Datasheet Operational Amplifiers Input/Output Full Swing High Voltage Operation CMOS Opera tional Amplifiers BD7561G BD7561SG BD7562xxx BD7562Sxxx General Descriptions Key Specifications BD7561G/BD7562xxx are CMOS operational amplifiers of  Operating Supply Voltage Range: the high voltage operation input/output full swing. Also, Single supply +5V to +14.5V BD7561SG/BD7562Sxxx which expanded the operating Split supply ±2.5V to ±7.25V temperature range performs a lineup.  Operating Temperature Range: An operating voltage range is wide with +5V to +14.5V BD7561G/ BD7562xxx -40°C to +85°C BD7561SG/ BD7562Sxxx -40°C to +105°C and is the operational amplifier which is good at a high  Sew Rate: 0.9V/μs(Typ) slew rate, a low input bias current is most suitable for a  Input Offset Current: 1pA (Typ) sensor amplifier and an industrial equipment.  Input Bias Current: 1pA (Typ) Features  Wide Operating Supply Voltage Package W(Typ) x D(Typ) x H(Max)  Input and Output Full Swing SSOP5 2.90mm x 2.80mm x 1.15mm  Low Supply Current SOP8 5.00mm x 6.20mm x 1.61mm  High Large Signal Voltage Gain MSOP8 2.90mm x 4.00mm x 0.83mm  Wide Temperature Range Applications  Sensor Amplifier  Industrial Equipment  Consumer Equipment Simplified Schematic VDD Vbias IN+ Class OUT AB control IN- V bias VSS Figure 1. Simplified Schematic ○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/30 20.Feb.2015 Rev.002 TSZ22111･14･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Pin Configuration BD7561G, BD7561SG: SSOP5 Pin No. Pin Name IN+ 1 5 VDD 1 IN+ + VSS 2 2 VSS - 3 IN- IN- 3 4 OUT 4 OUT 5 VDD BD7562F, BD7562SF: SOP8 BD7562FVM, BD7562SFVM: MSOP8 Pin No. Pin Name OUT1 1 8 VDD 1 OUT1 2 IN1- IN1- 2 C H1 7 OUT2 3 IN1+ - ++ 4 VSS IN1+ 3 C H2 6 IN2- + - 5 IN2+ 6 IN2- VSS 4 5 IN2+ 7 OUT2 8 VDD Package SSOP5 SOP8 MSOP8 BD7561G BD7562F BD7562FVM BD7561SG BD7562SF BD7562SFVM Ordering Information B D 7 5 6 x x x x x - x x Part Number Package Packaging and forming specification BD7561G G : SSOP5 E2: Embossed tape and reel BD7561SG F : SOP8 (SOP8) BD7562xxx FVM : MSOP8 TR: Embossed tape and reel BD7562Sxxx (SSOP5/MSOP8) Line-up Orderable Topr Channels Supply Current Package Part Number 1ch 370µA SSOP5 Reel of 3000 BD7561G-TR -40°C to +85°C SOP8 Reel of 2500 BD7562F-E2 2ch 750µA MSOP8 Reel of 3000 BD7562FVM-TR 1ch 370µA SSOP5 Reel of 3000 BD7561SG-TR -40°C to +105°C SOP8 Reel of 2500 BD7562SF-E2 2ch 750µA MSOP8 Reel of 3000 BD7562SFVM-TR www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 2/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Absolute Maximum Ratings (T =25°C) A Rating Parameter Symbol Unit BD7561G BD7562xxx BD7561SG BD7562Sxxx Supply Voltage VDD-VSS +15.5 V SSOP5 0.54 (Note 1,4) - 0.54 (Note 1,4) - Power Dissipation P SOP8 - 0.55 (Note 2,4) - 0.55 (Note 2,4) W D MSOP8 - 0.47 (Note 3,4) - 0.47 (Note 3,4) Differential Input V VDD - VSS V Voltage (Note 5) ID Input Common-mode V (VSS - 0.3) to (VDD + 0.3) V Voltage Range ICM Input Current (Note 6) I ±10 mA I Operating Supply Single +5 to +14.5 V V Voltage opr Split ±2.5 to ±7.25 V Operating Temperature T -40 to +85 -40 to +105 °C opr Storage Temperature T -55 to +125 °C stg Maximum Junction T +125 °C Temperature Jmax (Note 1) To use at temperature above TA=25C reduce 5.4mW/°C. (Note 2) To use at temperature above TA=25C reduce 5.5mW/°C. (Note 3) To use at temperature above TA=25C reduce 4.7mW/°C. (Note 4) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%). (Note 5) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 6) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 