Datasheet Voltage Detector IC Series Bipolar Voltage Detector ICs BD47xx series ●General Description ●Key Specifications The BD47xx series is a Voltage Detector IC,  Detection voltage range: 1.9V to 4.6V (Typ.) developed to prevent system errors at transient state, 0.1V steps when the power of CPU or logic circuit switches  High accuracy detection voltage: ±1% ON/OFF or in cases of momentary shut down. These  Low current consumption: 1.6µA (Typ.) ICs consist of three terminals (power supply, GND and  Operating temperature range: -40°C to +75°C reset output) to detect power supply voltages and outputs reset signals of various systems. These ICs are ultra-compact and have low current consumption, ●Package making them ideal for portable products. SSOP5 2.90mm x 2.80mm x 1.25mm ●Applications ●Features Circuits using microcontrollers or logic circuits that require  High accuracy detection a reset.  Low current consumption  Very small package  Open collector “L” reset output  Package SSOP5 is similar to SOT-23-5 (JEDEC) ●Typical Application Circuit VDD VDD RL CPU BD47xx series VOUT RESET Micro-controller CL GND GND ●Connection Diagram ●Pin Descriptions SSOP5 TOP VIEW VDD VOUT PIN No. Symbol Function 1 N.C. Unconnected Terminal 2 SUB Substrate* 3 GND GND Lot. No 4 VOUT Reset Output Marking 5 V Power Supply Voltage DD N.C. SUB GND *Substrate Pin should be connected wit h GND ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays .w ww.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 1/10 TSZ22111・14・001 21.Jun.2016 Rev.007

BD47xx series ●Ordering Information B D 4 7 x x G - T R Part Reset Voltage Value Package Packaging and Number 19 : 1.9V G : SSOP5 forming specification 0.1V step TR : Embossed tape 46 : 4.6V and reel (SOT-23-5) ●Lineup Detection Detection Detection Marking Part Number Marking Part Number Marking Part Number Voltage Voltage Voltage B2 4.6V BD4746 BR 3.6V BD4736 BH 2.6V BD4726 B1 4.5V BD4745 BQ 3.5V BD4735 BG 2.5V BD4725 BZ 4.4V BD4744 BP 3.4V BD4734 BF 2.4V BD4724 BY 4.3V BD4743 B4 3.3V BD4733 BE 2.3V BD4723 BX 4.2V BD4742 BN 3.2V BD4732 BD 2.2V BD4722 BW 4.1V BD4741 BM 3.1V BD4731 BC 2.1V BD4721 BV 4.0V BD4740 BL 3.0V BD4730 BB 2.0V BD4720 BU 3.9V BD4739 BK 2.9V BD4729 BA 1.9V BD4719 BT 3.8V BD4738 BJ 2.8V BD4728 BS 3.7V BD4737 B3 2.7V BD4727 www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 2/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Absolute maximum ratings Parameter Symbol Limit Unit Power Supply Voltage V -0.3 to +10 V DD Output Voltage VOUT -0.3 to +10 V Output Current Io 60 mA Power Dissipation *1 *2 Pd 540 mW Operation Temperature Range Topt -40 to +75 °C Ambient Storage Temperature Tstg -55 to +125 °C *1 Reduced by 5.4mW/°C when used over 25°C. *2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). ●Electrical characteristics (Unless Otherwise Specified Ta=25°C) Limit Parameter Symbol Condition Unit Min. Typ. Max. VDET (T) VDET(T) VDD=HL RL=4.7kΩ VDET(T) ×0.99 ×1.01 Ta=+25°C 2.475 2.5 2.525 VDET=2.5V Ta=-40°C to 75°C 2.418 - 2.584 Ta=+25°C 2.970 3.0 3.030 Detection Voltage VDET VDET=3.0V V Ta=-40°C to 75°C 2.901 - 3.100 Ta=+25°C 3.267 3.3 3.333 VDET=3.3V Ta=-40°C to 75°C 3.191 - 3.410 Ta=+25°C 4.158 4.2 4.242 VDET=4.2V Ta=-40°C to 75°C 4.061 - 4.341 Temperature Coefficient VDET/∆T RL=4.7kΩTa=-20 to+75°C Designed Guarantee - ±0.01 - %/°C Of Detection Voltage Detection Hysteresis Voltage ∆VDET RL=4.7kΩ, VDD=LHL 30 50 100 mV Transfer Delay Time ”H” t C =100pF，R =4.7kΩ *1 - 20 50 µs PLH L L Transfer Delay Time ”L” t C =100pF，R =4.7kΩ *2 - 60 120 µs PHL L L Reset Output Voltage ”L” VOL VDD=VDET(min.)