Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

BC848 series 30 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package PNP complement NXP JEITA JEDEC BC848B SOT23 - TO-236AB BC858B BC848W SOT323 SC-70 - BC858W 1.2 Features (cid:132) General-purpose transistors (cid:132) SMD plastic packages 1.3 Applications (cid:132) General-purpose switching and amplification 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V collector-emitter voltage open base - - 30 V CEO I collector current - - 100 mA C h DCcurrent gain V =5V; FE CE I =2mA C BC848B 200 290 450 BC848W 110 - 800

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol 1 base 2 emitter 3 3 3 collector 1 2 1 2 sym021 006aaa144 3. Ordering information Table 4. Ordering information Type number Package Name Description Version BC848B - plastic surface mounted package; 3leads SOT23 BC848W SC-70 plastic surface mounted package; 3leads SOT323 4. Marking Table 5. Marking codes Type number Marking code[1] BC848B 1K* BC848W 1M* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 2 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V collector-base voltage open emitter - 30 V CBO V collector-emitter voltage open base - 30 V CEO V emitter-base voltage open collector - 5 V EBO I collector current - 100 mA C I peak collector current single pulse; - 200 mA CM t ≤1ms p I peak base current single pulse; - 200 mA BM t ≤1ms p P total power dissipation T ≤25°C [1] tot amb SOT23 - 250 mW SOT323 - 200 mW T junction temperature - 150 °C j T ambient temperature −65 +150 °C amb T storage temperature −65 +150 °C stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from in free air [1] th(j-a) junction to ambient SOT23 - - 500 K/W SOT323 - - 625 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 3 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 7. Characteristics Table 8. Characteristics T =25°C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit I collector-base cut-off V =30V; I =0A - - 15 nA CBO CB E current V =30V; I =0A; - - 5 μA CB E T =150°C j I emitter-base cut-off V =5V; I =0A - - 100 nA EBO EB E current h DCcurrent gain V =5V; I =10μA - 150 - FE CE C V =5V; I =2mA CE C BC848B 200 290 450 BC848W 110 - 800 V collector-emitter I =10mA; I =0.5mA - 90 250 mV CEsat C B saturation voltage I =100mA; I =5mA [1] - 200 600 mV C B V base-emitter I =10mA; I =0.5mA [2] - 700 - mV BEsat C B saturation voltage I =100mA; I =5mA [2] - 900 - mV C B V base-emitter voltage I =2mA; V =5V [3] 580 660 700 mV BE C CE I =10mA; V =5V [3] - - 770 mV C CE f transition frequency V =5V; I =10mA; 100 - - MHz T CE C f=100MHz C collector capacitance V =10V; I =i =0A; - 2.5 3 pF c CB E e f=1MHz NF noise figure V =5V; I =200μA; - 2 10 dB CE C R =2kΩ; f=1kHz; S B=200Hz [1] Pulse test: tp≤300μs; δ≤0.02. [2] V decreases by approximately 1.7mV/K with increasing temperature. BEsat [3] V decreases by approximately 2mV/K with increasing temperature. BE BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 4 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors mgt727 mgt728 600 1200 hFE VBE (mV) 500 (1) 1000 (1) 400 800 (2) (2) 300 600 200 400 (3) (3) 100 200 0 0 10−1 1 10 102 103 10−2 10−1 1 10 102 103 IC (mA) IC (mA) V =5V V =5V CE CE (1) Tamb=150°C (1) Tamb=−55°C (2) Tamb=25°C (2) Tamb=25°C (3) Tamb=−55°C (3) Tamb=150°C Fig 1. BC848B: DC current gain as a function of Fig 2. BC848B: Base-emitter voltage as a function of collector current; typical values collector current; typical values 104 mgt729 1200 mgt730 VBEsat VCEsat (mV) (mV) 1000 (1) 103 800 (2) 600 (3) 102 400 (1) (3) (2) 200 10 0 10−1 1 10 102 103 10−1 1 10 102 103 IC (mA) IC (mA) I /I =20 I /I =10 C B C B (1) Tamb=150°C (1) Tamb=−55°C (2) Tamb=25°C (2) Tamb=25°C (3) Tamb=−55°C (3) Tamb=150°C Fig 3. BC848B: Collector-emitter saturation voltage Fig 4. BC848B: Base-emitter saturation voltage as a as a function of collector current; typical function of collector current; typical values values BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 5 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 8. Package outline 3.0 1.1 2.2 1.1 2.8 0.9 1.8 0.8 3 3 0.45 0.15 0.45 0.15 2.5 1.4 2.2 1.35 2.1 1.2 2.0 1.15 1 2 1 2 0.48 0.15 0.4 0.25 0.38 0.09 0.3 0.10 1.9 1.3 Dimensions in mm 04-11-04 Dimensions in mm 04-11-04 Fig 5. Package outline SOT23 (TO-236AB) Fig 6. Package outline SOT323 (SC-70) 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BC848B SOT23 4mm pitch, 8mm tape and reel -215 -235 BC848W SOT323 4mm pitch, 8mm tape and reel -115 -135 [1] For further information and the availability of packing methods, see Section14. BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 6 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 10. Soldering 2.90 2.50 solder lands solder resist 0.85 2 1 3.00 1.30 2.70 occupied area 0.85 3 solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.001.20 3 preferred transport direction during soldering 2.80 MSA427 4.50 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 7 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.50 2.35 0.85 0(3.6×0) 3 (3×) 1.90 solder resist occupied area 1 Dimensions in mm 0.55 (3×) 2.40 msa429 Fig 9. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3 3.65 2.10 2.70 solder lands 1 0(2.9×0) solder resist occupied area Dimensions in mm msa419 preferred transport direction during soldering Fig 10. Wave soldering footprint SOT323 (SC-70) BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 8 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 11. Mounting 43.4 43.4 0.6 0.7 0.6 40 0.6 0.55 40 0.7 0.5 0.5 Dimensions in mm 006aaa527 Dimensions in mm 006aaa672 PCBthickness: PCBthickness: FR4PCB=1.6mm FR4PCB=1.6mm Fig 11. FR4 PCB, standard footprint Fig 12. FR4 PCB, standard footprint SOT23 (TO-236AB) SOT323 (SC-70) BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 9 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BC848_SER_7 20091117 Product data sheet - BC848_SER_6 Modifications: • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 9 “Reflow soldering footprint SOT323 (SC-70)”: updated • Figure 10 “Wave soldering footprint SOT323 (SC-70)”: updated BC848_SER_6 20060203 Product data sheet - BC846_BC847_ BC848_5 BC846W_BC847W_ BC848W_4 BC846_BC847_BC848_5 20040206 Product specification - BC846_BC847_ BC848_4 BC846W_BC847W_ 20020204 Product specification - BC846W_847W_3 BC848W_4 BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 10 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 13.2 Definitions damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in Applications — Applications that are described herein for any of these modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the information included herein and shall have no liability for the consequences of specified use without further testing or modification. use of such information. Limiting values — Stress above one or more limiting values (as defined in Short data sheet — A short data sheet is an extract from a full data sheet the Absolute Maximum Ratings System of IEC60134) may cause permanent with the same product type number(s) and title. A short data sheet is intended damage to the device. Limiting values are stress ratings only and operation of for quick reference only and should not be relied upon to contain detailed and the device at these or any other conditions above those given in the full information. For detailed and full information see the relevant full data Characteristics sections of this document is not implied. Exposure to limiting sheet, which is available on request via the local NXP Semiconductors sales values for extended periods may affect device reliability. office. In case of any inconsistency or conflict with the short data sheet, the Terms and conditions of sale — NXP Semiconductors products are sold full data sheet shall prevail. subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, 13.3 Disclaimers intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such General — Information in this document is believed to be accurate and terms and conditions, the latter will prevail. reliable. However, NXP Semiconductors does not give any representations or No offer to sell or license — Nothing in this document may be interpreted or warranties, expressed or implied, as to the accuracy or completeness of such construed as an offer to sell products that is open for acceptance or the grant, information and shall have no liability for the consequences of use of such conveyance or implication of any license under any copyrights, patents or information. other industrial or intellectual property rights. Right to make changes — NXP Semiconductors reserves the right to make Export control — This document as well as the item(s) described herein changes to information published in this document, including without may be subject to export control regulations. Export might require a prior limitation specifications and product descriptions, at any time and without authorization from national authorities. notice. This document supersedes and replaces all information supplied prior to the publication hereof. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this Suitability for use — NXP Semiconductors products are not designed, document, and as such is not complete, exhaustive or legally binding. authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected 13.4 Trademarks to result in personal injury, death or severe property or environmental Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BC848_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 11 of 12

BC848 series NXP Semiconductors 30 V, 100 mA NPN general-purpose transistors 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Contact information. . . . . . . . . . . . . . . . . . . . . 11 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 November 2009 Document identifier: BC848_SER_7