Datasheet Single-chip Type with Built-in FET Switching Regulator Series Step-up and inverted 2-channel DC/DC converter with Built-in Power MOSFET BD8316GWL ●Description ●Important Specifications The BD8316GWL is step-up and inverted 2-channel ■ Input voltage range 2.5～5.5 [V] switching regulator with integrated internal high-side ■ Output boost voltage Input voltage(max)~18 [V] MOSFET. With wide input range from 2.5~5.5V ,it ■ Output inverted voltage -9.0～-1.0 [V] suitable for application of portable item. In addition,The ■ Maximum current 1[A](max) small package design is ideal for miniaturizing the ■ Operating frequency power supply. 1.6 [MHz] (typ.) ■ Nch FET ON resistance 230[mΩ] ■ Pch FET ON resistance ●Features 230[mΩ] ■ Standby current ■ Wide input voltage range of 2.5V to 5.5 V 1[μA](max) ■ High frequency operation 1.6MHz ●Package ■ Incorporates Nch FET of 230mΩ/22V and Pch UCSP50L1 (WLCSP) Pow FET of 230mΩ/15V 1.8mm×1.5mm×0.5mm, 4×3glid,11pin, ■ Incorporates Soft Start (4.2msec(typ))and hight side switch of boost channel ●Application ■ Independent ON/OFF signal(STB). Built-in ■ LCD battery discharge SW for step up channel ■ CCD battery ■ Small package UCSP50L1( 1.8mm×1.5mm, 4× ■ Portable items that are represented by mobile phone 3 grid, 11pin, WLCSP) and DSC ■ Circuits protection OCP,SCP,UVLO,TSD ●Typical Application Input: 2.5 to 5.5 V, ch1 output: 5.6 V / 200m A, ch2 output:5.6V/200mA 0.1uF/10V 10kΩ 56kΩ Vout1: -5.6V/200mA 4.7uF/10V 4.7uH VREF NON1 LX1 Vin→ VDD 2.5～5.5V 4.7uF/10V DIS1 ENCH1→ STB1 ENCH２→ STB2 HS2L 4.7uH Vout2: 5.6V/200mA GND INV2 LX2 4.7uF/10V 180kΩ 30kΩ Fig.1 Application schematic www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 1/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Pin Description C B A 1 2 3 4 Fig.2 Pin assignment (Bottom view) Pin No. Pin Name Function A-1 VDD Power input voltage pin. Connect to input ceramic capacitor bigger than 0.47uF. A-2 HS2L Load SW output pin .Connect to inductor A-3 LX2 Boost channel drain Nch Power MOS. Connect to diode and inductor. A-4 GND Ground connection B-1 LX1 PchPowerMOS drain of boost channel. Connect to diode and inductor Enable pin of inverted channel. B-3 STB1 ON threshold set to 1.5V. Integrated pull down resistance (800kΩ(typ)) Enable pin of boost channel. B-4 STB2 ON threshold set to 1.5V. Integrated pull down resistance (800kΩ(typ)) Discharge SW of inverted channel. Connect to output of inverted channel. C-1 DIS1 STB1 disable , Output pin voltage is discharged by 100Ω(typ) Reference voltage of inverted channel. C-2 VREF 1.0V(typ) is included in error amp offset Feedback pin of inverted channel. Connect to feedback resistance and set output voltage. C-3 NON1 The method of output voltage setting is P16/20. When inverted cannel is disable , the pin is discharged by integrated resistance (150Ω(typ)) Feedback pin of boost channel. Connect to feedback resistance and set output voltage. C-4 INV2 The method of output voltage setting is P16/20. www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 2/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Block Diagram Fig.3 Block diagram www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 3/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Function blacks description 1.Voltage Reference This block generates ERROR AMP reference voltage. The reference voltage of CH1 is 1.0V, The reference voltage of CH2 is 0.8V. 2.UVLO Circuit for preventing malfunction at low voltage input. This circuit prevents malfunction at the start of DC/DC converter and low input voltage .The function monitors VCC pin voltage and if VCC voltage is lower than 2.2V, function turns off all output of FETs and DC/DC converter , and reset the timer latch of the internal SCP circuit and soft-start circuit. 