3/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Electrical Characteristics ○BD7561G, BD7561SG (Unless otherwise specified VDD=+12V, VSS=0V, T =25°C) A Temperature Limit Parameter Symbol Unit Conditions Range Min Typ Max 25°C - 1 9 Input Offset Voltage (Note 7,8) V mV VDD=5 to 14.5V IO Full range - - 10 Input Offset Current (Note 7) I 25°C - 1 - pA - IO Input Bias Current (Note 7) I 25°C - 1 - pA - B 25°C - 370 550 R =∞, A =0dB, VDD=5V, L V IN+=2.5V Full range - - 600 Supply Current (Note 8) I μA DD 25°C - 440 650 R =∞, A =0dB, VDD=12V, L V IN+=6.0V Full range - - 700 Maximum Output Voltage (High) V 25°C VDD-0.1 - - V R =10kΩ OH L Maximum Output Voltage (Low) V 25°C - - VSS+0.1 V R =10kΩ OL L Large Single Voltage Gain A 25°C 70 95 - dB R =10kΩ V L Input Common-mode Voltage V 25°C 0 - 12 V VSS to VDD Range ICM Common-mode Rejection Ratio CMRR 25°C 45 60 - dB - Power Supply Rejection Ratio PSRR 25°C 60 80 - dB - Output Source Current (Note 9) I 25°C 3 8 - mA OUT=VDD-0.4V SOURCE Output Sink Current (Note 9) I 25°C 4 14 - mA OUT=VSS+0.4V SINK Slew Rate SR 25°C - 0.9 - V/μs C =25pF L Gain Bandwidth GBW 25°C - 1.0 - MHz C =25pF, A =40dB L V Phase Margin θ 25°C - 50 - deg C =25pF, A =40dB L V Total Harmonic Distortion + Noise THD+N 25°C - 0.05 - % OUT=1VP-P,f=1kHz (Note 7) Absolute value. (Note 8) Full range:BD7561G:TA=-40°C to +85°C BD7561S:TA=-40°C to +105°C. (Note 9) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 4/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Electrical Characteristics – continued ○BD7562xxx, BD7562Sxxx (Unless otherwise specified VDD=+12V, VSS=0V, T =25°C) A Temperature Limit Parameter Symbol Unit Conditions Range Min Typ Max 25°C - 1 9 Input Offset Voltage (Note 10,11) V mV VDD=5 to 14.5V IO Full range - - 10 Input Offset Current (Note 10) I 25°C - 1 - pA - IO Input Bias Current (Note 10) I 25°C - 1 - pA - B 25°C - 750 1300 R =∞, All Op-Amps L A =0dB, VDD=5V, IN+=2.5V Full range - - 1500 V Supply Current (Note 11) I μA DD 25°C - 900 1400 R =∞, All Op-Amps L A =0dB, VDD=12V, IN+=6.0V Full range - - 1600 V Maximum Output Voltage (High) V 25°C VDD-0.1 - - V R =10kΩ OH L Maximum Output Voltage (Low) V 25°C - - VSS+0.1 V R =10kΩ OL L Large Single Voltage Gain A 25°C 70 95 - dB R =10kΩ V L Input Common-mode Voltage V 25°C 0 - 12 V VSS to VDD Range ICM Common-mode Rejection Ratio CMRR 25°C 45 60 - dB - Power Supply Rejection Ratio PSRR 25°C 60 80 - dB - Output Source Current (Note 12) I 25°C 3 8 - mA OUT=VDD-0.4V SOURCE Output Sink Current (Note 12) I 25°C 4 14 - mA OUT=VSS+0.4V SINK Slew Rate SR 25°C - 0.9 - V/μs C =25pF L Gain Bandwidth GBW 25°C - 1.0 - MHz C =25pF, A =40dB L V Phase Margin θ 25°C - 50 - deg C =25pF, A =40dB L V Total Harmonic Distortion + Noise THD+N 25°C - 0.05 - % OUT=1VP-P,f=1kHz Channel Separation CS 25°C - 100 - dB AV=40dB, OUT=1Vrms (Note 10) Absolute value. (Note 11) Full range：BD7562xxx：TA=-40°C to +85°C BD7562Sxxx：TA=-40°C to +105°C. (Note 12) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 5/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (V ) ID Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (V ) ICM Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (P ) D Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (V ) IO Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (I ) IO Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (I ) B Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (I ) DD Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (V /V ) OH OL Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (A ) V Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. A = (Output