SMD NTC Thermistors (EPCOS) Series/Type: B57471V2 The following products presented in this data sheet are being withdrawn. Ordering Code Substitute Product Date of Deadline Last Last Withdrawal Orders Shipments B57471V2684J062 2020-10-02 2021-01-08 2021-04-09 B57471V2684H062 2020-10-02 2021-01-08 2021-04-09 Please contact your nearest TDK sales office if you need support in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.tdk- electronics.tdk.com/sales.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Applications Dimensionaldrawing Temperaturemeasurementand compensation Features MultilayerSMDNTCwithinnerelectrodes Nickelbarriertermination Fortemperaturemeasurementupto125(cid:176) C Excellentlong-termagingstabilityinhigh temperatureenvironment Highmechanicalrobustness Shortresponsetime 100%Pbfree ULapproval(E69802) Dimensionsinmm Approx.weight13mg Options Alternativeresistanceratings,resistance tolerancesandBvaluetolerancesavailable onrequest. Deliverymode Blistertape,180-mmreel(standard); 330-mmreel(onrequest) Generaltechnicaldata Operatingtemperaturerange Top (cid:4)55...125 (cid:176) C Max.power (at25(cid:176) C,onPCB) P 1) 210 mW 25 Resistancetolerance D R /R – 3,– 5 % R R Ratedtemperature T 25 (cid:176) C R Dissipationfactor (onPCB) d 1) approx.3.5 mW/K th Thermalcoolingtimeconstant (onPCB) t 1) approx.10 s c Heatcapacity C 1) approx.35 mJ/K th 1) Dependsonmountingsituation PleasereadCautionsandwarningsand Page2of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Electricalspecificationandorderingcodes R25 D RR/RR No.ofR/T B25/50 B25/85 B25/100 Orderingcode W % characteristic K K K 1.0k – 3,– 5 8502 3940 3980 4000– 3% B57421V2102+062 1.5k – 3,– 5 8502 3940 3980 4000– 3% B57421V2152+062 2.2k – 3,– 5 8502 3940 3980 4000– 3% B57421V2222+062 3.3k – 3,– 5 8502 3940 3980 4000– 3% B57421V2332+062 4.7k – 3,– 5 8500 3590 3635 3650– 3% B57401V2472+062 4.7k – 3,– 5 8507 4386 4455 4480– 3% B57471V2472+062 6.8k – 3,– 5 8507 4386 4455 4480– 3% B57471V2682+062 10k – 3,– 5 8500 3590 3635 3650– 3% B57401V2103+062 10k – 5 1011 3660 3720 3730– 3% B57620C5103J062 10k – 3,– 5 8502 3940 3980 4000– 3% B57421V2103+062 10k – 3,– 5 8507 4386 4455 4480– 3% B57471V2103+062 15k – 5 8502 3940 3980 4000– 3% B57421V2153J062 22k – 3,– 5 8502 3940 3980 4000– 3% B57421V2223+062 22k – 3,– 5 8507 4386 4455 4480– 3% B57471V2223+062 33k – 3,– 5 8502 3940 3980 4000– 3% B57421V2333+062 33k – 3,– 5 8507 4386 4455 4480– 3% B57471V2333+062 47k – 3,– 5 8502 3940 3980 4000– 3% B57421V2473+062 47k – 3,– 5 8507 4386 4455 4480– 3% B57471V2473+062 100k – 3,– 5 8507 4386 4455 4480– 3% B57471V2104+062 470k – 3,– 5 8507 4386 4455 4480– 3% B57471V2474+062 680k – 3,– 5 8507 4386 4455 4480– 3% B57471V2684+062 += Resistancetolerance H=– 3% J= – 5% PleasereadCautionsandwarningsand Page3of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Reliabilitydata SMDNTCthermistorsaretestedinaccordancewithIEC60068.Thepartsaremountedona standardizedPCBinaccordancewithIEC60539-1. Test Standard Testconditions D R /R Remarks 25 25 (typical) Storagein IEC Storageatupper <2%1) dryheat 60068-2-2 categorytemperature JISC0021 T:(125– 2)(cid:176) C t:1000h Storageindamp IEC Temperatureofair:(40– 2)(cid:176) C <2%2) heat,steadystate 60068-2-78 Relativehumidityofair: JISC0022 (93+2/(cid:4)3)% Duration:56days2) Rapidtemperature IEC Lowertesttemperature:(cid:4)55(cid:176) C <2%3) cycling 60068-2-14 Uppertesttemperature:125(cid:176) C JISC0025 Numberofcycles:1003) Endurance P :210mW <2%4) max T:(65– 2)(cid:176) C t:1000h Solderability IEC Solderability: 95%of 60068-2-58 (215– 3)(cid:176) C,(3– 0.3)s terminations JISC0054 (245– 5)(cid:176) C,(3– 0.3)s wetted Resistancetosolderingheat: (260– 5)(cid:176) C,(10– 1)s Resistancedrift Reflowsolderingprofile <1%4) aftersoldering Wavesolderingprofile 1) ExceptB57620C5102+062D R25/R25(typical):<6%,B57620C5103+062D R25/R25(typical):<3% 2) ExceptB57620C5102+062andB57620C5103+062duration:21days,D R25/R25(typical):<3% 3) ExceptB57620C5102+062andB57620C5103+062numberofcycles:10,D R25/R25(typical):<3% 4) ExceptB57620C5102+062andB57620C5103+062D R25/R25(typical):<5% PleasereadCautionsandwarningsand Page4of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries R/Tcharacteristics R/TNo. 1011 8500 8502 T((cid:176) C) B =3730K B =3650K B =4000K 25/100 25/100 25/100 R/R a (%/K) R/R a (%/K) R/R a (%/K) T 25 T 25 T 25 (cid:4)55.0 70.014 6.9 63.917 6.8 96.158 7.4 (cid:4)50.0 49.906 6.7 45.889 6.5 66.892 7.1 (cid:4)45.0 36.015 6.4 33.344 6.3 47.127 6.9 (cid:4)40.0 26.296 6.2 24.504 6.1 33.606 6.6 (cid:4)35.0 19.411 6.0 18.201 5.8 24.243 6.4 (cid:4)30.0 14.479 5.8 13.657 5.6 17.681 6.2 (cid:4)25.0 10.903 5.6 10.347 5.5 13.032 6.0 (cid:4)20.0 8.2923 5.4 7.9114 5.3 9.702 5.8 (cid:4)15.0 6.3591 5.2 6.1019 5.1 7.2923 5.6 (cid:4)10.0 4.9204 5.1 4.7454 4.9 5.5314 5.4 (cid:4)5.0 3.8279 4.9 3.7198 4.8 4.2325 5.3 0.0 3.0029 4.8 2.938 4.6 3.2657 5.1 5.0 2.3773 4.6 2.3372 4.5 2.54 4.9 10.0 1.8959 4.5 1.8722 4.4 1.9907 4.8 15.0 1.5207 4.3 1.5096 4.2 1.5716 4.7 20.0 1.228 4.2 1.2249 4.1 1.2494 4.5 25.0 1.0000 4.1 1.0000 4.0 1.0000 4.4 30.0 0.81779 3.9 0.82111 3.9 0.80552 4.3 35.0 0.67341 3.8 0.67798 3.8 0.65288 4.1 40.0 0.55747 3.7 0.56279 3.7 0.53229 4.0 45.0 0.46357 3.6 0.46958 3.6 0.43645 3.9 50.0 0.3874 3.6 0.39374 3.5 0.35981 3.8 55.0 0.32368 3.5 0.33171 3.4 0.29819 3.7 60.0 0.272 3.4 0.28073 3.3 0.24837 3.6 65.0 0.23041 3.3 0.23863 3.2 0.20787 3.5 70.0 0.19604 3.2 0.2037 3.1 0.17479 3.4 75.0 0.16735 3.1 0.17459 3.0 0.14763 3.3 80.0 0.14342 3.0 0.15022 3.0 0.12523 3.2 85.0 0.12347 3.0 0.12975 2.9 0.10667 3.2 90.0 0.10668 2.8 0.11247 2.8 0.091227 3.1 95.0 0.092734 2.8 0.097838 2.8 0.078319 3.0 100.0 0.080903 2.8 0.085396 2.7 0.067488 2.9 105.0 0.070616 2.7 0.074781 2.6 0.058363 2.9 110.0 0.061826 2.6 0.065691 2.6 0.050647 2.8 115.0 0.054282 2.6 0.057883 2.5 0.044098 2.7 120.0 0.047793 2.5 0.051153 2.4 0.03852 2.7 125.0 0.042249 2.4 0.045335 2.4 0.033752 2.6 130.0 (cid:4) (cid:4) 0.040289 2.3 0.029663 2.6 135.0 (cid:4) (cid:4) 0.0359 2.3 0.026146 2.5 140.0 (cid:4) (cid:4) 0.032071 2.2 0.023111 2.4 145.0 (cid:4) (cid:4) 0.028723 2.2 0.020484 2.4 150.0 (cid:4) (cid:4) 0.025786 2.1 0.018203 2.3 PleasereadCautionsandwarningsand Page5of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries R/Tcharacteristics R/TNo. 8507 T((cid:176) C) B =4480K T((cid:176) C) B =4480K T((cid:176) C) B =4480K 25/100 25/100 25/100 R/R a (%/K) R/R a (%/K) R/R a (%/K) T 25 T 25 T 25 (cid:4)55.0 142.71 7.9 15.0 1.6492 5.1 85.0 0.081823 3.6 (cid:4)50.0 96.913 7.6 20.0 1.2798 5.0 90.0 0.068589 3.5 (cid:4)45.0 66.637 7.4 25.0 1.0000 4.9 95.0 0.057735 3.4 (cid:4)40.0 46.366 7.1 30.0 0.78663 4.7 100.0 0.048796 3.3 (cid:4)35.0 32.629 6.9 35.0 0.62277 4.6 105.0 0.041403 3.2 (cid:4)30.0 23.213 6.7 40.0 0.4961 4.5 110.0 0.035263 3.2 (cid:4)25.0 16.686 6.5 45.0 0.39757 4.4 115.0 0.030143 3.1 (cid:4)20.0 12.115 6.3 50.0 0.32044 4.3 120.0 0.025858 3.0 (cid:4)15.0 8.8803 6.1 55.0 0.2597 4.1 125.0 0.022258 3.0 (cid:4)10.0 6.5692 5.9 60.0 0.21161 4.0 130.0 0.019223 2.9 (cid:4)5.0 4.9025 5.8 65.0 0.17331 3.9 135.0 0.016655 2.8 0.0 3.6896 5.6 70.0 0.14265 3.8 140.0 0.014476 2.8 5.0 2.7994 5.4 75.0 0.11799 3.8 145.0 0.012619 2.7 10.0 2.1406 5.3 80.0 0.098035 3.7 150.0 0.011033 2.7 PleasereadCautionsandwarningsand Page6of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Tapingandpacking 1 