Datasheet 4 .5V to 13.2V, 2A 1ch Synchronous Buck Co nverter with Integrated FET BD9141MUV General Description Key Specifications The BD9141MUV is ROHM’s high efficiency  Input Voltage Range: 4.5V to 13.2V step-down switching regulator designed to produce a  Output Voltage Range: 2.5V to 6.0V low voltage including 5.0V/3.3V from 2 lithium cell  Output Current: 2.0A(Max) power supply line. It offers high efficiency by using  Switching Frequency: 500KHz(Typ) pulse skip control technology and synchronous  Pch FET ON-Resistance: 150mΩ(Typ) switches, and provides fast transient response to  Nch FET ON-Resistance: 80mΩ(Typ) sudden load changes by implementing current mode  Standby Current: 0μA (Typ) control.  Operating Temperature Range: -40°C to +105°C Features Package W(Typ) x D(Typ) x H(Max) ■ Fast Transient Response because of Current Mode PWM Control System ■ High Efficiency for All Load Ranges because of Synchronous Rectifier (Nch/Pch FET) and SLLMTM (Simple Light Load Mode) ■ Soft-Start Function ■ Thermal Shutdown and UVLO Functions ■ Short-Circuit Protection with Time Delay Function ■ Shutdown Function Applications Power Supply for LSI including DSP, Microcomputer and ASIC VQFN020V4040 4.00mm x 4.00mm x 1.00mm Typical Application Circuit VCC CIN L VCC,PVCC EN SW VOUT C ADJ O R2 ITH GND,PGND R ITH R1 C ITH Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays .w ww.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/22 TSZ22111・14・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Pin Configuration (TOP VIEW) N V IT A G .C. REG H DJ ND 15 14 13 12 11 N.C. 16 10 VCC EN 17 9 N.C. 18 8 PGND 19 7 PVCC 20 6 1 2 3 4 5 SW Figure 2. Pin Configuration Pin Description Pin No. Pin Name Pin Function 1,2,3,4,5 SW Power switch node 6,7,8 PVCC Power switch supply pin 9 N.C. No connection 10 VCC Power supply input pin 11 GND Ground pin 12 ADJ Output voltage detection pin 13 ITH GmAmp output pin/connected to phase compensation capacitor 14 VREG Reference voltage 15,16 N.C. No connection 17 EN Enable pin(Active High) 18,19,20 PGND Power switch ground pin Block Diagram V CC VCC PVCC VCC R C ITH ITH R1 R2 Figure 3. Block Diagram www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 2/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Absolute Maximum Ratings Parameter Symbol Limit Unit VCC Voltage V -0.3 to +15 (Note 1) V CC PVCC Voltage PV -0.3 to +15 (Note 1) V CC EN Voltage V -0.3 to +15 V EN SW Voltage V -0.3 to +15 V SW ITH,VREG, ADJ Voltage VITH, VREG -0.3 to +7 V VADJ Power Dissipation 1 Pd1 0.34 (Note 2) W Power Dissipation 2 Pd2 0.70 (Note 3) W Power Dissipation 3 Pd3 2.21 (Note 4) W Power Dissipation 4 Pd4 3.56 (Note 5) W Operating Temperature Range Topr -40 to +105 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C (Note 1) Pd should not be exceeded. (Note 2) IC only. (Note 3) Mounted on a 1 layer board 74.2mmx74.2mmx1.6mm Glass-epoxy PCB (Copper foil area : 10.29mm2) (Note 4) Mounted on a 4 layer board 74.2mmx74.2mmx1.6mm Glass-epoxy PCB (1st ,4th Copper foil area : 10.29mm2 2nd ,3rd Copper foil area : 5505mm2),. (Note 5) Mounted on a 4 layer board 74.2mmx74.2mmx1.6mm Glass-epoxy PCB (Copper foil area : 5505mm2) , copper foil in each layers. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40°C to +105°C) Limit Parameter Symbol Unit Min Typ Max VCC Voltage V (Note 6) 4.5 (Note 7) 8.0 13.2 V CC PVCC Voltage PV (Note 6) 4.5 (Note 7) 8.0 13.2 V CC EN Voltage V 0 - V V EN CC SW Average Output Current I (Note 6) - - 2.0 A SW Output Voltage Setting Range V (Note 7) 2.5 - 6.0 V OUT (Note 6) Pd should not be exceeded. (Note 7) VCCMin = VOUT+ 1.3V. Electrical Characteristics (Ta=25°C, V =PV =8.0V, V =V , R =8.2kΩ, R =43kΩ, unless otherwise specified.) CC CC EN CC 1 2 Limit Parameter Symbol Unit Conditions Min Typ Max Standby Current I - 0 10 μA EN=GND STB Bias Current I - 300 500 μA CC EN Low Voltage V - GND 0.8 V Standby mode ENL EN High Voltage V 2.0 V - V Active mode ENH CC EN Input Current I - 1.6 10 μA V =8V EN EN Oscillation Frequency f 400 500 600 KHz OSC Pch FET ON-Resistance R - 150 300 mΩ PV =8V