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参数 | 数值 |
产品目录 | |
描述 | VARISTOR 6.4V 30A 0603ESD 抑制器 CeraDiode CDS3C05GTA |
产品分类 | |
品牌 | EPCOS Inc |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | EPCOS B72500D50A60- |
数据手册 | |
产品型号 | B72500D50A60 |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=15733http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=26133 |
产品目录绘图 | |
产品目录页面 | |
产品种类 | ESD 抑制器 |
其它名称 | 495-3414-2 |
击穿电压 | 6.4 V |
包装 | 带卷 (TR) |
变阻器电压 | 6.4V |
商标 | EPCOS |
封装 | Reel |
封装/外壳 | 0603(1608 公制) |
封装/箱体 | 0603 (1608 metric) |
工作温度范围 | - 40 C to + 85 C |
工作电压 | 5.6 V |
工厂包装数量 | 4000 |
最大AC电压 | - |
最大DC电压 | 5.6VDC |
标准包装 | 4,000 |
电容 | 470 pF |
电流-浪涌 | 30A |
电路数 | 1 |
端接类型 | SMD/SMT |
系列 | CeraDiodes Standard |
能量 | - |
通道 | 1 Channel |
钳位电压 | 19 V |
零件号别名 | B72500D0050A060 CDS3C05GTA |
CeraDiodes Standard series Series/Type: Date: April2016 ©EPCOSAG2016.Reproduction,publicationanddisseminationofthispublication,enclosuresheretoandthe informationcontainedthereinwithoutEPCOS'priorexpressconsentisprohibited. EPCOSAGisaTDKGroupCompany.
CeraDiodes Standardseries EPCOStypedesignation CD S 2 C05 GTA CD(cid:4)CeraDiode Device S(cid:4)Singledevice A(cid:4)Arraydevice Casesizesofsingledevices Code Casesize (inch/mm) 1 0201/0603 2 0402/1005 3 0603/1608 4 1003/2508 Casesizesofarraydevices Code Casesize (inch/mm) 3 0506/1216 4 0508/1220 5 0612/1632 6 1012/2532 Ratedvoltage Code VDC 040 4 050 5.5/5.6 090 9 120 12 150 15 160 16 180 18 200 20/22 300 30 360 36 480 48 700 70 900 90 201 200 Type GTA(cid:4)Standard GTB(cid:4)LED GTH(cid:4)High-speed HDMI1(cid:4)Capacitancevalue<1pF HDMI2(cid:4)Capacitancevalue<1pF PleasereadCautionsandwarningsand Page2of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Orderingcodesystem B72590 D 0050 A0 60 Type,casesizesanddevice Chipsize Device Orderingcode (inch/mm) 0201/0603 Single B72440... 0402/1005 Single B72590... 0603/1608 Single B72500... 1003/2508 Single B72570... 0506/1216 Array B72755... 0508/1220 Array B72714... 0612/1632 Array B72724... 1012/2532 Array B72735... D(cid:4)CeraDiode Ratedvoltage Code VDC 0040 4 0050 5.5/5.6 0090 9 0120 12 0150 15 0160 16 0180 18 0200 20/22 0300 30 0360 36 0480 48 0700 70 0900 90 0201 200 Type A0(cid:4)Standard B0(cid:4)LED H0(cid:4)High-speed H1(cid:4)Capacitancevalue<1pF H2(cid:4)Capacitancevalue<1pF Packaging 60(cid:4)Cardboardtape,180-mmreel 62(cid:4)Blistertape,180-mmreel 70(cid:4)Cardboardtape,330-mmreel 72(cid:4)Blistertape,330-mmreel PleasereadCautionsandwarningsand Page3of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Features Singlechip ESDprotectiontoIEC61000-4-2,level4 BidirectionalESDprotectioninonecomponent NochangeinESDprotectionperformanceattemperatures upto85(cid:176) C(temperaturederating) UseofparasiticcapacitanceforEMIsuppressionand 4-foldarray high-frequencyfiltering(replacementofadditionalMLCC) Highsurgecurrentcapability Lowparasiticinductance Lowleakagecurrent Fastresponsetime<0.5ns Lead-freenickelbarrierterminationssuitableforlead-freesoldering RoHS-compatible Applications Interfaces,datalines,powerlinesandaudiolines,pushbuttons, serialports,ICsandI/Oports