TapingofSMDNTCthermistors TapeandreelpackingaccordingtoIEC60286-3. Tapematerial:Cardboardorblister,tapewidth8– 0.30mm 2 Reelpacking Dimensionsinmm 8-mmtape 180-mmreel 330-mmreel A 180+0/(cid:4)3 330+0/(cid:4)2.0 W1 8.4+1.5/(cid:4)0 8.4+1.5/(cid:4)0 W 14.4max. 14.4max. 2 Leader,trailer PleasereadCautionsandwarningsand Page7of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Packingunitsfordiscretechip Casesize Chipthickness Cardboardtape Blistertape ˘ 180-mmreel ˘ 330-mmreel inch/mm th W W pcs. pcs. 0402/1005 0.5mm 8mm (cid:4) 10000 50000 0603/1608 0.8mm 8mm 8mm 4000 16000 0805/2012 0.8mm (cid:4) 8mm 2000/4000 16000 1.2mm (cid:4) 8mm 3000 12000 1206/3216 0.8mm (cid:4) 8mm 2000 12000 1.2mm (cid:4) 8mm 4000 12000 3 Packingcodes Thelasttwodigitsofthecompleteorderingcodestatethepackingmode: Lasttwodigits 60 SMD Cardboardtape 180-mmreelpacking 62 SMD Blistertape 180-mmreelpacking 70 SMD Cardboardtape 330-mmreelpacking 72 SMD Blistertape 330-mmreelpacking PleasereadCautionsandwarningsand Page8of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 4 TapingofradialleadedNTCthermistors Dimensionsandtolerances LeadspacingF=2.5mmand5.0mm(tapingtoIEC60286-2) Dimensions(mm) Lead Lead Toleranceof Remarks spacing spacing leadspacing 2.5mm 5mm 2.5/5mm w 11.0 11.5 max. th 5.0 6.0 max. d 0.5/0.6 0.5/0.6 – 0.05 P 12.7 12.7 – 0.3 – 1mm/20sprocketholes 0 P 5.1 3.85 – 0.7 1 F 2.5 5.0 +0.6/(cid:4)0.1 D h 0 0 – 2.0 measuredattopofcomponentbody D p 0 0 – 1.3 W 18.0 18.0 – 0.5 W 5.5 5.5 min. peel-offforce‡ 5N 0 W1 9.0 9.0 +0.75/(cid:4)0.5 W 3.0 3.0 max. 2 H 18.0 18.0 +2.0/(cid:4)0 H 16.0 16.0 – 0.5 0 H 32.2 32.2 max. 1 D 4.0 4.0 – 0.2 0 t 0.9 0.9 max. withoutwires L 11.0 11.0 max. L 4.0 4.0 max. 1 PleasereadCautionsandwarningsand Page9of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Typesofpacking Ammopacking Ammo x y z type I 80 240 210 Packingunit:1000-2000pcs./reel Reelpacking Packingunit:1000-2000pcs./reel Reeldimensions(inmm) Reeltype d f n w I 360max. 31– 1 approx.45 54max. PleasereadCautionsandwarningsand Page10of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Cassettepacking Packingunit:1000-2000pcs./cassette Bulkpacking Thecomponentsarepackedincardboardboxes,thesizeofwhichdependsontheorderquantity. PleasereadCautionsandwarningsand Page11of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 5 Packingcodes Thelasttwodigitsofthecompleteorderingcodestatethepackingmode: Lasttwodigits 00,01,02,03,04, (cid:4) Bulk (cid:4) 05,06,07,08 40,41 (cid:4) Bulk (cid:4) 45 (cid:4) Bulk (cid:4) 50 Radialleads,kinked Cardboardtape Cassettepacking 51 Radialleads,kinked Cardboardtape 360-mmreelpacking 52 Radialleads,straight Cardboardtape Cassettepacking 53 Radialleads,straight Cardboardtape 360-mmreelpacking 54 Radialleads,kinked Cardboardtape AMMOpacking 55 Radialleads,straight Cardboardtape AMMOpacking (Ifnopackingcodeisindicated,thiscorrespondsto40) Example1: B57164K0102J000 Bulk B57164K0102J052 Cardboardtape,cassettepacking Example2: B57881S0103F002 Bulk B57881S0103F251 Cardboardtape,reelpacking PleasereadCautionsandwarningsand Page12of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Mountinginstructions 1 Soldering 1.1 LeadedNTCthermistors LeadedthermistorscomplywiththesolderabilityrequirementsspecifiedbyCECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat.Thefollowingmaximumtemperatures,maximumtimespansandminimumdistanceshave tobeobserved: Dipsoldering Ironsoldering Bathtemperature max.260(cid:176) C max.360(cid:176) C Solderingtime max.4s max.2s Distancefromthermistor min.6mm min.6mm Undermoreseveresolderingconditionstheresistancemaychange. 