3.SCP Short-circuit protection function based on timer latch system. When the voltage of NON1 pin is higher than 0V or INV2 pin voltage is lower than 0.8V, the internal SCP circuit starts counting. SCP circuit detects output of Error AMP. Since internal Error AMP has highly gain as high as 80dB or more, if input erroramp voltage cross reference voltage ,the output voltage of Error AMP goes high and detects SCP . The internal counter is in synch with OSC, the latch circuit activates after the counter counts oscillations to turn off DC/DC converter output (about 40.9 msec ). To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again. 4.OSC This function determine oscillation frequency . Oscillation frequency of DC/DC converter set at 1.6MHz. 5.ERROR AMP Error amplifier watch output voltage and output PWM control signals. The internal reference voltage for Error AMP of ch1 is set at 0V. The internal reference voltage for Error AMP of ch2 is set at 0.8V. 6.Timing Control Voltage-pulse width converter for controlling output voltage corresponding to input voltage. Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width and outputs to the driver. Max Duties of ch1 and ch2 are set at 86%. 7.SOFT START Circuit for preventing in-rush current at the start of DC/DC converter by bringing the output voltage. Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after about 4.2m sec. 8.OCP Circuit for preventing malfunction at over current. Under input current over electrical characteristics , it supply minimum duty to DC/DC converter and IC stop safety by SCP detected. 9.TSD Circuit for preventing malfunction at high Temperature . When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150℃), it turns OFF all Output FET, and turns OFF DC/DC Comparator Output. 10. ON/OFF Voltage applied on STB pin to control ON/OFF channel of each channel. Turned ON when a voltage of 1.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied. Incorporates approximately 800 kΩ pull-down resistance. www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 4/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ○Absolute maximum ratings(T=25℃) Parameter Symbol Rating Unit VDD －0.3～7 V Maximum power supply voltage STB1,STB2 －0.3～7 V IHS2L 1.0 A Maximum input current ILX1 1.0 A ILX2 1.0 A VDD-LX1 15 V LX2 22 V Maximum input voltage NON1 -0.3～7 V INV2 -0.3～7 V DIS1 -9～0.3 V Power dissipation Pd 730 mW Operating temperature range Topr －35～+85 ℃ Storage temperature range Tstg －55～+150 ℃ Junction temperature Tjmax +150 ℃ ((*1) When mounted on 74.2×74.2×1.6mm and operated over 25℃ Pd reduces by 4.96mW/℃. ○Recommended operating conditions Standard value Parameter Symbol Units MIN TYP MAX Power supply voltage VDD 2.5 － 5.5 V Inverted output voltage VO1 -9.0 － -1.0 V Step up output voltage VO2 VCC - 18 V www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 5/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ○Electrical characteristics（Ta=25℃, VDD=3.6V） Standard value Parameter Symbol Unit Conditions MIN TYP MAX 【Low voltage input malfunction preventing circuit】 Detect threshold voltage VUV - 2.2 2.35 V VDD sweep down Hysteresis voltage ΔVUVhy 50 100 150 mV 【Oscillator】 Oscillating frequency Fosc 1.44 1.6 1.76 MHz LX1 Max Duty Dmax1 82 86 90 % LX2 Max Duty Dmax2 82 86 90 % 【Error AMP, VREF】 NON1 feedback resistance CH1output voltage VO1 -6.072 -6.000 -5.928 V 20kΩ, 120kΩ VREF line regulation DVLi - 4.0 12.5 mV VDD=2.5～5.5V INV threshold voltage VINV 0.792 0.800 0.808 V NON1 input bias current INON1 -50 0 50 nA STB1=3.6V, NON1=-0.2V INV2 input bias current IINV2 -50 0 50 nA INV2=1.2V CH1 Soft start time TSS1 3.7 4.2 4.7 ms CH2 Soft start time TSS2 3.7 4.2 4.7 ms 【Internal FET】 LX1 PMOS ON resistance RON1p - 300 480 mΩ DIS1discharge resistance RDIS1 - 100 160 Ω VSTB1=0V, IDIS1=-1mA NON1 discharge resistance RNON1 - 150 240 Ω VSTB1=0V, INON1=1mA LX2HighsideSW ON resistance RON2p - 150 240 mΩ LX2 NMOS ON resistance RON2n - 300 480 mΩ LX1 OCP threshold Iocp1 1.2 2.4 - A LX2 OCP threshold Iocp2 1.2 2.4 - A HS2L leak current IleakH1 -1 0 1 uA LX1 leak current I leak1 -1 0 1 uA LX2 leak current I leak2 -1 0 1 uA 【STB】 STB pin Active VSTBH 1.5 - 5.5 V Control voltage Non-active VSTBL -0.3 - 0.3 V STB pin pull down resistance RSTB1 500 800 1400 kΩ 【Circuit current】 Standby current ISTB - - 1 uA STB1=STB2=3.6V