ONP CC Nch FET ON-Resistance R - 80 160 mΩ PV =8V ONN CC ADJ Voltage V 0.788 0.800 0.812 V ADJ ITH Sink Current ITHSI 10 20 - μA VADJ=1.0V ITH Source Current ITHSO 10 20 - μA VADJ=0.6V UVLO Threshold Voltage V 3.90 4.10 4.30 V V =8V to 0V UVLO1 CC UVLO Release Voltage V 3.95 4.20 4.50 V V =0V to 8V UVLO2 CC Soft-Start Time t 0.5 1 2 ms SS Timer Latch Time t 1 2 3 ms SCP/TSD operated LATCH Output Short-Circuit V - 0.4 0.56 V V =0.8V to 0V Threshold Voltage SCP ADJ www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 3/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Typical Performance Curves 【VOUT=5V】 【VOUT=5V】 Ta=25°C [V] UT IO=2A [V] UT O O V V e: e: g g a a olt olt V V ut ut p p V =8V ut ut CC O O Ta=25°C I =0A O Input Voltage: VCC [V] EN Voltage: VEN [V] Figure 4. Output Voltage vs Input Voltage Figure 5. Output Voltage vs EN Voltage 【V =5V】 OUT V =8V CC V] V] IO=0A V [OUT V [OUT e: e: g g a a Output Volt 【VVCCO=UT8=V5 V】 Output Volt Ta=25°C Output Current: I [A] Temperature: Ta [°C] OUT Figure 6.Output Voltage vs Output Current Figure 7. Output Voltage vs Temperature www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 4/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Typical Performance Curves - continued V =8V CC 【VOUT=5V】 z] H η[%] VTaC=C=258°VC [kSC ncy: cy: fO cie en Effi qu e r F Output Current: IOUT [mA] Temperature: Ta [°C] Figure 8. Efficiency vs Output Current Figure 9. Frequency vs Temperature V =8V CC V =8V CC Resistance: R [Ω] ON Resistance: R [Ω] ON N- N- O O Temperature: Ta [°C] Temperature: Ta [°C] Figure 10. ON-Resistance vs Temperature Figure 11.ON-Resistance vs Temperature www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 5/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Typical Performance Curves – continued V =8V CC µA] z] [C kH nt: IC [OSC Curre ncy: f uit que c e Cir Fr Temperature: Ta [°C] Input Voltage: V [V] CC Figure 12. Circuit Current vs Temperature Figure 13. Frequency vs Input Voltage Typical Waveforms V =P V C C = ECNC SW VOUT=5V】 VOU T V OUT V =8V CC V =8V CC Ta=25°C Ta=25°C IO=0A IO=0A Figure 14. Soft Start Waveform Figure 15. SW Waveform (I =10mA) O www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 6/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Typical Waveforms – continued VOUT=5V] [VOUT=5V] V OUT IOUT VOUT VCC=8V VCC=8V Figure 16. SW Waveform Figure 17. Transient Response (IO=2000mA) (IO=0.5A to 1A, 10μs) VOUT I OUT V =8V CC Figure 18. Transient Response (I =1A to 0.5A, 10μs) O www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 7/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Application Information 1. Operation BD9141MUV is a synchronous step-down switching regulator that achieves fast transient response by employing current mode PWM control system. It utilizes switching operation either in PWM (Pulse Width Modulation) mode for heavier load, or SLLMTM (Simple Light Load Mode) operation for lighter load to improve efficiency. (1) Synchronous rectifier Integrated synchronous rectification using two MOSFETS reduces power dissipation and increases efficiency when compared to converters using external diodes. Internal shoot-through current limiting circuit further reduces power dissipation. (2) Current mode PWM control The PWM control signal of this IC depends on two feedback loops, the voltage feedback and the inductor current feedback. (a) PWM (Pulse Width Modulation) control The clock signal coming from OSC has a frequency of 500Khz. When OSC sets the RS latch, the P-Channel MOSFET is turned ON and the N-Channel MOSFET is turned OFF. The opposite happens when the current comparator (Current Comp) resets the RS latch i.e. the P-Channel MOSFET is turned OFF and the N-Channel MOSFET is turned ON. Current Comp’s output is a comparison of two signals, the current feedback control signal “SENSE” which is a voltage proportional to the current I , and the voltage feedback control signal, FB. L (b) SLLMTM (Simple Light Load Mode) control When the control mode is shifted by PWM from heavier load to lighter load or vise-versa, the switching pulse is designed to turn OFF with the device held operating in normal PWM control loop. This allows linear operation without voltage drop or deterioration in transient response during the sudden load changes. Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current Comp, it is designed such that the RESET signal is continuously sent even if the load is changed to light mode where the switching is tuned OFF and the switching pulses disappear. Activating the switching discontinuously reduces the switching dissipation and improves the efficiency. SENSE Current Comp VOUT RESET Level R Q IL Shift FB SET Gm Amp S DLorigviecr SW VOUT Load OSC R ITH Figure 19. Diagram of Current Mode PWM Control CCurormenpt PVCC SENSE CCurormenpt PSEVNCCS E FB FB SET GND SET GND RESET GND RESET GND SW GND SW IL IL(AVE) IL GND 0A VOUT VOUT(AVE) VOUT VOUT(AVE) Not switching Figure 20. PWM Switching Timing Diagram Figure 21. SLLMTM Switching Timing Diagram www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 8/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV 2. Description of Functions (1) Soft-Start Function During start-up, the soft-start gradually establishes the output voltage to limit the input current. This prevents the overshoot in the output voltage and inrush current. (2) Shutdown Function When EN terminal is “Low”, the device operates in Standby Mode, and all the functional blocks including reference voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0μA (Typ). (3) UVLO Function It detects whether the supplied input voltage is sufficient to obtain the output voltage of this IC. A hysteresis width of 100mV (Typ) is provided to prevent the output from chattering. Hysteresis 100mV V CC EN V OUT t t t SS SS SS Soft start Standby Standby Standby mode Operating mode mode O perating mode mode Operating mode Standby mode UVLO UVLO EN UVLO Figure 22. Soft-Start, Shutdown, UVLO Timing Chart (4) Short-Circuit Protection with Time Delay Function To protect the IC from breakdown, the short-circuit protection turns the output OFF when the internal current limiter is activated continuously for a fixed time(t ) or more. The output that is kept OFF may be turned on again by LATCH restarting EN or by resetting UVLO. EN Output OFF latch Output Short circuit Threshold Voltage VOUT I Limit L IL Standby t1<tLATCH t2=tLATCH Standby mode Operating mode mode Operating mode EN Timer latch EN Figure 23. Short-Circuit Protection with Time Delay Diagram www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 9/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV 3. Information on Advantages Advantage 1：It offers fast transient response by using current mode control system. Conventional product (Load response IO=0.5A to 1A) BD9141MUV (Load response IO=0.5A to 1A) VOUT VOUT 110mV 50mV I I OUT OUT Voltage drop due to sudden change in load was reduced. Figure 24. Comparison of Transient Response Advantage 2： It offers high efficiency for all load ranges (a) For lighter load: This IC utilizes the current mode control mode called SLLMTM, which reduces various dissipation such as switching dissipation (P ), gate charge/discharge dissipation (P ), ESR dissipation of output capacitor (P ) and SW GATE ESR ON-Resistance dissipation (P ) that may otherwise cause reduction in efficiency. RON It achieves efficiency improvement for lighter load. (b) For heavier load: This IC utilizes the synchronous rectifying mode and uses low ON-Resistance MOSFETs incorporated as power transistor. ON-Resistance of P-Channel MOSFET : 150mΩ(Typ) 100 ON-Resistance of N-Channel MOSFET : 80mΩ(Typ) SLLMTM %] ② η[ ncy : 50 ① PWM It achieves efficiency improvement for heavier load. cie ① improvement by SLLMTM system Effi 0 ②improvement by synchronous rectifier It offers high efficiency for all load ranges with the improvements mentioned above. 