1.1.1 Wavesoldering Temperaturecharacteristicatcomponentterminalwithdualwavesoldering PleasereadCautionsandwarningsand Page13of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 1.2 LeadlessNTCthermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder mayproducefinecracksintheceramic,resultinginchangesinresistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content shouldbeused.Inaddition,solderingmethodsshouldbeemployedwhichpermitshortsoldering times. 1.3 SMDNTCthermistors SMDNTCthermistorscanbeprovidedwithanickelbarrierterminationoronspecialrequestwith silver-palladium termination. The use of no-clean solder products is recommended. In any case mild,non-activatedfluxesshouldbeused.Fluxresiduesaftersolderingshouldbeminimized. SMDNTCswithAgPdterminationarenotapprovedforlead-freesoldering. Nickelbarriertermination Figure1 SMDNTCthermistors,structureofnickel barriertermination Thenickelbarrierlayerofthesilver/nickel/tintermination(seefigure1)preventsleachingofthe silverbasemetallizationlayer.Thisallowsgreatflexibilityintheselectionofsolderingparameters. Thetinpreventsthenickellayerfromoxidizingandthusensuresbetterwettingbythesolder.The nickel barrier termination is tested for all commonly-used soldering methods according to IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solventisnotrecommended. Thefollowingtestandprocessconditionsapplyfornickelbarriertermination. PleasereadCautionsandwarningsand Page14of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 1.3.1 Solderability(testtoIEC60068-2-58) Preconditioning:ImmersionintofluxF-SW32. Evaluationcriterion:Wettingofsolderingareas‡ 95%. Solder Bathtemperature((cid:176) C) Dwelltime(s) SnPb60/40 215– 3 3– 0.3 SnAg(3.0...4.0),Cu(0.5...0.9) 245– 3 3– 0.3 1.3.2 Resistancetosolderingheat(testtoIEC60068-2-58) Preconditioning:ImmersionintofluxF-SW32. Evaluationcriterion:Leachingofsideedges£ 1/3. Solder Bathtemperature((cid:176) C) Dwelltime(s) SnPb60/40 260– 5 10– 1 SnAg(3.0...4.0),Cu(0.5...0.9) 260– 5 10– 1 1.3.3 Reflowsoldering Temperaturerangesforreflowsolderingacc.toIEC60068-2-58recommendations. PleasereadCautionsandwarningsand Page15of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Profilefeature Sn-Pbeutecticassembly Pb-freeassembly Preheatandsoak -Temperaturemin T 100(cid:176) C 150(cid:176) C smin -Temperaturemax T 150(cid:176) C 200(cid:176) C smax -Time t tot 60...120s 60...120s smin smax Averageramp-uprate T toT 3(cid:176) C/smax. 3(cid:176) C/smax. smax p Liquidoustemperature T 183(cid:176) C 217(cid:176) C L Timeatliquidous t 40...150s 40...150s L Peakpackagebodytemperature T 215(cid:176) C...260(cid:176) C1) 235(cid:176) C...260(cid:176) C p Timeabove(TP(cid:4)5(cid:176) C) tp 10...40s 10...40s Averageramp-downrate T toT 6(cid:176) C/smax. 6(cid:176) C/smax. p smax Time25(cid:176) Ctopeaktemperature max.8minutes max.8minutes 1) Dependingonpackagethickness. Notes: Alltemperaturesrefertotopsideofthepackage,measuredonthepackagebody surface. Numberofreflowcycles:3 Ironsolderingshouldbeavoided,hotairmethodsarerecommendedforrepair purposes. Solderjointprofilesforsilver/nickel/tinterminations PleasereadCautionsandwarningsand Page16of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 1.3.4 Recommendedgeometryofsolderpads Recommendedmaximumdimensions(mm) Casesize A B C inch/mm 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductiveadhesion Analternativetosolderingforsilver-palladiumterminatedcomponentsisthegluingofthermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesivesusedmustbechemicallyinert. 3 Clampcontacting Pressurecontactingbymeansofclampsisparticularlysuitableforapplicationsinvolvingfrequent switchingandhighturn-onpowers. 