AXT5, 6 For board-to-FPC F4S Narrow pitch connectors Series (0.4mm pitch) FEATURES 1.Space-saving (3.6 mm widthwise) 3.Simple lock structure provides Smaller compared to F4 series (40 pin tactile feedback to ensure excellent contacts): mating/unmating operation feel. Socket — 27% smaller, Header — 38% smaller 3.6mm Socket 2.6mm Header Socket RoHS compliant 10.50 (40 pin contacts) Simple lock structure 3.60 Pickup width: 0.8mm 4.Gull-wing-shaped terminals to facilitate visual inspections. Soldering terminals at each corner 5.Connectors for inspection available Soldering terminals at each corner Header APPLICATIONS 2.60 9.80 (40 pin contacts) Mpdhiogobitnialeel s vd,i eddveigioci tecasal ,ms steuilrlc achsa .amse crealslu alanrd 2.Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. ORDERING INFORMATION AXT 2 4 5: Narrow Pitch Connector F4S (0.4 mm pitch) Socket 6: Narrow Pitch Connector F4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.0 mm 2: For mated height 1.2 mm <Header> 1: For mated height 1.0 mm 2: For mated height 1.2 mm Functions <Socket, Header> 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 4: Base: Ni plating Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating Surface: Au plating Note:Please note that models with a mated height of 1.0 mm (7th digit of part number is “1”) and 1.2 mm (7th digit of part number is “2”) are not compatible. ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXT5, 6 PRODUCT TYPES Part number Packing Mated height Number of pins Socket Header Inner carton Outer carton 10 AXT510124 AXT610124 12 AXT512124 AXT612124 14 AXT514124 AXT614124 16 AXT516124 AXT616124 20 AXT520124 AXT620124 22 AXT522124 AXT622124 24 AXT524124 AXT624124 26 AXT526124 AXT626124 28 AXT528124 AXT628124 30 AXT530124 AXT630124 32 AXT532124 AXT632124 1.0mm 34 AXT534124 AXT634124 36 AXT536124 AXT636124 40 AXT540124 AXT640124 42 AXT542124 AXT642124 3,000 pieces 6,000 pieces 44 AXT544124 AXT644124 48 AXT548124 AXT648124 50 AXT550124 AXT650124 54 AXT554124 AXT654124 60 AXT560124 AXT660124 64 AXT564124 AXT664124 70 AXT570124 AXT670124 80 AXT580124 AXT680124 10 AXT510224 AXT610224 30 AXT530224 AXT630224 40 AXT540224 AXT640224 1.2mm 50 AXT550224 AXT650224 70 AXT570224 AXT670224 80 AXT580224 AXT680224 Notes:1.Order unit: For volume production: 1-inner-box (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office. Samples: Small lot orders are possible. Please contact our sales office. ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXT5, 6 SPECIFICATIONS 1.Characteristics Item Specifications Conditions Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC No short-circuiting or damage at a detection current of 1 mA Electrical Breakdown voltage 150V AC for 1 min. when the specified voltage is applied for one minute. characteristics Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90mΩ Based on the contact resistance measurement method specified by JIS C 5402. Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial) Mechanical Composite removal force Min. 0.165N/pin contacts × pin contacts characteristics Contact holding force Measuring the maximum force. Min. 0.49N/pin contacts (Socket contact) As the contact is axially pull out. Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation. Peak temperature: 260°C or less (on the surface of Infrared reflow soldering Soldering heat resistance the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. Soldering iron –55°C to +85°C (product only) Storage temperature –40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Order Temperature (°C) Time (minutes) Echnavriraocntemriesntitcasl T(hheeardmear l asnhdo csko crekesits mtaantceed) 5icno scnuytclaalcetitso r,ne sreisstiasntacnec me amxi.n 9. 01m00ΩMΩ, 123 –5855−+0330 Ma33x00. 5 4 Max. 5 –55−03 Humidity resistance 1in2s0u lhaotiuorns ,resistance min. 100MΩ, Bath temperature 40±2°C, (header and socket mated) contact resistance max. 90mΩ humidity 90 to 95% R.H. S(haeltawdaetre ar nsdp rsaoyc rkeesti smtaantecde) 2icno4sn uhtlaoacutitro srne, sreisstiasntacnec me amxi.n 9. 01m00ΩMΩ, Bsaaltthw atetemr pceornactuernet r3a5ti±o2n° 5C±,1% H2S resistance 48 hours, Bath temperature 40±2°C, gas concentration 3±1 ppm, (header and socket mated) contact resistance max. 90mΩ humidity 75 to 80% R.H. Lifetime Repeated insertion and removal speed of max. 200 times/ Insertion and removal life 50 times characteristics hours Unit weight 20 pin contact type: Socket: 0.03 g Header: 0.01 g 2.Material and surface treatment Part name Material Surface treatment Molded LCP resin — portion (UL94V-0) Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) Contact and Copper alloy The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Post Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating Surface: Au plating (except the terminal tips) ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXT5, 6 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ Socket (Mated height: 1.0 mm and 1.2 mm) CAD Data e) A Terminal coplanarity 0 (Suction fac 00..4105±±00..00B53±0.1 D (0.62) (sCooldnetrainctg 0a tne.0drm 8inals*) DimNeudmnismbieoernn os tfi oapnbinles/ (mm)A B C 8 0. 