NTC thermistors for temperature measurement Miniature sensors with bendable wires Series/Type: B57863S Date: March2013 © EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Applications Dimensionaldrawing Temperaturemeasurement Features Unicurvesensor Shortresponsetime Hightemperatureaccuracy between0(cid:176) Cand70(cid:176) C Excellentlong-termstability Epoxyresinencapsulation PTFE-insulatedleadsofsilver-plated nickelwire,AWG30 ULapproval(E69802) Options Alternativeleadlengthsonrequest Dimensionsinmm Deliverymode Approx.weight60mg Bulk Generaltechnicaldata Climaticcategory (IEC60068-1) 55/155/56 Max.power (at25(cid:176) C) P 60 mW 25 Temperaturetolerance (0...70(cid:176) C) D T – 0.2,– 0.5 K Ratedtemperature T 25 (cid:176) C R Dissipationfactor (inair) d approx.1.5 mW/K th Thermalcoolingtimeconstant (inair) t approx.15 s c Heatcapacity C approx.22.5 mJ/K th Electricalspecificationandorderingcodes R No.ofR/T B Orderingcode 25 25/100 W characteristic K 3k 8016 3988 B57863S0302+040 5k 8016 3988 B57863S0502+040 10k 8016 3988 B57863S0103+040 30k 8018 3964 B57863S0303+040 += Temperaturetolerance F=– 0.2K G=– 0.5K PleasereadCautionsandwarningsand Page2of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Note ForcalculationoftheR/Tcharacteristicsrefertoourspecialtool"NTCR/Tcalculation".Youmay downloadthistoolfromtheInternet(www.epcos.com/toolsfi NTCThermistorsfi NTCR/T Calculation). Reliabilitydata Test Standard Testconditions D R /R Remarks 25 25 (typical) Storagein IEC Storageatupper <2% Novisible dryheat 60068-2-2 categorytemperature damage T:155(cid:176) C t:1000h Storageindamp IEC Temperatureofair:40(cid:176) C <1% Novisible heat,steadystate 60068-2-78 Relativehumidityofair:93% damage Duration:56days Rapidtemperature IEC Lowertesttemperature:(cid:4)55(cid:176) C <1% Novisible cycling 60068-2-14 Uppertesttemperature:155(cid:176) C damage Numberofcycles:100 Endurance P :60mW <3% Novisible max t:1000h damage Long-termstability Temperature:70(cid:176) C <2% Novisible (empiricalvalue) t:10000h damage PleasereadCautionsandwarningsand Page3of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 ReliabilitydataaccordingtoAECQ200,Rev.D Test Standard Testconditions D R /R Remarks 25 25 (typical) Hightemperature MIL-STD-202, StorageatT=+125(cid:176) C <2% Novisible exposure(storage) method108 t=1000h damage Biasedhumidity MIL-STD-202, T=85(cid:176) C <2% Novisible method103 Relativehumidityofair85% damage t=1000h Testvoltagemax.0.3VDCon NTC1) Operationallife MIL-STD-202, T=+125(cid:176) C <2% Novisible method108 t=1000h damage Testvoltagemax.0.3VDCon NTC1) Temperature JESD22, Lowertesttemperature:(cid:4)55(cid:176) C <2% Novisible cycling methodJA-104 Uppertesttemperature:125(cid:176) C damage 1000cycles Dwelltime:max.30min Transitiontimeinair:max.1min Terminalstrength MIL-STD-202, Testleadeddeviceintegrity <1% Novisible (leaded) method211 ConditionA:2.27N2) damage Mechanicalshock MIL-STD-202, Acceleration:40g2) <1% Novisible method213, Pulseduration:6ms damage conditionC Numberofbumps:3,each direction Vibration MIL-STD-202, Acceleration:5g <1% Novisible method204 t=20min damage 12cyclesineachof3orientations Frequencyrange:10to2000Hz 1) SelfheatingoftheNTCthermistormustnotexceed0.2K,steadystate.TestconditionsdeviatingfromAECQ200,Rev.D. 2) DeviatingfromAECQ200,Rev.D. Note ContactofNTCthermistorswithanyliquidsandsolventsshallbeprevented.Itmustbe ensuredthatnowaterenterstheNTCthermistors(e.g.throughplugterminals). Avoiddewingandcondensationunlessthermistorisspecifiedfortheseconditions. PleasereadCautionsandwarningsand Page4of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 R/Tcharacteristics R/TNo. 8016 