Consumerelectronicproducts(TV,DVDplayer/recorder,set-top box,gameconsoles,MP3player,digitalstill/videocamera,etc.) EDPproducts(desktopandnotebookcomputer,monitor,PDA, printer,memorycard,controlunit,headset,speaker,HDD,optical drive,etc.) Industrialapplications Design Multilayertechnology Nickelbarriertermination(Ag/Ni/Sn)forlead-freesoldering Marking Duetothesymmetricalconfigurationnomarkinginformationis needed. Generaltechnicaldata MaximumDCoperatingvoltage V 5.5...22 V DC,max Typicalcapacitance C 1.5...470 pF typ AirdischargeESDcapability toIEC61000-4-2 V 15 kV ESD,air ContactdischargeESDcapability toIEC61000-4-2 V 8 kV ESD,contact Leakagecurrent1) (V =5.6V) I 1 m A leak leak Operatingtemperature (withoutderating) Top (cid:5)40/+85 (cid:176) C Storagetemperature LCT/UCT (cid:5)40/+125 (cid:176) C 1) ExceptCDS2C05GTAandCDS3C05GTAVleak=3.3V.AnyoperatingvoltagelowerthanVleakresultsinlowerleakagecurrent. PleasereadCautionsandwarningsand Page4of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Electricalspecificationsandorderingcodes Maximumratings(T =85(cid:176) C)andcharacteristics(T =25(cid:176) C) op,max A Type Orderingcode VDC,max VBR,min Vclamp,max IPP PPP Ctyp (1mA) (1A) (8/20µs) (8/20µs) (1MHz,1V) V V V A W pF Array,4-fold,0508,nosemiconductordiodeequivalent CDA4C20GTA B72714D0200A060 22 24 60 10 600 33 Array,4-fold,0612,nosemiconductordiodeequivalent CDA5C20GTA B72724D0200A062 22 25 50 30 2200 56 Single,0201,nosemiconductordiodeequivalent CDS1C05GTA1 B72440C0050A160 5.5 11 22 - - 15 Single,0402,SOD-723 CDS2C05GTA B72590D0050A060 5.6 6.4 24 10 320 1801) CDS2C15GTA B72590D0150A060 15 20 46 10 670 47 Single,0603,SOD-523 CDS3C05GTA B72500D0050A060 5.6 6.4 19 30 1000 4701) CDS3C09GTA B72500D0090A060 9 10 30 30 1600 2201) CDS3C15GTA B72500D0150A060 15 22 42 30 2000 1601) CDS3C20GTA B72500D0200A060 22 25 50 30 2200 56 Single,1003,SOD-323 CDS4C12GTA B72570D0120A060 12 16 46 20 1000 82 Typicalcharacteristics 1) CtypmeasuredatV=1V,f=1kHz. PleasereadCautionsandwarningsand Page5of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Dimensionaldrawings Singledevice Dimensionsinmm Case (inch) 0201 0402 0603 1003 size (mm) 0603 1005 1608 2508 Min. Max. Min. Max. Min. Max. Min. Max. l 0.57 0.63 0.85 1.15 1.45 1.75 2.34 2.74 w 0.27 0.33 0.4 0.6 0.7 0.9 0.7 0.9 h 0.27 0.33 0.4 0.6 0.7 0.9 0.7 0.9 k 0.1 0.2 0.1 0.3 0.1 0.4 0.13 0.75 Arraydevice Dimensionsinmm Case (inch) 0508 0612 size (mm) 1220 1632 Min. Max. Min. Max. l 1.8 2.2 3.0 3.4 w 1.05 1.45 1.45 1.75 h - 0.9 - 0.9 d 0.2 0.4 0.25 0.55 e 0.4 0.6 0.61 0.91 k - 0.35 - 0.35 PleasereadCautionsandwarningsand Page6of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Recommendedsolderpads Singledevice Dimensionsinmm Casesize (inch) 0201 0402 0603 1003 (mm) 0603 1005 1608 2508 A 0.3 0.6 1.0 0.8 B 0.25 0.6 1.0 0.8 C 0.3 0.5 1.0 1.45 Arraydevice Dimensionsinmm Casesize (inch) 0508 0612 (mm) 1220 1632 A 0.35 0.5 B 0.9 0.7 C 0.4 1.2 E 0.5 0.76 PleasereadCautionsandwarningsand Page7of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Pinconfigurations Singledevice Pin Description P1 GND