10 4.50 1.60 3.40 3.00 2.36 3.60 1124 45..9300 22..0400 34..8200 16 5.70 2.80 4.60 2) 20 6.50 3.60 5.40 6 C0.15 (0. 22 6.90 4.00 5.80 24 7.30 4.40 6.20 26 7.70 4.80 6.60 28 8.10 5.20 7.00 30 8.50 5.60 7.40 32 8.90 6.00 7.80 34 9.30 6.40 8.20 36 9.70 6.80 8.60 Y note 40 10.50 7.60 9.40 42 10.90 8.00 9.80 2.00 3.60 General tolerance: ±0.2 4484 1112..3100 89..4200 1101..2000 Z note 50 12.50 9.60 11.40 0.30±0.03 C±0.1 0.45 (0.80) Mated height/ D 5640 1134..3500 1110..6400 1132..4200 dimension 64 15.30 12.40 14.20 1.0mm 0.97 70 16.50 13.60 15.40 Note:Since the soldering terminals* has a single-piece construction, 1.2mm 1.17 80 18.50 15.60 17.40 sections Y and Z are electrically connected. Header (Mated height: 1.0 mm and 1.2 mm) CAD Data e) 80 (Suction fac 00..4105±±B00±..A000.531 R0.15 D T(sPeoroldmseti nraiannlgd 0c t.oe0pr8mlaninaarlisty*) DimNeudmnismbieoernn os tfi oapnbinles/ (mm)A B C 0. 10 3.80 1.60 3.20 1.68 2.60 12 4.20 2.00 3.60 14 4.60 2.40 4.00 1.86 C0.13 0.46) 1260 55..0800 23..8600 45..4200 ( C0.13 2224 66..2600 44..0400 56..6000 26 7.00 4.80 6.40 28 7.40 5.20 6.80 30 7.80 5.60 7.20 32 8.20 6.00 7.60 34 8.60 6.40 8.00 Soldering terminals* 36 9.00 6.80 8.40 40 9.80 7.60 9.20 nals* 4424 1100..6200 88..4000 1 09..0600 0.15±0.03C±0.1 (0.48) 0.94 1.90 ng termi General tolerance: ±0.2 4580 1111..4800 99..6200 1110..2800 deri 54 12.60 10.40 12.00 ol S Mated height/ 60 13.80 11.60 13.20 D dimension 64 14.60 12.40 14.00 1.0mm 0.83 70 15.80 13.60 15.20 1.2mm 1.01 80 17.80 15.60 17.20 •Socket and Header are mated Header Header Socket ±1.000.15 Socket ±1.200.15 Mated height: 1.0 mm Mated height: 1.2 mm ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXT5, 6 EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common to all sockets and headers) •Specifications for taping •Specifications for the plastic reel (In accordance with JIS C 0806:1990. However, not applied to (In accordance with EIAJET-7200B.) the mounting-hole pitch of some connectors.) Tape I Tape II A±0.3 A±0.3 D±1 Taping reel Label C B 1.75 1.75 Top cover tape C g ding direction after packagin 8.042 ng direction after packaging 8.042 380 dia. EmEbomsbsoesds ceadr rmieoru tnatpineg-hole Lea eadi 1.5 + 00 . 1 dia. L 1.5 + 00 . 1 dia. •Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for 24 or less Tape I 16.00 — 7.50 17.40 3,000 sockets and headers: 26 to 70 Tape I 24.00 — 11.50 25.40 3,000 1.0mm, 1.2mm 80 Tape II 32.00 28.40 14.20 33.40 3,000 •Connector orientation with respect to embossed tape feeding direction Type Direction Common for F4S of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXT5, 6 For board-to-FPC Connectors for F4S inspection usage Series (0.4mm pitch) FEATURES APPLICATIONS 1.3,000 mating and unmating cycles Ideal for module unit inspection and 2.Same external dimensions and foot equipment assembly inspection pattern as standard type. 3.6mm Socket 2.6mm Header 3In.sIemrptioronv aendd m reamtionvgal easy due to a reduction in mating retention force. This is made possible by a simple locking RoHS compliant structure design. Note: Mating retention force cannot be warranted. TABLE OF PRODUCT TYPES ✩: Available for sale Product name Number of pins F4S 10 12 14 16 20 22 24 26 28 30 32 34 36 40 42 44 48 50 54 60 64 70 80 for inspection ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ Notes:1.Please inquire about number of pins other than those shown above. 2.Please inquire with us regarding availability. 3.Please keep the minimum order quantities no less than 50 pieces per lot. 4.Please inquire if further information is needed. 5.Please note that this inspection connector cannot be connected to standard models with a stacking height of 1.2 mm (AXT5∗∗224 and AXT6∗∗224). Please contact our sales office for a type connectable to models with a stacking height of 1.2 mm. PRODUCT TYPES Specifications Part No. Specifications Part No. Socket Without positioning bosses AXT5E∗∗26 Header Without positioning bosses AXT6E∗∗26 Notes:1.When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector. 2.The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our local sales office. ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXT5, 6 NOTES 1.For high resistance to drop impact •Socket (Mated height: 1.0 mm) •Header (Mated height: 1.0 mm) the F4 series is recommended. Recommended PC board pattern (TOP VIEW) Recommended PC board pattern (TOP VIEW) 2.Recommended PC board and metal mCdeoannssnkiet ypc, ationtrttsee rravnrasel sm oof u0n.3te5d m wmith, 0h.i4g hm pmit cohr 00..9700±±00..0033 (0.92)±2.360.03±4.200.03 00..8405±±00..0033 Max. 1.00(0.75)±1.700.03±3.200.03 0.5 mm. In order to reduce solder and flux rise, ssTouhlrede efi trgh uberr epidsrgo tepose t rha elne dvri egolhstht oeafrr esis orselduceeorsm ismm uaeskneedd e.d ±1.800.03(1.20) 00..2430±±00..0033 : Insulation area ±2.060.03±0.750.03(0.655) 00..2430±±00..0033 : Insulation area metal mask patterns. Please use them as Recommended metal mask pattern Recommended metal mask pattern a reference. Metal mask thickness: When 150µm Metal mask thickness: When 150µm (Terminal opening ratio: 48%) (Terminal opening ratio: 48%) (Metal-part opening ratio: 100%) (Metal-part opening ratio: 100%) 00..9700±±00..0011 (0.51)±2.980.01±4.000.01 00..8405±±00..0011 (0.41)±2.180.01±3.000.01 ±4.200.01±1.800.01(1.20) 00..2400±±00..0011 ±2.060.01±0.750.01(0.655) 00..2400±±00..0011 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 120µm Metal mask thickness: When 120µm (Terminal opening ratio: 60%) (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) (Metal-part opening ratio: 100%) 11 00..9700±±00..0011 (0.63)±2.740.0±4.000.0 00..8405±±00..0011 (0.52)±1.960.01±3.000.01 ±4.200.01±1.800.01(1.20) 00..2400±±00..0011 ±2.060.01±0.750.01(0.655) 00..2400±±00..0011 Please note that this inspection connector cannot be connected to standard models with a stacking height of 1.2 mm (AXT5∗∗224 and AXT6∗∗224). Please contact our sales office for a type connectable to models with a stacking height of 1.2 mm. Please refer to the latest product specifications when designing your product. ACCTB29E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Notes on Using Narrow pitch Connectors Regarding the design of devices and PC board patterns 1)When connecting several connectors 5)For all connectors of the narrow pitch backside of the FPC board to which the together by stacking, make sure to series, to prevent the PC board from connector is being connected. Please maintain proper accuracy in the design of coming off during vibrations or impacts, make the reinforcement board structure and mounting equipment so and to prevent loads from falling directly dimensions bigger than the outer limits of that the connectors are not subjected to on the soldered portions, be sure to the recommended PC board pattern twisting and torsional forces. design some means to fix the PC board (should be approximately 1 mm greater 2)With mounting equipment, there may in place. than the outer limit). be up to a ±0.2 to 0.3-mm error in Example) Secure in place with screws Material should be glass epoxy or positioning. Be sure to design PC boards polyimide, and the thickness should be Screw and patterns while taking into between 0.2 and 0.3 mm. consideration the performance and (2) Collisions, impacts, or turning of FPC abilities of the required equipment. Spacer Connector PC board boards, may apply forces on the Spacer 3) Some connectors have tabs embossed connector and cause it to come loose. on the body to aid in positioning. When Therefore, make to design retaining using these connectors, make sure that When connecting PC boards, take plates or screws that will fix the connector the PC board is designed with positioning appropriate measures to prevent the in place. holes to match these tabs. connector from coming off. 7)The narrow pitch connector series is 4)To ensure the required mechanical 6)Notes when using a FPC. designed to be compact and thin. strength when soldering the connector (1) When the connector is soldered to an Although ease of handling has been terminals, make sure the PC board FPC board, during its insertion and taken into account, take care when meets recommended PC board pattern removal procedures, forces may be mating the connectors, as displacement design dimensions given. applied to the terminals and cause the or angled mating could damage or soldering to come off. It is recommended deform the connector. to use a reinforcement board on the Regarding the selection of the connector placement machine and the mounting procedures 1)Select the placement machine taking 4)Depending on the size of the 6) Excessive mounter chucking force may into consideration the connector height, connector being used, self alignment deform the molded or metal part of the required positioning accuracy, and may not be possible. In such cases, be connector. Consult us in advance if packaging conditions. sure to carefully position the terminal with chucking is to be applied. 