Circuit current of operation VDD IDD - 450 650 uA NON1=-0.2V, INV2=1.2V ◎This product is not designed for normal operation within a radioactive environment. www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 6/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Reference data (unless otherwise specified Ta=25℃, VCC=3.6V) 1.030 0.850 V] 0.840 1.020 LD[ 0.830 O 1.010 SH 0.820 E EF [V] 1.000 VCC=2.5V VCC=3.6V VCC=5.5V V THR 00..880100 R N V I 0.790 VCC=2.5V 0.990 0.780 VCC=3.6V 0.980 0.770 VCC=5.5V 0.760 0.970 0.750 TEMPERATURE[℃] TEMPERATURE[℃] -50 0 50 100 150 -50 0 50 100 150 Fig.4 VREF vs temp Fig.5 INV2 threshold vs temp 1.700 2.400 VCC=5.5V VCC=3.6V 1.600 MHz] VCC=2.5V ge[V] 2.300 Detect threshold CY[ olta UEN 1.500 hold v 2.200 FREQ O thres Reset threshold 1.400 L UV 2.100 1.300 2.000 0 2 4 6 8 -50 0 50 100 150 VCC[V] TEMPERATURE[℃] Fig.6 Oscillation frequency vs temp Fig.7 UVLO detect threshold Vs temp www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 7/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL 1.4 1.4 VCC=7.0V 1.2 1.2 VCC=7.0V V] 1.0 V] 1.0 m m holdt[ 0.8 VCC=2.5V VCC=3.6V VCC=5.5V holdt[ 0.8 VCC=2.5V es es VCC=3.6V VCC=5.5V hr 0.6 hr 0.6 N t F t O F B 0.4 O 0.4 T B S T S 0.2 0.2 0.0 0.0 -50 0 50 100 150 -50 0 50 100 150 TEMPERATURE[℃] TEMPERATURE[℃] Fig.8 STB ON threshold voltage Fig.9 STB OFF threshold voltage vs temp vs temp 500 500 450 450 400 400 Ω] 350 Ω] 350 m m CE[ 300 CE[ 300 N N TA 250 TA 250 Ta=150deg S S Ta=25deg SI 200 Ta=150deg SI 200 E E R Ta=25deg R Ta=-60deg N 150 N 150 O Ta=-60deg O 100 100 50 50 0 0 0 2 4 6 8 0 2 4 6 8 VCC[V] VCC[V] Fig.10 LX1 high side FET ON Fig.11 LX2 high side FET ON registance vs VCC registance vs VCC www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 8/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL 500 300 450 250 400 Ω] 350 Ω] m E[ 200 E[ C C 300 N AN 250 Ta=150deg TA 150 N RESIST 125000 TTaa==-2650ddeegg N RESIS 100 O O Ta=150deg 100 Ta=25deg 50 50 Ta=-60deg 0 0 0 2 4 6 8 0 2 4 6 8 VCC[V] VCC[V] Fig.13 DIS1 discharge SW ON Fig.12 HS2L high side FET ON registance vs VCC registance vs VCC 1,000 300 900 250 800 NCE[Ω] 200 RENT[uA] 670000 Ta=25deg A R 500 ESIST 150 C CU 400 R C N 100 V 300 O Ta=150deg Ta=25deg 200 50 Ta=-60deg 100 0 0 0 1 2 3 4 5 0 2 4 6 8 VCC[V] VCC[V] Fig.14 NON1 discharge SW ON Fig.15 VCC input current vs VCC registance vs VCC (STB ON) www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 9/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL 20 15 A] u T[ N E RR 10 U C C C VCC=5.5V PV 5 VVCCCC==23..56VV 0 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPURTURE[℃] Fig.16 VCC input current vs Temp (STB OFF) www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 10/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Example of Application1 Input: 2.5 to 5.5 V, ch1 output: 5.6 V / 200m A, ch2 output:5.6V/200mA 4.7μF/10V (GRM21BB31A475K) 0.1μF/10V (GRM155B11A104K) 56kΩ 180kΩ 10kΩ 30kΩ 30V/1A (RSX101VA-30) 4.7μH (NR3015T4R7M) 4.7μH (NR3015T4R7M) 30V/1A 1μF/10V (RSX101VA-30) (GRM188B11A105K) 4.7μF/10V (GRM21BB31A475K) Fig.17 Example of Application1 ●Example of Application2 Input: :2.5~5.5 V ch1 output: -9V / 30mA ch2output : 18V/ 30mA 4.7μF/25V 180kΩ 430kΩ 20kΩ 20kΩ 0.1μF/10V 30V/1A 4.7μH 1μF/10V 4.7μH 30V/1A 4.7μF/16V Fig.18 Example of Application2 www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 11/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Example of Board Layout ROHM SMD Evaluation Board Fig.19 Assembly Layer Fig.20 Bottom Layer www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 12/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Typical Performance Characteristic (Unless otherwise specified, Ta = 25°C, VCC = 3.6V) (Example of application 1) 100 100 Vin=3.6V 90 90 80 80 H1Total Efficiency[%] 3456700000 Vin=4.5V Vin=3.6V Vin=2.5V 2 Total Efficiency[%]3456700000 Vin=4.5V Vin=2.5V C 20 CH20 10 10 0 0 1 10 100 1000 1 10 100 1000 Output Current [mA] Output Current[mA] Fig.21 CH1 Power conversion Fig.22 CH2 Power conversion efficiency vs output current