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ・Short-current protection circuit with time delay function Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for the fixed time(TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking UVLO. EN1＝EN2 Output Short circuit Threshold Voltage Output OFF Latch VOUT2 IL1 IL Limit Smtaonddeb y Opt1e<raTtLinATgC mH ode t2=TLATCH Standby Operating mode mode EN Timer latch EN Fig.31 Short-current protection circuit with time delay timing chart ●Switching regulator efficiency Efficiency ŋ may be expressed by the equation shown below: η= VOUT×IOUT ×100[%]= POUT ×100[%]= POUT ×100[%] Vin×Iin Pin POUT+PDα Efficiency may be improved by reducing the switching regulator power dissipation factors P α as follows: D Dissipation factors: 1) ON resistance dissipation of inductor and FET：PD(I2R) 2) Gate charge/discharge dissipation：PD(Gate) 3) Switching dissipation：PD(SW) 4) ESR dissipation of capacitor：PD(ESR) 5) Operating current dissipation of IC：PD(IC) 1)PD(I2R)=IOUT2×(RCOIL+RON) (RCOIL[Ω]：DC resistance of inductor, RON[Ω]：ON resistance of FET, IOUT[A]：Output current.) 2)PD(Gate)=Cgs×f×V (Cgs[F]：Gate capacitance of FET, f[H]：Switching frequency, V[V]：Gate driving voltage of FET) Vin2×CRSS×IOUT×f 3)PD(SW)= (CRSS[F]：Reverse transfer capacitance of FET, IDRIVE[A]：Peak current of gate.) IDRIVE 4)PD(ESR)=IRMS2×ESR (IRMS[A]：Ripple current of capacitor, ESR[Ω]：Equivalent series resistance.) 5)PD(IC)=Vin×ICC (ICC[A]：Circuit current.) www.rohm.com 2010.04 - Rev.C 9/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Consideration on permissible dissipation and heat generation As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered. Because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. 4.5 4.0 ① (c4o lpapyeerr sfo (icl oinp peearc hfo lial ayerersa) : 5505mm2) P=IOUT2×RON ①3.56W ②θ 4j -laa=ye3r5s. 1(c℃o/pWpe r foil area : 10.29mm2) RON=D×RONP+(1-D)RONN (copper foil in each layers) θj-a=103.3℃/W ③ 1 layer (copper foil area : 0mm2) D：ON duty (=VOUT/VCC) θj-a=178.6℃/W W] 3.0 ④IC only RONH：ON resistance of Highside MOS FET Pd [ θj-a=367.6℃/W RONL：ON resistance of Lowside MOS FET n : IOUT：Output current atio dissip 2.0 wer ②1.21W o P 1.0 ③0.70W ④0.34W 0 0 25 50 75 100 105 125 150 Ambient temperature :Ta [℃] Fig.32 Thermal derating curve (VQFN020V4040) (Example) VCC=5V, VOUT1=3.3V, VOUT2=1.2V, RONH=170mΩ, RONL=130mΩ IOUT=1.5A, for example, D1=VOUT1/VCC=3.3/5=0.66 D2=VOUT2/VCC=1.2/5=0.24 RON1=0.66×0.170+(1-0.66)×0.130 =0.1122+0.0442 =0.1564[Ω] RON2=0.24×0.170+(1-0.24)×0.130 =0.0408+0.0988 =0.1397[Ω] P=1.52×0.1564+1.52×0.1397=0.666[W] As RONHis greater than RONL in this IC, the dissipation increases as the ON duty becomes greater. With the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. www.rohm.com 2010.04 - Rev.C 10/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Selection of components externally connected 1. Selection of inductor (L) IL The inductance significantly depends on output ripple current. ΔIL As seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. VCC (VCC-VOUT)×VOUT ΔIL= [A]・・・(1) L×VCC×f IL Appropriate ripple current at output should be 20% more or less of the V maximum output current. OUT L ΔIL=0.2×IOUTmax. [A]・・・(2) Co (VCC-VOUT)×VOUT L= [H]・・・(3) ΔIL×VCC×f Fig.33 Output ripple current (ΔIL: Output ripple current, and f: Switching frequency) ※Current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. The inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. If VCC=5.0V, VOUT=1.2V, f=1.0MHz, ΔIL=0.3×1.5A=0.45A, for example,(BD9152MUV) (5-1.2)×1.2 L= 0.45×5×1.0M =2.02μ → 2.2[μH] ※Select the inductor of low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for better efficiency. 