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  • 型号: BAP64-03,115
  • 制造商: NXP Semiconductors
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BAP64-03,115产品简介:

ICGOO电子元器件商城为您提供BAP64-03,115由NXP Semiconductors设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 BAP64-03,115价格参考。NXP SemiconductorsBAP64-03,115封装/规格:二极管 - 射频, RF Diode PIN - Single 175V 100mA 500mW SOD-323。您可以下载BAP64-03,115参考资料、Datasheet数据手册功能说明书,资料中有BAP64-03,115 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

DIODE PIN 175V 100MA SOD-323PIN 二极管 PIN 175V 100MA

产品分类

RF 二极管分离式半导体

品牌

NXP Semiconductors

产品手册

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产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

二极管与整流器,PIN 二极管,NXP Semiconductors BAP64-03,115-

数据手册

产品型号

BAP64-03,115

PCN封装

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PCN组件/产地

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PCN设计/规格

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不同 If、F时的电阻

1.35 欧姆 @ 100mA,100MHz

不同 Vr、F时的电容

0.35pF @ 20V,1MHz

二极管类型

PIN - 单

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=563http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=684

产品目录页面

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产品种类

PIN 二极管

供应商器件封装

SOD-323

其它名称

568-1930-2
934055511115
BAP64-03 T/R

功率耗散

500 mW

功率耗散(最大值)

500mW

包装

带卷 (TR)

反向电压

175 V

商标

NXP Semiconductors

安装风格

SMD/SMT

封装

Reel

封装/外壳

SC-76,SOD-323

封装/箱体

SOD-323

工厂包装数量

3000

最大串联电阻(中频最大时)

1.35 Ohms at 100 mA

最大串联电阻(中频最小时)

40 Ohms at 0.5 mA

最大二极管电容

0.35 pF at 20 V

最大工作温度

+ 150 C

最小工作温度

- 65 C

标准包装

3,000

正向电压

1.1 V at 50 mA

正向电流

100 mA

电压-峰值反向(最大值)

175V

电流-最大值

100mA

类型

Attenuator or Switch

载流子寿命

1.55 us

配置

Single

零件号别名

BAP64-03 T/R

频率范围

SHF

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PDF Datasheet 数据手册内容提取

BAP64LX DFN1006D-2 Silicon PIN diode Rev. 6.0 — 4 July 2018 Product data sheet 1 Product profile 1.1 General description Planar PIN diode in a SOD882D leadless ultra small plastic SMD package. 1.2 Features and benefits • High voltage, current controlled RF resistor for RF attenuators and switches • Low diode capacitance • Low forward resistance • Very low series inductance • For applications up to 3 GHz • AEC-Q101 qualified 1.3 Applications • RF attenuators and switches

NXP Semiconductors BAP64LX Silicon PIN diode 2 Pinning information Table 1. Discrete pinning Pin Description Simplified outline Symbol 1 cathode [1] 2 anode 1 2 sym006 Transparent topview [1] The marking bar indicates the cathode. 3 Ordering information Table 2. Ordering information Type number Package Name Description Version BAP64LX DFN1006D-2 leadless ultra small plastic package; 2 terminals; SOD882D body 1 x 0.6 x 0.4 mm 4 Marking Table 3. Marking codes [1] Type number Marking code BAP64LX 1111 1111 [1] For SOD882D binary marking code description, see Figure 1. 4.1 Binary marking code description CATHODEBAR READINGDIRECTION VENDORCODE READINGEXAMPLE: 0111 1011 MARKINGCODE (EXAMPLE) READINGDIRECTION 006aac477 Figure 1. SOD882D binary marking code description example BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 2 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 5 Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 60 V R I forward current - 100 mA F P total power dissipation T = 90 °C - 150 mW tot sp T storage temperature -65 +150 °C stg T junction temperature -65 +150 °C j 6 Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction 56 K/W th(j-sp) to solder point BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 3 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 7 Characteristics Table 6. Characteristics T = 25 °C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V forward voltage I = 100 mA - 0.95 1.1 V F F I reverse current V = 60 V - - 100 nA R R C diode capacitance see Figure 2; f = 1 MHz; d V = 0 V - 0.48 - pF R V = 1 V - 0.34 - pF R V = 20 V - 0.17 0.30 pF R r diode forward resistance see Figure 3; f = 100 MHz; D I = 0.5 mA - 31 50 Ω F I = 1 mA - 16 26 Ω F I = 10 mA - 2.6 4.4 Ω F I = 100 mA - 0.9 1.5 Ω F ISL isolation see Figure 4; V = 0 V; R f = 900 MHz - 22 - dB f = 1800 MHz - 16 - dB f = 2450 MHz - 14 - dB L insertion loss see Figure 5; I = 0.5 mA; ins F f = 900 MHz - 2.15 - dB f = 1800 MHz - 2.13 - dB f = 2450 MHz - 2.14 - dB L insertion loss see Figure 5; I = 1 mA; ins F f = 900 MHz - 1.21 - dB f = 1800 MHz - 1.21 - dB f = 2450 MHz - 1.22 - dB L insertion loss see Figure 5; I = 10 mA; ins F f = 900 MHz - 0.22 - dB f = 1800 MHz - 0.23 - dB f = 2450 MHz - 0.24 - dB L insertion loss see Figure 5; I = 100 mA; ins F f = 900 MHz - 0.09 - dB f = 1800 MHz - 0.1 - dB f = 2450 MHz - 0.11 - dB T charge carrier life time when switched from I = 10 mA to I = - 1.0 - µs L F R 6 mA; R = 100 Ω; measured at I = 3 L R mA BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 4 / 10