4 Robustnessofterminations(leadedtypes) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feed- throughs.Duringbending,anymechanicalstressattheoutletoftheleadsmustberemoved.The bendingradiusshouldbeatleast0.75mm. PleasereadCautionsandwarningsand Page17of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Tensilestrength: TestUa1: ValueofappliedforceforUa1test: Diameter(d)of Forcewithtoleranceof– 10% correspondingroundleads ˘£ 0.25mm 1.0N 0.25<˘£ 0.35mm 2.5N 0.35<˘£ 0.50mm 5.0N 0.50<˘£ 0.80mm 10.0N Bendingstrength: TestUb: Two90(cid:176) -bendsinoppositedirections ValueofappliedforceforUbtest: Diameter(d)of Forcewithtoleranceof– 10% correspondingroundleads ˘£ 0.25mm 0.5N 0.25<˘£ 0.35mm 1.25N 0.35<˘£ 0.50mm 2.5N 0.50<˘£ 0.80mm 5N Torsionalstrength: TestUc:severity2 Theleadisbentby90(cid:176) atadistanceof6to6.5mmfromthethermistorbody. Thebendingradiusoftheleadsshouldbeapprox.0.75mm.Twotorsionsof 180(cid:176) each(severity2). Whensubjectingleadstomechanicalstress,thefollowingshouldbeobserved: Tensilestressonleads Duringmountingandoperationtensileforcesontheleadsaretobeavoided. Bendingofleads Bendingoftheleadsdirectlyonthethermistorbodyisnotpermissible. A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder jointonthethermistorbody.Duringbendingthewiremustbemechanicallyrelievedatitsoutlet. Thebendingradiusshouldbeatleast0.75mm. PleasereadCautionsandwarningsand Page18of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 5 Sealingandpotting Sealingorpottingprocessescanaffectthereliabilityofthecomponent. Whenthermistorsaresealed,pottedorovermolded,theremustbenomechanicalstresscaused by thermal expansion during the production process (curing / overmolding process) and during lateroperation.Theuppercategorytemperatureofthethermistormustnotbeexceeded.Ensure thatthematerialsused(sealing/pottingcompoundand plasticmaterial)arechemicallyneutral. Asthermistorsaretemperaturesensitivecomponentsitshouldbeconsideredthatmoldingcanaf- fectthethermalsurroundingandmayinfluencee.g.theresponsetime. Extensivetestingisencouragedinordertodeterminewhetherovermoldingorpottinginfluences thefunctionalityand/orreliabilityofthecomponent. 6 Cleaning Cleaningprocessescanaffectthereliabilityofthecomponent. Ifcleaningisnecessary,mildcleaningagentsarerecommended.Cleaningagentsbasedonwa- ter are not allowed. Washing processes may damage the product due to the possible static or cyclicmechanicalloads(e.g.ultrasoniccleaning).Theymaycausecrackswhichmightleadtore- ducedreliabilityand/orlifetime. 7 Storage Inordertomaintaintheirsolderability,thermistorsmustbestoredinanon-corrosiveatmosphere. Humidity,temperatureandcontainermaterialsarecriticalfactors. DonotstoreSMDswheretheyareexposedtoheatordirectsunlight.Otherwise,thepackingma- terial may be deformed or SMDs may stick together, causing problems during mounting. After openingthefactoryseals,suchaspolyvinyl-sealedpackages,usetheSMDsassoonaspossible. Thecomponentsshouldbeleftintheoriginalpacking.Touchingthemetallizationofunsoldered thermistorsmaychangetheirsolderingproperties. Storagetemperature: (cid:4)25(cid:176) Cupto45(cid:176) C Relativehumidity(withoutcondensation): £ 75%annualmean <95%,maximum30daysperannum SolderthethermistorslistedinthisdatabookaftershipmentfromTDKwithinthetimespecified: SMDswithAgPdtermination: 6months SMDswithnickelbarriertermination: 12months Leadlesscomponents: 12months Leadedcomponents: 24months PleasereadCautionsandwarningsand Page19of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries 8 PlacementandorientationofSMDNTCthermistorsonPCB a)Componentplacement ItisrecommendedthatthePCboard shouldbeheldbymeansofsome adequatesupportingpinssuchas shownlefttopreventtheSMDsfrom beingdamagedorcracked. b)Cracks Whenplacingacomponentnearan