voltage) / (Differential Input voltage) V (7) Input Common-mode Voltage Range (V ) ICM Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of power supply voltage)/(Input offset fluctuation) (10) Output Source Current/ Output Sink Current (I / I ) SOURCE SINK The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (11) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. (13) Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 6/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx (14) Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (15) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 7/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves ○BD7561G, BD7561SG 0.8 0.8 0.6 0.6 W] W] n [ n [ atio BD7561G atio BD7561SG p p ssi 0.4 ssi 0.4 Di Di er er w w o o P P 0.2 0.2 0.0 0.0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] Figure 2. Figure 3. Power Dissipation vs Ambient Temperature Power Dissipation vs Ambient Temperature (Derating Curve) (Derating Curve) 800 800 6 00 600 A] -40°C A] 14.5V μ μ nt [ 25°C nt [ e e urr4 00 urr400 C C y y pl pl Sup 85°C Sup 12 V 5V 105°C 2 00 200 0 0 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 4. Figure 5. Supply Current vs Supply Voltage Supply Current vs Ambient Temperature (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7561G: -40°C to +85°C BD7561SG: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 8/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7561G, BD7561SG 16 16 V] V] gh) [ gh) [ 14.5V Hi Hi e (12 e (12 g 105°C g a a 12V olt 85°C 10 olt V V ut 25°C ut p p Out -40°C Out m 8 m 8 u u m m xi xi Ma Ma 5V 4 4 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 6. Figure 7. Maximum Output Voltage (High) vs Supply Voltage Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) (RL=10kΩ) 40 40 mV] mV] w) [ 30 w) [ 30 o o ge (L 85°C 1 05°C ge (L Volta 20 Volta 20 14.5V ut ut 12V Outp Outp m m mu 10 25°C mu 10 axi -40°C axi 5V M M 0 0 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 8. Figure 9. Maximum Output Voltage (Low) vs Supply Voltage Maximum Output Voltage (Low) vs Ambient Temperature (R =10kΩ) (R =10kΩ) L L (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7561G: -40°C to +85°C BD7561SG: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 9/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7561G, BD7561SG 80 15 12 A] 60 A] m m urrent [ -40°C urrent [ 9 14.5V C C ce 40 ce ur 25°C ur o o 6 12V S S ut 85°C ut p p Out 20 105°C Out 3 5V 0 0 8 9 10 11 12 13 -50 -25 0 25 50 75 100 125 Output Voltage [V] Ambient Temperature [°C] Figure 10. Figure 11. Output Source Current vs Output Voltage Output Source Current vs Ambient Temperature (VDD=12V) (OUT=VDD-0.4V) 100 40 80 30 A] -40°C A] m m nt [ 60 nt [ e e Curr 25°C Curr 20 k k n n Si 40 Si 14.5V ut ut Outp 85°C Outp 10 12V 20 105°C 5V 0 0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 Output Voltage [V] Ambient Temperature [°C] Figure 12. Figure 13. Output Sink Current vs Output Voltage Output Sink Current vs Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7561G: -40°C to +85°C BD7561SG: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 10/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7561G, BD7561SG 1 0.0 10.0 7.5 7.5 V] 5.0 V] 5.0 m m e [ 2.5 -40°C 25°C e [ 2.5 14.5V g g a a olt olt V0.0 V 0.0 et 105°C 85°C et 12V 5V s s Off -2.5 Off -2.5 ut ut p p In -5.0 In -5.0 -7.5 -7.5 -1 0.0 -10.0 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 14. Figure 15. Input Offset Voltage vs Supply Voltage Input Offset Voltage vs Ambient Temperature (VICM=VDD/2, EK=-VDD/2) (VICM=VDD/2, EK=-VDD/2) 