AXE5, 6 For board-to-FPC A4S Narrow pitch connectors Series (0.4mm pitch) FEATURES 1.2.5 mm wide slim two-piece type 3. Mated heights of 0.8 and 1.0 mm are connector available for the same foot pattern. Compact and slim structure contributes 4.Connectors for inspection available overall miniaturization of product design. <Compared to F4S series (40 pin APPLICATIONS contacts, when mated)> •Width: 30% down Recommended for board-to-FPC •Footprint: 30% down connections of mobile equipment, 2.5mm Socket 2.0mm Header F4S such as cellular phones, smart phones, laptops, and portable music A4S 1.0 0.8 players RoHS compliant 2.5 3.6 2. “ ” ensures high resistance to various environments in lieu of slim and low profile body Ni barrier Bellows contact construction construction (Against solder rise!) (Against dropping!) Porosity treatment (Against corrosive gases!) V notch and Double contact constructions (Against foreign particles and flux!) ORDERING INFORMATION AXE 2 4 5: Narrow Pitch Connector A4S (0.4 mm pitch) Socket 6: Narrow Pitch Connector A4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 0.8/1.0 mm <Header> 1: For mated height 0.8 mm 2: For mated height 1.0 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface ACCTB7E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXE5, 6 PRODUCT TYPES Part number Packing Mated height Number of pins Socket Header Inner carton (1-reel) Outer carton 10 AXE510124 AXE610124 12 AXE512124 AXE612124 14 AXE514124 AXE614124 16 AXE516124 AXE616124 18 AXE518124 AXE618124 20 AXE520124 AXE620124 22 AXE522124 AXE622124 24 AXE524124 AXE624124 26 AXE526124 AXE626124 28 AXE528124 AXE628124 30 AXE530124 AXE630124 0.8mm 32 AXE532124 AXE632124 34 AXE534124 AXE634124 36 AXE536124 AXE636124 40 AXE540124 AXE640124 44 AXE544124 AXE644124 50 AXE550124 AXE650124 54 AXE554124 AXE654124 60 AXE560124 AXE660124 5,000 pieces 10,000 pieces 64 AXE564124 AXE664124 70 AXE570124 AXE670124 80 AXE580124 AXE680124 10 AXE510124 AXE610224 12 AXE512124 AXE612224 14 AXE514124 AXE614224 20 AXE520124 AXE620224 24 AXE524124 AXE624224 26 AXE526124 AXE626224 30 AXE530124 AXE630224 1.0mm 32 AXE532124 AXE632224 40 AXE540124 AXE640224 44 AXE544124 AXE644224 50 AXE550124 AXE650224 54 AXE554124 AXE654224 60 AXE560124 AXE660224 70 AXE570124 AXE670224 80 AXE580124 AXE680224 Notes:1.Order unit: For volume production: 1-inner carton (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office. Samples: Small lot orders are possible. Please contact our sales office. 2.Please contact us for connectors having a number of pins other than those listed above. ACCTB7E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXE5, 6 SPECIFICATIONS (cid:1)Characteristics Item Specifications Conditions Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC No short-circuiting or damage at a detection current of 1 mA Electrical Breakdown voltage 150V AC for 1 min. when the specified voltage is applied for one minute. characteristics Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90mΩ Based on the contact resistance measurement method specified by JIS C 5402. Composite insertion force Max. 1.200N/pin contacts × pin contacts (initial) Mechanical Composite removal force Min. 0.165N/pin contacts × pin contacts characteristics Contact holding force Measuring the maximum force. Min. 0.20N/pin contacts (Socket contact) As the contact is axially pull out. Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation. Peak temperature: 260°C or less (on the surface of Infrared reflow soldering Soldering heat resistance the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. Soldering iron –55°C to +85°C (product only) Storage temperature –40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Order Temperature (°C) Time (minutes) Echnavriraocntemriesntitcasl T(hheeardmear l asnhdo csko crekesits mtaantceed) 5icno scnuytclaalcetitso r,ne sreisstiasntacnec me amxi.n 9. 01m00ΩMΩ, 123 –5855−+0330 Ma33x00. 5 4 Max. 5 –55−03 Humidity resistance 1in2s0u lhaotiuorns ,resistance min. 100MΩ, Bath temperature 40±2°C, (header and socket mated) contact resistance max. 90mΩ humidity 90 to 95% R.H. S(haeltawdaetre ar nsdp rsaoyc rkeesti smtaantecde) 2icno4sn uhtlaoacutitro srne, sreisstiasntacnec me amxi.n 9. 