2. Selection of output capacitor (CO) VCC Output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. Output ripple voltage is determined by the equation (4)： VOUT L ESR ΔVOUT=ΔIL×ESR [V]・・・(4) Co (ΔIL: Output ripple current, ESR: Equivalent series resistance of output capacitor) ※Rating of the capacitor should be determined allowing sufficient margin against output voltage. A 22μF to 100μF ceramic capacitor is recommended. Fig.34 Output capacitor Less ESR allows reduction in output ripple voltage. 3. Selection of input capacitor (Cin) Input capacitor to select must be a low ESR capacitor of the capacitance VCC Cin sufficient to cope with high ripple current to prevent high transient voltage. The ripple current IRMS is given by the equation (5): VOUT √VOUT(VCC-VOUT) L Co IRMS=IOUT× VCC [A]・・・(5) < Worst case > IRMS(max.) IOUT When Vcc=2×VOUT, IRMS= 2 Fig.35 Input capacitor If VCC=5.0V, VOUT=1.8V, and IOUTmax.=1.5A, (BD9152MUV) √1. 8(5.0-1.8) IRMS=2× 5.0 =0.48[ARMS] A low ESR 22μF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency. www.rohm.com 2010.04 - Rev.C 11/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note 4. Determination of RITH, CITH that works as a phase compensator As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its ESR. So, the phases are easily compensated by adding a zero to the power amplifier output with C and R as described below to cancel a pole at the power amplifier. fp(Min.) A fp= 1 fp(Max.) 2π×RO×CO Gain 0 1 [dB] fz(ESR) fz(ESR)= 2π×ESR×CO IOUTMin. IOUTMax. Pole at power amplifier 0 When the output current decreases, the load resistance Ro Phase [deg] increases and the pole frequency lowers. -90 1 fp(Min.)= 2π×ROMax.×CO [Hz]←with lighter load Fig.36 Open loop gain characteristics 1 fp(Max.)= [Hz] ←with heavier load 2π×ROMin.×CO A fz(Amp.) Zero at power amplifier Gain [dB] Increasing capacitance of the output capacitor lowers the pole 0 frequency while the zero frequency does not change. (This is because when the capacitance is doubled, the capacitor ESR reduces to half.) 0 Phase [deg] 1 -90 fz(Amp.)= 2π×RITH×CITH Fig.37 Error amp phase compensationcharacteristics VOUT1 L1 FB1 EN1 SW1 SW1 PGND1 ECSORU T1 RO1 ITH1 PGND1 RITH1 CITH1 AGND PVcc CIN1 N.C. PVcc AVcc PVcc CIN2 ITH2 PGND2 RITH2 COUT2 CITH2 FB2 EN2 SW2 SW2 PGND2 VOUT2 L2 R2 RO2 R1 Fig.38 Typical application Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load resistance with CR zero correction by the error amplifier. fz(Amp.)= fp(Min.) 1 1 = 2π×RITH×CITH 2π×ROMax.×CO www.rohm.com 2010.04 - Rev.C 12/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note 5. Determination of VOUT2 output voltage The output voltage VOUT2 is determined by the equation (6): L2 VOUT2=(R2/R1+1)×VFB2・・・(6) VFB2: Voltage at ADJ terminal (0.8V Typ.) VOUT2 With R1 and R2 adjusted, the output voltage may be determined as required. SW2 Cout2 R2 FB2 Adjustable output voltage range : 0.8V～2.5V R1 Fig.39 Determination of output voltage Use 1 kΩ～100 kΩ resistor for R1. If a resistor of the resistance higher than 100 kΩ is used, check the assembled set carefully for ripple voltage etc. ●BD9152MUV Cautions on PC Board layout VOUT1 L1 FB1 EN1 SW1 SW1PGND1 COUT1 ITH1 PGND1 RITH1 CITH1 AGND PVcc CIN1 N.C. PVcc AVcc PVcc CIN2 ITH2 PGND2 RITH2 COUT2 CITH2 FB2 EN2 SW2SW2PGND2 VOUT2 L2 R2 R1 Fig.40 Layout diagram ① Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the pin PGND. ② Lay out CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring. ※ VQFN020V4040 (BD9152MUV) has thermal PAD on the reverse of the package. The package thermal performance may be enhanced by bonding the PAD to GND plane which take a large area of PCB. www.rohm.com 2010.04 - Rev.C 13/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Recommended components Lists on above application Symbol Part Value Manufacturer Series L1,2 Coil 2.2uH TDK LTF5022-2R2N3R2 CIN1,CIN2 Ceramic capacitor 22uF Murata GRM32EB11A226KE20 Cout1,Cout2 Ceramic capacitor 22uF Murata GRM31CB30J226KE18 CITH1 