10.0 160 7.5 B] 140 mV] 5.0 n [d Voltage [ 02..05 - 40°C 2 5°C oltage Gai 120 105°C 85°C Offset -2.5 85°C 1 05°C gnal V 100 25°C put e Si In -5.0 rg -40°C a L 80 -7.5 -10.0 60 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 4 8 12 16 Input Voltage [V] Supply Voltage [V] Figure16. Figure 17. Input Offset Voltage vs Input Voltage Large Signal Voltage Gain vs Supply Voltage (VDD=12V) (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7561G: -40°C to +85°C BD7561SG: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 11/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7561G, BD7561SG 160 120 B] 100 n [dB] 140 14.5V atio [d 25°C -40°C ai R 80 G n oltage 120 12V ejectio 60 85°C 105°C V 5V R gnal 100 Mode ge Si mon 40 r a m L 80 Co 20 60 0 -50 -25 0 25 50 75 100 125 4 8 12 16 Ambient Temperature [°C] Supply Voltage [V] Figure 18. Figure 19. Large Signal Voltage Gain vs Ambient Temperature Common Mode Rejection Ratio vs Supply Voltage (VDD=12V) 120 120 dB] 100 B] 100 on Ratio [ 80 5V n Ratio [d 80 ecti 12V 14.5V ctio Rej 60 Reje 60 ode ply M p 40 u 40 n S mo er m ow o 20 P 20 C 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] Figure 20. Figure 21. Common Mode Rejection Ratio vs Ambient Temperature Power Supply Rejection Ratio vs Ambient Temperature (VDD=12V) (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7561G: -40°C to +85°C BD7561SG: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 12/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7561G, BD7561SG 4.0 2.0 3.0 1.5 s] s] µ µ V/ V/ H [ L [ e L- 2.0 e H- 1.0 12V 14.5V Rat 14.5V Rat w 12V w Sle Sle 5V 1.0 0.5 5V 0.0 0.0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] Figure 22. Figure 23. Slew Rate L-H vs Ambient Temperature Slew Rate H-L vs Ambient Temperature 100 200 Phase 80 160 B] d ain [ 60 120deg] ge G Gain ase [ olta 40 80 Ph V 20 40 0 0 10 102 103 104 105 106 107 Frequency [Hz] Figure 24. Voltage Gain・Phase vs Frequency (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7561G: -40°C to +85°C BD7561SG: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 13/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7562xxx, BD7562Sxxx 0.8 0.8 0.6 0.6 W] W] n [ BD7562F n [ BD7562SF atio atio p p ssi 0.4 ssi 0.4 Di BD7562FVM Di BD7562SFVM er er w w o o P P 0.2 0.2 0.0 0.0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] Figure 25. Figure 26. Power Dissipation vs Ambient Temperature Power Dissipation vs Ambient Temperature (Derating Curve) (Derating Curve) 1200 1200 1000 1000 14.5V -40°C A] 800 A] 800 nt [μ 25°C nt [μ e e urr 600 urr 600 C 85°C C 12 V y y 5V pl 105°C pl p p u 400 u 400 S S 200 200 0 0 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 27. Figure 28. Supply Current vs Supply Voltage Supply Current vs Ambient Temperature (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7562xxx: -40°C to +85°C BD7562Sxxx: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 14/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7562xxx, BD7562Sxxx 16 16 V] V] gh) [ gh) [ 14.5V Hi Hi e (12 e (12 g 105°C g a a 12V olt 85°C 10 olt V V ut 25°C ut p p Out -40°C Out m 8 m 8 u u m m xi xi Ma Ma 5V 4 4 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 29. Figure 30. Maximum Output Voltage (High) vs Supply Voltage Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) (RL=10kΩ) 40 40 V] V] m m w) [ 30 w) [ 30 o o L L ge ( 85°C 1 05°C ge ( a a Volt 20 Volt 20 14.5V ut ut 12V p p ut ut O O m m mu 10 mu 10 xi 25°C xi 5V Ma -40°C Ma 0 0 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 31. Figure 32. Maximum Output Voltage (Low) vs Supply Voltage Maximum Output Voltage (Low) vs Ambient Temperature (R =10kΩ) (R =10kΩ) L L (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7562xxx: -40°C to +85°C BD7562Sxxx: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 15/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7562xxx, BD7562Sxxx 80 15 12 A] 60 A] m m urce Current [ 40 -40°C2 5°C urce Current [ 9 12V 14.5V o o 6 S S ut 85°C ut p p Out 20 105°C Out 3 5V 0 0 8 9 10 11 12 13 -50 -25 0 25 50 75 100 125 Output Voltage [V] Ambient Temperature [°C] Figure 33. Figure 34. Output Source Current vs Output Voltage Output Source Current vs Ambient Temperature (VDD=12V) (OUT=VDD-0.4V) 100 40 80 -40°C 30 A] A] m m nt [ 60 nt [ e e Curr Curr 20 k k Sin 40 25°C Sin 14.5V ut ut Outp 85°C Outp 10 12V 20 105°C 5V 0 0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 Output Voltage [V] Ambient Temperature [°C] Figure 35. Figure 36. Output Sink Current vs Output Voltage Output Sink Current vs Ambient Temperature (VDD=3V) (OUT=VSS+0.4V) (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7562xxx: -40°C to +85°C BD7562Sxxx: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 16/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7562xxx, BD7562Sxxx 10.0 10.0 7.5 7.5 V] 5.0 V] 5.0 m m e [ 2.5 25°C e [ 2.5 ag -40°C ag 14.5V olt olt V0.0 V 0.0 et 105°C 85°C et 12V 5V s s Off -2.5 Off -2.5 ut ut p p In -5.0 In -5.0 -7.5 -7.5 -10.0 -10.0 4 8 12 16 -50 -25 0 25 50 75 100 125 Supply Voltage [V] Ambient Temperature [°C] Figure 37. Figure 38. Input Offset Voltage vs Supply Voltage Input Offset Voltage vs Ambient Temperature (VICM=VDD/2, EK=-VDD/2) (VICM=VDD/2, EK=-VDD/2) 10.0 160 7.5 B] 140 mV] 5.0 n [d oltage [ 2.5 - 40°C 2 5°C age Gai 120 105°C Offset V -20..50 85°C 1 05°C nal Volt 100 25°C 85°C g Input -5.0 rge Si -40°C La 80 -7.5 -10.0 60 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 4 8 12 16 Supply Voltage [V] Input Voltage [V] Figure 39. Figure 40. Input Offset Voltage vs Input Voltage Large Signal Voltage Gain vs Supply Voltage (VDD=12V) (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7562xxx: -40°C to +85°C BD7562Sxxx: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 17/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7562xxx, BD7562Sxxx 1 60 120 B] 100 n [dB] 1 40 14.5V atio [d 25°C -40°C ai R 80 G n age 1 20 12V ectio 85°C 105°C Volt 5V Rej 60 nal 1 00 ode g M e Si on 40 g m ar m L 80 o 20 C 60 0 -50 -25 0 25 50 75 100 125 4 8 12 16 Ambient Temperature [°C] Supply Voltage [V] Figure 41. Figure 42. Large Signal Voltage Gain vs Ambient Temperature Common Mode Rejection Ratio vs Supply Voltage (VDD=12V) 120 200 Ratio [dB] 10800 5V Ratio [dB] 160 ejection 60 12V 14.5V ejection 120 R R ode ply 80 M p 40 u n S mo er m ow 40 o 20 P C 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] Figure 43. Figure 44. Common Mode Rejection Ratio vs Ambient Temperature Power Supply Rejection Ratio vs Ambient Temperature (VDD=12V) (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7562xxx: -40°C to +85°C BD7562Sxxx: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 18/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Typical Performance Curves - continued ○BD7562xxx, BD7562Sxxx 4.0 2.0 3.0 1.5 s] s] µ µ 14.5V V/ V/ H [ L [ e L- 2.0 14.5V e H- 1.0 Rat 12V Rat 12V 5V w w Sle Sle 1.0 0.5 5V 0.0 0.0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] Figure 45. Figure 46. Slew Rate L-H vs Ambient Temperature Slew Rate H-L vs Ambient Temperature 100 200 Phase 80 160 B] d n [ 60 120eg] ai d e G se [ g Gain a olta 40 80 Ph V 20 40 0 0 10 102 103 104 