8018 T((cid:176) C) B =3988K B =3964K 25/100 25/100 R/R a (%/K) R/R a (%/K) T 25 T 25 (cid:4)55.0 96.3 7.4 (cid:4) (cid:4) (cid:4)50.0 67.01 7.2 (cid:4) (cid:4) (cid:4)45.0 47.17 6.9 (cid:4) (cid:4) (cid:4)40.0 33.65 6.7 30.24 6.3 (cid:4)35.0 24.26 6.4 22.1 6.1 (cid:4)30.0 17.7 6.2 16.32 5.9 (cid:4)25.0 13.04 6.0 12.17 5.8 (cid:4)20.0 9.707 5.8 9.153 5.6 (cid:4)15.0 7.293 5.6 6.945 5.4 (cid:4)10.0 5.533 5.5 5.313 5.2 (cid:4)5.0 4.232 5.3 4.097 5.1 0.0 3.265 5.1 3.183 4.9 5.0 2.539 5.0 2.491 4.8 10.0 1.99 4.8 1.963 4.7 15.0 1.571 4.7 1.557 4.6 20.0 1.249 4.5 1.244 4.4 25.0 1.0000 4.4 1.0000 4.3 30.0 0.8057 4.3 0.8083 4.2 35.0 0.6531 4.1 0.6572 4.1 40.0 0.5327 4.0 0.5373 4.0 45.0 0.4369 3.9 0.4418 3.9 50.0 0.3603 3.8 0.365 3.7 55.0 0.2986 3.7 0.303 3.7 60.0 0.2488 3.6 0.2527 3.6 65.0 0.2083 3.5 0.2118 3.5 70.0 0.1752 3.4 0.1783 3.4 75.0 0.1481 3.3 0.1508 3.3 80.0 0.1258 3.2 0.128 3.2 85.0 0.1072 3.2 0.1091 3.2 90.0 0.09177 3.1 0.0933 3.1 95.0 0.07885 3.0 0.08016 3.0 100.0 0.068 2.9 0.0691 2.9 105.0 0.05886 2.9 0.05974 2.9 110.0 0.05112 2.8 0.05183 2.8 115.0 0.04454 2.7 0.04512 2.8 120.0 0.03893 2.6 0.0394 2.7 125.0 0.03417 2.6 0.0345 2.6 130.0 0.03009 2.5 0.03032 2.6 135.0 0.02654 2.5 0.02672 2.5 140.0 0.02348 2.4 0.02361 2.5 145.0 0.02083 2.4 0.02091 2.4 150.0 0.01853 2.3 0.01857 2.4 155.0 0.01653 2.3 0.016537 2.3 PleasereadCautionsandwarningsand Page5of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Mountinginstructions 1 Soldering 1.1 LeadedNTCthermistors LeadedthermistorscomplywiththesolderabilityrequirementsspecifiedbyCECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat.Thefollowingmaximumtemperatures,maximumtimespansandminimumdistanceshave tobeobserved: Dipsoldering Ironsoldering Bathtemperature max.260(cid:176) C max.360(cid:176) C Solderingtime max.4s max.2s Distancefromthermistor min.6mm min.6mm Undermoreseveresolderingconditionstheresistancemaychange. 1.2 LeadlessNTCthermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder mayproducefinecracksintheceramic,resultinginchangesinresistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content shouldbeused.Inaddition,solderingmethodsshouldbeemployedwhichpermitshortsoldering times. 1.3 SMDNTCthermistors SMDNTCthermistorscanbeprovidedwithanickelbarrierterminationoronspecialrequestwith silver-palladiumtermination.Theusageofmild,non-activatedfluxesforsolderingisrecommend- edaswellasapropercleaningofthePCB. Nickelbarriertermination Thenickelbarrierlayerofthesilver/nickel/tintermination(seefigure1)preventsleachingofthe silverbasemetalizationlayer.Thisallowsgreatflexibilityintheselectionofsolderingparameters. Thetinpreventsthenickellayerfromoxidizingandthusensuresbetterwettingbythesolder.The nickelbarrierterminationissuitableforallcommonly-usedsolderingmethods. Note:SMDNTCswithAgPdterminationarenotapprovedforlead-freesoldering. Figure1 SMDNTCthermistors,structureofnickelbarrier termination PleasereadCautionsandwarningsand Page6of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 1.3.1 Solderability(testtoIEC60068-2-58) Preconditioning:ImmersionintofluxF-SW32. Evaluationcriterion:Wettingofsolderingareas‡ 95%. Solder Bathtemperature((cid:176) C) Dwelltime(s) SnPb60/40 215– 3 3– 0.3 SnAg(3.0...4.0),Cu(0.5...0.9) 245– 3 3– 0.3 1.3.2 Resistancetosolderingheat(testtoIEC60068-2-58) Preconditioning:ImmersionintofluxF-SW32. Evaluationcriterion:Leachingofsideedges£ 1/3. Solder Bathtemperature((cid:176) C) Dwelltime(s) SnPb60/40 260– 5 10– 1 SnAg(3.0...4.0),Cu(0.5...0.9) 260– 5 10– 1 PleasereadCautionsandwarningsand Page7of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Wavesoldering Temperaturecharacteristicatcomponentterminalwithdualwavesoldering