BAL-NRF02D3 50 ohm nominal input / conjugate match balun to nRF51822- CEAA/CDAB/CFAC and nRF51422-CEAA/CDAB/CFAC Datasheet - production data Description STMicroelectronics BAL-NRF02D3 is an ultraminiature balun. The BAL-NRF02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the following Nordic Semiconductor circuits: nRF51422-CEAA, nRF51422-CDAB, nRF51422- CFAC and nRF51822-CEAA, nRF51822-CDAB, nRF51822-CFAC. Flip-Chip(5bumps)package The BAL-NRF02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance. Features The BAL-NRF02D3 has been tested and  50 Ω nominal input / conjugate match to approved by Nordic Semiconductor in the nRFgo Nordic Semiconductor chips nRF51422- modules. CEAA, nRF51422-CDAB, nRF51422-CFAC Figure 1: Pin coordinates and nRF51822-CEAA, nRF51822-CDAB, nRF51822-CFAC  Low insertion loss  Low amplitude imbalance  Low phase imbalance  Small footprint: < 1.2 mm2 Benefits  Very low profile < 570 μm after reflow with pad 260 µm max. or < 585 μm after reflow with pad 220 µm typ.  High RF performance  RF BOM and area reduction Applications  2.45 GHz impedance matched balun filter  Optimized for Nordic's chip set nRF51422- CEAA, nRF51422-CDAB, nRF51422-CFAC and nRF51822-CEAA, nRF51822-CDAB, nRF51822-CFAC November 2017 DocID024794 Rev 8 1/11 This is information on a product in full production. www.st.com

Characteristics BAL-NRF02D3 Application Figure 2: Application schematic C1 12pF X1 16MHz C2 12pF C8 100nF 987654321 0.20.20.20.20.20.20.20.20.2 VCC_nRF PPPPPPPPP 778756655432 CBAACABBAAAA C9 1.0nF VCC_nRF BB89 VDD P0.29P0.28.P027P0.26P0.2524P0.P0.23P0.22P0.21DEC1XC21XC A1 DCC AVDD P0.30 D8 G6 P0.30 VSS P0.31 E8 G9 C7 P0.31 VSS P0.00 C9 D7 B1 100nF P0.00 VSS P0.01 E9 C1 B3 A1RF P0.01 ANT2 ANT2 SE P0.02 D9 D1 A3 P0.02 ANT1 ANT1 P0.03 F9 E1 A2 B1 P0.03 VDD_PA VDD_PAGND P0.04 F8 F1 P0.05 H9 P0.04 T DEC2 G1 P0.20 BAL-NRF02D3 P0.05 E P0.20 1C00V1n1CFC_nRF PP00..0067 HGH878 VPPD00..D00SS67SS0.08.0090.100.110.120.130.140.150.16WDIO/nRESWDCLKSSPPP000SS...111789 GHF212 PPP000...111789 C471n0F C2.32nF VVPPPPPPPPPSSVV U1 B1B4J8J7H6J6J5H5H4J4J3J2H2C8H3 nRF51822-CEAA K 0.080.090.100.110.120.130.140.150.16OWDIWDCL R1 PPPPPPPPPSS 12k 2/11 DocID024794 Rev 8

BAL-NRF02D3 Characteristics 1 Characteristics Table 1: Absolute ratings (limiting values) Value Symbol Parameter Unit Min. Typ. Max. PIN Input power RFIN - 20 dBm ESD ratings human body model (JESD22-A114-C), all I/O 2000 - one at a time while others connected to GND VESD ESD ratings charge device model (JESD22-C101-C) 500 - V ESD ratings machine model, all I/O 200 - TOP Operating temperature (JESD22-A115-C), all I/O -40 - +105 °C - Tstg Storage temperature range 55°C +150 °C Table 2: Impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. Typ. Max. ZOUT Nominal differential output impedance - matched - Ω ZIN Nominal input impedance - 50 - Ω Table 3: RF performances (Tamb = 25 °C) Value Symbol Parameter Unit Min. Typ. Max. f Frequency range (bandwidth) 2400 2540 MHz IL Insertion loss in bandwidth 1.9 dB RL Return loss in bandwidth 12 dB φimb Phase imbalance 6 ° Aimb Amplitude imbalance 0.15 dB 2f0 2nd harmonic S21 attenuation 4880 MHz 44 10 dB 3f0 3rd harmonic S21 attenuation 7320 MHz 20 dB DocID024794 Rev 8 3/11