P2 I/Oline Arraydevice Pin Description P1 GND P2 GND P3 GND P4 GND P5 I/Oline1 P6 I/Oline2 P7 I/Oline3 P8 I/Oline4 PleasereadCautionsandwarningsand Page8of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Termination Singledevice Arraydevice PleasereadCautionsandwarningsand Page9of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Deliverymode EIAcasesize Taping Reelsize Packingunit Type Orderingcode mm pcs. 0201 Cardboard 180 15000 CDS1C05GTA1 B72440C0050A160 0402 Cardboard 180 10000 CDS2C05GTA B72590D0050A060 0402 Cardboard 180 10000 CDS2C15GTA B72590D0150A060 0508 Cardboard 180 4000 CDA4C20GTA B72714D0200A060 0603 Cardboard 180 4000 CDS3C05GTA B72500D0050A060 0603 Cardboard 180 4000 CDS3C09GTA B72500D0090A060 0603 Cardboard 180 4000 CDS3C15GTA B72500D0150A060 0603 Cardboard 180 4000 CDS3C20GTA B72500D0200A060 0612 Blister 180 3000 CDA5C20GTA B72724D0200A062 1003 Cardboard 180 4000 CDS4C12GTA B72570D0120A060 PleasereadCautionsandwarningsand Page10of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 1 TapingandpackingforchipandarrayCeraDiodes 1.1 Cardboardtape(tapingtoIEC60286-3) Dimensionsinmm Casesize(inch) 0201 0402 0603 1003 0508 Tolerance (mm) 0603 1005 1608 2508 1220 Compartmentwidth A 0.38– 0.05 0.6 0.95 1.0 1.6 – 0.2 0 Compartmentlength B 0.68– 0.05 1.15 1.8 2.85 2.4 – 0.2 0 Sprocketholediameter D0 1.5– 0.1 1.5 1.5 1.5 1.5 +0.1/(cid:5)0 Sprocketholepitch P 4.0– 0.11) 4.0 4.0 4.0 4.0 – 0.11) 0 Distancecenterholetocenter P 2.0– 0.05 2.0 2.0 2.0 2.0 – 0.05 2 compartment Pitchofcomponentcompartments P 2.0– 0.05 2.0 4.0 4.0 4.0 – 0.1 1 Tapewidth W 8.0– 0.3 8.0 8.0 8.0 8.0 – 0.3 Distanceedgetocenterofhole E 1.75– 0.1 1.75 1.75 1.75 1.75 – 0.1 Distancecenterholetocenter F 3.5– 0.05 3.5 3.5 3.5 3.5 – 0.05 compartment Distancecompartmenttoedge G 0.75min. 0.75 0.75 0.75 0.75 min. Thicknesstape T 0.42– 0.02 0.6 0.9 0.95 0.95 max. Overallthickness T 0.4min. 0.7 1.1 1.1 1.10 max. 2 1)£– 0.2mmover10sprocketholes PleasereadCautionsandwarningsand Page11of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 1.2 Blistertape(tapingtoIEC60286-3) Dimensionsinmm Casesize(inch) 0506 0612 1012 Tolerance (mm) 1216 1632 2532 Compartmentwidth A 1.5 1.8 2.8 – 0.2 0 Compartmentlength B 1.8 3.4 3.5 – 0.2 0 Compartmentheight K 0.8 1.8 1.8 max. 0 Sprocketholediameter D0 1.5 1.5 1.5 +0.1/(cid:5)0 Compartmentholediameter D 0.3 0.3 0.3 min. 1 Sprocketholepitch P 4.0 4.0 4.0 – 0.11) 0 Distancecenterholetocenter P 2.0 2.0 2.0 – 0.05 2 compartment Pitchofcomponentcompartments P 4.0 4.0 4.0 – 0.1 1 Tapewidth W 8.0 8.0 8.0 – 0.3 Distanceedgetocenterofhole E 1.75 1.75 1.75 – 0.1 Distancecenterholetocenter F 3.5 3.5 3.5 – 0.05 compartment Distancecompartmenttoedge G 0.75 0.75 0.75 min. Thicknesstape T 0.3 0.3 0.3 max. Overallthickness T 1.3 2.5 2.5 max. 2 1)£– 0.2mmover10sprocketholes PleasereadCautionsandwarningsand Page12of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 1.3 Reelpacking Dimensionsinmm Dimensions Tolerance Dimensions Tolerance Reeldiameter A 180 +0/–3 330 +0/–2 Reelwidth(inside) W 8.4 +1.5/–0 8.4 +1.5/–0 1 Reelwidth(outside) W 14.4 max. 14.4 max. 2 