Solderjointprofilesforsilver/nickel/tinterminations PleasereadCautionsandwarningsand Page8of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Reflowsoldering RecommendedtemperaturecharacteristicforreflowsolderingfollowingJEDECJ-STD-020D Profilefeature Sn-Pbeutecticassembly Pb-freeassembly Preheatandsoak -Temperaturemin T 100(cid:176) C 150(cid:176) C smin -Temperaturemax T 150(cid:176) C 200(cid:176) C smax -Time t tot 60...120s 60...180s smin smax Averageramp-uprate T toT 3(cid:176) C/smax. 3(cid:176) C/smax. smax p Liquidoustemperature T 183(cid:176) C 217(cid:176) C L Timeatliquidous t 60...150s 60...150s L Peakpackagebodytemperature T1) 220(cid:176) C...235(cid:176) C2) 245(cid:176) C...260(cid:176) C2) p Time(t )3)within5(cid:176) Cofspecified P 20s3) 30s3) classificationtemperature(T) c Averageramp-downrate T toT 6(cid:176) C/smax. 6(cid:176) C/smax. p smax Time25(cid:176) Ctopeaktemperature maximum6min maximum8min 1) Toleranceforpeakprofiletemperature(TP)isdefinedasasupplierminimumandausermaximum. 2) Dependingonpackagethickness.FordetailspleaserefertoJEDECJ-STD-020D. 3) Tolerancefortimeatpeakprofiletemperature(tP)isdefinedasasupplierminimumandausermaximum. Note:Alltemperaturesrefertotopsideofthepackage,measuredonthepackagebodysurface. Numberofreflowcycles:3 PleasereadCautionsandwarningsand Page9of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Solderjointprofilesforsilver/nickel/tinterminations 1.3.3 Recommendedgeometryofsolderpads Recommendedmaximumdimensions(mm) Casesize A B C inch/mm 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.3.4 Notes Ironsolderingshouldbeavoided,hotairmethodsarerecommendedforrepairpurposes. PleasereadCautionsandwarningsand Page10of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 2 Conductiveadhesion Analternativetosolderingisthegluingofthermistorswithconductiveadhesives.Thebenefitof thismethodisthatitinvolvesnothermalstress.Theadhesivesusedmustbechemicallyinert. 3 Clampcontacting Pressurecontactingbymeansofclampsisparticularlysuitableforapplicationsinvolvingfrequent switchingandhighturn-onpowers. 4 Robustnessofterminations(leadedtypes) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feed- throughs.Duringbending,anymechanicalstressattheoutletoftheleadsmustberemoved.The bendingradiusshouldbeatleast0.75mm. Tensilestrength: TestUa1: Leads ˘£ 0.25mm= 1.0N 0.25< ˘£ 0.35mm= 2.5N 0.35< ˘£ 0.50mm= 5.0N 0.50< ˘£ 0.80mm= 10.0N 0.80< ˘£ 1.25mm= 20.0N Bendingstrength: TestUb: Two90(cid:176) -bendsinoppositedirectionsataweightof0.25kg. Torsionalstrength: TestUc:severity2 Theleadisbentby90(cid:176) atadistanceof6to6.5mmfromthethermistorbody. Thebendingradiusoftheleadsshouldbeapprox.0.75mm.Twotorsionsof 180(cid:176) each(severity2). Whensubjectingleadstomechanicalstress,thefollowingshouldbeobserved: Tensilestressonleads Duringmountingandoperationtensileforcesontheleadsaretobeavoided. Bendingofleads Bendingoftheleadsdirectlyonthethermistorbodyisnotpermissible. A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder jointonthethermistorbody.Duringbendingthewiremustbemechanicallyrelievedatitsoutlet. Thebendingradiusshouldbeatleast0.75mm. Twistingofleads Thetwisting(torsion)by180(cid:176) ofaleadbentby90(cid:176) ispermissibleat6mmfromthebottomofthe thermistorbody. PleasereadCautionsandwarningsand Page11of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 5 Sealingandpotting Whenthermistorsaresealed,pottedorovermolded,theremustbenomechanicalstresscaused by thermal expansion during the production process (curing / overmolding process) and during lateroperation.Theuppercategorytemperatureofthethermistormustnotbeexceeded.Ensure thatthematerialsused(sealing/pottingcompoundand plasticmaterial)arechemicallyneutral. 