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ICGOO电子元器件商城为您提供B82464A4682M由EPCOS设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供B82464A4682M价格参考以及EPCOSB82464A4682M封装/规格参数等产品信息。 你可以下载B82464A4682M参考资料、Datasheet数据手册功能说明书, 资料中有B82464A4682M详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
DC电阻(DCR) | 27 毫欧最大 |
描述 | INDUCTOR POWER 6.8UH 3.5A SMD固定电感器 6.8uH 3.5A 20% 10x10.4mm SMD |
产品分类 | |
品牌 | EPCOS |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 固定电感器,EPCOS B82464A4682MB82464A4 |
数据手册 | |
产品型号 | B82464A4682M |
不同频率时的Q值 | - |
产品 | SMD Power Inductor |
产品目录绘图 | |
产品目录页面 | |
产品种类 | 固定电感器 |
供应商器件封装 | - |
其它名称 | 495-2017-1 |
包装 | 剪切带 (CT) |
商标 | EPCOS |
外壳宽度 | 10.4 mm |
外壳长度 | 10.4 mm |
外壳高度 | 4.8 mm |
大小/尺寸 | 0.409" 长 x 0.409" 宽 (10.40mm x 10.40mm) |
安装类型 | 表面贴装 |
容差 | 20 % |
封装 | Reel |
封装/外壳 | 非标准 |
屏蔽 | 无屏蔽 |
工作温度 | - |
工作温度范围 | - 55 C to + 150 C |
工具箱 | /product-detail/zh/B82464X004/495-1683-ND/697358 |
工厂包装数量 | 750 |
最大直流电流 | 3.5 A |
最大直流电阻 | 27 mOhms |
材料-磁芯 | 铁氧体 |
标准包装 | 1 |
电感 | 6.8 uH |
电流-饱和值 | 4.7A |
端接类型 | SMD/SMT |
类型 | SMT Power Inductors |
系列 | B82464A4 |
芯体材料 | Ferrite |
零件号别名 | B82464A4682M000 |
频率-测试 | 100kHz |
频率-自谐振 | 100kHz |
额定电流 | 3.5A |
高度-安装(最大值) | 0.189"(4.80mm) |
SMT power inductors Size 10.4 (cid:117) 10.4 (cid:117) 4.8 (mm) Series/Type: B82464A4 Date: September 2019 aa~~íí~~==ppÜÜÉÉÉÉíí (cid:164)(cid:3)TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited.
SMT power inductors B82464A4 Size 10.4 x 10.4 x 4.8 (mm) Rated inductance 1 ... 1000 μH Rated current 0.33 ... 7 A Construction ■ Ferrite core ■ Winding: enamel copper wire ■ Winding welded to terminals Features ■ Temperature range up to +150 °C ■ High rated current ■ Low DC resistance ■ Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D ■ Qualified to AEC-Q200 ■ RoHS-compatible Applications ■ Filtering of supply voltages ■ Coupling, decoupling ■ DC/DC converters ■ Automotive electronics ■ Industrial electronics Terminals ■ Base material CuFe2P ■ Layer composition Ag, Sn (lead-free) ■ Electro-plated Marking ■ Marking on component: Manufacturer, L value (nH, coded), L tolerance (coded), manufacturing date (YWWD), two last digits of work order ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 16-mm blister tape, wound on 330-mm (cid:135) reel ■ Packing unit: 750 pcs./reel Please read Cautions and warnings and 2 09/19 Important notes at the end of this document.
SMT power inductors B82464A4 Size 10.4 x 10.4 x 4.8 (mm) Dimensional drawing and layout recommendation Dimensions in mm Taping and packing Blister tape Reel Dimensions in mm Please read Cautions and warnings and 3 09/19 Important notes at the end of this document.