01m00ΩMΩ, Bsaaltthw atetemr pceornactuernet r3a5ti±o2n° 5C±,1% H2S resistance 48 hours, Bath temperature 40±2°C, gas concentration 3±1 ppm, (header and socket mated) contact resistance max. 90mΩ humidity 75 to 80% R.H. Lifetime Repeated insertion and removal speed of max. 200 times/ Insertion and removal life 30 times characteristics hours Unit weight 20 pin contact type: Socket: 0.02 g Header: 0.01 g (cid:1)Material and surface treatment Part name Material Surface treatment Molded LCP resin — portion (UL94V-0) Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) Contact and Copper alloy The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Post Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating Surface: Au plating (except the terminal tips) ACCTB7E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXE5, 6 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ (cid:1)Socket (Mated height: 0.8 mm/1.0 mm) CAD Data e) Dimension table (mm) on fac B±A0.1 0.77 Termina0l .c0o8planarity Nudmimbeern osfi opnins/ A B C 0 (Sucti 00..1450±±00..0035 (sCooldnetrainctg a tnedrm inals) 1102 44..5900 21..0600 33..8400 7 0. 2.20 1.722.50 1146 55..7300 22..8400 44..6200 9) 18 6.10 3.20 5.00 3 (0. 20 6.50 3.60 5.40 22 6.90 4.00 5.80 24 7.30 4.40 6.20 (0.90) 26 7.70 4.80 6.60 Y note 28 8.10 5.20 7.00 30 8.50 5.60 7.40 0 5 2. 32 8.90 6.00 7.80 Z note 0.30±0.03 06 34 9.30 6.40 8.20 C±0.1 1. 36 9.70 6.80 8.60 40 10.50 7.60 9.40 General tolerance: ±0.2 44 11.30 8.40 10.20 50 12.50 9.60 11.40 54 13.30 10.40 12.20 Note:Since the soldering terminals has a single-piece construction, 60 14.50 11.60 13.40 sections Y and Z are electrically connected. 64 15.30 12.40 14.20 70 16.50 13.60 15.40 80 18.50 15.60 17.40 (cid:1)Header (Mated height: 0.8 mm) CAD Data Dimension table (mm) e) on fac B±A0.1 0.65 Termin0a.l 0co8planarity Nudmimbeern osfi opnins/ A B C ucti 0.40±0.05 (Post and 10 3.80 1.60 3.20 0 (S 0.15±0.03 soldering terminals) 12 4.20 2.00 3.60 7 0. 1.42 2.00 1146 54..0600 22..8400 44..4000 6) 28 18 5.40 3.20 4.80 (0.3 1. 20 5.80 3.60 5.20 22 6.20 4.00 5.60 24 6.60 4.40 6.00 Soldering terminals als 26 7.00 4.80 6.40 min 28 7.40 5.20 6.80 g ter 30 7.80 5.60 7.20 0.15±0.03C±0.1 (0.31) 0.841.46Solderin 333246 898...206000 666...084000 788...640000 40 9.80 7.60 9.20 General tolerance: ±0.2 44 10.60 8.40 10.00 50 11.80 9.60 11.20 54 12.60 10.40 12.00 60 13.80 11.60 13.20 64 14.60 12.40 14.00 70 15.80 13.60 15.20 80 17.80 15.60 17.20 ACCTB7E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXE5, 6 (cid:1)Header (Mated height: 1.0 mm) 0 (Suction face) 00..1450±±B00±..A00035.1 0.85 (sTPeoorldmseti rnai0nan.gld 0 c to8eprmlainnaarlisty) DimNeudmnismbieoe1rnn0 os tfi oapnbinles/ (mm )3A.80 1B.60 3C.20 0.7 1.42 2.00 1124 44..2600 22..0400 34..6000 6) 8 20 5.80 3.60 5.20 3 2 0. 1. 24 6.60 4.40 6.00 ( 26 7.00 4.80 6.40 30 7.80 5.60 7.20 32 8.20 6.00 7.60 Soldering terminals als 40 9.80 7.60 9.20 min 44 10.60 8.40 10.00 g ter 50 11.80 9.60 11.20 0.15±0.03 31) 8446erin 54 12.60 10.40 12.00 C±0.1 (0. 0.1.Sold 60 13.80 11.60 13.20 70 15.80 13.60 15.20 General tolerance: ±0.2 80 17.80 15.60 17.20 (cid:1)Socket and Header are mated Header ±0.800.1 Header ±1.000.1 Socket Socket EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact types, sockets and headers) (cid:1)Specifications for taping (cid:1)Specifications for the plastic reel (In accordance with JIS C 0806-3:1999. However, not applied to (In accordance with EIAJ ET-7200B.) the mounting-hole pitch of some connectors.) Tape I Tape II (A +− 00 .. 31 ) (A±0.3) (D±1) Label (B) (C) (C) Top cover tape ackaging (1.75) (4.0) (1.75) (4.0) 0 dia. Embossed carrier tape p 8 direction after 8.0(2.0) 8.0(2.0) 3 Taping reel Embossed mounting-hole g n di Lea 1.50+ 0 .1dia. 1.50+ 0 .1dia. (cid:1)Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets Max. 24 Tape I 16.00 — 7.50 17.40 5,000 and headers 26 to 70 Tape I 24.00 — 11.50 25.40 5,000 0.8 mm/1.0 mm 80 Tape II 32.00 28.40 14.20 33.40 5,000 (cid:1)Connector orientation with respect to embossed tape feeding direction Type Direction Common for A4S of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. ACCTB7E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXE5, 6 For board-to-FPC Connectors for A4S inspection usage Series (0.4mm pitch) FEATURES APPLICATIONS 1.3,000 mating and unmating cycles Ideal for module unit inspection and 2.Same external dimensions and foot equipment assembly inspection pattern as standard type. 3.Improved mating Insertion and removal easy due to a 2.5mm Socket 2.0mm Header reduction in mating retention force. This is made possible by a simple locking structure design. Note: Mating retention force cannot be RoHS compliant warranted. TABLE OF PRODUCT TYPES ✩: Available for sale Product name Number of pins A4S 10 12 14 16 18 20 22 24 26 28 30 32 34 36 40 44 50 54 60 64 70 80 for inspection ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ Notes:1.Please inquire about number of pins other than those shown above. 2.Please inquire with us regarding availability. 