6 Cleaning Washing processes may damage the product due to the possible static or cyclic mechanical loads(e.g.ultrasoniccleaning).Theymaycausecrackstodevelopontheproductanditsparts, whichmightleadtoreducedreliabilityorlifetime. 7 Storage Inordertomaintaintheirsolderability,thermistorsmustbestoredinanon-corrosiveatmosphere. Humidity,temperatureandcontainermaterialsarecriticalfactors. DonotstoreSMDswheretheyareexposedtoheatordirectsunlight.Otherwise,thepackingma- terial may be deformed or SMDs may stick together, causing problems during mounting. After openingthefactoryseals,suchaspolyvinyl-sealedpackages,usetheSMDsassoonaspossible. Thecomponentsshouldbeleftintheoriginalpacking.Touchingthemetallizationofunsoldered thermistorsmaychangetheirsolderingproperties. Storagetemperature: (cid:4)25(cid:176) Cupto45(cid:176) C Relativehumidity(withoutcondensation): £ 75%annualmean <95%,maximum30daysperannum SolderthethermistorslistedinthisdatabookaftershipmentfromEPCOSwithinthetimespeci- fied: SMDswithnickelbarriertermination: 12months SMDswithAgPdtermination: 6months Leadedcomponents: 24months PleasereadCautionsandwarningsand Page12of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 8 PlacementandorientationofSMDNTCthermistorsonPCB a)Componentplacement ItisrecommendedthatthePCboard shouldbeheldbymeansofsome adequatesupportingpinssuchas shownlefttopreventtheSMDsfrom beingdamagedorcracked. b)Cracks Whenplacingacomponentnearan areawhichisapttobendoragrid grooveonthePCboard,itisadvisable tohavebothelectrodessubjectedto uniformstress,ortopositionthe component'selectrodesatrightangles tothegridgrooveorbendingline(see c)Componentorientation). c)Componentorientation Chooseamountingpositionthat minimizesthestressimposedonthe chipduringflexingorbendingofthe board. PleasereadCautionsandwarningsand Page13of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Cautionsandwarnings See"Importantnotes". Storage Storethermistorsonlyinoriginalpackaging.Donotopenthepackagepriortostorage. Storageconditionsinoriginalpackaging:storagetemperature(cid:4)25(cid:176) C...+45(cid:176) C,relative humidity£ 75%annualmean,<95%maximum30daysperannum,dewprecipitationis inadmissible. Donotstorethermistorswheretheyareexposedtoheatordirectsunlight.Otherwise,the packingmaterialmaybedeformedorcomponentsmaysticktogether,causingproblemsduring mounting. Avoidcontaminationofthermistorsurfaceduringstorage,handlingandprocessing. Avoidstorageofthermistorsinharmfulenvironmentslikecorrosivegases(SO,Cletc). x Usethecomponentsassoonaspossibleafteropeningthefactoryseals,i.e.the polyvinyl-sealedpackages. SolderthermistorswithinthetimespecifiedaftershipmentfromEPCOS. Forleadedcomponentsthisis24months,forSMDcomponentswithnickelbarriertermination 12months,forSMDcomponentswithAgPdtermination6months. Handling NTCthermistorsmustnotbedropped.Chip-offsoranyotherdamagemustnotbecaused duringhandlingofNTCs. Donottouchcomponentswithbarehands.Glovesarerecommended. Avoidcontaminationofthermistorsurfaceduringhandling. Washingprocessesmaydamagetheproductduetothepossiblestaticorcyclicmechanical loads(e.g.ultrasoniccleaning).Theymaycausecrackstodevelopontheproductanditsparts, whichmightleadtoreducedreliabilityorlifetime. Bending/twistingleads Alead(wire)maybebentataminimumdistanceoftwicethewire’sdiameterplus4mmfrom thecomponentheadorhousing.Whenbendingensurethewireismechanicallyrelievedatthe componentheadorhousing.Thebendingradiusshouldbeatleast0.75mm. Twisting(torsion)by180(cid:176) ofaleadbentby90(cid:176) ispermissibleat6mmfromthebottomofthe thermistorbody. Soldering