Film Capacitors EMI Suppression Capacitors (MKP) Series/Type: B81123 Date: June 2018 ©EPCOSAG2018.Reproduction,publicationanddisseminationofthispublication,enclosuresheretoandthe informationcontainedthereinwithoutEPCOS'priorexpressconsentisprohibited. EPCOSAGisaTDKGroupCompany.

EMI suppression capacitors (MKP) B81123 Y1 / 500 V AC Typical applications Dimensional drawing Y1 class for interference suppression "Line to ground" applications Double insulation Climatic Max. operating temperature: 110 °C Climatic category (IEC 60068-1:2013): 40/110/56 Construction Dielectric: polypropylene (MKP) Internal series connection Dimensions in mm Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0) Lead spacing Lead diameter d 1 ±0.4 Features 15, 22.5 0.8 Self-healing properties RoHS-compatible Marking example AEC-Q200D compliant (position of marks may vary): Terminals Parallel wire leads, lead-free tinned Standard lead lengths: 6 (cid:4)1 mm Special lead lengths available on request Marking Manufacturer's logo, lot number, date code, rated capacitance (coded), cap. tolerance (code letter), rated AC voltage, series number, sub-class (Y1), dielectric code (MKP), climatic category, passive flammability category, approvals. Delivery mode Bulk (untaped) Taped (Ammo pack or reel) For taping details, refer to chapter "Taping and packing". PleasereadCautionsandwarningsand Page2of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Approvals Approval Standards Certificate marks EN 60384-14:2014 ENEC-01093 IEC 60384-14:2013 EN 60384-14:2014 138584 IEC 60384-14:2013 UL 1414:2000 E97863 UL 60384-14:2014 E97863 (approved by UL) CSA E60384-14:2013 Notes: Effective January 2014, only for EMI supression capacitors: (cid:4) UL 60384-14:2014 certification replaces both UL 1414:2000 and UL 1283:2005 standards. (cid:4) CSA C22.2 No.1:2004 and CSA C22.2 No.8:2013 are replaced by CSA E60384-14:2013. (cid:4) References like 1414, 1283 are removed from the capacitor marking. Capacitors under UL 1414:2000, UL 1283:2005 produced during or before 2013, are accepted under UL scope. Capacitors under CSA C22.2 No.1:2004 / CSA C22.2 No.8:2013 produced during or before 2013, are accepted under UL scope. Overview of available types Lead spacing 15 mm 22.5 mm C (μF) R 0.0010 0.0015 0.0022 0.0033 0.0047 0.0056 0.0068 0.010 PleasereadCautionsandwarningsand Page3of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Ordering codes and packing units Lead C Max. dimensions Ordering code Ammo Reel Untaped R spacing w × h × l (composition see pack mm μF mm below) pcs./MOQ pcs./MOQ pcs./MOQ 15 0.0010 5.0 × 10.5 × 18.0 B81123C1102M*** 4680 5200 4000 0.0015 6.0 × 11.0 × 18.0 B81123C1152M*** 3840 4400 4000 0.0022 7.0 × 12.5 × 18.0 B81123C1222M*** 3320 3600 4000 0.0033 8.5 × 14.5 × 18.0 B81123C1332M*** 2720 2800 2000 0.0047 9.0 × 17.5 × 18.0 B81123C1472M*** 2560 2800 2000 22.5 0.0056 7.0 × 16.0 × 26.5 B81123C1562M*** 2320 2400 2520 0.0068 8.5 × 16.5 × 26.5 B81123C1682M*** 1920 2000 2040 0.010 10.5 × 18.5 × 26.5 B81123C1103M*** 1560 1600 2160 MOQ = Minimum Order Quantity, consisting of 4 packing units. Compositionoforderingcode += Capacitancetolerancecode: ***= Packagingcode: M=±20% 289= Straightterminals,Ammopack 189= Straightterminals,Reel 003= Straightterminals,untaped (leadlength3.2±0.3mm) 000= Straightterminals,untaped (leadlength6(cid:4)1mm) PleasereadCautionsandwarningsand Page4of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Technical data Reference standard: IEC 60384-14:2013 / UL 60384-14:2014. All data given at T = 20 °C, unless otherwise specified. Max. operating temperature T +110 °C op,max Dissipation factor tan δ (in 10-3) at 1 kHz 1.0 at 20 °C (upper limit values) at 100 kHz 5.0 Insulation resistance R or time 30 000 MΩ ins constant τ = CR (cid:5) Rins at 20 °C, rel. humidity ≤ 65% (minimum as-delivered values) DC test voltage 4800 V, 2 s The repetition of this DC voltage test may damage the capacitor. Special care must be taken in case of use several capacitors in a parallel configuration. Passive flammability category B