Package:8-mmtape Reelmaterial:Plastic 1.4 Packingunits Casesize ˘ 180-mmreel ˘ 330-mmreel Tape (inch)/(mm) pieces pieces 0201/0603 15000 - cardboard 0402/1005 10000 50000 cardboard 0603/1608 4000 16000 cardboard 1003/2508 4000 16000 cardboard 0506/1216 3000 12000 blister 0508/1220 4000 16000 cardboard 0612/1632 3000 12000 blister 1012/2532 2000 8000 blister PleasereadCautionsandwarningsand Page13of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Solderingdirections 1 Reflowsolderingtemperatureprofile Recommendedtemperaturecharacteristicforreflowsolderingfollowing JEDECJ-STD-020D Profilefeature Sn-Pbeutecticassembly Pb-freeassembly Preheatandsoak -Temperaturemin T 100(cid:176) C 150(cid:176) C smin -Temperaturemax T 150(cid:176) C 200(cid:176) C smax -Time t tot 60...120s 60...180s smin smax Averageramp-uprate T toT 3(cid:176) C/smax. 3(cid:176) C/smax. smax p Liquidoustemperature T 183(cid:176) C 217(cid:176) C L Timeatliquidous t 60...150s 60...150s L Peakpackagebodytemperature T1) 220(cid:176) C...235(cid:176) C2) 245(cid:176) C...260(cid:176) C2) p Time(t )3)within5(cid:176) Cofspecified P 20s3) 30s3) classificationtemperature(T) c Averageramp-downrate T toT 6(cid:176) C/smax. 6(cid:176) C/smax. p smax Time25(cid:176) Ctopeaktemperature maximum6min maximum8min 1) Toleranceforpeakprofiletemperature(TP)isdefinedasasupplierminimumandausermaximum. 2) Dependingonpackagethickness.FordetailspleaserefertoJEDECJ-STD-020D. 3) Tolerancefortimeatpeakprofiletemperature(tP)isdefinedasasupplierminimumandausermaximum. Note:Alltemperaturesrefertotopsideofthepackage,measuredonthepackagebodysurface. Numberofreflowcycles:3 PleasereadCautionsandwarningsand Page14of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 2 Solderingguidelines Theuseofmild,non-activatedfluxesforsolderingisrecommended,aswellaspropercleaningof thePCB. ThecomponentsaresuitableforreflowsolderingtoJEDECJ-STD-020D. 3 Solderjointprofiles/solderquantity 3.1 Cementquantity Thecomponentisfixedontothecircuitboardwithcementpriortosoldering.Itmuststillbeable tomoveslightly.Whentheboardisplacedintothereflowoven,excessivelyrigidfixingcanlead to high forces acting on the component and thus to a break. In addition, too much cement can leadtounsymmetricalstressingandthustomechanicalfractureofthecomponent.Thecement mustalsobesosoftduringmountingthatnomechanicalstressingoccurs. 3.2 Mountingthecomponentsontheboard Itisbesttomountthecomponentsontheboardbeforesolderingsothatoneterminationdoesnot entertheovenfirstandthesecondterminationissolderedsubsequently.Theidealcaseissimul- taneouswettingofbothterminations. 3.3 Solderjointprofiles Ifthemeniscusheightistoolow,thatmeansthesolderquantityistoolow,thesolderjointmay break,i.e.thecomponentbecomesdetachedfromthejoint.Thisproblemissometimesinterpret- edasleachingoftheexternalterminations. Ifthesoldermeniscusistoohigh,i.e.thesolderquantityistoolarge,theviseeffectmayoccur. As the solder cools down, the solder contracts in the direction of the component. If there is too muchsolderonthecomponent,ithasnoleewaytoevadethestressandmaybreak,asinavise. PleasereadCautionsandwarningsand