BAP64LX DFN1006D-2 Silicon PIN diode Rev. 6.0 — 4 July 2018 Product data sheet 1 Product profile 1.1 General description Planar PIN diode in a SOD882D leadless ultra small plastic SMD package. 1.2 Features and benefits • High voltage, current controlled RF resistor for RF attenuators and switches • Low diode capacitance • Low forward resistance • Very low series inductance • For applications up to 3 GHz • AEC-Q101 qualified 1.3 Applications • RF attenuators and switches

NXP Semiconductors BAP64LX Silicon PIN diode 2 Pinning information Table 1. Discrete pinning Pin Description Simplified outline Symbol 1 cathode [1] 2 anode 1 2 sym006 Transparent topview [1] The marking bar indicates the cathode. 3 Ordering information Table 2. Ordering information Type number Package Name Description Version BAP64LX DFN1006D-2 leadless ultra small plastic package; 2 terminals; SOD882D body 1 x 0.6 x 0.4 mm 4 Marking Table 3. Marking codes [1] Type number Marking code BAP64LX 1111 1111 [1] For SOD882D binary marking code description, see Figure 1. 4.1 Binary marking code description CATHODEBAR READINGDIRECTION VENDORCODE READINGEXAMPLE: 0111 1011 MARKINGCODE (EXAMPLE) READINGDIRECTION 006aac477 Figure 1. SOD882D binary marking code description example BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 2 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 5 Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 60 V R I forward current - 100 mA F P total power dissipation T = 90 °C - 150 mW tot sp T storage temperature -65 +150 °C stg T junction temperature -65 +150 °C j 6 Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction 56 K/W th(j-sp) to solder point BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 3 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 7 Characteristics Table 6. Characteristics T = 25 °C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V forward voltage I = 100 mA - 0.95 1.1 V F F I reverse current V = 60 V - - 100 nA R R C diode capacitance see Figure 2; f = 1 MHz; d V = 0 V - 0.48 - pF R V = 1 V - 0.34 - pF R V = 20 V - 0.17 0.30 pF R r diode forward resistance see Figure 3; f = 100 MHz; D I = 0.5 mA - 31 50 Ω F I = 1 mA - 16 26 Ω F I = 10 mA - 2.6 4.4 Ω F I = 100 mA - 0.9 1.5 Ω F ISL isolation see Figure 4; V = 0 V; R f = 900 MHz - 22 - dB f = 1800 MHz - 16 - dB f = 2450 MHz - 14 - dB L insertion loss see Figure 5; I = 0.5 mA; ins F f = 900 MHz - 2.15 - dB f = 1800 MHz - 2.13 - dB f = 2450 MHz - 2.14 - dB L insertion loss see Figure 5; I = 1 mA; ins F f = 900 MHz - 1.21 - dB f = 1800 MHz - 1.21 - dB f = 2450 MHz - 1.22 - dB L insertion loss see Figure 5; I = 10 mA; ins F f = 900 MHz - 0.22 - dB f = 1800 MHz - 0.23 - dB f = 2450 MHz - 0.24 - dB L insertion loss see Figure 5; I = 100 mA; ins F f = 900 MHz - 0.09 - dB f = 1800 MHz - 0.1 - dB f = 2450 MHz - 0.11 - dB T charge carrier life time when switched from I = 10 mA to I = - 1.0 - µs L F R 6 mA; R = 100 Ω; measured at I = 3 L R mA BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 4 / 10