NXP Semiconductors BAP64LX Silicon PIN diode Symbol Parameter Conditions Min Typ Max Unit L series inductance I = 100 mA; f = 100 MHz - 0.4 - nH S F 7.1 Graphics 500 001aag637 102 001aag638 Cd (fF) rD 400 (Ω) 10 300 200 1 100 0 10-1 0 4 8 12 16 20 10-1 1 10 102 VR(V) IF(mA) f = 1 MHz; T = 25 °C. f = 100 MHz; T = 25 °C. j j Figure 2. Diode capacitance as a function of reverse Figure 3. Forward resistance as a function of forward voltage; typical values current; typical values 001aag639 001aag640 0 0 Lins ISL (dB) (dB) -0.5 (1) (2) -10 -1.0 (3) -1.5 -20 -2.0 (4) -30 -2.5 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 f(MHz) f (MHz) T = 25 °C T = 25 °C amb amb Diode zero biased and inserted in series with a 50 Ω 1. I = 100 mA F stripline circuit 2. I = 10 mA F 3. I = 1 mA F 4. I = 0.5 mA F Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network Figure 4. Isolation of the diode as a function of Figure 5. >Insertion loss of the diode as a function of frequency; typical values frequency; typical values BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 5 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 8 Package outline DFN1006D-2: Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm SOD882D (2x) L1 w A (2x) 1 2 b (2x) (2x) w B e A A1 y E A D (2) B Dimensions 0 0.5 1 mm scale Unit A(1) A1 b D E e L1 w y max 0.4 0.04 0.55 0.65 1.05 0.30 0.1 0.03 mm nom 0.50 0.60 1.00 0.65 0.25 min 0.45 0.55 0.95 0.22 Note 1. Dimension including plating thickness. 2. The marking bar indicates the cathode (if applicable). sod882d_po Outline References European Issue date version IEC JEDEC JEITA projection 10-09-27 SOD882D 12-05-01 Figure 6. Package outline SOD882D (DFN1006D-2) BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 6 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 9 Abbreviations Table 7. Abbreviations Acronym Description AQL acceptable quality level PIN P-type, intrinsic, N-type SMD surface mounted device S4 special inspection level 4 10 Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP64LX v.6 20180704 Product data sheet - BAP64LX v.5 Modifications: • changed max value off VR at limiting values • changed IRconditions at characteristics • adapted the layout of the data sheet BAP64LX v.5 20150512 Product data sheet - BAP64LX v.4 Modifications: • AEC-Q101 qualified BAP64LX v.4 20140416 Product data sheet - BAP64LX v.3 BAP64LX v.3 20140211 Product data sheet - BAP64LX v.2 BAP64LX v.2 20130807 Product data sheet - BAP64LX v.1 BAP64LX v.1 20070629 Product data sheet - - BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 7 / 10