-0.05V, RL=4.7kΩ - 0.1 0.4 V Circuit Current ON Icc1 VDD=VDET(min.)-0.05V, RL=∞ - 1.5 3.0 µA Circuit Current OFF Icc2 VDD=VDET(typ.)/0.85V, RL=∞ - 1.6 3.2 µA Operating Voltage Range V R =4.7kΩ，V ≤0.4V - 0.65 0.85 V OPL L OL Output Leak Current I V =V =10V - - 0.1 µA leak DD OUT Reset Output Current ”L” IOL Vo=0.4V, VDD=VDET(min.)-0.05V 3.0 15.0 - mA VDET(T):Standard Detection Voltage(1.9V to 4.6V, 0.1V step） RＬ:Pull-up resistor to be connected between VOUT and power supply. CL:Capacitor to be connected between VOUT and GND. *1 tPLH:VDD=(VDET(typ.)-0.4V)(VDET(typ.)+0.4V) *2 tPHL:VDD=(VDET(typ.)+0.4V)(VDET(typ.)-0.4V) Design Guarantee. (Outgoing inspection is not done on all products) www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 3/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Block Diagram V DD 5 4 V OUT Vref 3 GND Fig.1 BD47xx series www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 4/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Typical Performance Curves 10 800 ] [μA]CC 89 【【BBDD44772299G】】 ： I[mAOL 670000 【【BBDD44772299】G】 ： I 7 T NT 6 REN 500 RRE 5 CUR 400 IOL=12.194mA at Vo=400mV UIT CU 34 TPUT 300 C U 200 R 2 O CI 1 Icc1=1.34μA W" 100 Icc2=1.46μA O 0 L 0 " 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 VDD SUPPLY VOLTAGE ：VDD[V] OUTPUT VOLTAGE ： VOUT[mV] Fig.2 Circuit Current Fig.3 “Low” Output Current 1000 6 【【BBDD44772299G】 】 V] 900 【【BBDD44772299G】】 [V]T 5 [mT 800 U U VO VO 700 ：E 4 ：E 600 G G A T 3 A 500 L T O L V O 400 UT 2 V =2.90V V =2.95V T V 300 VOPL=0.675V P DET DET U T P U 1 T 200 O ⊿V =50mV U DET O 100 0 0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 V SUPPLY VOLTAGE ：V [V] DD DD V SUPPLY VOLTAGE ： V [V] DD DD Fig.4 I/O Characteristics Fig.5 Operating Limit Voltage www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 5/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Typical Performance Curves – continued 3.5 2.5 A] V] 【【BBDD44772299G】】 m 【【BBDD44772299G】】 V[DET 3.3 I[：CC1 2.0 ： N E 3.1 O G N A -0.007%/℃ E 1.5 T H L 2.9 W N VO ENT 1.0 O 2.7 R TI UR C TE 2.5 IT C 0.5 E ~ U D ~ C R 2.3 CI 0.0 -20-10 0 10 20 30 40 50 60 70 80 -20-10 0 10 20 30 40 50 60 70 80 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.6 Detection Voltage Fig.7 Circuit Current when ON 2.5 0.9 A] m 【【BBDD44772299G】】 V] 【【BBDD44772299G】】 OFF[： ICC2 2.0 ： AGEV[OPL 0.8 EN 1.5 LT 0.7 WH N VO T O N 1.0 TI 0.6 E A R ER R P U O C 0.5 M 0.5 T U CUI NIM R MI CI 0.0 0.4 -20-10 0 10 20 30 40 50 60 70 80 -20-10 0 10 20 30 40 50 60 70 80 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.8 Circuit Current when OFF Fig.9 Operating Limit Voltage www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 6/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Typical Performance Curves – continued 500 ] 【【BBDD44772299G】】 V m 400 [T U VO ：E 300 G A Ta=-20℃ T L O 200 V T U P 100 T U O Ta=25℃ Ta=75℃ 0 0 1 2 3 4 5 "LOW" OUTPUT CURRENT ： IOL[mA] Fig.10 Output Saturation Voltage www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 7/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Application Information Explanation of Operation BD47xx series has threshold voltages namely the detection voltage and release voltage. As the voltages applied to the input reach their respective thresholds, the output switches from “High” to “Low” and from “Low” to “High”. The release voltage has a hysteresis that is the value of the detection voltage +50mV (Typ.), preventing chattering in the output. When the input is greater than the release voltage, the output is in