3.Please keep the minimum order quantities no less than 50 pieces per lot. 4.Please inquire if further information is needed. PRODUCT TYPES Specifications Part No. Specifications Part No. Socket Without positioning bosses AXE5E∗∗26 Header Without positioning bosses AXE6E∗∗26 Note:When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector. NOTES (cid:1)Recommended PC board and metal •Socket (Mated height: 0.8mm/1.0mm) •Header (Mated height: 0.8mm/1.0mm) mask patterns Recommended PC board pattern (TOP VIEW) Recommended PC board pattern (TOP VIEW) Connectors are mounted with high pitch d0Ine.5 no smrditmey,r. itnot erervdaulcse o sf o0l.d3e5r manmd, fl0u.4x mrisme ,o r ±2.900.03±1.060.03(0.92) 00..2430±±00..0033 (0.50)±0.200.03±1.900.03 ±1.660.03±0.600.03(0.53) 00..2430±±00..0033 (0.65)±1.100.03±2.400.03 solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended 0.90±0.03 C 0.30 0.45±0.03 metal mask patterns. Please use them as 1.45±0.03 : Insulation area 0.80±0.03 a reference. Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 120µm Metal mask thickness: When 120µm (Terminal opening ratio: 70%) (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) (Metal-part opening ratio: 100%) ±2.900.01±1.060.01(0.92) 00..2400±±00..0011 (0.40)±2.000.01±2.800.01 ±1.660.01±0.600.01(0.53) 00..2400±±00..0011 (0.52)±1.260.01±2.300.01 10..4950±±00..0011 C 0.30 00..8405±±00..0011 Please refer to the latest product specifications when designing your product. ACCTB7E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Notes on Using Narrow pitch Connectors Regarding the design of devices and PC board patterns 1)When connecting several connectors 5)For all connectors of the narrow pitch backside of the FPC board to which the together by stacking, make sure to series, to prevent the PC board from connector is being connected. Please maintain proper accuracy in the design of coming off during vibrations or impacts, make the reinforcement board structure and mounting equipment so and to prevent loads from falling directly dimensions bigger than the outer limits of that the connectors are not subjected to on the soldered portions, be sure to the recommended PC board pattern twisting and torsional forces. design some means to fix the PC board (should be approximately 1 mm greater 2)With mounting equipment, there may in place. than the outer limit). be up to a ±0.2 to 0.3-mm error in Example) Secure in place with screws Material should be glass epoxy or positioning. Be sure to design PC boards polyimide, and the thickness should be Screw and patterns while taking into between 0.2 and 0.3 mm. consideration the performance and (2) Collisions, impacts, or turning of FPC abilities of the required equipment. Spacer Connector PC board boards, may apply forces on the Spacer 3) Some connectors have tabs embossed connector and cause it to come loose. on the body to aid in positioning. When Therefore, make to design retaining using these connectors, make sure that When connecting PC boards, take plates or screws that will fix the connector the PC board is designed with positioning appropriate measures to prevent the in place. holes to match these tabs. connector from coming off. 7)The narrow pitch connector series is 4)To ensure the required mechanical 6)Notes when using a FPC. designed to be compact and thin. strength when soldering the connector (1) When the connector is soldered to an Although ease of handling has been terminals, make sure the PC board FPC board, during its insertion and taken into account, take care when meets recommended PC board pattern removal procedures, forces may be mating the connectors, as displacement design dimensions given. applied to the terminals and cause the or angled mating could damage or soldering to come off. It is recommended deform the connector. to use a reinforcement board on the Regarding the selection of the connector placement machine and the mounting procedures 1)Select the placement machine taking 4)Depending on the size of the 6) Excessive mounter chucking force may into consideration the connector height, connector being used, self alignment deform the molded or metal part of the required positioning accuracy, and may not be possible. In such cases, be connector. Consult us in advance if packaging conditions. sure to carefully position the terminal with chucking is to be applied. 2)Be aware that if the catching force of the PC board pattern. the placement machine is too great, it 5)The positioning bosses give an may deform the shape of the connector approximate alignment for positioning on body or connector terminals. the PC board. For accurate positioning of 3)Be aware that during mounting, the connector when mounting it to the PC external forces may be applied to the board, we recommend using an connector contact surfaces and terminals automatic positioning machine. and cause deformations. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Regarding soldering 1.Reflow soldering Soldering conditions 2.Hand soldering 1)Measure the recommended profile Please use the reflow temperature profile 1)Set the soldering iron so that the tip temperature for reflow soldering by conditions recommended below for temperature is less than that given in the placing a sensor on the PC board near reflow soldering. Please contact us table below. the connector surface or terminals. (The before using a temperature profile other Table A setting for the sensor will differ depending than that described below (e.g. lead-free Product name Soldering iron temperature on the sensor used, so be sure to solder). 300°C within 5 sec. carefully read the instructions that comes •Narrow pitch connectors SMD type connectors 350°C within 3 sec. with it.) (except P8 type) 2)As for cream solder printing, screen 2)Do not allow flux to spread onto the Upper limited (Solder heat resistance) printing is recommended. Lower limited (Solder wettability) connector leads or PC board. This may 3)To determine the relationship between Temperature lead to flux rising up to the connector the screen opening area and the PC- Peak temperature 260°C Peak temperature inside. 230°C 220°C board foot pattern area, refer to the 180°C Preheating 200°C 3)Touch the soldering iron to the foot diagrams in the recommended patterns 150°C 25 sec. pattern. After the foot pattern and for PC boards and metal masks. Make 60 to 120 sec. 70 sec. connector terminal are heated, apply the sure to use the terminal tip as a reference Time solder wire so it melts at the end of the position when setting. Avoid an excessive connector terminals. •Narrow pitch connector (P8) amount of solder from being applied, ocathuesrew aisne ,i minpteerrffeercet nccoen tbayc tt.he solder will T2e4m5p°eCr amtuarxe. Peak temperatu2r0e0°C Awpirpel yh ethree solder Soldeirirnogn 155 to 165°C Preheating Terminal Terminal Small angle as Psoalsdteer 60 to 120 sec. Within 30 sec. p4o5s dseibglree ueps to PC board Time foot pattern PC board For products other than the ones above, 4)Consult us when using a screen- please refer to the latest product Pattern printing thickness other than that specifications. 4)Be aware that soldering while applying recommended. 7) The temperatures are measured at the a load on the connector terminals may 5)When mounting on both sides of the surface of the PC board near the cause improper operation of the PC board and the connector is mounting connector terminals. (The setting for the connector. on the underside, use adhesives or other sensor will differ depending on the sensor 5)Thoroughly clean the soldering iron. means to ensure the connector is used, so be sure to carefully read the 6)Flux from the solder wire may get on properly fixed to the PC board. (Double instructions that comes with it.) the contact surfaces during soldering reflow soldering on the same side is 8)The temperature profiles given in this operations. After soldering, carefully possible.) catalog are values measured when using check the contact surfaces and clean off 6)N2 reflow, conducting reflow soldering the connector on a resin-based PC any solder before use. in a nitrogen atmosphere, increases the board. When performed reflow soldering 7)For soldering of prototype devices solder flow too greatly, enabling wicking on a metal board (iron, aluminum, etc.) or during product development, you can to occur. Make sure that the solder feed a metal table to mount on a FPC, make perform soldering at the necessary rate and temperature profile are sure there is no deformation or locations by heating with a hot-air gun by appropriate. discoloration of the connector beforehand applying cream solder to the foot pattern and then begin mounting. beforehand. However, at this time, make 9)Consult us when using a screen- sure that the air pressure does not move printing thickness other than that connectors by carefully holding them recommended. down with tweezers or other similar tool. 10)Some solder and flux types may Also, be careful not to go too close to the cause serious solder or flux creeping. connectors and melt any of the molded Solder and flux characteristics should be components. taken into consideration when setting the 8)If an excessive amount of solder is reflow soldering conditions. applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3.Solder reworking 1)Finish reworking in one operation. 