efficiency vs output current ‐5.400  5.800  ‐5.450  5.750  Vin=2.5V age [V] ‐‐55..555000   age [V] 55..675000   Vin=2.5V olt ‐5.600  olt 5.600  V V put  ‐5.650  Vin=4.5V Vin=3.6V put  5.550  Vin=4.5V Vin=3.6V ut ut O ‐5.700  O 5.500  ‐5.750  5.450  ‐5.800  5.400  0 50 100 150 200 0 50 100 150 200 Output Current [A] Output Current [A] Fig.23 CH1 Output voltage Fig.24 CH2 Output voltage vs Output Current vs Output Current www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 13/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ‐5.4 5.8 ‐5.45 5.75 ‐5.5 V] 5.7 e [ ‐5.55 [V] ag e  5.65 olt ‐5.6 tag V ol 5.6 t  V Outpu ‐5‐.56.57 Io=10mA utput  5.55 Io=10mA O 5.5 ‐5.75 5.45 ‐5.8 5.4 2.5 3.5 4.5 5.5 2.5 3.5 4.5 5.5 Input Voltage[V] Input Voltage[V] Fig.25 CH1 Output voltage vs Input voltage Fig.26 CH2 Output voltage vs Input voltage 5msec/div 5msec/div Vo1=100mV/div Vo2=100mV/div Io=100mA/div Io=100mA/div Fig.27 CH1 Output current response Fig.28 CH2 Output current response (output current : 10mA ⇔ 100mA) (output current : 10mA ⇔ 100mA) www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 14/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL 1msec/div 1msec/div STB1=2V/div STB=2V/div Vo2=2V/div Vo1=2V/div Fig.29 CH1 Soft start waveform Fig.30 CH2 Soft start waveform 500usec/div STB1=2V/div Vo1=2V/div Fig.31 CH1 Discharge waveform [500usec/div] (STB1:High → Low) www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 15/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Selection of Parts for Applications (1)Output inductor A shielded inductor that satisfies the current rating (current value, Ipeak as shown in the drawing below) and has a low DCR (direct current resistance component) is recommended. Inductor values affect output ripple current greatly. Ripple current can be reduced as the inductor L value becomes larger and the switching frequency becomes higher as the equations shown below. ΔIL I =Vin −Vout +Vf ×I + 1× Vin ×(−Vout +Vf ) 　 peak V out 2 L× f ×(V −V +V ) (Inverted channel) in in out f Fig. 32 Ripple current I ×V 1 V ×(V −V ) I = out out + × in out in 　 peak V ×η 2 L× f ×V (Boost channel) in out η: Efficiency(<0.92), f: Switching frequency(1.6MHz), L: inductance, The second terms of equations above are ripple current of the inductor(⊿IL of Fig.32) which should be set at about 20 to 50% of the maximum output current. ＊Current over the inductor rating flowing in the inductor brings the inductor into magnetic saturation, which may lead to lower efficiency or output bad oscillation. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the inductor. (2) Output capacitor CH1 The reference voltage of CH1 is 1.0V and the internal reference voltage of the ERROR AMP is 0 V. Output voltage should be obtained by referring to Equation (3) of Fig.33. VREF 1.0 V R1B ERROR AMP R1A NON1 Vout =− R1B 　・・・　　(3) R1A VOUT Fig.33 CH1output setting CH2 The internal reference voltage of the ERROR AMP is 0.8 V. Output voltage should be obtained by referring to Equation (4) of Fig.34. VOUT R2A INV2 (R2A+R2B) R2B Vout = R2B ×0.8　・・・　　(4) Inside reference voltage 0.8V Fig.34 CH2 output setting www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 16/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL (3) Output capacitor A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple. There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias property into consideration. Output ripple voltage when ceramic capacitor is used is obtained by the following equation. 