Characteristics BAL-NRF02D3 1.1 On-board measurements Figure 3: Transmission (Tamb = 25 °C) Figure 4: Insertion loss (Tamb = 25 °C) dB dB -0 -0 -5 -0.5 -1.0 -10 -1.5 -15 -2.0 -20 -2.5 -25 F(GHz) F(GHz) -3.0 -30 0 1 2 3 4 5 6 7 8 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 5: Return loss on SE port (Tamb = 25 °C) Figure 6: Return loss on DIFF port (Tamb = 25 °C) dB dB -10 -15.0 -11 -17.5 -12 -20.0 -13 -22.5 -14 F(GHz) F(GHz) -25.0 -15 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 7: Amplitude imbalance (Tamb = 25 °C) Figure 8: Phase imbalance (Tamb = 25 °C) dB Degrees 0.5 15.0 0.4 12.5 10.0 0.3 7.5 0.2 5.0 0.1 2.5 0.0 0.0 -2.5 -0.1 -5.0 -0.2 -7.5 -0.3 -10.0 -0.4 F(GHz) -7.5 F(GHz) -0.5 -15.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 4/11 DocID024794 Rev 8

BAL-NRF02D3 Characteristics Table 4: Compatibility matrix (nRF51422) nRF51422 IC revision Packet/variant Build code 1 CEAA A0A 2 CEAA Bx0 CDAB Ax0 3 CEAA Cx0 CFAC Ax0 Table 5: Compatibility matrix (nRF51822) nRF51822 IC revision Packet/variant Build code CEAA BA 1 CEAA B0 CEAA CA0 2 CEAA DA0 CEAA Dx0 CDAB Ax0 3 CEAA Ex0 CFAC Ax0 DocID024794 Rev 8 5/11

Package information BAL-NRF02D3 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Epoxy meets UL94, V0  Lead-free package 2.1 Flip-Chip 5 bumps package information Figure 9: Flip-Chip 5 bumps package outline 6/11 DocID024794 Rev 8

BAL-NRF02D3 Package information Figure 10: Recommended land pattern Figure 11: PCB stack-up recommendation 35um 230um 35um 930um 35um 230um 35um DocID024794 Rev 8 7/11

Package information BAL-NRF02D3 2.2 Flip-chip 5 bumps packing information Figure 12: Marking Figure 13: Flip Chip tape and reel specifications More packing information is available in the application note:  AN2348 Flip-Chip: “Package description and recommendations for use”  AN4315: “BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor ultralow power transceivers” 8/11 DocID024794 Rev 8

BAL-NRF02D3 Package information Figure 14: Footprint - 3 mils stencil -non solder Figure 15: Footprint - 3 mils stencil - solder mask mask defined defined Copperpaddiameter: Soldermaskopening: 220µmrecommended 220µmrecommended 180µmminimum 180µmminimum 260µmmaximum 260µmmaximum Soldermaskopening: Copperpaddiameter: 320µmrecommended 320µmrecommended 300µmminimum 300µmminimum 340µmmaximum Solderstencilopening: Solderstencilopening: 220µmrecommended 220µmrecommended Figure 16: Footprint - 5 mils stencil -non solder Figure 17: Footprint - 5 mils stencil - solder mask mask defined defined Copperpaddiameter: 220µmrecommended Soldermaskopening: 180µmminimum 220µmrecommended 260µmmaximum 180µmminimum 260µmmaximum Soldermaskopening: Copperpaddiameter: 320µmrecommended 320µmrecommended 300µmminimum 300µmminimum 340µmmaximum Solderstencilopening: Solderstencilopening: 330µmrecommended* 330µmrecommended* *dependingonpaste,itcangodownto270µm *dependingonpaste,itcangodownto270µm DocID024794 Rev 8 9/11

Ordering information BAL-NRF02D3 3 Ordering information Table 6: Ordering information Order code Marking Package Weight Base qty. Delivery mode BAL-NRF02D3 SK Flip-Chip 5 bumps 1.44 mg 5000 Tape and reel 4 Revision history Table 7: Document revision history Date Revision Changes 02-Jul-2013 1 Initial release. 30-Aug-2013 2 Updated Table 1. 13-Oct-2014 3 Updated Figure 9. 25-Mar-2015 4 Updated cover page, added Table 4 and Table 5. 15-Jun-2015 5 Updated Table 1. 07-Dec-2016 6 Updated Table 1: "Absolute ratings (limiting values)". 02-Aug-2017 7 Updated Section 3: "Ordering information". 14-Nov-2017 8 Updated Section "Benefits". 10/11 DocID024794 Rev 8

BAL-NRF02D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID024794 Rev 8 11/11

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