0.001 0.01 0.1 1 Output Current I [A] OUT Figure 25. Efficiency Advantage 3：・It is supplied in smaller package due to small-sized power MOSFET. ・Output capacitor C required for current mode control: 22µF ceramic capacitor O ・Inductance L required for the operating frequency of 500kHz: 4.7µH inductor Reduces mounting area requirement. V CC 15mm C IN C IN R L CDonCv/eDrCto r L VOUT 10mm ITH Controller RITH CO CITH C O C ITH Figure 26.Example Application www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 10/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV 4. Switching Regulator Efficiency The Efficiency ŋ may be expressed by the equation shown below: V I P P  OUT OUT 100 OUT 100 OUT 100 [%] VINIIN PIN POUT Pd The efficiency may be improved by reducing the switching regulator power dissipation factors Pdα as follows: Dissipation factors: (1) ON-Resistance Dissipation of Inductor and FET：Pd(I2R) Pd(I2R)I 2 (R R ) OUT COIL ON Where: R is the DC resistance of inductor COIL R is the ON-Resistance of FET ON I is the Output current OUT (2) Gate Charge/Discharge Dissipation：Pd(Gate) Pd(Gate)Cgs f V2 Where: C is the gate capacitance of FET gs f is the switching frequency V is the gate driving voltage of FET (3) Switching Dissipation：Pd(SW) V 2C I  f Pd(SW) IN RSS OUT I DRIVE Where: C is the Reverse transfer capacitance of FET. RSS I is the Peak current of gate. DRIVE (4) ESR Dissipation of Capacitor：Pd(ESR) Pd(ESR)I 2ESR RMS Where: I is the ripple current of capacitor. RMS ESR is the equivalent series resistance. (5) Operating Current Dissipation of IC：Pd(IC) Pd(IC)V I IN CC Where: I is the Circuit current. CC www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 11/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV 5. Consideration on Permissible Dissipation and Heat Generation Since this IC functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. For dissipation, only conduction losses due to DC resistance of inductor and ON-Resistance of FET are considered. This is because the conduction losses are the most significant among other dissipation mentioned above such as gate charge/discharge dissipation and switching dissipation. 4.5 ① 4 layers (Copper foil area : 5505mm2) copper foil in each layers. 4.0 θj-a= 35.1°C /W ①3.56W ② 4 layers (Copper foil area : 10.29m2) W] 2, 3 layers Copper foil area : 5505mm2). Pd [ 3.0 ③ θ j-1a =la5y6e.6rs° C(C /oWp per foil area : 10.29m2) ssipation: ②2.21W ④ θθ j-jI-aCa== 3o16n77l8y...6 6°°CC //WW Di 2.0 wer PIOUT2RON Po W] RON DRONP (1D)RONN [ 1.0 ③0.70W where: D is the ON duty (=VOUT/VCC). ④0.34W RONP is the ON-Resistance of P-Channel MOS FET 0 RONN is the ON-Resistance of N-Channel MOS FET. I is the Output current. 0 25 50 75 100 105 125 150 OUT Ambient Temperature: Ta [°C] Figure 27. Thermal Derating Curve (VQFN020V4040) If V =8V, V =5V, R =0.15Ω, R =0.08Ω CC OUT ONP ONN I =2A, for example, OUT DV /V 5/80.625 OUT CC R 0.6250.1510.6250.08 ON 0.093750.03 0.12375  P220.123750.495 W Since R is greater than R in this IC, the dissipation increases as the ON duty increases. Taking into consideration the ONP ONN dissipation shown above, thermal design must be carried out with sufficient margin. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 12/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV 6. Selection of Components Externally Connected (1) Selection of inductor (L) The inductance significantly depends on the output ripple current. IL As seen in equation (1), the ripple current decreases as the inductor and/or switching frequency increases. ΔI L V V V  I  CC OUT OUT [A]・・・(1) VCC L LV  f CC Appropriate output ripple current should be about 30% of the I L maximum output current. VOUT IL 0.3IOUTMax [A]・・・(2) L C O V V V L  CC OUT OUT [H]・・・(3) I V  f L CC Figure 28. Output Ripple Current where: ΔIL is the Output ripple current. f is the Switching frequency Note: Current exceeding the current rating of an inductor results in magnetic saturation of the inductor, which decreases efficiency. The inductor must be selected with sufficient margin in which the peak current may not exceed its current rating. If V =8V, V =5V, f=500kHz, ΔI =0.3 x 2A=0.6A, for example, (BD9141MUV) CC OUT L 855   L 6.256.3 H 0.68500k Note: Select an inductor with low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for