Page15of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 3.3.1 Solderjointprofilesfornickelbarriertermination Goodandpoorsolderjointscausedbyamountofsolderininfraredreflowsoldering PleasereadCautionsandwarningsand Page16of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 4 Solderabilitytests Test Standard Testconditions/ Testconditions/ Criteria/testresults Sn-Pbsoldering Pb-freesoldering Wettability IEC Immersionin Immersionin Coveringof95% 60068-2-58 60/40SnPbsolder Sn96.5Ag3.0Cu0.5 ofendtermination, usingnon-activated solderusingnon-or checkedbyvisual fluxat215– 3(cid:176) Cfor lowactivatedflux inspection 3– 0.3s at245– 5(cid:176) C for3– 0.3s Leaching IEC Immersionin Immersionin Noleachingof resistance 60068-2-58 60/40SnPb Sn96.5Ag3.0Cu0.5 contacts solderusing solderusingnon-or mildlyactivatedflux lowactivatedflux withoutpreheating withoutpreheating at 255– 5(cid:176) C at 255– 5(cid:176) C for10– 1s for10– 1s Testsof IEC Immersionin Immersionin Capacitancechange: resistanceto 60068-2-58 60/40SnPbfor10s Sn96.5Ag3.0Cu0.5 (cid:5)15%£D C£ 15% solderingheat at260(cid:176) C for10sat260(cid:176) C forSMDs Note: Leachingofthetermination Effectiveareaattheterminationmightbelostifthesolderingtemperatureand/orimmersiontime arenotkeptwithintherecommendedconditions.Leachingoftheouterelectrodeshouldnotex- ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B, shownbelowasmountedonthesubstrate. Assinglechip Asmountedonsubstrate PleasereadCautionsandwarningsand Page17of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 5 Notesforpropersoldering 5.1 Preheatingandcooling Theaverageramp-upratemustnotexceed3(cid:176) C/s. Thecoolingratemustnotexceed8(cid:176) C/s. 5.2 Repair/rework Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for makingrepairs. 5.3 Cleaning All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning solutionaccordingtothetypeoffluxused.Thetemperaturedifferencebetweenthecomponents and cleaning liquid must not be greater than 100 (cid:176) C. Ultrasonic cleaning should be carried out withtheutmostcaution.Toohighultrasonicpowercanimpairtheadhesivestrengthofthemetal- lizedsurfaces.InsufficientorexcessivecleaningcanbedetrimentaltoCeraDiodeperformance. 5.4 Solderpasteprinting(reflowsoldering) An excessive application of solder paste results in too high a solder fillet, thus making the chip moresusceptibletomechanicalandthermalstress.Thiswillleadtotheformationofcracks.Too little solder paste reduces the adhesive strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be applied smoothly to the end surface to a height of min.0.2mm. 5.5 Selectionofflux Usedfluxshouldhavelessthanorequalto0.1wt%ofhalogenatedcontent,sincefluxresidue aftersolderingcouldleadtocorrosionoftheterminationand/orincreasedleakagecurrentonthe surfaceoftheCeraDiode.Strongacidicfluxmustnotbeused.Theamountoffluxappliedshould becarefullycontrolled,sinceanexcessmaygeneratefluxgas,whichinturnisdetrimentaltosol- derability. 