ICGOO在线商城 > 集成电路(IC) > 接口 - 传感器,电容式触摸 > AT42QT2120-XU
数量阶梯 | 香港交货 | 国内含税 |
+xxxx | $xxxx | ¥xxxx |
查看当月历史价格
查看今年历史价格
AT42QT2120-XU产品简介:
ICGOO电子元器件商城为您提供AT42QT2120-XU由Atmel设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 AT42QT2120-XU价格参考¥12.67-¥16.33。AtmelAT42QT2120-XU封装/规格:接口 - 传感器,电容式触摸, Capacitive Touch Buttons, Slider, Wheel 20-TSSOP。您可以下载AT42QT2120-XU参考资料、Datasheet数据手册功能说明书,资料中有AT42QT2120-XU 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | IC TOUCH SENSOR 12CH 20-TSSOP电容触摸传感器 QTouchADC-BSW Proximity Detection |
产品分类 | 电容式触摸传感器,接近传感器 IC电容触摸传感器 |
品牌 | Atmel |
产品手册 | |
产品图片 | |
产品系列 | Atmel AT42QT2120-XUQTouch™ |
数据手册 | |
产品型号 | AT42QT2120-XU |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品种类 | 电容触摸传感器 |
供应商器件封装 | 20-TSSOP |
其它名称 | AT42QT2120XU |
分辨率(位) | 8 b |
包装 | 托盘 |
商标 | Atmel |
安装类型 | 表面贴装 |
封装/外壳 | 20-TSSOP(0.173",4.40mm 宽) |
封装/箱体 | TSSOP-20 |
尺寸 | 6.6 mm L x 4.5 mm W x 1.2 mm H |
工作温度 | -40°C ~ 85°C |
工厂包装数量 | 1036 |
应用说明 | |
接口类型 | I2C |
数据接口 | I²C |
数据速率/采样率(SPS,BPS) | - |
标准包装 | 74 |
温度范围 | - 40 C to + 85 C |
电压-电源 | 1.8 V ~ 5.5 V |
电压基准 | 内部 |
电流-电源 | ±10mA |
电源电压 | 1.8 V to 5.5 V |
端接类型 | SMD/SMT |
类型 | 电容性 |
触摸面板接口 | 2 线 |
评估工具 | * |
输入/按键数 | 12 键 |
通道数量 | 12 Channel |
Features • Number of Keys: – Comms Mode: 1 to 12 keys (1 to 9 if wheel or slider option enabled) – Standalone Mode: 1 to 5 keys • Technology: – Patented spread-spectrum QTouchADC charge-transfer • Number of Output Lines: – Comms Mode: Up to 10 channels can be configured as outputs (but they will replace the keys) – Standalone Mode: 1 to 5 channels can be configured as outputs • Key Outline Sizes: QTouch – 5mmx 5mm or larger (panel thickness dependent) • Key Spacings: 12-channel – 6mm or wider, center to center (panel thickness, human factors dependent) • Key Design: Touch Sensor – Single solid or ring shaped electrodes; widely different sizes and shapes possible • Proximity Electrode Design: IC – Single solid electrodes; Key Design, Loop, PCB Trace - different sizes and shapes possible • Wheel Size: – Typically 30mm–50mm diameter AT42QT2120 • Wheel Electrode Design: – Spatially interpolated wheel up to 80mm diameter – Typical width of segments 12mm • Slider Electrode Design: – Spatially interpolated, resistorless design – Typical length 50mm–100mm, typical width 12mm – Can be an arc or other irregular shape • Substrates: – FR-4, low cost CEM-1 or FR-2 PCB materials; polyamide FPCB; PET films, glass • Adjacent Metal: – Compatible with grounded metal immediately next to keys • Layers Required: – One; electrodes and components can be on same side • Electrode Materials: – Etched copper, silver, carbon, indium tin oxide (ITO), PEDOT • Panel Materials: – Plastic, glass, composites, painted surfaces (nonconductive paints) • Key Panel Thickness: – Up to 15mm glass (key size dependent) – Up to 10mm plastic (key size dependent) • Wheel/slider Panel Thickness: – Up to 4mm glass – Up to 3mm plastic • Key Sensitivity: – Comms Mode – individually settable via simple commands over I2C interface – Standalone mode – settings are fixed • Interface: – I2C slave mode (400kHz) – CHANGE status indication pin • Signal Processing: – Self-calibration, Auto drift compensation, Noise filtering, Adjacent Key Suppression® (AKS®) • Power: – 1.8V to 5.5V • Packages: – 20-pin SOIC/TSSOP RoHS compliant IC – 20-pad VQFN RoHS compliant IC 9634E–AT42–06/12
