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DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D087 BAT120 series Schottky barrier double diodes Product data sheet 2003 Aug 04 Supersedes data of 2001 Aug 27

NXP Semiconductors Product data sheet Schottky barrier double diodes BAT120 series FEATURES PINNING • Low switching losses BAT120 PIN • Capability of absorbing very high surge current A C S • Fast recovery time 1 k a a 1 1 1 • Guard ring protected 2 n.c. n.c. n.c. • Plastic SMD package. 3 k a k 2 2 2 4 a , a k , k k , a 1 2 1 2 1 2 APPLICATIONS • Low power switched-mode power supplies • Rectification handbook, halfpage 4 • Polarity protection. DESCRIPTION Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package. MARKING 1 2 3 TYPE NUMBER MARKING CODE Top view MSB002 - 1 BAT120A AT120A Fig.1 Simplified outline (SOT223) and pin BAT120C AT120C configuration. BAT120S AT120S 4 4 4 1 3 1 3 1 3 2 n.c. MGL171 2 n.c. MGL172 2 n.c. MGL173 a. BAT120A. b. BAT120C. c. BAT120S. Fig.2 BAT120 diode configurations and symbols. 2003 Aug 04 2

NXP Semiconductors Product data sheet Schottky barrier double diodes BAT120 series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode V continuous reverse voltage − 25 V R I continuous forward current − 1 A F I non-repetitive peak forward current t < 10 ms; half sinewave; − 10 A FSM p JEDEC method I non-repetitive peak reverse current t = 100 μs − 0.5 A RSM p T storage temperature −65 +150 °C stg T junction temperature − 125 °C j T operating ambient temperature −65 +125 °C amb ELECTRICAL CHARACTERISTICS T = 25 °C unless otherwise specified. amb SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT Per diode V forward voltage see Fig.3 F I = 100 mA 260 300 mV F I = 1 A 400 450 mV F I reverse current V = 20 V; note 1; see Fig.4 80 500 μA R R V = 25 V; note 1; see Fig.4 − 1 mA R V = 20 V; T = 100 °C; note 1 − 10 mA R j C diode capacitance f = 1 MHz; V = 4 V; see Fig.5 100 − pF d R Note 1. Pulse test: t = 300 μs; δ = 0.02. p THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT R thermal resistance from junction to ambient note 1 100 K/W th j-a Note 1. Refer to SOT223 standard mounting conditions. 2003 Aug 04 3

NXP Semiconductors Product data sheet Schottky barrier double diodes BAT120 series GRAPHICAL DATA handbook1,0 h4alfpage MBL886 105 MHB970 handbook, halfpage IR (1) IF (μA) (mA) 104 (2) 103 (3) (1) 103 (2) 102 (3) (4) (4) 102 10 10 1 1 0 10 20 30 0 200 400 600 800 VR (V) VF (mV) (1) Tamb = 125 °C. (3) Tamb = 75 °C. (1) Tamb = 125 °C. (3) Tamb = 75 °C. (2) Tamb = 100 °C. (4) Tamb = 25 °C. (2) Tamb = 100 °C. (4) Tamb = 25 °C. Fig.3 Forward current as a function of forward Fig.4 Reverse current as a function of reverse voltage; typical values. voltage; typical values. 103 MBK571 handbook, halfpage Cd (pF) 102 10 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.5 Diode capacitance as a function of reverse voltage; typical values. 2003 Aug 04 4

NXP Semiconductors Product data sheet Schottky barrier double diodes BAT120 series PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223 D B E A X c y HE v M A b1 4 Q A A1 1 2 3 Lp e1 bp w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y 1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95 mm 4.6 2.3 0.2 0.1 0.1 1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION 97-02-28 SOT223 SC-73 99-09-13 2003 Aug 04 5

NXP Semiconductors Product data sheet Schottky barrier double diodes BAT120 series DATA SHEET STATUS DOCUMENT PRODUCT DEFINITION STATUS(1) STATUS(2) Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for General ⎯ Information in this document is believed to be extended periods may affect device reliability. accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, Terms and conditions of sale ⎯ NXP Semiconductors expressed or implied, as to the accuracy or completeness products are sold subject to the general terms and of such information and shall have no liability for the conditions of commercial sale, as published at consequences of use of such information. http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights Right to make changes ⎯ NXP Semiconductors infringement and limitation of liability, unless explicitly reserves the right to make changes to information otherwise agreed to in writing by NXP Semiconductors. In published in this document, including without limitation case of any inconsistency or conflict between information specifications and product descriptions, at any time and in this document and such terms and conditions, the latter without notice. This document supersedes and replaces all will prevail. information supplied prior to the publication hereof. No offer to sell or license ⎯ Nothing in this document Suitability for use ⎯ NXP Semiconductors products are may be interpreted or construed as an offer to sell products not designed, authorized or warranted to be suitable for that is open for acceptance or the grant, conveyance or use in medical, military, aircraft, space or life support implication of any license under any copyrights, patents or equipment, nor in applications where failure or malfunction other industrial or intellectual property rights. of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe Export control ⎯ This document as well as the item(s) property or environmental damage. NXP Semiconductors described herein may be subject to export control accepts no liability for inclusion and/or use of NXP regulations. Export might require a prior authorization from Semiconductors products in such equipment or national authorities. applications and therefore such inclusion and/or use is at Quick reference data ⎯ The Quick reference data is an the customer’s own risk. extract of the product data given in the Limiting values and Applications ⎯ Applications that are described herein for Characteristics sections of this document, and as such is any of these products are for illustrative purposes only. not complete, exhaustive or legally binding. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2003 Aug 04 6

NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/04/pp7 Date of release: 2003 Aug 04 Document order number: 9397 750 11054