Maximum continuous AC voltage V 750 V (50/60 Hz) AC Rated AC voltage (UL 500 V (50/60 Hz) 60384-14:2014) Maximum continuous DC voltage V 3000 V DC T ≤ 110 °C V = V (continuously) op op AC temperature Top ≤ 110 °C Vop = 1.25 (cid:5) VAC (1000 h) Damp heat test 56 days / 40 °C / 93% relative humidity Limit values after damp heat test Capacitance change (cid:6)ΔC/C(cid:6) ≤ 5% Dissipation factor change Δ tan δ ≤ 5.10-3 (at 1 kHz) ≤ 1.0 (cid:5) 10-3 (at 100 kHz) Insulation resistance R ≥ 50% of minimum ins or time constant τ = CR (cid:5) Rins as-delivered values PleasereadCautionsandwarningsand Page5of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/μs. "k " represents the maximum permissible pulse characteristic of the waveform applied to the 0 capacitor, expressed in V2/μs. Note: The values of dV/dt and k provided below must not be exceeded in order to avoid damaging the 0 capacitor. dV/dt and k values 0 Lead spacing 15 mm 22.5 mm dV/dt in V/μs 3 000 1 000 k in V2/μs 2 100 000 700 000 0 Impedance Z versus frequency f (typical values) PleasereadCautionsandwarningsand Page6of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Testing and Standards Test Reference Conditions of test Performance requirements Electrical IEC Voltage Proof: Within specified limits parameters 60384-14:2013 Between terminals: 4000 V AC, 1 min Terminals and enclosure: 4000 V AC, 1 min Insulation resistance, R ins Capacitance, C Dissipation factor, tan δ Robustness IEC Tensile strength (test Ua1) Capacitance and tan δ of termina- 60068-2-21:2006 Wire diameter Tensile within specified limits tions force 0.5 < d ≤ 0.8 mm 10 N 1 0.8 < d ≤ 1.25 mm 20 N 1 Resistance IEC Solder bath temperature at ΔC/C ≤ 5% 0 to soldering 60068-2-20:2008, 260 ±5 °C, immersion for tan δ within specified limits heat test Tb, 10 seconds method 1A Rapid IEC T = lower category temperature No visible damage A change of 60384-14:2013 TB = upper category temperature (cid:6)ΔC/C0(cid:6) ≤ 5% temperature Five cycles, duration t = 30 min. tan δ within specified limits Vibration IEC Test F : vibration sinusoidal No visible damage C 60384-14:2013 Displacement: 0.75 mm Accleration: 98 m/s2 Frequency: 10 Hz ... 500 Hz Test duration: 3 orthogonal axes, 2 hours each axe Bump IEC Test Eb: Total 4000 bumps with No visible damage 60384-14:2013 400 m/s2 mounted on PCB (cid:6)ΔC/C0(cid:6) ≤ 5% 6 ms duration tan δ within specified limits Climatic IEC Dry heat Tb / 16 h No visible damage sequence 60384-14:2013 Damp heat cyclic, 1st cycle (cid:6)ΔC/C0(cid:6) ≤ 5% +55 °C / 24 h / 95% ... 100% RH (cid:6)Δ tan δ(cid:6) ≤ 0.008 for C ≤ 1 μF Cold Ta / 2 h (cid:6)Δ tan δ(cid:6) ≤ 0.005 for C > 1 μF Damp heat cyclic, 5 cycles Voltage proof +55 °C / 24 h / 95% ... 100% RH R ≥ 50% of initial limit ins PleasereadCautionsandwarningsand Page7of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Test Reference Conditions of test Performance requirements Damp heat, IEC Test Ca No visible damage steady 60384-14:2013 40 °C / 93% RH / 56 days (cid:6)ΔC/C0(cid:6) ≤ 5% state (cid:6)Δ tan δ(cid:6) ≤ 0.008 for C ≤ 1 μF (cid:6)Δ tan δ(cid:6) ≤ 0.005 for C > 1 μF Voltage proof R ≥ 50% of initial limit ins Impulse IEC 3 impulses No visible damage test 60384-14:2013 Tb / 1.7 VR / 1000 hours, (cid:6)ΔC/C0(cid:6) ≤ 10% Endurance 1000 V for 0.1 s every hour (cid:6)Δ tan δ(cid:6) ≤ 0.008 for C ≤ 1 μF RMS (cid:6)Δ tan δ(cid:6) ≤ 0.005 for C > 1 μF Voltage proof R ≥ 50% of initial limit ins Passive IEC Flame applied for a period of B flammability 60384-14:2013 time depending on capacitor volume Mounting guidelines 1 Soldering 1.1 Solderability of leads The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature 235 ±5 °C Soldering time 2.0 ±0.5 s Immersion depth 2.0 +0/(cid:4)0.5 mm from capacitor body or seating plane Evaluation criteria: Wetting of wire surface by new solder ≥90%, Visual inspection free-flowing solder PleasereadCautionsandwarningsand Page8of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC 1.2 Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1. Conditions: Series Solder bath temperature Soldering time MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C 10 ±1 s coated uncoated (lead spacing >10 mm) MFP MKP (lead spacing >7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) 5 ±1 s MKP (lead spacing ≤7.5 mm) <4 s MKT uncoated (lead spacing ≤10 mm) recommended soldering insulated (B32559) profile for MKT uncoated (lead spacing ≤ 10 mm) and insulated (B32559) Immersion depth 2.0 +0/(cid:4)0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage 2% for MKT/MKP/MFP ΔC/C 0 5% for EMI suppression capacitors tan δ As specified in sectional specification PleasereadCautionsandwarningsand Page9of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC 1.3 General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate- gory temperature T . Long exposure to temperatures above this type-related temperature limit max can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable coun- termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommendations As a reference, the recommended wave soldering profile for our film capacitors is as follows: PleasereadCautionsandwarningsand Page10of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Body temperature should follow the description below: MKP capacitor During pre-heating: T ≤110 °C p During soldering: T ≤120 °C, t ≤45 s s s MKT capacitor During pre-heating: T ≤125 °C p During soldering: T ≤160 °C, t ≤45 s s s When SMD components are used together with leaded ones, the film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. In order to ensure proper conditions for manual or selective soldering, the body temperature of the capacitor (T ) must be ≤120 °C. s One recommended condition for manual soldering is that the tip of the soldering iron should be <360 °C and the soldering contact time should be no longer than 3 seconds. For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea- sures are recommended: pre-heating to not more than 110 °C in the preheater phase rapid cooling after soldering Please refer to EPCOS Film Capacitor Data Book in case more details are needed. PleasereadCautionsandwarningsand Page11of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. Consult us if application is with severe temperature and humidity condition. There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or any attempts to open or repair the capacitor will void the warranty and liability of EPCOS. Please note that the standards referred to in this publication may have been revised in the meantime. The table below summarizes the safety instructions that must always be observed. A detailed de- scription can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". Topic Safety information Reference chapter "General technical information" Storage Make sure that capacitors are stored within the specified 4.5 conditions range of time, temperature and humidity conditions. "Storage conditions" Flammability Avoid external energy, such as fire or electricity (passive 5.3 flammability), avoid overload of the capacitors (active "Flammability" flammability) and consider the flammability of materials. Resistance to Do not exceed the tested ability to withstand vibration. 5.2 vibration The capacitors are tested to IEC 60068-2-6:2007. "Resistance to EPCOS offers film capacitors specially designed for vibration" operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics". Topic Safety information Reference chapter "Mounting guidelines" Soldering Do not exceed the specified time or temperature limits 1 "Soldering" during soldering. Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning" PleasereadCautionsandwarningsand Page12of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Topic Safety information Reference chapter "Mounting guidelines" Embedding of When embedding finished circuit assemblies in plastic 3 "Embedding of capacitors in resins, chemical and thermal influences must be taken capacitors in finished finished into account. assemblies" assemblies Caution: Consult us first, if you also wish to embed other uncoated component types! Design of EMI Capacitors EPCOS EMI capacitors use polypropylene (PP) film metalized with a thin layer of Zinc (Zn). The following key points have made this design suitable to IEC/UL testing, holding a minimum size. Overvoltage AC capability with very high temperature Endurance test of IEC 60384-14:2013 (4 edition) / UL 60384-14:2014 (2nd edition) must be performed at 1.25 × V at maximum tem- th R perature, during 1000 hours, with a capacitance drift less than 10%. Higher breakdown voltage withstanding if compared to other film metallizations, like Aluminum. IEC 60384-14:2013 (4th edition) / UL 60384-14:2014 (2nd edition) establishes high voltage tests performed at 4.3 × VR (cid:4)1 minute, impulse testing at 2500 V for C = 1 μF and active flammability tests. Damp heat steady state: 40 °C/ 93% RH / 56 days. (without voltage or current load) Effect of humidity on capacitance stability Long contact of a film capacitor with humidity can produce irreversible effects. Direct contact with liquid water or excess exposure to high ambient humidity or dew will eventually remove the film metallization and thus destroy the capacitor. Plastic boxed capacitors must be properly tested in the final application at the worst expected conditions of temperature and humidity in order to check if any parameter drift may provoke a circuit malfunction. In case of penetration of humidity through the film, the layer of Zinc can be degraded, specially under AC operation (change of polarity), accelerated by the temperature, provoking an increment of the serial resistance of the electrode and eventually a reduction of the capacitance value. For DC operation, the parameter drift is much less. Plastic boxes and resins can not protect 100% against humidity. Metal enclosures, resin potting or coatings or similar measures by customers in their applications will offer additional protection against humidity penetration. Display of ordering codes for EPCOS products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications and the website of EPCOS, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the or- dering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes. PleasereadCautionsandwarningsand Page13of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Symbols and terms Symbol English German α Heat transfer coefficient Wärmeübergangszahl α Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität C A Capacitor surface area Kondensatoroberfläche β Humidity coefficient of capacitance Feuchtekoeffizient der Kapazität C C Capacitance Kapazität C Rated capacitance Nennkapazität R ΔC Absolute capacitance change Absolute Kapazitätsänderung ΔC/C Relative capacitance change (relative Relative Kapazitätsänderung (relative deviation of actual value) Abweichung vom Ist-Wert) ΔC/C Capacitance tolerance (relative deviation Kapazitätstoleranz (relative Abweichung R from rated capacitance) vom Nennwert) dt Time differential Differentielle Zeit Δt Time interval Zeitintervall ΔT Absolute temperature change Absolute Temperaturänderung (self-heating) (Selbsterwärmung) Δtan δ Absolute change of dissipation factor Absolute Änderung des Verlustfaktors ΔV Absolute voltage change Absolute Spannungsänderung dV/dt Time differential of voltage function (rate Differentielle Spannungsänderung of voltage rise) (Spannungsflankensteilheit) ΔV/Δt Voltage change per time interval Spannungsänderung pro Zeitintervall E Activation energy for diffusion Aktivierungsenergie zur Diffusion ESL Self-inductance Eigeninduktivität ESR Equivalent series resistance Ersatz-Serienwiderstand f Frequency Frequenz f Frequency limit for reducing permissible Grenzfrequenz für thermisch bedingte 1 AC voltage due to thermal limits Reduzierung der zulässigen Wechselspannung f Frequency limit for reducing permissible Grenzfrequenz für strombedingte 2 AC voltage due to current limit Reduzierung der zulässigen Wechselspannung f Resonant frequency Resonanzfrequenz r F Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur D Diffusion F Derating factor Deratingfaktor