2)Be aware that if the catching force of the PC board pattern. the placement machine is too great, it 5)The positioning bosses give an may deform the shape of the connector approximate alignment for positioning on body or connector terminals. the PC board. For accurate positioning of 3)Be aware that during mounting, the connector when mounting it to the PC external forces may be applied to the board, we recommend using an connector contact surfaces and terminals automatic positioning machine. and cause deformations. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Regarding soldering 1.Reflow soldering Soldering conditions 2.Hand soldering 1)Measure the recommended profile Please use the reflow temperature profile 1)Set the soldering iron so that the tip temperature for reflow soldering by conditions recommended below for temperature is less than that given in the placing a sensor on the PC board near reflow soldering. Please contact us table below. the connector surface or terminals. (The before using a temperature profile other Table A setting for the sensor will differ depending than that described below (e.g. lead-free Product name Soldering iron temperature on the sensor used, so be sure to solder). 300°C within 5 sec. carefully read the instructions that comes •Narrow pitch connectors SMD type connectors 350°C within 3 sec. with it.) (except P8 type) 2)As for cream solder printing, screen 2)Do not allow flux to spread onto the Upper limited (Solder heat resistance) printing is recommended. Lower limited (Solder wettability) connector leads or PC board. This may 3)To determine the relationship between Temperature lead to flux rising up to the connector the screen opening area and the PC- Peak temperature 260°C Peak temperature inside. 230°C 220°C board foot pattern area, refer to the 180°C Preheating 200°C 3)Touch the soldering iron to the foot diagrams in the recommended patterns 150°C 25 sec. pattern. After the foot pattern and for PC boards and metal masks. Make 60 to 120 sec. 70 sec. connector terminal are heated, apply the sure to use the terminal tip as a reference Time solder wire so it melts at the end of the position when setting. Avoid an excessive connector terminals. •Narrow pitch connector (P8) amount of solder from being applied, ocathuesrew aisne ,i minpteerrffeercet nccoen tbayc tt.he solder will T2e4m5p°eCr amtuarxe. Peak temperatu2r0e0°C Awpirpel yh ethree solder Soldeirirnogn 155 to 165°C Preheating Terminal Terminal Small angle as Psoalsdteer 60 to 120 sec. Within 30 sec. p4o5s dseibglree ueps to PC board Time foot pattern PC board For products other than the ones above, 4)Consult us when using a screen- please refer to the latest product Pattern printing thickness other than that specifications. 4)Be aware that soldering while applying recommended. 7) The temperatures are measured at the a load on the connector terminals may 5)When mounting on both sides of the surface of the PC board near the cause improper operation of the PC board and the connector is mounting connector terminals. (The setting for the connector. on the underside, use adhesives or other sensor will differ depending on the sensor 5)Thoroughly clean the soldering iron. means to ensure the connector is used, so be sure to carefully read the 6)Flux from the solder wire may get on properly fixed to the PC board. (Double instructions that comes with it.) the contact surfaces during soldering reflow soldering on the same side is 8)The temperature profiles given in this operations. After soldering, carefully possible.) catalog are values measured when using check the contact surfaces and clean off 6)N2 reflow, conducting reflow soldering the connector on a resin-based PC any solder before use. in a nitrogen atmosphere, increases the board. When performed reflow soldering 7)For soldering of prototype devices solder flow too greatly, enabling wicking on a metal board (iron, aluminum, etc.) or during product development, you can to occur. Make sure that the solder feed a metal table to mount on a FPC, make perform soldering at the necessary rate and temperature profile are sure there is no deformation or locations by heating with a hot-air gun by appropriate. discoloration of the connector beforehand applying cream solder to the foot pattern and then begin mounting. beforehand. However, at this time, make 9)Consult us when using a screen- sure that the air pressure does not move printing thickness other than that connectors by carefully holding them recommended. down with tweezers or other similar tool. 10)Some solder and flux types may Also, be careful not to go too close to the cause serious solder or flux creeping. connectors and melt any of the molded Solder and flux characteristics should be components. taken into consideration when setting the 8)If an excessive amount of solder is reflow soldering conditions. applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3.Solder reworking 1)Finish reworking in one operation. 