Useresin-typefluxornon-activatedflux. Insufficientpreheatingmaycauseceramiccracks. Rapidcoolingbydippinginsolventisnotrecommended. Completeremovaloffluxisrecommended. PleasereadCautionsandwarningsand Page14of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Mounting Ensurethatnothermo-mechanicalstressoccursduetoproductionprocesses(curingor overmoldingprocesses)whenthermistorsaresealed,pottedorovermoldedorduringtheir subsequentoperation.Themaximumtemperatureofthethermistormustnotbeexceeded. Ensurethatthematerialsused(sealing/pottingcompoundandplasticmaterial)arechemically neutral. Electrodes/contactsmustnotbescratchedordamagedbefore/during/afterthemounting process. Contactsandhousingusedforassemblywiththethermistormustbecleanbeforemounting. Ensurethatadjacentmaterialsaredesignedforoperationattemperaturescomparabletothe surfacetemperatureofthethermistor.Besurethatsurroundingpartsandmaterialscan withstandthetemperature. Avoidcontaminationofthethermistorsurfaceduringprocessing. Theconnectionsofsensors(e.g.cableend,wireend,plugterminal)mayonlybeexposedto anenvironmentwithnormalatmosphericconditions. Tensileforcesoncablesorleadsmustbeavoidedduringmountingandoperation. Bendingortwistingofcablesorleadsdirectlyonthethermistorbodyisnotpermissible. Avoidusingchemicalsubstancesasmountingaids.Itmustbeensuredthatnowaterorother liquidsentertheNTCthermistors(e.g.throughplugterminals).Inparticular,waterbased substances(e.g.soapsuds)mustnotbeusedasmountingaidsforsensors. Operation Usethermistorsonlywithinthespecifiedoperatingtemperaturerange. Usethermistorsonlywithinthespecifiedpowerrange. Environmentalconditionsmustnotharmthethermistors.Onlyusethethermistorsunder normalatmosphericconditionsorwithinthespecifiedconditions. ContactofNTCthermistorswithanyliquidsandsolventsshallbeprevented.Itmustbe ensuredthatnowaterenterstheNTCthermistors(e.g.throughplugterminals).For measurementpurposes(checkingthespecifiedresistancevs.temperature),thecomponent mustnotbeimmersedinwaterbutinsuitableliquids(e.g.Galden). Avoiddewingandcondensationunlessthermistorisspecifiedfortheseconditions. Bendingortwistingofcablesand/orwiresisnotpermissibleduringoperationofthesensorin theapplication. Besuretoprovideanappropriatefail-safefunctiontopreventsecondaryproductdamage causedbymalfunction. Thislistingdoesnotclaimtobecomplete,butmerelyreflectstheexperienceofEPCOSAG. PleasereadCautionsandwarningsand Page15of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Symbolsandterms Symbol English German A Area Fläche AWG AmericanWireGauge AmerikanischeNormfürDrahtquerschnitte B Bvalue B-Wert B Bvaluedeterminedbyresistance B-Wert,ermitteltdurchWiderstands- 25/100 measurementat25(cid:176) Cand100(cid:176) C messungenbei25(cid:176) Cund100(cid:176) C C Heatcapacitance Wärmekapazität th I Current Strom N Number(integer) Anzahl(ganzzahligerWert) P Maximumpowerat25(cid:176) C MaximaleLeistungbei25(cid:176) C 25 P Powerdissipation Verlustleistung diss P Electricalpower ElektrischeLeistung el P Maximumpowerwithinstated MaximaleLeistungim max temperaturerange angegebenenTemperaturbereich D R /R Resistancetolerancecausedby Widerstandstoleranz,diedurchdie B B spreadofBvalue StreuungdesB-Wertesverursachtwird R Insulationresistance Isolationswiderstand ins R Parallelresistance Parallelwiderstand P R Ratedresistance Nennwiderstand R D R /R Resistancetolerance Widerstandstoleranz R R R Seriesresistance Serienwiderstand S R ResistanceattemperatureT WiderstandbeiTemperaturT T (e.g.R =resistanceat25(cid:176) C) (z.B.R =Widerstandbei25(cid:176) C) 25 25 T Temperature Temperatur D T Temperaturetolerance Temperaturtoleranz t Time Zeit T Ambienttemperature Umgebungstemperatur A T Uppercategorytemperature