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BBY 66-02V H6327产品简介:
ICGOO电子元器件商城为您提供BBY 66-02V H6327由Infineon设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供BBY 66-02V H6327价格参考以及InfineonBBY 66-02V H6327封装/规格参数等产品信息。 你可以下载BBY 66-02V H6327参考资料、Datasheet数据手册功能说明书, 资料中有BBY 66-02V H6327详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | DIODE TUNING 12V 50MA SC79变容二极管 RF DIODE |
产品分类 | 可变电容二极管(可变电容二极管,变容二极管)分离式半导体 |
品牌 | Infineon Technologies |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 二极管与整流器,变容二极管,Infineon Technologies BBY 66-02V H6327- |
数据手册 | http://www.infineon.com/dgdl/bby66series.pdf?folderId=db3a304313d846880113ddc160d402c0&fileId=db3a304313d846880113deb52d8e0400 |
产品型号 | BBY 66-02V H6327 |
不同Vr、F时的Q值 | - |
不同 Vr、F时的电容 | 13.5pF @ 4.5V,1MHz |
二极管类型 | 单一 |
产品种类 | 变容二极管 |
供应商器件封装 | PG-SC79-2 |
其它名称 | BBY 66-02V H6327DKR |
包装 | Digi-Reel® |
反向电压 | 12 V |
商标 | Infineon Technologies |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | SC-79,SOD-523 |
封装/箱体 | SC-79 |
工厂包装数量 | 3000 |
最大工作温度 | + 150 C |
最小工作温度 | - 55 C |
最小调谐率 | 5 |
标准包装 | 1 |
正向连续电流 | 50 mA |
电压-峰值反向(最大值) | 12V |
电容 | 66 pF |
电容比 | 5.41 |
电容比条件 | C1/C4.5 |
端接类型 | Solder Lug |
系列 | BBY66 |
调谐率测试条件 | 1 V to 4.5 V |
配置 | Single |
零件号别名 | BBY6602VH6327XTSA1 SP000743580 |
BBY66... Silicon Tuning Diodes • High capacitance ratio • High Q hyperabrupt tuning diode • Low series resistance • Designed for low tuning voltage operation for VCO's in mobile communications equipment • Very low capacitance spread • Pb-free (RoHS compliant) package1) • Qualified according AEC Q101 BBY66-02V BBY66-05 BBY66-05W (cid:3) (cid:1) (cid:2) (cid:4)(cid:1) (cid:4)(cid:2) (cid:1) (cid:2) Type Package Configuration L (nH) Marking S BBY66-02V SC79 single 0.6 h BBY66-05 SOT23 common cathode 1.8 O1s / O2s** BBY66-05W SOT323 common cathode 1.4 OBs **For differences see next page Capacitance groups Maximum Ratings at T = 25°C, unless otherwise specified A Parameter Symbol Value Unit Diode reverse voltage V 12 V R Forward current I 50 mA F Operating temperature range T -55 ... 150 °C op Storage temperature T -55 ... 150 stg 1Pb-containing package may be available upon special request 1 2007-04-20
BBY66... Electrical Characteristics at T = 25°C, unless otherwise specified A Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current I nA R V = 10 V - - 20 R V = 10 V, T = 65 °C - - 200 R A AC Characteristics Diode capacitance1) C pF T V = 1 V, f = 1 MHz 66 68.7 71.5 R V = 2 V, f = 1 MHz 33 35.4 38 R V = 3 V, f = 1 MHz 19.7 20.95 22.2 R V = 4.5 V, f = 1 MHz 12 12.7 13.5 R Capacitance ratio C /C 5 5.41 - T1 T4.5 V = 1 V, V = 4.5 V R R Series resistance r - 0.25 0.4 Ω S V = 1 V, f = 470 MHz R 1Capacitance groups at 1V, coded 01; 02 (only BBY66-05) C /groups 01 02 T C min 66pF 68.5pF 1V C max 69pF 71.5pF 1V Deliveries contain either C group 01 or group 02 (marked on reel). T No direct order of C groups possible T 2 2007-04-20
BBY66... Diode capacitance C = ƒ (V ) Temperature coefficient of the diode T R f = 1MHz capacitance T = ƒ (V ) Cc R 80 1200 pF ppm/°C 60 C T C C 50 T 40 600 30 20 300 10 0 0 0 1 2 3 V 5 1 2 3 V 5 V V R R Reverse current I = ƒ(V ) R R T = Parameter A 10 4 pA TA=+85°C 10 3 TA=+65°C R I TA=+25°C 10 2 10 1 10 0 2 3 4 5 6 7 8 9 10 V 12 V R 3 2007-04-20
Package SC79 BBY66... Package Outline 0.2M A 0.8 ±0.1 0.13+-00..0035 A 2 X. AX. MA 1.6±0.1 ˚10M ˚101.2±0.1 Cathode 1 marking 0.3±0.05 0.55±0.04 ±0.05 2 0. Foot Print 5 5 3 1.3 0. 0.35 Marking Layout (Example) 2005, June Date code BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard Reel with 2 mm Pitch 4 2 0.2 1.33 1.96 8 Cathode 0.4 Cathode 0.66 marking 0.93 marking 4 2007-04-20
BBY66... Date Code marking for discrete packages with one digit (SCD80, SC79, SC751)) CES-Code Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 5 2007-04-20
Package SOT23 BBY66... Package Outline N. 1±0.1 MI 2.9±0.1 B 15 0.1 MAX. 0. 0.4-+00..0151) 1 3 2 C 2.4±0.15 10˚ MAX. 0.08...0.10˚ MAX.15 A1.3±0.1 0.95 0...8˚ 1.9 0.25M B C 0.2M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 9 0. 3 1. 0.8 1.2 0.9 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 0.2 2.132.65 8 Pin 1 3.15 1.15 6 2007-04-20
Package SOT323 BBY66... Package Outline 2±0.2 0.9±0.1 0.1 MAX. 0.3+0.1 3x -0.05 0.1M 0.1 A 3 2.1±0.1 MIN. 1.25±0.1 1 1 2 0. 0.65 0.65 0.15+-00..015 0.2M A Foot Print 0.6 6 1. 8 0. 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 3 2. Pin 1 2.15 1.1 7 2007-04-20
BBY66... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2007-04-20
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