areawhichisapttobendoragrid grooveonthePCboard,itisadvisable tohavebothelectrodessubjectedto uniformstress,ortopositionthe component'selectrodesatrightangles tothegridgrooveorbendingline(see c)Componentorientation). c)Componentorientation Chooseamountingpositionthat minimizesthestressimposedonthe chipduringflexingorbendingofthe board. PleasereadCautionsandwarningsand Page20of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Cautionsandwarnings General See"Importantnotes"attheendofthisdocument. Storage Storethermistorsonlyinoriginalpackaging.Donotopenthepackagepriortoprocessing. Storageconditionsinoriginalpackaging:storagetemperature(cid:4)25(cid:176) C...+45(cid:176) C,relative humidity£ 75%annualmean,<95%maximum30daysperannum,dewprecipitationis inadmissible. Donotstorethermistorswheretheyareexposedtoheatordirectsunlight.Otherwise,the packingmaterialmaybedeformedorcomponentsmaysticktogether,causingproblemsduring mounting. Avoidcontaminationofthermistorsurfaceduringstorage,handlingandprocessing. Avoidstorageofthermistorsinharmfulenvironmentslikecorrosivegases(SO,Cletc). x Usethecomponentsassoonaspossibleafteropeningtheoriginalpackaging. SolderthermistorswithinthetimespecifiedaftershipmentfromTDK. Forleadedcomponentsthisis24months,forSMDcomponentswithnickelbarriertermination 12months,forleadlesscomponentsthisis12months,forSMDcomponentswithAgPd termination6months. Handling NTCthermistorsmustnotbedropped.Chip-offsoranyotherdamagemustnotbecaused duringhandlingofNTCs. Donottouchcomponentswithbarehands.Glovesarerecommended. Avoidcontaminationofthermistorsurfaceduringhandling. Washingprocessesmaydamagetheproductduetothepossiblestaticorcyclicmechanical loads(e.g.ultrasoniccleaning).Theymaycausecrackstodevelopontheproductanditsparts, whichmightleadtoreducedreliabilityorlifetime. Bending/twistingleads Alead(wire)maybebentataminimumdistanceoftwicethewire’sdiameterplus4mmfrom thecomponentheadorhousing.Whenbendingensurethewireismechanicallyrelievedatthe componentheadorhousing.Thebendingradiusshouldbeatleast0.75mm. Soldering Useresin-typefluxornon-activatedflux. Insufficientpreheatingmaycauseceramiccracks. Rapidcoolingbydippinginsolventisnotrecommended. Completeremovaloffluxisrecommended. PleasereadCautionsandwarningsand Page21of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Mounting Ensurethatnothermo-mechanicalstressoccursduetoproductionprocesses(curingor overmoldingprocesses)whenthermistorsaresealed,pottedorovermoldedorduringtheir subsequentoperation.Themaximumtemperatureofthethermistormustnotbeexceeded. Ensurethatthematerialsused(sealing/pottingcompoundandplasticmaterial)arechemically neutral. Electrodes/contactsmustnotbescratchedordamagedbefore/during/afterthemounting process. Contactsandhousingusedforassemblywiththethermistormustbecleanbeforemounting. Ensurethatadjacentmaterialsaredesignedforoperationattemperaturescomparabletothe surfacetemperatureofthethermistor.Besurethatsurroundingpartsandmaterialscan withstandthetemperature. Avoidcontaminationofthethermistorsurfaceduringprocessing. Theconnectionsofsensors(e.g.cableend,wireend,plugterminal)mayonlybeexposedto anenvironmentwithnormalatmosphericconditions. Tensileforcesoncablesorleadsmustbeavoidedduringmountingandoperation. Bendingortwistingofcablesorleadsdirectlyonthethermistorbodyisnotpermissible. Avoidusingchemicalsubstancesasmountingaids.Itmustbeensuredthatnowaterorother liquidsentertheNTCthermistors(e.g.throughplugterminals).Inparticular,waterbased substances(e.g.soapsuds)mustnotbeusedasmountingaidsforsensors. Theuseofno-cleansolderproductsisrecommended.Inanycasemild,non-activatedfluxes shouldbeused.Fluxresiduesaftersolderingshouldbeminimized. Operation