2)For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Handling Single Components 1)Make sure not to drop or allow parts to 4)Do not insert or remove the connector Excessive force applied for insertion in a fall from work bench when it is not soldered. Forcibly applied pivot action as shown may also cause 2)Excessive force applied to the external pressure on the terminals can product breakage. terminals could cause warping, come weaken the adherence of the terminals to Align the header and socket positions out, or weaken the adhesive strength of the molded part or cause the terminals to before connecting them. the solder. Handle with care. lose their evenness. 3)Repeated bending of the terminals 5)Excessive prying-force applied to one may cause terminals to break. end may cause product breakage and separation of the solder joints at the terminal. Cleaning flux from PC board 3)Since some powerful cleaning Handling the PC board solutions may dissolve molded 1)To increase the cleanliness of the •Handling the PC board after components of the connector and wipe cleaning fluid and cleaning operations, mounting the connector off or discolor printed letters, we prepare equipment for cleaning process When cutting or bending the PC board recommend aqua pura electronic parts beginning with boil cleaning, ultrasonic after mounting the connector, be careful cleaners. Please consult us if you wish to cleaning, and then vapor cleaning. that the soldered sections are subjected use other types of cleaning fluids. 2)Carefully oversee the cleanliness of to excessive force. 4)Please note that the surfaces of the cleaning fluids to make sure that the molded parts may whiten when cleaned The soldered areas should not be subjected to force. contact surfaces do not become dirty with alcohol. from the cleaning fluid itself. Storage of connectors 1)To prevent problems from voids or air Some connectors may change color 4)Avoid storing the connectors in pockets due to heat of reflow soldering, slightly if subjected to ultraviolet rays locations with excessive dust. The dust avoid storing the connectors in areas of during storage. This is normal and will not may accumulate and cause improper high humidity. When storing the affect the operation of the connector. connections at the contact surfaces. connectors for more than six months, be 3)When storing the connectors with the sure to consider storage area where the PC boards assembled and components humidity is properly controlled. alreeady set, be careful not to stack them 2)Depending on the connector type, the up so the connectors are subjected to color of the connector may vary from excessive forces. connector to connector depending on when it is produced. Other Notes 1)These products are made for the 3)Before soldering, try not to insert or 6)The connectors are not meant to be design of compact and lightweight remove the connector more than used for switching. devices and therefore the thickness of the absolutely necessary. 7)Be sure not to allow external pressure molded components has been made very 4)When coating the PC board after to act on connectors when assembling thin. Therefore, be careful during soldering the connector to prevent the PCBs or moving in block assemblies. insertion and removal operations for deterioration of insulation, perform the excessive forces applied may damage coating in such a way so that the coating the products. does not get on the connector. 2)Dropping of the products or rough 5)There may be variations in the colors mishandling may bend or damage the of products from different production lots. terminals and possibly hinder proper This is normal. reflow soldering. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement Please refer to the latest product machine, connectors are delivered in 50- specifications when designing your piece units in the condition given right. product. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Reel (Delivery can also be made on a reel by Embossed tape Required number customer request.) of products for amount required for the mounting sample production (Unit 50 pcs.) ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: P anasonic: AXT514124 AXT580124 AXT614124 AXT680124 AXT564124 AXT664124 AXT522124 AXT526124 AXT542124 AXT548124 AXT554124 AXT570124 AXT622124 AXT626124 AXT642124 AXT648124 AXT654124 AXT670124 AXT530224 AXT616124 AXT624124 AXT560124 AXT630124 AXT540124 AXT634124 AXT524124 AXT550124 AXT512124 AXT530124 AXT650124 AXT660124 AXT640124 AXT610124 AXT528124 AXT612124 AXT546124 AXT628124 AXT544124 AXT632124 AXT644124 AXT636124 AXT532124 AXT646124 AXT536124 AXT516124 AXT550224 AXT510224 AXT630224 AXT542124DD1 AXT642124DD1