BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors Rev. 8 — 24 October 2011 Product data sheet 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device(SMD) plastic packages. Table 1. Product overview Type number[1] Package PNP complement Nexperia JEITA JEDEC BCP55 SOT223 SC-73 - BCP52 BCX55 SOT89 SC-62 TO-243 BCX52 BC55PA SOT1061 - - BC52PA [1] Valid for all available selection groups. 1.2 Features and benefits  High current  Three current gain selections  High power dissipation capability  Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  Leadless very small SMD plastic package with medium power capability (SOT1061)  AEC-Q101 qualified 1.3 Applications  Linear voltage regulators  Power management  Low-side switches  MOSFET drivers  Battery-driven devices  Amplifiers 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V collector-emitter voltage open base - - 60 V CEO I collector current - - 1 A C I peak collector current single pulse; t 1ms - - 2 A CM p h DCcurrent gain V =2V; I =150mA [1] 63 - 250 FE CE C h selection-10 V =2V; I =150mA [1] 63 - 160 FE CE C h selection-16 V =2V; I =150mA [1] 100 - 250 FE CE C [1] Pulse test: tp300s; =0.02.

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 2. Pinning information Table 3. Pinning Pin Description Simplified outline Graphic symbol SOT223 1 base 4 2, 4 2 collector 3 emitter 1 4 collector 1 2 3 3 sym016 SOT89 1 emitter 2 2 collector 3 base 3 1 3 2 1 sym042 SOT1061 1 base 3 3 2 emitter 3 collector 1 2 1 2 sym021 Transparent top view 3. Ordering information Table 4. Ordering information Type number[1] Package Name Description Version BCP55 SC-73 plastic surface-mounted package with increased SOT223 heatsink; 4leads BCX55 SC-62 plastic surface-mounted package; exposed die pad for SOT89 good heat transfer; 3leads BC55PA HUSON3 plastic thermal enhanced ultra thin small outline SOT1061 package; no leads; 3 terminals; body 220.65mm [1] Valid for all available selection groups. BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 2 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 4. Marking Table 5. Marking codes Type number Marking code BCP55 BCP55 BCP55-10 BCP55/10 BCP55-16 BCP55/16 BCX55 BE BCX55-10 BG BCX55-16 BM BC55PA AW BC55-10PA BH BC55-16PA BJ BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 3 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V collector-base voltage open emitter - 60 V CBO V collector-emitter voltage open base - 60 V CEO V emitter-base voltage open collector - 5 V EBO I collector current - 1 A C I peak collector current single pulse; - 2 A CM t 1ms p I base current - 0.3 A B I peak base current single pulse; - 0.3 A BM t 1ms p P total power dissipation T 25C tot amb BCP55 [1] - 0.65 W [2] - 1.00 W [3] - 1.35 W BCX55 [1] - 0.50 W [2] - 0.95 W [3] - 1.35 W BC55PA [1] - 0.42 W [2] - 0.83 W [3] - 1.10 W [4] - 0.81 W [5] - 1.65 W T junction temperature - 150 C j T ambient temperature 55 +150 C amb T storage temperature 65 +150 C stg [1] Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. [4] Device mounted on an FR4PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4PCB, 4-layer copper, tin-plated, mounting pad for collector 1cm2. BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 4 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 006aac674 006aac675 1.5 1.5 (1) (1) Ptot Ptot (W) (W) (2) 1.0 1.0 (2) (3) (3) 0.5 0.5 0.0 0.0 –75 –25 25 75 125 175 –75 –25 25 75 125 175 Tamb (°C) Tamb (°C) (1) FR4PCB, mounting pad for collector 6cm2 (1) FR4PCB, mounting pad for collector 6cm2 (2) FR4PCB, mounting pad for collector 1cm2 (2) FR4PCB, mounting pad for collector 1cm2 (3) FR4PCB, standard footprint (3) FR4PCB, standard footprint Fig 1. Power derating curves SOT223 Fig 2. Power derating curves SOT89 006aac676 2.0 Ptot (W) (1) 1.5 (2) 1.0 (3) (4) 0.5 (5) 0.0 –75 –25 25 75 125 175 Tamb (°C) (1) FR4PCB, 4-layer copper, mounting pad for collector 1cm2 (2) FR4PCB, single-sided copper, mounting pad for collector 6cm2 (3) FR4PCB, single-sided copper, mounting pad for collector 1cm2 (4) FR4PCB, 4-layer copper, standard footprint (5) FR4PCB, single-sided copper, standard footprint Fig 3. Power derating curves SOT1061 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 5 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from in free air th(j-a) junction to ambient BCP55 [1] - - 192 K/W [2] - - 125 K/W [3] - - 93 K/W BCX55 [1] - - 250 K/W [2] - - 132 K/W [3] - - 93 K/W BC55PA [1] - - 298 K/W [2] - - 151 K/W [3] - - 114 K/W [4] - - 154 K/W [5] - - 76 K/W R thermal resistance from th(j-sp) junction to solder point BCP55 - - 16 K/W BCX55 - - 16 K/W BC55PA - - 20 K/W [1] Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. [4] Device mounted on an FR4PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4PCB, 4-layer copper, tin-plated, mounting pad for collector 1cm2. BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 6 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 103 006aac677 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typicalvalues 103 006aac678 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 1 0 0.01 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, mounting pad for collector 1cm2 Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typicalvalues BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 7 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 103 006aac679 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 10 0.1 0.05 1 0.02 0 0.01 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, mounting pad for collector 6cm2 Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typicalvalues 103 006aac680 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typicalvalues BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 8 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 103 006aac681 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, mounting pad for collector 1cm2 Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typicalvalues 103 006aac682 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 10 0.1 0.05 1 0.02 0 0.01 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, mounting pad for collector 6cm2 Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typicalvalues BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 9 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 103 006aac683 Zth(j-a) duty cycle = 1 (K/W) 0.75 0.5 102 0.33 0.25 0.2 0.1 0.05 10 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, single-sided copper, standard footprint Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typicalvalues 103 006aac684 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, single-sided copper, mounting pad for collector 1cm2 Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typicalvalues BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 10 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 103 006aac685 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 1 0 0.01 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, single-sided copper, mounting pad for collector 6cm2 Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typicalvalues 103 006aac686 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, 4-layer copper, standard footprint Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typicalvalues BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 11 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 103 006aac687 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 1 0 0.01 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4PCB, 4-layer copper, mounting pad for collector 1cm2 Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typicalvalues 7. Characteristics Table 8. Characteristics T =25C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit I collector-base cut-off V =30V; I =0A - - 100 nA CBO CB E current V =30V; I =0A; - - 10 A CB E T =150C j I emitter-base cut-off V =5V; I =0A - - 100 nA EBO EB C current h DCcurrent gain V =2V FE CE I =5mA [1] 63 - - C I =150mA [1] 63 - 250 C I =500mA [1] 40 - - C DCcurrent gain V =2V CE h selection-10 I =150mA [1] 63 - 160 FE C h selection-16 I =150mA [1] 100 - 250 FE C V collector-emitter I =500mA; I =50mA [1] - - 0.5 V CEsat C B saturation voltage V base-emitter voltage V =2V; I =500mA [1] - - 1 V BE CE C C collector capacitance V =10V; I =i =0A; - 6 - pF c CB E e f=1MHz f transition frequency V =5V; I =50mA; 100 180 - MHz T CE C f=100MHz [1] Pulse test: tp300s; =0.02. BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 12 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 300 006aac691 1.6 006aaa084 IB (mA) = 50 45 40 35 30 IC hFE (A) 1.2 (1) 25 200 20 15 (2) 0.8 10 100 (3) 5 0.4 0 0 10–4 10–3 10–2 10–1 1 10 0 0.4 0.8 1.2 1.6 2.0 IC (A) VCE (V) VCE=2V Tamb=25C (1) Tamb=100C (2) Tamb=25C (3) Tamb=55C Fig 15. DCcurrent gain as a function of collector Fig 16. Collector current as a function of current; typical values collector-emitter voltage; typical values 006aac692 006aac693 1.2 1 VBE (V) VCEsat (1) (V) 0.8 (2) 10–1 (3) (1) 0.4 (2) (3) 0.0 10–2 10–1 1 10 102 103 104 10–1 1 10 102 103 104 IC (mA) IC (mA) V = 2V I /I =10 CE C B (1) Tamb=55C (1) Tamb=100C (2) Tamb=25C (2) Tamb=25C (3) Tamb=100C (3) Tamb=55C Fig 17. Base-emitter voltage as a function of collector Fig 18. Collector-emitter saturation voltage as a current; typical values function of collector current; typical values BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 13 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 6.7 6.3 1.8 3.1 1.5 2.9 4 1.1 0.7 7.3 3.7 6.7 3.3 1 2 3 0.8 0.32 2.3 0.6 0.22 4.6 Dimensions in mm 04-11-10 Fig 19. Package outline SOT223(SC-73) 4.6 4.4 1.6 1.8 1.4 1.4 2.6 2.4 4.25 3.75 1.2 1 2 3 0.8 0.53 0.40 0.48 0.44 1.5 0.35 0.23 3 Dimensions in mm 06-08-29 Fig 20. Package outline SOT89(SC-62/TO-243) BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 14 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 1.3 0.35 0.65 0.25 max 0.45 1 2 1.05 0.35 0.95 2.1 1.1 1.9 0.9 0.3 0.2 3 1.6 1.4 2.1 1.9 Dimensions in mm 09-11-12 Fig 21. Package outline SOT1061(HUSON3) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type Package Description Packing quantity number[2] 1000 3000 4000 BCP55 SOT223 8mm pitch, 12mm tape and reel -115 - -135 BCX55 SOT89 8mm pitch, 12mm tape and reel; T1 [3] -115 - -135 8mm pitch, 12mm tape and reel; T3 [4] -146 - - BC55PA SOT1061 4mm pitch, 8mm tape and reel - -115 - [1] For further information and the availability of packing methods, see Section14. [2] Valid for all available selection groups. [3] T1: normal taping [4] T3: 90 rotated taping BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 15 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 11. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4×) (4×) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 sot223_fr Fig 22. Reflow soldering footprint SOT223(SC-73) 8.9 6.7 1.9 solder lands 4 solder resist 6.2 8.7 occupied area Dimensions in mm 1 2 3 preferred transport direction during soldering 1.9 (3×) 2.7 2.7 1.9 1.1 (2×) sot223_fw Fig 23. Wave soldering footprint SOT223(SC-73) BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 16 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 4.75 2.25 2 1.9 1.2 0.2 0.85 solder lands 1.7 solder resist 1.2 4.6 4.85 0.5 solder paste occupied area 1 1.1 (3×) (2×) Dimensions in mm 1.5 1.5 0.6 (3×) 0.7 (3×) 3.95 sot089_fr Fig 24. Reflow soldering footprint SOT89(SC-62/TO-243) 6.6 2.4 3.5 solder lands 7.6 0.5 solder resist occupied area 1.8 (2×) Dimensions in mm preferred transport direction during soldering 1.9 1.9 1.5 (2×) 0.7 5.3 sot089_fw Fig 25. Wave soldering footprint SOT89(SC-62/TO-243) BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 17 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 2.1 1.3 0.5 (2×) 0.4 (2×) 0.5 (2×) 0.6 (2×) 1.05 2.3 0.6 0.55 0.25 1.1 1.2 0.25 0.25 0.4 0.5 1.6 1.7 solder paste = solder lands Dimensions in mm solder resist occupied area sot1061_fr Reflow soldering is the only recommended soldering method. Fig 26. Reflow soldering footprint SOT1061(HUSON3) BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 18 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BCP55_BCX55_BC55PAv.8 20111024 Product data sheet - BC637_BCP55_BCX55v.7 Modifications: • Type number removed: BC637 • Type number added: BC55PA, BC55-10PA and BC55-16PA • Section 1 “Product profile”: updated • Section 2 “Pinning information”: updated • Table6 and 7: updated according to latest measurements • Figure1, 2, 4, 5, 7 to 9, 15, 17 and 18: updated • Figure3, 6, 10 to 14: added • Section 8 “Test information”: added • Section 10 “Packing information”: updated • Section 11 “Soldering”: added • Section 13 “Legal information”: updated BC637_BCP55_BCX55v.7 20070625 Product data sheet - BC637_BCP55_BCX55v.6 BC637_BCP55_BCX55v.6 20050218 Product data sheet CPCN2004050 BC635_637_639v.4 29 BCP54_55_56v.5 BCX54_55_56v.4 BC635_637_639v.4 20011010 Product specification - BC635_637_639v.3 BCP54_55_56v.5 20030206 Product specification - BCP54_55_56v.4 BCX54_55_56v.4 20011010 Product specification - BCX54_55_56v.3 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 19 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nexperia.com. 13.2 Definitions malfunction of a Nexperia product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Nexperia accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under Nexperia products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. Nexperia does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. 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In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the Nexperia product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using Nexperia products in order to avoid a default of the applications and 13.3 Disclaimers the products or of the application or use by customer’s third party customer(s). Nexperia does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. 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Constant or In no event shall Nexperia be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — Nexperia damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nexperia.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, Nexperia’s aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. Nexperia hereby expressly objects to with the Terms and conditions of commercial sale of Nexperia. applying the customer’s general terms and conditions with regard to the purchase of Nexperia products by customer. Right to make changes — Nexperia reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — Nexperia products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities. BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 20 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors Quick reference data — The Quick reference data is an extract of the 13.4 Trademarks product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 8 — 24 October 2011 21 of 22

BCP55; BCX55; BC55PA Nexperia 60 V, 1 A NPN medium power transistors 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . 14 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 14 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 14 10 Packing information . . . . . . . . . . . . . . . . . . . . 15 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 14 Contact information. . . . . . . . . . . . . . . . . . . . . 21 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 © Nexperia B.V. 2017. All rights reserved For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com Date of release: 24 October 2011