NXP Semiconductors BAP64LX Silicon PIN diode 11 Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes 11.2 Definitions no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers Draft — The document is a draft version only. The content is still under are responsible for the design and operation of their applications and internal review and subject to formal approval, which may result in products using NXP Semiconductors products, and NXP Semiconductors modifications or additions. NXP Semiconductors does not give any accepts no liability for any assistance with applications or customer product representations or warranties as to the accuracy or completeness of design. It is customer’s sole responsibility to determine whether the NXP information included herein and shall have no liability for the consequences Semiconductors product is suitable and fit for the customer’s applications of use of such information. and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Short data sheet — A short data sheet is an extract from a full data sheet design and operating safeguards to minimize the risks associated with with the same product type number(s) and title. A short data sheet is their applications and products. NXP Semiconductors does not accept any intended for quick reference only and should not be relied upon to contain liability related to any default, damage, costs or problem which is based detailed and full information. For detailed and full information see the on any weakness or default in the customer’s applications or products, or relevant full data sheet, which is available on request via the local NXP the application or use by customer’s third party customer(s). Customer is Semiconductors sales office. In case of any inconsistency or conflict with the responsible for doing all necessary testing for the customer’s applications short data sheet, the full data sheet shall prevail. and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by Product specification — The information and data provided in a Product customer’s third party customer(s). NXP does not accept any liability in this data sheet shall define the specification of the product as agreed between respect. NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, Limiting values — Stress above one or more limiting values (as defined in shall an agreement be valid in which the NXP Semiconductors product the Absolute Maximum Ratings System of IEC 60134) will cause permanent is deemed to offer functions and qualities beyond those described in the damage to the device. Limiting values are stress ratings only and (proper) Product data sheet. operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect 11.3 Disclaimers the quality and reliability of the device. Limited warranty and liability — Information in this document is believed Terms and conditions of commercial sale — NXP Semiconductors to be accurate and reliable. However, NXP Semiconductors does not products are sold subject to the general terms and conditions of commercial give any representations or warranties, expressed or implied, as to the sale, as published at http://www.nxp.com/profile/terms, unless otherwise accuracy or completeness of such information and shall have no liability agreed in a valid written individual agreement. In case an individual for the consequences of use of such information. NXP Semiconductors agreement is concluded only the terms and conditions of the respective takes no responsibility for the content in this document if provided by an agreement shall apply. NXP Semiconductors hereby expressly objects to information source outside of NXP Semiconductors. In no event shall NXP applying the customer’s general terms and conditions with regard to the Semiconductors be liable for any indirect, incidental, punitive, special or purchase of NXP Semiconductors products by customer. consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based No offer to sell or license — Nothing in this document may be interpreted on tort (including negligence), warranty, breach of contract or any other or construed as an offer to sell products that is open for acceptance or legal theory. Notwithstanding any damages that customer might incur for the grant, conveyance or implication of any license under any copyrights, any reason whatsoever, NXP Semiconductors’ aggregate and cumulative patents or other industrial or intellectual property rights. liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Suitability for use in automotive applications — This NXP Semiconductors. Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, Right to make changes — NXP Semiconductors reserves the right to authorized or warranted to be suitable for use in life support, life-critical or make changes to information published in this document, including without safety-critical systems or equipment, nor in applications where failure or limitation specifications and product descriptions, at any time and without malfunction of an NXP Semiconductors product can reasonably be expected notice. This document supersedes and replaces all information supplied prior to result in personal injury, death or severe property or environmental to the publication hereof. damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 8 / 10

NXP Semiconductors BAP64LX Silicon PIN diode applications and therefore such inclusion and/or use is at the customer's own risk. 11.4 Trademarks Export control — This document as well as the item(s) described herein Notice: All referenced brands, product names, service names and may be subject to export control regulations. Export might require a prior trademarks are the property of their respective owners. authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 6.0 — 4 July 2018 9 / 10

NXP Semiconductors BAP64LX Silicon PIN diode Contents 1 Product profile ....................................................1 1.1 General description ............................................1 1.2 Features and benefits ........................................1 1.3 Applications ........................................................1 2 Pinning information ............................................2 3 Ordering information ..........................................2 4 Marking .................................................................2 4.1 Binary marking code description .......................2 5 Limiting values ....................................................3 6 Thermal characteristics ......................................3 7 Characteristics ....................................................4 7.1 Graphics .............................................................5 8 Package outline ...................................................6 9 Abbreviations ......................................................7 10 Revision history ..................................................7 11 Legal information ................................................8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2018. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 July 2018 Document identifier: BAP64LX

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: BAP64-02,115 BAP64-03,115 BAP64-06,215 BAP64-06W,115 BAP64LX,315 BAP64Q,125