NXP Semiconductors BAP64LX Silicon PIN diode Symbol Parameter Conditions Min Typ Max Unit L series inductance I = 100 mA; f = 100 MHz - 0.4 - nH S F 7.1 Graphics 500 001aag637 102 001aag638 Cd (fF) rD 400 (Ω) 10 300 200 1 100 0 10-1 0 4 8 12 16 20 10-1 1 10 102 VR(V) IF(mA) f = 1 MHz; T = 25 °C. f = 100 MHz; T = 25 °C. j j Figure 2. Diode capacitance as a function of reverse Figure 3. Forward resistance as a function of forward voltage; typical values current; typical values 001aag639 001aag640 0 0 Lins ISL (dB) (dB) -0.5 (1) (2) -10 -1.0 (3) -1.5 -20 -2.0 (4) -30 -2.5 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 f(MHz) f (MHz) T = 25 °C T = 25 °C amb amb Diode zero biased and inserted in series with a 50 Ω 1. I = 100 mA F stripline circuit 2. I = 10 mA F 3. I = 1 mA F 4. I = 0.5 mA F Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network Figure 4. Isolation of the diode as a function of Figure 5. >Insertion loss of the diode as a function of frequency; typical values frequency; typical values BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 5 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 8 Package outline DFN1006D-2: Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm SOD882D (2x) L1 w A (2x) 1 2 b (2x) (2x) w B e A A1 y E A D (2) B Dimensions 0 0.5 1 mm scale Unit A(1) A1 b D E e L1 w y max 0.4 0.04 0.55 0.65 1.05 0.30 0.1 0.03 mm nom 0.50 0.60 1.00 0.65 0.25 min 0.45 0.55 0.95 0.22 Note 1. Dimension including plating thickness. 2. The marking bar indicates the cathode (if applicable). sod882d_po Outline References European Issue date version IEC JEDEC JEITA projection 10-09-27 SOD882D 12-05-01 Figure 6. Package outline SOD882D (DFN1006D-2) BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 6 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 9 Abbreviations Table 7. Abbreviations Acronym Description AQL acceptable quality level PIN P-type, intrinsic, N-type SMD surface mounted device S4 special inspection level 4 10 Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP64LX v.6 20180704 Product data sheet - BAP64LX v.5 Modifications: • changed max value off VR at limiting values • changed IRconditions at characteristics • adapted the layout of the data sheet BAP64LX v.5 20150512 Product data sheet - BAP64LX v.4 Modifications: • AEC-Q101 qualified BAP64LX v.4 20140416 Product data sheet - BAP64LX v.3 BAP64LX v.3 20140211 Product data sheet - BAP64LX v.2 BAP64LX v.2 20130807 Product data sheet - BAP64LX v.1 BAP64LX v.1 20070629 Product data sheet - - BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 7 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 11 Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Applications — Applications that are described herein for any of these products are for illustrative purposes only. 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It is customer’s sole responsibility to determine whether the NXP information included herein and shall have no liability for the consequences Semiconductors product is suitable and fit for the customer’s applications of use of such information. and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Short data sheet — A short data sheet is an extract from a full data sheet design and operating safeguards to minimize the risks associated with with the same product type number(s) and title. A short data sheet is their applications and products. NXP Semiconductors does not accept any intended for quick reference only and should not be relied upon to contain liability related to any default, damage, costs or problem which is based detailed and full information. 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In no event however, Limiting values — Stress above one or more limiting values (as defined in shall an agreement be valid in which the NXP Semiconductors product the Absolute Maximum Ratings System of IEC 60134) will cause permanent is deemed to offer functions and qualities beyond those described in the damage to the device. Limiting values are stress ratings only and (proper) Product data sheet. operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect 11.3 Disclaimers the quality and reliability of the device. Limited warranty and liability — Information in this document is believed Terms and conditions of commercial sale — NXP Semiconductors to be accurate and reliable. However, NXP Semiconductors does not products are sold subject to the general terms and conditions of commercial give any representations or warranties, expressed or implied, as to the sale, as published at http://www.nxp.com/profile/terms, unless otherwise accuracy or completeness of such information and shall have no liability agreed in a valid written individual agreement. In case an individual for the consequences of use of such information. NXP Semiconductors agreement is concluded only the terms and conditions of the respective takes no responsibility for the content in this document if provided by an agreement shall apply. NXP Semiconductors hereby expressly objects to information source outside of NXP Semiconductors. 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Unless otherwise agreed in writing, the product is not designed, Right to make changes — NXP Semiconductors reserves the right to authorized or warranted to be suitable for use in life support, life-critical or make changes to information published in this document, including without safety-critical systems or equipment, nor in applications where failure or limitation specifications and product descriptions, at any time and without malfunction of an NXP Semiconductors product can reasonably be expected notice. This document supersedes and replaces all information supplied prior to result in personal injury, death or severe property or environmental to the publication hereof. damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 8 / 10

NXP Semiconductors BAP64LX Silicon PIN diode applications and therefore such inclusion and/or use is at the customer's own risk. 11.4 Trademarks Export control — This document as well as the item(s) described herein Notice: All referenced brands, product names, service names and may be subject to export control regulations. Export might require a prior trademarks are the property of their respective owners. authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 9 / 10

NXP Semiconductors BAP64LX Silicon PIN diode Contents 1 Product profile ....................................................1 1.1 General description ............................................1 1.2 Features and benefits ........................................1 1.3 Applications ........................................................1 2 Pinning information ............................................2 3 Ordering information ..........................................2 4 Marking .................................................................2 4.1 Binary marking code description .......................2 5 Limiting values ....................................................3 6 Thermal characteristics ......................................3 7 Characteristics ....................................................4 7.1 Graphics .............................................................5 8 Package outline ...................................................6 9 Abbreviations ......................................................7 10 Revision history ..................................................7 11 Legal information ................................................8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2018. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 July 2018 Document identifier: BAP64LX

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: BAP64-02,115 BAP64-03,115 BAP64-06,215 BAP64-06W,115 BAP64LX,315 BAP64Q,125