T i Current (peak) Stromspitze I Category current (max. continuous Kategoriestrom (max. Dauerstrom) C current) PleasereadCautionsandwarningsand Page14of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Symbol English German I (Sinusoidal) alternating current, (Sinusförmiger) Wechselstrom RMS root-mean-square value i Capacitance drift Inkonstanz der Kapazität z k Pulse characteristic Impulskennwert 0 L Series inductance Serieninduktivität S λ Failure rate Ausfallrate λ Constant failure rate during useful Konstante Ausfallrate in der 0 service life Nutzungsphase λ Failure rate, determined by tests Experimentell ermittelte Ausfallrate test P Dissipated power Abgegebene Verlustleistung diss P Generated power Erzeugte Verlustleistung gen Q Heat energy Wärmeenergie ρ Density of water vapor in air Dichte von Wasserdampf in Luft R Universal molar constant for gases Allg. Molarkonstante für Gas R Ohmic resistance of discharge circuit Ohmscher Widerstand des Entladekreises R Internal resistance Innenwiderstand i R Insulation resistance Isolationswiderstand ins R Parallel resistance Parallelwiderstand P R Series resistance Serienwiderstand S S severity (humidity test) Schärfegrad (Feuchtetest) t Time Zeit T Temperature Temperatur τ Time constant Zeitkonstante tan δ Dissipation factor Verlustfaktor tan δ Dielectric component of dissipation Dielektrischer Anteil des Verlustfaktors D factor tan δ Parallel component of dissipation factor Parallelanteil des Verlfustfaktors P tan δ Series component of dissipation factor Serienanteil des Verlustfaktors S T Temperature of the air surrounding the Temperatur der Luft, die das Bauteil A component umgibt T Upper category temperature Obere Kategorietemperatur max T Lower category temperature Untere Kategorietemperatur min t Operating life at operating temperature Betriebszeit bei Betriebstemperatur und OL and voltage -spannung T Operating temperature, T + ΔT Beriebstemperatur, T + ΔT op A A T Rated temperature Nenntemperatur R T Reference temperature Referenztemperatur ref t Reference service life Referenz-Lebensdauer SL PleasereadCautionsandwarningsand Page15of18 Importantnotesattheendofthisdocument.

B81123 Y1 / 500 V AC Symbol English German V AC voltage Wechselspannung AC V Category voltage Kategoriespannung C V Category AC voltage (Sinusförmige) C,RMS Kategorie-Wechselspannung V Corona-discharge onset voltage Teilentlade-Einsatzspannung CD V Charging voltage Ladespannung ch V DC voltage Gleichspannung DC V Fly-back capacitor voltage Spannung (Flyback) FB V Input voltage Eingangsspannung i V Output voltage Ausgangssspannung o V Operating voltage Betriebsspannung op V Peak pulse voltage Impuls-Spitzenspannung p V Peak-to-peak voltage Impedance Spannungshub pp V Rated voltage Nennspannung R Amplitude of rated AC voltage Amplitude der Nenn-Wechselspannung R V (Sinusoidal) alternating voltage, (Sinusförmige) Wechselspannung RMS root-mean-square value V S-correction voltage Spannung bei Anwendung "S-correction" SC V Snubber capacitor voltage Spannung bei Anwendung sn "Beschaltung" Z Impedance Scheinwiderstand Lead spacing Rastermaß PleasereadCautionsandwarningsand Page16of18 Importantnotesattheendofthisdocument.

Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bent on the customer to check and decide whether an EPCOS product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Ma- terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de- tailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). Page17of18

Important notes 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun- tries. Further information will be found on the Internet at www.epcos.com/trademarks. Release 2018-06 Page18of18

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: E PCOS / TDK: B81123C1102M B81123C1103M B81123C1222M B81123C1332M B81123C1472M B81123C1562M B81123C1682M B81123C1102M189 B81123C1152M B81123C1222M189 B81123C1102M289 B81123C1472M289 B81123C1152M189 B81123C1332M189 B81123C1472M189 B81123C1103M189 B81123C1222M289 B81123C1152M289 B81123C1472M000 B81123C1562M000