better efficiency. (2) Selection of output capacitor (C ) O Output capacitor should be selected with the consideration on the stability V CC region and the equivalent series resistance required to minimize ripple voltage. Output ripple voltage is determined by the equation (4) ： V O U T  V I ESR [V]・・・(4) OUT L L ESR C Where: o ΔI is the Output ripple current L ESR is the Equivalent series resistance of output capacitor Figure 29. Output Capacitor Note: Rating of the capacitor should be determined allowing sufficient margin against output voltage. A 22μF to 100μF ceramic capacitor is recommended. Less ESR allows reduction in output ripple voltage. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 13/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV (3) Selection of input capacitor (C ) IN The input capacitor must be a low ESR capacitor with capacitance sufficient VCC C enough to cope with high ripple current to prevent high transient voltage. The IN ripple current I is given by the equation (5): RMS V O U T V V V  L Co IRMS  IOUT  OUT CC OUT [A]・・・(5) V CC < W o r st c a s e > I RMSMax I Figure 30. Input Capacitor When VCC is twice the VOUT ,IRMS  O2UT If VCC=8V, VOUT=5V, and IOUTMax=2A, (BD9140MUV) 585 I  2  0.96 [A ] RMS RMS 8 A low ESR 22μF/25V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency. (4) Calculating R , C for phase compensation ITH ITH Since the Current Mode Control is designed to limit inductor current, a pole (phase lag) appears in the low frequency area due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its ESR. Therefore, the phases are easily compensated by adding a zero to the power amplifier output with C and R as described below to cancel the pole at the power amplifier. fp(Min) 1 fp  A 2R C O O fp(Max) Gain 1 [dB] 0 fz(ESR) fZESR  2ESRCO IOUTMin I OUTMax Pole at power amplifier 0 Phase When the output current decreases, the load resistance Ro [deg] increases and the pole frequency decreases. -90 1 Figure 31. Open Loop gain Characteristics fpMin 2R C [Hz]withlighterload OMax O 1 fp  [Hz]withheavierload (Max) 2R C OMin O A fz ( A m p ) Zero at power amplifier Gain Increasing capacitance of the output capacitor lowers the [dB] pole frequency while the zero frequency does not change. 0 (This is because when the capacitance is doubled, the capacitor ESR is reduced to half.) 0 Phase [deg] 1 - 9 0 fzAmp 2R C ITH ITH Figure 32. Error Amp phase compensation characteristics www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 14/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV VCC CIN EN VCC, PVCC SW L V OUT V VOUT ESR R OUT O ITH GND,PGND C O R ITH C ITH Figure 33. Typical Application Stable feedback loop may be achieved by canceling the pole fp(Min) produced by the output capacitor and the load resistance with CR zero correction by the error amplifier. fz  fp (Amp) (Min) 1 1   2RITH CITH 2ROMaxCO (5) Setting the output voltage The output voltage V is determined by the equation (6): OUT V (R /R 1)V ・・・(6) OUT 2 1 ADJ Where: L V is the Voltage at ADJ terminal (0.8V Typ) ADJ 6 Output The required output voltage may be determined by adjusting R1 and R2. SW Co R2 1 ADJ Adjustable output voltage range: 2.5V to 6.0V R 1 Figure 34. Setting the Output Voltage Use 1 kΩ to 100 kΩ resistor for R . When using a resistor with resistance higher than 100 kΩ, check the assembled 1 set carefully for ripple voltage etc. 8 The minimum input voltage depends on the output voltage. 