SMT power inductors B82464A4 Size 10.4 x 10.4 x 4.8 (mm) Technical data and measuring conditions Rated inductance L Measured with impedance analyzer Agilent 4294A or R equivalent at frequency f , 0.1 V, +20 °C L Operating temperature range –55 ... + 150 °C Rated current I Max. permissible DC with temperature increase of (cid:100) 40 K temp,typ at +85 °C Saturation current I Max. permissible DC with inductance decrease sat (cid:39)L/L of approx. 10% 0 DC resistance R Measured at +20 °C max Solderability (lead-free) Dip and look method Sn95.5Ag3.8Cu0.7: +(245 (cid:114)5) °C, (5 (cid:114)0.3) s Wetting of soldering area (cid:116)(cid:3)90% (based on IEC 60068-2-58) Resistance to soldering heat +260 °C, 40 s (as referenced in JEDEC J-STD 020D) Climatic category 55/150/56 (to IEC 60068-1) Storage conditions Mounted: –55 °C … +150 °C Packaged: –25 °C … +40 °C, (cid:100)(cid:3)75% RH Weight Approx. 1.1 g Please read Cautions and warnings and 4 09/19 Important notes at the end of this document.
SMT power inductors B82464A4 Size 10.4 x 10.4 x 4.8 (mm) Characteristics and ordering codes L Tolerance f I I I R R Ordering code R L sat,typ sat,min temp,typ max typ (cid:80)H MHz A A A (cid:58) (cid:58) 1.0 (cid:114)20% ^ M 0.1 11.34 11.00 7.00 0.0090 0.0056 B82464A4102M000 1.5 0.1 9.80 9.80 6.50 0.0100 0.0080 B82464A4152M000 2.2 0.1 8.40 8.40 5.70 0.0120 0.0093 B82464A4222M000 3.3 0.1 6.65 6.60 4.90 0.0150 0.0125 B82464A4332M000 4.7 0.1 5.72 5.60 4.30 0.0180 0.0142 B82464A4472M000 6.8 0.1 4.80 4.70 3.50 0.0270 0.0210 B82464A4682M000 10 0.1 3.90 3.90 2.90 0.0380 0.0310 B82464A4103M000 15 (cid:114)10% ^ K 0.1 3.35 3.20 2.50 0.0460 0.0450 B82464A4153K000 22 0.1 2.60 2.60 2.10 0.0850 0.0650 B82464A4223K000 33 0.1 2.20 2.20 1.80 0.1000 0.0890 B82464A4333K000 47 0.1 1.90 1.80 1.50 0.1400 0.1190 B82464A4473K000 68 0.1 1.51 1.50 1.25 0.2000 0.1770 B82464A4683K000 100 0.1 1.20 1.20 1.03 0.2800 0.2500 B82464A4104K000 150 0.1 1.10 1.00 0.86 0.4000 0.3800 B82464A4154K000 220 0.1 0.85 0.85 0.69 0.6100 0.5700 B82464A4224K000 330 0.1 0.70 0.70 0.58 1.0000 0.8600 B82464A4334K000 470 0.1 0.58 0.55 0.50 1.2700 1.1200 B82464A4474K000 680 0.1 0.46 0.45 0.40 2.0000 1.6800 B82464A4684K000 1000 0.1 0.38 0.38 0.33 3.0000 2.7000 B82464A4105K000 Please read Cautions and warnings and 5 09/19 Important notes at the end of this document.
SMT power inductors B82464A4 Size 10.4 x 10.4 x 4.8 (mm) Impedance |Z| versus frequency f Inductance L versus DC load current I DC measured with impedance analyzer measured with LCR meter Agilent 4285A, Agilent 4294A, typical values at +20 °C typical values at +20 °C Current derating I /I op R versus ambient temperature T A (rated temperature T = +85 °C) R Please read Cautions and warnings and 6 09/19 Important notes at the end of this document.
Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire, wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. – Many coating materials have a negative effect (chemically and mechanically) on the winding wires, insulation materials and connecting points. Customers are always obligated to determine whether and to what extent their coating materials influence the component. Customers are responsible and bear all risk for the use of the coating material. TDK Electronics does not assume any liability for failures of our components that are caused by the coating material. ■ Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. Please read Cautions and warnings and 7 09/19 Important notes at the end of this document.
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical require- ments that are often placed on our products in the areas of application concerned. We never- theless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the cus- tomers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or fail- ure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the mal- function or failure of an electronic component could endanger human life or health (e.g. in acci- dent prevention or life-saving systems), it must therefore be ensured by means of suitable de- sign of the customer application or other action taken by the customer (e.g. installation of pro- tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this pub- lication may contain substances subject to restrictions in certain jurisdictions (e.g. be- cause they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequent- ly, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 8 09/19
Important notes 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality manage- ment system in the automotive industry. Referring to customer requirements and customer spe- cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in- dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re- quirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun- tries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2018-10 9 09/19
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