BAS16WT1G Silicon Switching Diode Features • S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • http://onsemi.com These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 3 1 CATHODE ANODE MAXIMUM RATINGS (TA = 25°C) MARKING Rating Symbol Value Unit DIAGRAM Continuous Reverse Voltage VR 100 V Recurrent Peak Forward Current IR 200 mA A6 M(cid:2) SC−70 (cid:2) PPuelaske FWoirdwtha r=d 1S0u r(cid:2)gse Current IFM(surge) 500 mA CASE 419 STYLE 2 1 Total Power Dissipation, One Diode Loaded TA = 25°C PD 200 mW Derate above 25°C A6 = Specific Device Code Mounted on a Ceramic Substrate 1.6 mW/°C M = Date Code (10 x 8 x 0.6 mm) (cid:2) = Pb−Free Package Operating and Storage Junction TJ, Tstg −55 to °C (*Note: Microdot may be in either location) Temperature Range +150 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended ORDERING INFORMATION Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Device Package Shipping† THERMAL CHARACTERISTICS BAS16WT1G SC−70 3000 / Tape & Reel (Pb−Free) Characteristic Symbol Max Unit SBAS16WT1G SC−70 3000 / Tape & Reel Thermal Resistance, Junction−to−Ambient R(cid:3)JA 625 °C/W (Pb−Free) One Diode Loaded NSVBAS16WT3G SC−70 10000 / Tape & Mounted on a Ceramic Substrate (Pb−Free) Reel (10 x 8 x 0.6 mm) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: March, 2014− Rev. 11 BAS16WT1/D

BAS16WT1G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit Forward Voltage VF mV (IF = 1.0 mA) − 715 (IF = 10 mA) − 866 (IF = 50 mA) − 1000 (IF = 150 mA) − 1250 Reverse Current IR (cid:2)A (VR = 100 V) − 1.0 (VR = 75 V, TJ = 150°C) − 50 (VR = 25 V, TJ = 150°C) − 30 Capacitance CD − 2.0 pF (VR = 0, f = 1.0 MHz) Reverse Recovery Time trr − 6.0 ns (IF = IR = 10 mA, RL = 50 (cid:4)) (Figure 1) Stored Charge QS − 45 PC (IF = 10 mA to VR = 6.0 V, RL = 500 (cid:4)) (Figure 2) Forward Recovery Voltage VFR − 1.75 V (IF = 10 mA, tr = 20 ns) (Figure 3) http://onsemi.com 2

BAS16WT1G 1 ns MAX t 500 (cid:4) DUT 10% trr tif 50 (cid:4) DUTY CYCLE = 2% 90% VF Irr 100 ns Figure 1. Reverse Recovery Time Equivalent Test Circuit OSCILLOSCOPE R (cid:2) 10 M(cid:2) C (cid:3) 7 pF VC 500 (cid:4) DUT BAW62 20 ns MAX VCM D1 243 pF 100 K(cid:4) t 10% VCM(cid:2)Qa C DUTY CYCLE = 2% t 90% Vf 400 ns Figure 2. Stored Charge Equivalent Test Circuit V 120 ns 1 K(cid:4) 450 (cid:4) V 90% DUT 50 (cid:4) Vfr 10% t DUTY CYCLE = 2% 2 ns MAX Figure 3. Forward Recovery Voltage Equivalent Test Circuit http://onsemi.com 3

BAS16WT1G 100 10 TA = 150°C NT (mA) 10 μENT (A) 1.0 TA = 125°C E R R R UR TA = 85°C CU TA = 85°C D C SE 0.1 R R RWA 1.0 TA = 25°C REVE TA = 55°C , FOF TA = -(cid:2)40°C I, R0.01 I TA = 25°C 0.1 0.001 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 4. Forward Voltage Figure 5. Leakage Current 0.68 F) E (p 0.64 C N A T CI PA 0.60 A C E D O DI , D 0.56 C 0.52 0 2 4 6 8 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Capacitance http://onsemi.com 4

BAS16WT1G PACKAGE DIMENSIONS SC−70 (SOT−323) CASE 419−04 ISSUE N D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. e1 2. CONTROLLING DIMENSION: INCH. MILLIMETERS INCHES 3 DIM MIN NOM MAX MIN NOM MAX A 0.80 0.90 1.00 0.032 0.035 0.040 HE E A1 0.00 0.05 0.10 0.000 0.002 0.004 1 2 A2 0.70 REF 0.028 REF b 0.30 0.35 0.40 0.012 0.014 0.016 c 0.10 0.18 0.25 0.004 0.007 0.010 D 1.80 2.10 2.20 0.071 0.083 0.087 b E 1.15 1.24 1.35 0.045 0.049 0.053 e 1.20 1.30 1.40 0.047 0.051 0.055 e e1 0.65 BSC 0.026 BSC L 0.20 0.38 0.56 0.008 0.015 0.022 HE 2.00 2.10 2.40 0.079 0.083 0.095 c A A2 0.05 (0.002) L A1 SOLDERING FOOTPRINT* 0.65 0.65 0.025 0.025 1.9 0.075 0.9 0.035 0.7 0.028 (cid:3) (cid:4) mm SCALE 10:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com BAS16WT1/D 5