5.6 Storage Solderability is guaranteed for one year from date of delivery, provided that components are storedintheiroriginalpackages. Storagetemperature: (cid:5)25(cid:176) Cto+45(cid:176) C Relativehumidity: £ 75%annualaverage,£ 95%on30daysayear ThesolderabilityoftheexternalelectrodesmaydeteriorateifSMDsarestoredwheretheyareex- posed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). DonotstoreSMDswheretheyareexposedtoheatordirectsunlight.Otherwisethepackingma- terialmaybedeformedorSMDsmaysticktogether,causingproblemsduringmounting. Afteropeningthefactoryseals,suchaspolyvinyl-sealedpackages,itisrecommendedtousethe SMDsassoonaspossible. PleasereadCautionsandwarningsand Page18of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries 5.7 Placementofcomponentsoncircuitboard Itisofadvantagetoplacethecomponentsontheboardbeforesolderingsothattheirtwotermi- nalsdonotenterthesolderovenatdifferenttimes.Ideally,bothterminalsshouldbewettedsi- multaneously. 5.8 Solderingcaution Suddenheatingorcoolingofthecomponentresultsinthermaldestructionbycracks. Anexcessivelylongsolderingtimeorhighsolderingtemperatureresultsinleachingoftheout- erelectrodes,causingpooradhesionduetolossofcontactbetweenelectrodesandtermina- tion. Avoidmanualsolderingwithasolderingiron. WavesolderingmustnotbeappliedforCeraDiodesdesignatedforreflowsolderingonly. Keeptotherecommendeddown-coolingrate. 5.9 Standards CECC00802 IEC60068-2-58 IEC60068-2-20 JEDECJ-STD-020D PleasereadCautionsandwarningsand Page19of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Symbolsandterms CeraDiode Semiconductordiode C Maximumcapacitance max C Typicalcapacitance typ I I ,I (Reverse)current@breakdownvoltage BR R T I I (Reverse)leakagecurrent leak RM I I ,I Current@clampingvoltage,peakpulse PP P PP current P P Peakpulsepower PP PP T Operatingtemperature op T Storagetemperature stg V V (Reverse)breakdownvoltage BR BR V Minimumbreakdownvoltage BR,min V V V Clampingvoltage clamp cl, C V Maximumclampingvoltage clamp,max V V ,V ,V ,V (Reverse)stand-offvoltage,working DC RM RWM WM DC voltage,operatingvoltage V MaximumDCoperatingvoltage DC,max V AirdischargeESDcapability ESD,air V ContactdischargeESDcapability ESD,contact V V ,V ,V ,V (Reverse)voltage@leakagecurrent leak RM RWM WM DC -*) I Current@forwardvoltage F -*) I ,I @V (Reverse)current@maximumreverse RM RM,max RM stand-offvoltage,workingvoltage, operatingvoltage -*) V Forwardvoltage F *)NotapplicableduetobidirectionalcharacteristicsofCeraDiodes PleasereadCautionsandwarningsand Page20of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Cautionsandwarnings General SomepartsofthispublicationcontainstatementsaboutthesuitabilityofourCeraDiodesforcer- tainareasofapplication,includingrecommendationsaboutincorporation/design-inoftheseprod- ucts into customer applications. The statements are based on our knowledge of typical require- mentsoftenmadeofourCeraDiodesintheparticularareas.Weneverthelessexpresslypointout that such statements cannot be regarded as binding statements about the suitability of our CeraDiodesforaparticularcustomerapplication.Asarule,EPCOSiseitherunfamiliarwithindi- vidualcustomerapplicationsorlessfamiliarwiththemthanthecustomersthemselves.Forthese reasons, it is always incumbent on the customer