105 106 107 Frequency [Hz] Figure 47. Voltage Gain・Phase vs Frequency (*) The above characteristics are measurements of typical sample, they are not guaranteed. BD7562xxx: -40°C to +85°C BD7562Sxxx: -40°C to +105°C www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 19/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Application Information NULL method condition for Test Circuit 1 VCC, VEE, EK, VICM Unit: V Parameter V SW1 SW2 SW3 VDD VSS E V Calculation F K ICM Input Offset Voltage V ON ON OFF 12 0 -6 12 1 F1 V -0.5 F2 Large Signal Voltage Gain ON ON ON 12 0 6 2 V -11.5 F3 V 0 Common-Mode Rejection Ratio F4 ON ON OFF 12 0 -6 3 (Input Common-Mode Voltage Range) V 12 F5 V 5 F6 Power Supply Rejection Ratio ON ON OFF 0 -2.5 0 4 V 14.5 F7 - Calculation - |V | 1. Input Offset Voltage (VIO) VIO = 1 + RF1/R [V] F S E × (1+R/R ) 2. Large Signal Voltage Gain (A ) Av = 20Log K F S [dB] V |V - V | F3 F2 V × (1+R/R ) 3. Common-mode Rejection Ration (CMRR) CMRR = 20Log ICM F S [dB] |V - V | F5 F4 VCC × (1+ R/R ) 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log F S [dB] |V - V | F7 F6 0.1μF R =50kΩ F SW1 500kΩ 0.01μF VDD 15V RS=50Ω RI=1MΩ Vo EK 500kΩ 0.015μF 0.015μF DUT SW3 NULL RS=50Ω RI=1MΩ 1000pF VICM RL V VF 50kΩ SW2 V VSS RL -15V Figure 48. Test Circuit 1 (one channel only) www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 20/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage (R =10kΩ) OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF L Output Current OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF Slew Rate OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON Gain Bandwidth ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON SW3 SW4 R2=100kΩ ● VDD － SW1 SW2 ＋ SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 R1=1kΩ VSS RL CL IN- IN+ OUT Figure 49. Test Circuit 2 (each channel) Input Wave Output Wave VH VH 90% SR=ΔV/Δt ΔV 10% VL VL Δt t t Input Wave Output Wave Figure 50. Slew Rate Input and Output Wave R2=100kΩ R2=100kΩ VDD VDD R1=1kΩ R1=1kΩ OUT1 OUT2 R1//R2 R1//R2 VIN VSS VSS Figure 51. Test Circuit 3 (Channel Separation) www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 21/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at T =25°C (normal temperature). As the IC A consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θ °C/W, indicates this heat dissipation JA capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 52(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θ ), given the ambient temperature (T ), maximum junction temperature (T ), and power dissipation JA A Jmax (P ). D θ = (T －T ) / P °C/W JA Jmax A D The Derating curve in Figure 52(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θ ), which depends on the chip size, power consumption, package, ambient temperature, package condition, JA wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 52(c) to (f) shows an example of the derating curve for BD7561G, BD7561SG, BD7562xxx, and BD7562Sxxx. Power Dissipation of LSI [W] PDmax θ =(T -T )/ P °C/W JA Jmax A D P2 Ambient Temperature T A [ °C ] of IC θJA2 < θJA1 n patio P1 θJA2 wer Dissi θJA1 TJmax o P Chip Surface Temperature TJ [ °C ] 0 A2m5 bient T5e0m perat7u5r e TA[C10] 0 125 (a) Thermal Resistance (b) Derating curve 0.8 0.8 W] 0.6 W]0.6 on [ BD7561G (Note 13) on [ BD7561SG (Note 13) Dissipati 0.4 Dissipati0.4 wer wer Po 0.2 Po0.2 0.0 0.0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] (c) BD7561G (d) BD7561SG Figure 52. Thermal Resistance and Derating Curve www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 