BAL-NRF01D3 50 Ω nominal input / conjugate match balun to nRF51422-QFAA, nRF24LE1, nRF51822-QFAA/AB, with integrated harmonic filter Datasheet - production data Description STMicroelectronics BAL-NRF01D3 is an ultraminiature balun. The device integrates matching network and harmonics filter. Matching impedance has been customized for the following Nordic Semiconductor circuits: nRF24LE1 QFN- 32 pins, nRF24AP2-1CH, nRF24AP2-8CH, nRF51422-QFAA (build code CA/C0), nRF51822-QFAA (build code CA/C0) and nRF51822-QFAB (build code AA/A0). Lead-freeFlip-Chip(5bumps)package The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate Features to optimize RF performance.  50 Ω nominal input / conjugate match to The BAL-NRF01D3 has been tested and Nordic Semiconductor chips nRF24LE1 approved by Nordic Semiconductor in their QFN32, nRF24AP2-1CH, nRF24AP2-8CH, nRF2723 and nRF2752 nRFgo modules. nRF51422-QFAA (build code CA/C0), Figure 1: Application schematic nRF51822-QFAA (build code CA/C0) and nRF51822-QFAB (build code AA/A0) 3 2 1  Low insertion loss  Low amplitude imbalance  Low phase imbalance A DIFF GND  Small footprint < 1.5 mm2 B SE Benefits  Very low profile < 595 μm after reflow DIFF VCC C  High RF performance  RF BOM and area reduction Applications  2.45 GHz impedance matched balun filter  Optimized for Nordic's chip set nRF24LE1/AP2, nRF51422-QFAA (build code CA/C0), nRF51822-QFAA (build code CA/C0) and nRF51822-QFAB (build code AA/A0) June 2017 DocID023215 Rev 7 1/10 This is information on a product in full production. www.st.com

Characteristics BAL-NRF01D3 1 Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. Typ. Max. PIN Input power RFIN - 20 dBm ESD ratings MIL STD883C 2000 - (HBM: C = 100 pF, R = 1.5 Ω, air discharge) ESD ratings charge device model VESD (JESD22-C101-C) 500 V ESD ratings machine model 200 - (MM: C = 200 pF, R = 25 W, L = 500 nH) TOP Operating temperature -40 - +105 °C Table 2: Impedances (T = 25 °C) amb Value Symbol Parameter Unit Min. Typ. Max. Conjugate match to: nRF24LE1/AP2 nRF51422-QFAA (build code Nominal differential output CA/C0) ZOUT impedance - nRF51822-QFAA (build code - Ω CA/C0) nRF51822-QFAB (build code AA/A0) ZIN Nominal input impedance - 50 - Ω Table 3: RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. Typ. Max. F Frequency range (bandwidth) 2400 2540 2400 2540 MHz IL Insertion loss in bandwidth 2.25 dB RL Return loss in bandwidth 10 dB ɸimb Phase imbalance 3 ° Aimb Amplitude imbalance 0.1 dB 2f0 2nd harmonic filtering 4880 MHz 10 dB 3f0 3rd harmonic filtering 7320 MHz 20 dB 2/10 DocID023215 Rev 7

BAL-NRF01D3 Characteristics 1.1 RF measurement Figure 2: Transmission (Tamb = 25 °C) Figure 3: Return loss on SE port (Tamb = 25 °C) Figure 4: Return loss on DIFF port (Tamb = 25 °C) Figure 5: Amplitude imbalance (Tamb = 25 °C) Figure 6: Phase imbalance (Tamb = 25 °C) DocID023215 Rev 7 3/10

Application information BAL-NRF01D3 2 Application information Figure 7: Application schematic (courtesy of Nordic Semiconductor) BAL-NRF01D3 Figure 8: nRF2723 application board (courtesy of Nordic Semiconductor) 4/10 DocID023215 Rev 7