to check and decide whether the CeraDiodes withthepropertiesdescribedintheproductspecificationaresuitableforuseinaparticularcus- tomerapplication. Do not use EPCOS CeraDiodes for purposes not identified in our specifications, application notesanddatabooks. EnsurethesuitabilityofaCeraDiodeinparticularbytestingitforreliabilityduringdesign-in.Al- waysevaluateaCeraDiodeunderworst-caseconditions. PayspecialattentiontothereliabilityofCeraDiodesintendedforuseinsafety-criticalapplica- tions(e.g.medicalequipment,automotive,spacecraft,nuclearpowerplant). Designnotes AlwaysconnectaCeraDiodeinparallelwiththeelectroniccircuittobeprotected. Consider maximum rated power dissipation if a CeraDiode has insufficient time to cool down betweenanumberofpulsesoccurringwithinaspecifiedisolatedtimeperiod.Ensurethatelec- tricalcharacteristicsdonotdegrade. Considerderatingathigheroperatingtemperatures.Choosethehighestvoltageclasscompati- blewithderatingathighertemperatures. Surge currents beyond specified values will puncture a CeraDiode. In extreme cases a CeraDiodewillburst. Ifsteepsurgecurrentedgesaretobeexpected,makesureyourdesignisaslow-inductance aspossible. Insomecasesthemalfunctioningofpassiveelectroniccomponentsorfailurebeforetheendof theirservicelifecannotbecompletelyruledoutinthecurrentstateoftheart,eveniftheyare operatedasspecified.DonotuseCeraDiodesinapplicationsrequiringaveryhighlevelofop- erationalsafetyandespeciallywhenthemalfunctionorfailureofapassiveelectroniccompo- nent could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotivebatterylineapplicationssuchasclamp30),ensurebysuitabledesignoftheappli- cationorothermeasures(e.g.installationofprotectivecircuitryorredundancy)thatnoinjuryor damageissustainedbythirdpartiesintheeventofsuchamalfunctionorfailure. Specified values only apply to CeraDiodes that have not been subject to prior electrical, me- chanicalorthermaldamage.TheuseofCeraDiodesinline-to-groundapplicationsistherefore notadvisable,anditisonlyallowedtogetherwithsafetycountermeasureslikethermalfuses. PleasereadCautionsandwarningsand Page21of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Storage OnlystoreCeraDiodesintheiroriginalpackaging.Donotopenthepackagebeforestorage. Storageconditionsinoriginalpackaging:temperature-25to+45(cid:176) C,relativehumidity£ 75%an- nualaverage,maximum95%,dewprecipitationisinadmissible. Do not store CeraDiodes where they are exposed to heat or direct sunlight. Otherwise the packagingmaterialmaybedeformedorCeraDiodesmaysticktogether,causingproblemsdur- ingmounting. AvoidcontaminationoftheCeraDiodesurfaceduringstorage,handlingandprocessing. AvoidstoringCeraDiodesinharmfulenvironmentswheretheyareexposedtocorrosivegases forexample(SO,Cl). x UseCeraDiodesassoonaspossibleafteropeningfactorysealssuchaspolyvinyl-sealedpack- ages. SolderCeraDiodesaftershipmentfromEPCOSwithinthetimespecified:12months. Handling DonotdropCeraDiodesandallowthemtobechipped. DonottouchCeraDiodeswithyourbarehands-glovesarerecommended. AvoidcontaminationoftheCeraDiodesurfaceduringhandling. Washing processes may damage the product due to the possible