7.5 Basically, it is recommended to use the condition: VO=6.0V VCCMin VOUT 1.3V V [V]E : VCC[V] CC 6.57 e :AG VO=5.0V FmTopihgineiusirm radetua iomt3an5 iir nsasp nthuhgotee wv .co shl taathrgaeec .t ne(eDricsCetiRcs s voaafr lyiun edo,u usctopto uirtt: d0co.u1erΩsren)n ’tt gvuaalruaen teaet tthhee Input VoltagINPUT VOLT 5.56 VO=4.0V 5 (6) Selection of the reference voltage capacitor (CVREG) VO=3.3V VREG voltage : reference voltage created by Input voltage 4.5 (VCC Voltage). C capacitor should be 0.1µF or more. 0 0.5 1 1.5 2 VREG OuOtUpTuPtU CTu CrUreRnRtE :NIOTU :T I O[AUT] [A] Figure 35. Minimum Input Voltage in each Output Voltage www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 15/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV 7. BD9141MUV Cautions on PCB Layout V CC R2 EN ADJ EN R1 VCC PVCC VREG L ① CVREG ITH SW VOUT R③ITH CIN CO GND PGND ② CITH GND Figure 36. Layout Diagram ① For the sections drawn with heavy line, use thick conductor pattern as short as possible. ② Layout the input ceramic capacitor C closer to the pins PVCC and PGND, and the output capacitor C closer to IN O the pin PGND. ③ Layout C and R between the pins ITH and GND as near as possible with least necessary wiring. ITH ITH ④ The Non connection pin must be left open or connected to GND. Note: VQFN020V4040 (BD9141MUV) has thermal FIN on the reverse of the package. The package thermal performance may be enhanced by bonding the FIN to GND plane which occupy a large area of PCB. 8. Recommended Components Lists on Above Application Symbol Part Value Manufacturer Series L Coil 4.7µH TDK RLF7030T-4R7M3R4 C Ceramic Capacitor 22µF Kyocera CM32X5R226M25A IN C Ceramic Capacitor 22µF Kyocera CM32X5R226M10A O CVREG Ceramic Capacitor 0.1 µF Murata GRM188B31H104KA92 V =3.3V 1000pF Murata GRM1882C1H102JA01 O C Ceramic Capacitor ITH V =5V 1000pF Murata GRM1882C1H102JA01 O V =3.3V 20kΩ Rohm MCR03 Series O R Resistance ITH V =5V 47kΩ Rohm MCR03 Series O Note: The parts list presented above is an example of the recommended parts. Although the parts are standard, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When switching noise is significant and may affect the system, a low pass filter should be inserted between the VCC and PVCC pins, and a Schottky barrier diode established between the SW and PGND pins. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 16/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV I/O Equivalent Circuit ・EN pin ・SW pin PVCC PVCC PVCC EN SW ・ADJ pin ・ ITH pin V CC ADJ ITH ・VREG pin VCC VCC VREG Figure 37. I/O Equivalent Circuits www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 17/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 18/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 38. Example of monolithic IC structure 13. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 14. Selection of Inductor It is recommended to use an inductor with a series resistance element (DCR) 0.1Ω or less. Especially, note that use of a high DCR inductor will cause an inductor loss, resulting in decreased output voltage. Should this condition continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched OFF. When using an inductor over 0.1Ω, be careful to ensure adequate margins for variation between external devices and this IC, including transient as well as static characteristics. Furthermore, in any case, it is recommended to start up the output with EN after supply voltage is within. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 19/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Ordering Information B D 9 1 4 1 M U V E 2 Part Number Package Packaging and forming specification MUV: VQFN020V4040 E2: Embossed tape and reel Marking Diagram VQFN020V4040 (TOP VIEW) Part Number Marking D 9 1 4 1 LOT Number 1PIN MARK www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 20/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Physical Dimension, Tape and Reel Information Package Name VQFN020V4040 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand 1pin Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 21/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett B D9141MUV Revision History Date Revision Changes 02.Mar.2012 001 New Release 03.Oct.2014 002 Applied the ROHM Standard Style and improved understandability. 04.Jun.2015 003 Updated the contents of Japanese datasheet. The English datasheet was updated from Ver.002 to 003. www.rohm.com TSZ02201-0J3J0AJ00180-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 22/22 TSZ22111・15・001 04.Jun.2015 Rev.003

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

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