BAL-NRF01D3 Application information Figure 9: nRF2752 application board (courtesy of Nordic Semiconductor) BAL-NRF01D3 DocID023215 Rev 7 5/10

Package information BAL-NRF01D3 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Epoxy meets UL94, V0  Lead-free package 3.1 Flip-Chip 5 bumps package information Figure 10: Flip-Chip 5 bumps package outline X T 1 B DIFF GND B D SE Y DIFF VCC 2 B 1 B A1 A A2 A1 T1 H Table 4: Flip-Chip 5 bumps dimensions Parameter Description Min. Typ. Max. Unit X X dimension of the die 1445 1485 1525 mm Y Y dimension of the die 980 1020 1060 mm A X pitch 604 mm B Y pitch 500 mm A1 Distance from bump to edge of die on X axis 224 mm B1 Distance from bump to edge of die on Y axis 260 mm A2 Distance from VCC bump to SE bump on X axis 433 mm B2 Distance from bump to edge of die on Y axis 510 mm C GND, VCC bump to SE bump pitch 500 mm D Bump diameter 240 255 260 mm T1 Substrate thickness 425 mm H Bump height 205 mm T Total die thickness 570 630 690 6/10 DocID023215 Rev 7

BAL-NRF01D3 Package information Figure 11: Footprint - 3 mils stencil -non solder Figure 12: Footprint - 3 mils stencil - solder mask mask defined defined Copperpaddiameter: Soldermaskopening: 220µmrecommended 220µmrecommended 180µmminimum 180µmminimum 260µmmaximum 260µmmaximum Soldermaskopening: Copperpaddiameter: 320µmrecommended 320µmrecommended 300µmminimum 300µmminimum 340µmmaximum Solderstencilopening: Solderstencilopening: 220µmrecommended 220µmrecommended Figure 13: Footprint - 5 mils stencil -non solder Figure 14: Footprint - 5 mils stencil - solder mask mask defined defined Copperpaddiameter: Soldermaskopening: 220µmrecommended 220µmrecommended 180µmminimum 180µmminimum 260µmmaximum 260µmmaximum Soldermaskopening: Copperpaddiameter: 320µmrecommended 320µmrecommended 300µmminimum 300µmminimum 340µmmaximum Solderstencilopening: Solderstencilopening: 330µmrecommended* 330µmrecommended* *dependingonpaste,itcangodownto270µm *dependingonpaste,itcangodownto270µm 3.2 Flip-chip 5 bumps packing information Figure 15: Marking Dot,STlogo ECOPACKgrade xx=marking x x z z=manufacturing location yww=datecode y w w DocID023215 Rev 7 7/10

Package information BAL-NRF01D3 Figure 16: Flip Chip tape and reel specifications More packing information is available in the application note:  AN2348 Flip-Chip: “Package description and recommendations for use”  AN4111: “BAL-NRF01D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers” 8/10 DocID023215 Rev 7

BAL-NRF01D3 Ordering information 4 Ordering information Table 5: Ordering information Order code Marking Package Weight Base qty. Delivery mode BAL-NRF01D3 SC Flip-Chip package (5 bumps) 1.82 mg 5000 Tape and reel 5 Revision history Table 6: Document revision history Date Revision Changes 15-Oct-2012 1 First issue. Added references to nRF51 series. Added Figure 9. Updated y-axis 13-Nov-2012 2 labels in Figure 2. 04-Mar-2013 3 Updated footprint illustrations in Figure 13, and Figure 14. Added dimensions in Figure 10. Updated marking orientation in Figure 06-Aug-2013 4 11 and Figure 12. 13-Jan-2014 5 Updated document title and product references. 07-Jul-2015 6 Updated Table 1. Updated Figure 10: "Flip-Chip 5 bumps package outline" and Table 4: 21-Jun-2017 7 "Flip-Chip 5 bumps dimensions". DocID023215 Rev 7 9/10

BAL-NRF01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 10/10 DocID023215 Rev 7