static or cyclic mechanical loads(e.g.ultrasoniccleaning).Theymaycausecrackstodevelopontheproductanditsparts, whichmightleadtoreducedreliabilityorlifetime. Mounting WhenCeraDiodesareencapsulatedwithsealingmaterialorovermoldedwithplasticmaterial, beawarethatpotting,sealingoradhesivecompoundscanproducechemicalreactionsinthe CeraDiodeceramicthatwilldegradeitselectricalcharacteristicsandreduceitslifetime. Makesureanelectrodeisnotscratchedbefore,duringorafterthemountingprocess. MakesurecontactsandhousingsusedforassemblywithCeraDiodesarecleanbeforemount- ing. ThesurfacetemperatureofanoperatingCeraDiodecanbehigher.Ensurethatadjacentcom- ponentsareplacedatasufficientdistancefromaCeraDiodetoallowpropercooling. AvoidcontaminationoftheCeraDiodesurfaceduringprocessing. OnlyCeraDiodeswithanNibarrierterminationareapprovedforlead-freesoldering. Soldering Completeremovaloffluxisrecommendedtoavoidsurfacecontaminationthatcanresultinan instableand/orhighleakagecurrent. Useresin-typeornon-activatedflux. Bearinmindthatinsufficientpreheatingmaycauseceramiccracks. Rapidcoolingbydippinginsolventisnotrecommended,otherwiseacomponentmaycrack. PleasereadCautionsandwarningsand Page22of25 Importantnotesattheendofthisdocument.
CeraDiodes Standardseries Operation UseCeraDiodesonlywithinthespecifiedoperatingtemperaturerange. UseCeraDiodesonlywithinspecifiedvoltageandcurrentranges. Environmental conditions must not harm a CeraDiode. Only use them in normal atmospheric conditions.Reducingtheatmosphere(e.g.hydrogenornitrogenatmosphere)isprohibited. Prevent a CeraDiode from contacting liquids and solvents. Make sure that no water enters a CeraDiode(e.g.throughplugterminals). Avoiddewingandcondensation. EPCOSCeraDiodesaredesignedforencasedapplications.Underallcircumstancesavoidex- posureto: (cid:5)directsunlight (cid:5)rainorcondensation (cid:5)steam,salinespray (cid:5)corrosivegases (cid:5)atmospherewithreducedoxygencontent EPCOS CeraDiodes are not suitable for switching applications or voltage stabilization where staticpowerdissipationisrequired. Thislistingdoesnotclaimtobecomplete,itmerelyreflectstheexperienceofEPCOSAG. DisplayoforderingcodesforEPCOSproducts TheorderingcodeforoneandthesameEPCOSproductcanberepresenteddifferentlyindata sheets,databooks,otherpublications,ontheEPCOSwebsite,orinorder-relateddocuments suchasshippingnotes,orderconfirmationsandproductlabels.Thevaryingrepresentationsof theorderingcodesareduetodifferentprocessesemployedanddonotaffectthe specificationsoftherespectiveproducts.DetailedinformationcanbefoundontheInternet underwww.epcos.com/orderingcodes PleasereadCautionsandwarningsand Page23of25 Importantnotesattheendofthisdocument.
Importantnotes The following applies toall products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. Page24of25
Importantnotes 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2018-10 Page25of25
Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: E PCOS / TDK: B72714D200A60 B72724D200A62 B72500D150A60 B72500D200A60 B72500D50A60 B72500D90A60 B72570D120A60 B72590D150A60 B72590D50A60 B72500D200A60V7 B72500D200A60V9 B72440C50A160