2)For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Handling Single Components 1)Make sure not to drop or allow parts to 4)Do not insert or remove the connector Excessive force applied for insertion in a fall from work bench when it is not soldered. Forcibly applied pivot action as shown may also cause 2)Excessive force applied to the external pressure on the terminals can product breakage. terminals could cause warping, come weaken the adherence of the terminals to Align the header and socket positions out, or weaken the adhesive strength of the molded part or cause the terminals to before connecting them. the solder. Handle with care. lose their evenness. 3)Repeated bending of the terminals 5)Excessive prying-force applied to one may cause terminals to break. end may cause product breakage and separation of the solder joints at the terminal. Cleaning flux from PC board 3)Since some powerful cleaning Handling the PC board solutions may dissolve molded 1)To increase the cleanliness of the •Handling the PC board after components of the connector and wipe cleaning fluid and cleaning operations, mounting the connector off or discolor printed letters, we prepare equipment for cleaning process When cutting or bending the PC board recommend aqua pura electronic parts beginning with boil cleaning, ultrasonic after mounting the connector, be careful cleaners. Please consult us if you wish to cleaning, and then vapor cleaning. that the soldered sections are subjected use other types of cleaning fluids. 2)Carefully oversee the cleanliness of to excessive force. 4)Please note that the surfaces of the cleaning fluids to make sure that the molded parts may whiten when cleaned The soldered areas should not be subjected to force. contact surfaces do not become dirty with alcohol. from the cleaning fluid itself. Storage of connectors 1)To prevent problems from voids or air Some connectors may change color 4)Avoid storing the connectors in pockets due to heat of reflow soldering, slightly if subjected to ultraviolet rays locations with excessive dust. The dust avoid storing the connectors in areas of during storage. This is normal and will not may accumulate and cause improper high humidity. When storing the affect the operation of the connector. connections at the contact surfaces. connectors for more than six months, be 3)When storing the connectors with the sure to consider storage area where the PC boards assembled and components humidity is properly controlled. alreeady set, be careful not to stack them 2)Depending on the connector type, the up so the connectors are subjected to color of the connector may vary from excessive forces. connector to connector depending on when it is produced. Other Notes 1)These products are made for the 3)Before soldering, try not to insert or 6)The connectors are not meant to be design of compact and lightweight remove the connector more than used for switching. devices and therefore the thickness of the absolutely necessary. 7)Be sure not to allow external pressure molded components has been made very 4)When coating the PC board after to act on connectors when assembling thin. Therefore, be careful during soldering the connector to prevent the PCBs or moving in block assemblies. insertion and removal operations for deterioration of insulation, perform the excessive forces applied may damage coating in such a way so that the coating the products. does not get on the connector. 2)Dropping of the products or rough 5)There may be variations in the colors mishandling may bend or damage the of products from different production lots. terminals and possibly hinder proper This is normal. reflow soldering. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement Please refer to the latest product machine, connectors are delivered in 50- specifications when designing your piece units in the condition given right. product. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Reel (Delivery can also be made on a reel by Embossed tape Required number customer request.) of products for amount required for the mounting sample production (Unit 50 pcs.) ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: P anasonic: AXE510124 AXE512124 AXE514124 AXE516124 AXE518124 AXE520124 AXE522124 AXE524124 AXE526124 AXE530124 AXE532124 AXE534124 AXE536124 AXE540124 AXE550124 AXE560124 AXE564124 AXE570124 AXE580124 AXE610124 AXE612124 AXE618124 AXE620124 AXE622124 AXE624124 AXE626124 AXE628124 AXE632124 AXE636124 AXE664124 AXE670124 AXE680124 AXE528124 AXE544124 AXE554124 AXE644124 AXE654124 AXE630224 AXE680224 AXE620224 AXE670224 AXE624224 AXE650224 AXE614224