Usethermistorsonlywithinthespecifiedoperatingtemperaturerange. Usethermistorsonlywithinthespecifiedpowerrange. Environmentalconditionsmustnotharmthethermistors.Onlyusethethermistorsunder normalatmosphericconditionsorwithinthespecifiedconditions. ContactofNTCthermistorswithanyliquidsandsolventsshallbeprevented.Itmustbe ensuredthatnowaterenterstheNTCthermistors(e.g.throughplugterminals).For measurementpurposes(checkingthespecifiedresistancevs.temperature),thecomponent mustnotbeimmersedinwaterbutinsuitableliquids(e.g.perfluoropolyetherssuchasGalden). Avoiddewingandcondensationunlessthermistorisspecifiedfortheseconditions. Bendingortwistingofcablesand/orwiresisnotpermissibleduringoperationofthesensorin theapplication. Besuretoprovideanappropriatefail-safefunctiontopreventsecondaryproductdamage causedbymalfunction. Thislistingdoesnotclaimtobecomplete,butmerelyreflectstheexperienceofTDK. PleasereadCautionsandwarningsand Page22of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries DisplayoforderingcodesforTDKElectronicsproducts The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shippingnotes,orderconfirmationsandproductlabels.Thevaryingrepresentationsoftheor- deringcodesareduetodifferentprocessesemployedanddonotaffectthespecifications oftherespectiveproducts. DetailedinformationcanbefoundontheInternetunder www.tdk-electronics.tdk.com/orderingcodes. PleasereadCautionsandwarningsand Page23of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Symbolsandterms Symbol English German A Area Fläche AWG AmericanWireGauge AmerikanischeNormfürDrahtquerschnitte B Bvalue B-Wert B Bvaluedeterminedbyresistance B-Wert,ermitteltdurchWiderstands- 25/100 measurementat25(cid:176) Cand100(cid:176) C messungenbei25(cid:176) Cund100(cid:176) C C Heatcapacitance Wärmekapazität th I Current Strom N Number(integer) Anzahl(ganzzahligerWert) P Maximumpowerat25(cid:176) C MaximaleLeistungbei25(cid:176) C 25 P Powerdissipation Verlustleistung diss P Electricalpower ElektrischeLeistung el P Maximumpowerwithinstated MaximaleLeistungim max temperaturerange angegebenenTemperaturbereich D R /R Resistancetolerancecausedby Widerstandstoleranz,diedurchdie B B spreadofBvalue StreuungdesB-Wertesverursachtwird R Insulationresistance Isolationswiderstand ins R Parallelresistance Parallelwiderstand P R Ratedresistance Nennwiderstand R D R /R Resistancetolerance Widerstandstoleranz R R R Seriesresistance Serienwiderstand S R ResistanceattemperatureT WiderstandbeiTemperaturT T (e.g.R =resistanceat25(cid:176) C) (z.B.R =Widerstandbei25(cid:176) C) 25 25 T Temperature Temperatur D T Temperaturetolerance Temperaturtoleranz t Time Zeit T Ambienttemperature Umgebungstemperatur A T Uppercategorytemperature ObereGrenztemperatur max (Kategorietemperatur) T Lowercategorytemperature UntereGrenztemperatur min (Kategorietemperatur) T Operatingtemperature Betriebstemperatur op T Ratedtemperature Nenntemperatur R T Surfacetemperature Oberflächentemperatur surf V Voltage Spannung V Insulationtestvoltage Isolationsprüfspannung ins V Operatingvoltage Betriebsspannung op V Testvoltage Prüfspannung test PleasereadCautionsandwarningsand Page24of27 Importantnotesattheendofthisdocument.

Temperaturemeasurementandcompensation B574**V2/B57620C5 SMDNTCthermistors,casesize0805(2012) Standardseries Symbol English German a Temperaturecoefficient Temperaturkoeffizient D Tolerance,change Toleranz,Änderung d Dissipationfactor Wärmeleitwert th t Thermalcoolingtimeconstant ThermischeAbkühlzeitkonstante c t Thermaltimeconstant ThermischeZeitkonstante a Abbreviations/Notes Symbol English German Surface-mounteddevices OberflächenmontierbaresBauelement * Tobereplacedbyanumberinordering PlatzhalterfürZahlimBestellnummern- codes,typedesignationsetc. codeoderfürdieTypenbezeichnung. + Tobereplacedbyaletter. PlatzhalterfüreinenBuchstaben. Alldimensionsaregiveninmm. AlleMaßesindinmmangegeben. Thecommasusedinnumericalvalues VerwendeteKommasinZahlenwerten denotedecimalpoints. bezeichnenDezimalpunkte. PleasereadCautionsandwarningsand Page25of27 Importantnotesattheendofthisdocument.