Ceramic capacitor 680pF Murata GRM18 Series RITH1 Resistance 82kΩ Rohm MCR03 Series VOUT2=0.8V 680pF Murata GRM18 Series VOUT2=1.0V 680pF Murata GRM18 Series CITH2 Ceramic capacitor VOUT2=1.2V 680pF Murata GRM18 Series VOUT2=1.5V 680pF Murata GRM18 Series VOUT2=1.8V 680pF Murata GRM18 Series VOUT2=2.5V 680pF Murata GRM18 Series VOUT2=0.8V 12kΩ Rohm MCR03 Series VOUT2=1.0V 12kΩ Rohm MCR03 Series VOUT2=1.2V 15kΩ Rohm MCR03 Series RITH2 Resistance VOUT2=1.5V 15kΩ Rohm MCR03 Series VOUT2=1.8V 33kΩ Rohm MCR03 Series VOUT2=2.5V 82kΩ Rohm MCR03 Series ※The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode or snubber established between the SW and PGND pins. ●I/O equivalence circuit ・EN1,EN2 pin ・SW1,SW2 PVCC PVCC PVCC E N1,EN2 SW1,SW2 ・FB1,FB2 pin ・ITH1,ITH2 pin AVCC FB1,FB2 ITH1,ITH2 Fig.41 I/O equivalence circuit www.rohm.com 2010.04 - Rev.C 14/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note ●Notes for use 1. Absolute Maximum Ratings While utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken, short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. Electrical potential at GND GND must be designed to have the lowest electrical potential In any operating conditions. 3. Short-circuiting between terminals, and mismounting When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and power supply or GND may also cause breakdown. 4. Thermal shutdown protection circuit Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 5. Inspection with the IC set to a pc board If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the inspection process, be sure to turn OFF the power supply before it is connected and removed. 6. Input to IC terminals This is a monolithic IC with P+ isolation between P-substrate and each element as illustrated below. This P-layer and the N-layer of each element form a P-N junction, and various parasitic element are formed. If a resistor is joined to a transistor terminal as shown in Fig 42. ○P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and ○if GND>Terminal B (at NPN transistor side), a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode. The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in activation of parasitic elements. Resistor Transistor (NPN) Pin A B Pin B C Pin A E B C N N P+ N P+ P P+ Parasitic P P+ N N element N E Parasitic P substrate P substrate element GND GND GND GND Parasitic element Parasitic element Other adjacent elements Fig.42 Simplified structure of monorisic IC 7. Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 8 . Selection of inductor It is recommended to use an inductor with a series resistance element (DCR) 0.15Ω or less. Note that use of a high DCR inductor will cause an inductor loss, resulting in decreased output voltage. Should this condition continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched OFF. When using an inductor over 0.15Ω, be careful to ensure adequate margins for variation between external devices and this IC, including transient as well as static characteristics. www.rohm.com 2010.04 - Rev.C 15/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

BD9152MUV Technical Note  Ordering part number B D 9 1 5 2 M U V - E 2 Part No. Part No. Package Packaging and forming specification MUV: VQFN020V4040 E2: Embossed tape and reel VQFN020V4040 <Tape and Reel information> 4.0±0.1 Tape Embossed carrier tape ±4.00.1 Quantity 2E5200pcs Direction AX 1PIN MARK S of feed (Treheel odnir ethcteio lne fits h tahned 1 apnind oyfo pur opduull cot uist tahte t htaep uep opne rt hleef tr iwghhte hna ynodu hold ) M 1.00.08C0.S2 2.1±0.10.5 +0.03 0.02-0.02 (0.22) 1 5 ±0.40.1 2106 160 ±2.10.1 1.0 15 110.25-+00..0045 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com 2010.04 - Rev.C 16/16 ○c 2010 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.

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