1 Vpp=⊿IL× ＋ ⊿IL×RESR [V] 2π×f×Co Co is set within the range of 1～20uF. Setting must be performed so that output ripple is within the allowable ripple voltage. www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 17/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●I/O Equivalence Circuit VREF NON1,INV2 VCC VCC VCC VCC VREF NON1,INV2 STB1,STB2 VCC,LX1,DIS1,GND VCC VCC LX1 STB1,STB2 GND DIS1 HS2L LX2 VCC VCC LX2 HS2L Fig.35 I/O Equivalence Circuit www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 18/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ○Operation Notes １.) Absolute maximum ratings This product is produced with strict quality control. However, the IC may be destroyed if operated beyond its absolute maximum ratings. If the device is destroyed by exceeding the recommended maximum ratings, the failure mode will be difficult to determine. (E.g. short mode, open mode) Therefore, physical protection counter-measures (like fuse) should be implemented when operating conditions beyond the absolute maximum ratings anticipated. ２.) GND potential Make sure GND is connected at lowest potential. ３.) Setting of heat Make sure that power dissipation does not exceed maximum ratings. ４.) Pin short and mistake fitting Avoid placing the IC near hot part of the PCB. This may cause damage to IC. Also make sure that the output-to-output and output to GND condition will not happen because this may damage the IC. ５.) Actions in strong magnetic field Exposing the IC within a strong magnetic field area may cause malfunction. ６.) Mutual impedance Use short and wide wiring tracks for the main supply and ground to keep the mutual impedance as small as possible. Use inductor and capacitor network to keep the ripple voltage minimum. ７.) Thermal shutdown circuit (TSD circuit) The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. ８.)Rush current at the time of power supply injection. An IC which has plural power supplies, or CMOS IC could have momentaly rush current at the time of power supply injection. Because there exists inside logic uncertainty state. Please take care about power supply coupling capacity and width of power Supply and GND pattern wiring. ９.)IC Terminal Input This IC is a monolithic IC that has a P- board and P+ isolation for the purpose of keeping distance between elements. A P-N junction is formed between the P-layer and the N-layer of each element, and various types of parasitic elements are then formed. For example, an application where a resistor and a transistor are connected to a terminal (shown in Fig.36): ○When GND > (terminal A) at the resistor and GND > (terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○When GND > (terminal B) at the transistor (NPN), a parasitic NPN transistor operates as a result of the NHayers of other elements in the proximity of the aforementioned parasitic diode. Parasitic elements are structurally inevitable in the IC due to electric potential relationships. The operation of parasitic elements Induces the interference of circuit operations, causing malfunctions and possibly the destruction of the IC. Please be careful not to use the IC in a way that would cause parasitic elements to operate. For example, by applying a voltage that is lower than the GND (P-board) to the input terminal. Transistor (NPN) Resistor B ～～ （Terminal A） （Terminal B） C E GND （Terminal A） N ～～ P＋ P P＋ P＋ P P＋ Parasitic element N N N N Ｎ N P-board Parasitic P-board GND element Parasitic GND element Fig.36 Simplified structure of a Bipolar IC www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 19/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett BD8316GWL ●Ordering part number B D 8 3 1 6 G W L - E2 Part No. Part No. Package Packaging and forming specification GWL: USCP50L1 E2: Embossed tape and reel ●External information 1PIN MARK Lot No. 8316 05 0. ± 5 1. 1.8±0.05 UCSP50L1 (B(BDD828130136GGWWLL)) <Tape and Reel information> 1PIN MARK Tape Embossed carrier tape 1.8±0.05 ±1.50.05±0.10.05 0.55MAX S QDofiu rfeaecnettdiiotyn 3E(02Tre0he0elp odcnisr ethcteio lne fits h tahned 1 apnind oyfo pur opduull cot uist tahte t htaep uep opne rt hleef tr iwghhte hna ynodu hold ) 11-φ00.2.0±50.0A5B 0.08AS ±0.350.05 (φ0.15)INDEX POST C B B A 0.3±0.05 1P=20.43×34 ×P=0.42 (Unit : mm) Reel 1p∗in Order quantity needs to be muDltiiprelec otifo tnh eo mf fineiemdum quantity. www.rohm.com TSZ02201-0Q1Q0AJ00170-1-2 © 2011 ROHM Co., Ltd. All rights reserved. 20/20 TSZ22111・14・001 2012.08.03 Rev. 003

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved.

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