Importantnotes Thefollowingappliestoallproductsnamedinthispublication: 1. Somepartsofthispublicationcontainstatementsaboutthesuitabilityofourproductsfor certain areas of application. These statements are based on our knowledge of typical re- quirementsthatareoftenplacedonourproductsintheareasofapplicationconcerned.We nevertheless expressly point out that such statements cannot be regarded as binding statementsaboutthesuitabilityofourproductsforaparticularcustomerapplication. As a rule, we are either unfamiliar with individual customer applications or less familiar with themthanthecustomersthemselves.Forthesereasons,itisalwaysultimatelyincumbenton the customer to check and decide whether a product with the properties described in the productspecificationissuitableforuseinaparticularcustomerapplication. 2. We also point out that in individual cases, a malfunction of electronic components or failurebeforetheendoftheirusualservicelifecannotbecompletelyruledoutinthe currentstateoftheart,eveniftheyareoperatedasspecified.Incustomerapplications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g.installationofprotectivecircuitryorredundancy)thatnoinjuryordamageissustainedby thirdpartiesintheeventofmalfunctionorfailureofanelectroniccomponent. 3. Thewarnings,cautionsandproduct-specificnotesmustbeobserved. 4. In order to satisfy certain technical requirements, some of the products described in this publicationmaycontainsubstancessubjecttorestrictionsincertainjurisdictions(e.g. becausetheyareclassedashazardous).UsefulinformationonthiswillbefoundinourMa- terial Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have anymoredetailedquestions,pleasecontactoursalesoffices. 5. Weconstantlystrivetoimproveourproducts.Consequently,theproductsdescribedinthis publicationmaychangefromtimetotime.Thesameistrueofthecorrespondingproduct specifications.Pleasecheckthereforetowhatextentproductdescriptionsandspecifications containedinthispublicationarestillapplicablebeforeorwhenyouplaceanorder.Wealso reservetherighttodiscontinueproductionanddeliveryofproducts.Consequently,we cannot guarantee that all products named in this publication will always be available. The aforementioneddoesnotapplyinthecaseofindividualagreementsdeviatingfromthefore- goingforcustomer-specificproducts. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General TermsandConditionsofSupply. Page26of27

Importantnotes 7. OurmanufacturingsitesservingtheautomotivebusinessapplytheIATF16949 standard.TheIATFcertificationsconfirmourcompliancewithrequirementsregardingthe qualitymanagementsystemintheautomotiveindustry.Referringtocustomerrequirements andcustomerspecificrequirements(“CSR”)TDKalwayshasandwillcontinuetohavethe policyofrespectingindividualagreements.EvenifIATF16949mayappeartosupportthe acceptanceofunilateralrequirements,weherebyliketoemphasizethatonlyrequirements mutuallyagreeduponcanandwillbeimplementedinourQualityManagementSystem. ForclarificationpurposesweliketopointoutthatobligationsfromIATF16949shallonly becomelegallybindingifindividuallyagreedupon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,DeltaCap,DigiSiMic,ExoCore,FilterCap,FormFit,LeaXield,MiniBlue,MiniCell,MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release2018-10 Page27of27