a “High” state. When the input decreases from that state, the output switches to “Low” upon reaching the detection voltage. When the input is less than the detection voltage, the output is in a “Low” state. When the input increases from that state, the output switches to “High” upon reaching the release voltage. Additionally, at least 0.85V input voltage is required for the circuit to function as expected. When the input falls below the operating limit voltage, the output becomes unstable. VDD VDD VDET+ΔVDET VDET ⑤ VOPL 0V VOUT VOH tPHL tPLH tPHL tPLH VOL ① ② ③ ④ Fig.11 Timing Waveform 1 When the power supply is turned on, the output is still unstable until it reaches the operating limit voltage (V ) with a OPL given time t . Therefore it is possible that the reset signal is not outputted when the rise time of V is faster than t . PHL DD PHL 2 When VDD is greater than VOPL but less than the reset release voltage (VDET+ΔVDET), the output voltages will switch to Low. 3 If VDD exceeds the reset release voltage (VDET+ΔVDET) then VOUT switches from L to H after tPLH. 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, V switches to L (with a delay of t ). OUT PHL 5 The potential difference between the detection voltage and the release voltage is known as the Hysteresis Width (ΔVDET). The system is designed such that, the output does not toggle with power supply fluctuations within this hysteresis width, malfunctions due to noise are prevented. <Precautions> Please be aware that when there is resistance on the power supply line, the detection voltage varies with voltage drops caused by the IC current consumption. Please connect a capacitor between V and GND when the power supply line has high impedance. DD www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 8/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Circuit Applications The following is an example of an application circuit using Reset IC for normal power supply detection. BD47xx series requires a pull up resistor on the output terminal. The pull up resistor value should be decided depending on the application, with enough consideration of power supply level and output current capability. When a capacitor is placed at the output terminal, to delay the output time or to remove noise, the output will become slower during starting or stopping. Please be careful in considering the appropriate value for pull up resistors, output current, and capacitor when inserting a bypass capacitor between input and GND. Please be aware that if an extremely large capacitor is used, the response time will become excessively slow. ●●●●●●●●●●●● VDD ● ● ● VDD ● 5 microcontroller ● ●● ● ● ● ● 4 Reset Pin ● VOUT ●●●●●●●●●●●● Vref BD47xx series 3 GND Fig.12 Circuit Applications www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 9/10 TSZ22111・15・001 21.Jun.2016 Rev.007

BD47xx series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The V line impedance might cause oscillation because of the detection current. DD 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 10) External parameters The recommended parameter range for RL is 2kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 11) Power on reset operation Please note that the power on reset output varies with the V rise time. Please verify the behavior in the actual DD operation. 12) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com TSZ02201-0R7R0G300020-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 10/10 TSZ22111・15・001 21.Jun.2016 Rev.007

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