ObereGrenztemperatur max (Kategorietemperatur) T Lowercategorytemperature UntereGrenztemperatur min (Kategorietemperatur) T Operatingtemperature Betriebstemperatur op T Ratedtemperature Nenntemperatur R T Surfacetemperature Oberflächentemperatur surf V Voltage Spannung V Insulationtestvoltage Isolationsprüfspannung ins V Operatingvoltage Betriebsspannung op V Testvoltage Prüfspannung test PleasereadCautionsandwarningsand Page16of18 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57863S Miniaturesensorswithbendablewires S863 Symbol English German a Temperaturecoefficient Temperaturkoeffizient D Tolerance,change Toleranz,Änderung d Dissipationfactor Wärmeleitwert th t Thermalcoolingtimeconstant ThermischeAbkühlzeitkonstante c t Thermaltimeconstant ThermischeZeitkonstante a Abbreviations/Notes Symbol English German Surface-mounteddevices OberflächenmontierbaresBauelement * Tobereplacedbyanumberinordering PlatzhalterfürZahlimBestellnummern- codes,typedesignationsetc. codeoderfürdieTypenbezeichnung. + Tobereplacedbyaletter. PlatzhalterfüreinenBuchstaben. Alldimensionsaregiveninmm. AlleMaßesindinmmangegeben. Thecommasusedinnumericalvalues VerwendeteKommasinZahlenwerten denotedecimalpoints. bezeichnenDezimalpunkte. PleasereadCautionsandwarningsand Page17of18 Importantnotesattheendofthisdocument.

Importantnotes Thefollowingappliestoallproductsnamedinthispublication: 1. Somepartsofthispublicationcontainstatementsaboutthesuitabilityofourproductsfor certain areas of application. These statements are based on our knowledge of typical re- quirementsthatareoftenplacedonourproductsintheareasofapplicationconcerned.We nevertheless expressly point out that such statements cannot be regarded as binding statementsaboutthesuitabilityofourproductsforaparticularcustomerapplication. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bentonthecustomertocheckanddecidewhetheranEPCOSproductwiththepropertiesde- scribedintheproductspecificationissuitableforuseinaparticularcustomerapplication. 2. We also point out that in individual cases, a malfunction of electronic components or failurebeforetheendoftheirusualservicelifecannotbecompletelyruledoutinthe currentstateoftheart,eveniftheyareoperatedasspecified.Incustomerapplications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g.installationofprotectivecircuitryorredundancy)thatnoinjuryordamageissustainedby thirdpartiesintheeventofmalfunctionorfailureofanelectroniccomponent. 3. Thewarnings,cautionsandproduct-specificnotesmustbeobserved. 4. In order to satisfy certain technical requirements, some of the products described in this publicationmaycontainsubstancessubjecttorestrictionsincertainjurisdictions(e.g. becausetheyareclassedashazardous).UsefulinformationonthiswillbefoundinourMa- terialDataSheetsontheInternet(www.epcos.com/material).Shouldyouhaveanymorede- tailedquestions,pleasecontactoursalesoffices. 5. Weconstantlystrivetoimproveourproducts.Consequently,theproductsdescribedinthis publicationmaychangefromtimetotime.Thesameistrueofthecorrespondingproduct specifications.Pleasecheckthereforetowhatextentproductdescriptionsandspecifications containedinthispublicationarestillapplicablebeforeorwhenyouplaceanorder.Wealso reservetherighttodiscontinueproductionanddeliveryofproducts.Consequently,we cannot guarantee that all products named in this publication will always be available. The aforementioneddoesnotapplyinthecaseofindividualagreementsdeviatingfromthefore- goingforcustomer-specificproducts. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further informationwillbefoundontheInternetatwww.epcos.com/trademarks. Page18of18

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