22/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Power Dissipation - continued 0.8 0.8 W] 0.6 BD7562F (Note 14) W]0.6 BD7562SF (Note 14) n [ BD7562FVM (Note 15) n [ BD7562SFVM (Note 15) o o Dissipati 0.4 Dissipati0.4 wer wer Po 0.2 Po0.2 0.0 0.0 85 105 0 25 50 75 100 125 0 25 50 75 100 125 Ambient Temperature [°C] Ambient Temperature [°C] (e) BD7562xxx (f) BD7561Sxxx Figure 52. Thermal Resistance and Derating Curve (Note 13) (Note 14) (Note 15) Unit 5.4 5.5 4.7 mW/°C When using the unit above TA=25℃, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 23/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the P stated in this specification is when D the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the P rating. D 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 24/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Operational Notes – continued 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. VDD 13. Unused Circuits When there are unused op-amps, it is recommended that they are Keep this potential + connected as in Figure 53, setting the non-inverting input terminal to a in VICM potential within the in-phase input voltage range (VICM). V - ICM 14. Input Voltage Applying VDD +0.3V to the input terminal is possible without causing VSS deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the Figure 53. Example of application circuit input voltage is within the common mode input voltage range of the for unused op-amp electric characteristics. 15. Power Supply(single/dual) The operational amplifiers operate when the voltage supplied is between VDD and VSS. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 16. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1µF between output pin and VSS pin. 17. Oscillation by Output Capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 18. Latch Up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 25/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Physical Dimension, Tape and Reel Information Package Name SSOP5 www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 26/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Physical Dimension Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 27/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Physical Dimension Tape and Reel Information – continued Package Name MSOP8 www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 28/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Marking Diagram SSOP5(TOP VIEW) Part Number Marking LOT Number SOP8(TOP VIEW) MSOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Product Name Package Type Marking BD7561 AS G SSOP5 BD7561S A8 F SOP8 BD7562 7562 FVM MSOP8 F SOP8 BD7562S 7562S FVM MSOP8 www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 29/30 20.Feb.2015 Rev.002 TSZ22111･15･001

Datasheet BD7561G BD7561SG BD7562xxx BD7562Sxxx Land Pattern Data All dimensions in mm Land pitch Land space Land length Land width Package e MIE ≧ℓ 2 b2 SSOP5 0.95 2.4 1.0 0.6 SOP8 1.27 4.60 1.10 0.76 MSOP8 0.65 2.62 0.99 0.35 SSOP5 SOP8, MSOP8 e e MIE E MI e 2 ℓ ? b2 2 b ℓ 2 Revision History Date Revision Changes 20.Sep.2013 001 New Release 20.Feb.2015 002 Correction of Figure Number (Page.22 Power Dissipation) www.rohm.com TSZ02201-0RAR1G200250-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30/30 20.Feb.2015 Rev.002 TSZ22111･15･001

DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-GE Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-GE Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: R OHM Semiconductor: BD7561SG-TR BD7561G-TR BD7562SF-E2 BD7562FVM-TR BD7562SFVM-TR BD7562F-E2