BAP51-06W General purpose PIN diode Rev. 01 — 26 May 2008 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in common anode configuration in a SOT323 small SMD plastic package. 1.2 Features n Two elements in common anode configuration in a small SMD plastic package n Low diode capacitance n Low diode forward resistance 1.3 Applications n general RF application 2. Pinning information Table 1. Discrete pinning Pin Description Simplified outline Graphic symbol 1 cathode 1 3 3 2 cathode 2 3 common connection 2 1 mgu320 1 2 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BAP51-06W - plastic surface-mounted package; 3 leads SOT323

BAP51-06W NXP Semiconductors General purpose PIN diode 4. Marking Table 3. Marking Type number Marking Description BAP51-06W W7* * = p: made in Hong Kong * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V reverse voltage - 50 V R I forward current - 50 mA F P total power dissipation T =90(cid:176) C - 240 mW tot sp T storage temperature - 65 +150 (cid:176) C stg T junction temperature - 65 +150 (cid:176) C j 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction 250 K/W th(j-sp) to solder point 7. Characteristics Table 6. Characteristics T = 25(cid:176) C unless otherwise specified. j Symbol Parameter Conditions Min Typ Max Unit V forward voltage I =50mA - 0.95 1.1 V F F I reverse current V =50V - - 100 nA R R C diode capacitance seeFigure1; f=1MHz d V =0V - 0.4 - pF R V =1V - 0.3 0.55 pF R V =5V - 0.2 0.35 pF R r diode forward resistance seeFigure2; f=100MHz D I =0.5mA [1] - 5.3 9 W F I =1mA [1] - 3.5 6.5 W F I =10mA [1] - 1.5 2.5 W F BAP51-06W_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 26 May 2008 2 of 8

BAP51-06W NXP Semiconductors General purpose PIN diode Table 6. Characteristics …continued T = 25(cid:176) C unless otherwise specified. j Symbol Parameter Conditions Min Typ Max Unit ISL isolation V = 0 V R f = 900 MHz - 17 - dB f = 1800 MHz - 13 - dB f = 2450 MHz - 12 - dB L insertion loss I = 0.5 mA ins F f = 900 MHz - 0.44 - dB f = 1800 MHz - 0.50 - dB f = 2450 MHz - 0.54 - dB I = 1 mA F f = 900 MHz - 0.33 - dB f = 1800 MHz - 0.39 - dB f = 2450 MHz - 0.43 - dB I = 10 mA F f = 900 MHz - 0.19 - dB f = 1800 MHz - 0.24 - dB f = 2450 MHz - 0.28 - dB t charge carrier life time whenswitchedfromI =10mAtoI =6mA; - 0.55 - m s L F R R =100W ; measured at I =3mA L R L series inductance I =100mA; f=100MHz - 1.6 - nH S F [1] Guaranteed on AQL basis: inspection level S4, AQL 1.0. 500 mld508 102 mld507 Cd (fF) rD (W ) 400 10 300 200 1 100 0 10- 1 0 4 8 12 16 20 10- 1 1 10 102 VR (V) IF (mA) f=100MHz; T =25(cid:176) C. f=100MHz; T =25(cid:176) C. j j Fig 1. Diode capacitance as a function of reverse Fig 2. Diode forward resistance as a function of voltage; typical values forward current; typical values BAP51-06W_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 26 May 2008 3 of 8

BAP51-06W NXP Semiconductors General purpose PIN diode 001aai135 001aai136 0 0 Lins ISL (dB) (dB) - 0.5 - 10 (1) (2) (3) - 1 - 20 - 1.5 - 30 - 2 - 40 - 2.5 - 50 0.5 1 1.5 2 2.5 3 0.5 1 1.5 2 2.5 3 f (GHz) f (GHz) (1) I = 10 mA Diode zero biased and inserted in series with a 50W F (2) IF = 1 mA stripline circuit; Tamb =25(cid:176) C. (3) I = 0.5 mA F Diode inserted in series with a 50W stripline circuit and biased via the analyzer Tee network. Fig 3. Insertion loss of the diode as a function of Fig 4. Isolation of the diode as a function of frequency; typical values frequency; typical values BAP51-06W_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 26 May 2008 4 of 8

BAP51-06W NXP Semiconductors General purpose PIN diode 8. Package outline Plastic surface-mounted package; 3 leads SOT323 D B E A X y HE v M A 3 Q A A1 c 1 2 e1 bp w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mAa1x bp c D E e e1 HE Lp Q v w 1.1 0.4 0.25 2.2 1.35 2.2 0.45 0.23 mm 0.1 1.3 0.65 0.2 0.2 0.8 0.3 0.10 1.8 1.15 2.0 0.15 0.13 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 04-11-04 SOT323 SC-70 06-03-16 Fig 5. Package outline SOT323 BAP51-06W_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 26 May 2008 5 of 8

BAP51-06W NXP Semiconductors General purpose PIN diode 9. Abbreviations Table 7. Abbreviations Acronym Description AQL Acceptable Quality Level PIN P-type, Intrinsic, N-type SMD Surface Mounted Device RF Radio Frequency S4 Special inspection level 4 10. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP51-06W_1 20080526 Product data sheet - - BAP51-06W_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 26 May 2008 6 of 8

BAP51-06W NXP Semiconductors General purpose PIN diode 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatus information is available on the Internet at URLhttp://www.nxp.com. 11.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft —The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications —Applications that are described herein for any of these informationincludedhereinandshallhavenoliabilityfortheconsequencesof products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet —A short data sheet is an extract from a full data sheet withthesameproducttypenumber(s)andtitle.Ashortdatasheetisintended Limiting values —Stress above one or more limiting values (as defined in forquickreferenceonlyandshouldnotbereliedupontocontaindetailedand theAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanent full information. For detailed and full information see the relevant full data damagetothedevice.Limitingvaluesarestressratingsonlyandoperationof sheet, which is available on request via the local NXP Semiconductors sales the device at these or any other conditions above those given in the office. In case of any inconsistency or conflict with the short data sheet, the Characteristics sections of this document is not implied. Exposure to limiting full data sheet shall prevail. values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold 11.3 Disclaimers subjecttothegeneraltermsandconditionsofcommercialsale,aspublished athttp://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless General —Information in this document is believed to be accurate and explicitly otherwise agreed to in writing by NXP Semiconductors. In case of reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsor any inconsistency or conflict between information in this document and such warranties,expressedorimplied,astotheaccuracyorcompletenessofsuch terms and conditions, the latter will prevail. information and shall have no liability for the consequences of use of such No offer to sell or license —Nothing in this document may be interpreted information. or construed as an offer to sell products that is open for acceptance or the Right to make changes —NXPSemiconductorsreservestherighttomake grant,conveyanceorimplicationofanylicenseunderanycopyrights,patents changes to information published in this document, including without or other industrial or intellectual property rights. limitation specifications and product descriptions, at any time and without notice.Thisdocumentsupersedesandreplacesallinformationsuppliedprior to the publication hereof. 11.4 Trademarks Suitability for use —NXP Semiconductors products are not designed, Notice:Allreferencedbrands,productnames,servicenamesandtrademarks authorized or warranted to be suitable for use in medical, military, aircraft, are the property of their respective owners. space or life support equipment, nor in applications where failure or 12. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com BAP51-06W_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 26 May 2008 7 of 8

BAP51-06W NXP Semiconductors General purpose PIN diode 13. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Contact information. . . . . . . . . . . . . . . . . . . . . . 7 13 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 May 2008 Document identifier: BAP51-06W_1

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