1. Pinouts and Schematics 1.1 Pinouts 1.1.1 20-pin SOIC/TSSOP – Comms Mode KEY8/GPO6 1 20 KEY9/GPO7 KEY7/GPO5 2 19 KEY10/GPO8 KEY6/GPO4 3 18 KEY11/GPO9 KEY5/GPO3 4 17 CHANGE KEY4/GPO2 5 16 SCL QT2120 KEY3/GPO1 6 15 N/C KEY2/GPO0 7 14 RESET KEY1 8 13 SDA KEY0 9 12 MODE VSS 10 11 VDD 1.1.2 20-pin SOIC/TSSOP – Standalone Mode OUT3 1 20 OUT4 OUT2 2 19 OUT5 KEY6 3 18 OUT6 KEY5 4 17 N/C KEY4 5 16 N/C QT2120 KEY3 6 15 PXOUT KEY2 7 14 RESET GUARD 8 13 N/C PROX 9 12 MODE VSS 10 11 VDD AT42QT2120 2 9634E–AT42–06/12
AT42QT2120 1.1.3 20-pin VQFN – Comms Mode 8 9 5 6 7 O O O O O P P P P P G G 7/G 8/G 9/G 10/ 11/ Y Y Y Y Y E E E E E K K K K K 0 9 8 7 6 2 1 1 1 1 KEY6/GPO4 1 15 CHANGE KEY5/GPO3 2 14 SCL KEY4/GPO2 3 QT2120 13 N/C KEY3/GPO1 4 12 RESET KEY2/GPO0 5 11 SDA 0 6 7 8 9 1 1 0 S D E Y Y S D D E E V V O K K M 1.1.4 20-pin VQFN – Standalone Mode 2 3 4 5 6 T T T T T U U U U U O O O O O 0 9 8 7 6 2 1 1 1 1 KEY6 1 15 N/C KEY5 2 14 N/C KEY4 3 QT2120 13 PXOUT KEY3 4 12 RESET KEY2 5 11 N/C 0 6 7 8 9 1 D X S D E R O S D D A R V V O U P M G 3 9634E–AT42–06/12
1.2 Pin Descriptions 1.2.1 20-pin SOIC/TSSOP Table 1-1. Pin Listings (20-pin SOIC/TSSOP) Name Name Pin (Comms) (Standalone) Type Description If Unused... KEY8/ Comms mode: Key 8 / General-purpose output 1 OUT3 I/O Leave open GPO6 Standalone mode: push-pull output for key 3 KEY7/ Comms mode: Key 7 / General-purpose output 2 OUT2 I/O Leave open GPO5 Standalone mode: push-pull output for key 2 KEY6/ Comms mode: Key 6 / General-purpose output 3 KEY6 I/O Leave open GPO4 Standalone mode: Key 6 KEY5/ Comms mode: Key 5 / General-purpose output 4 KEY5 I/O Leave open GPO3 Standalone mode: Key 5 KEY4/ Comms mode: Key 4 / General-purpose output 5 KEY4 I/O Leave open GPO2 Standalone mode: Key 4 KEY3/ Comms mode: Key 3 / General-purpose output 6 KEY3 I/O Leave open GPO1 Standalone mode: Key 3 KEY2/ Comms mode: Key/slider/wheel 2 / General-purpose output 7 KEY2 I/O Leave open GPO0 Standalone mode: Key 2 Comms mode: Key/slider/wheel 1 8 KEY1 GUARD I/O Leave open Standalone mode: Guard channel Comms mode: Key/slider/wheel 0 9 KEY0 PROX I/O Leave open Standalone mode: Proximity channel 10 VSS VSS P Ground – 11 VDD VDD P Power – Mode selection pin 12 MODE MODE I Comms mode: connect to Vss – Standalone mode: connect to Vdd Comms mode: Serial Interface Data 13 SDA N/C OD Pull up to Vdd Standalone mode: Unused 14 RESET RESET I Active low reset; has internal pull-up 60k resistor Tie to Vdd Comms mode: no connection 15 N/C PXOUT O Leave open Standalone mode: open drain output for proximity channel Comms mode: Serial Interface Clock 16 SCL N/C OD Pull up to Vdd Standalone mode: Unused Comms mode: Active low state change interrupt (external 17 CHANGE N/C OD pull-up resistor needed) Pull up to Vdd Standalone mode: Unused KEY11/ Comms mode: Key 11 / General-purpose output 18 OUT6 I/O Leave open GPO9 Standalone mode: push-pull output for key 6 KEY10/ Comms mode: Key 10 / General-purpose output 19 OUT5 I/O Leave open GPO8 Standalone mode: push-pull output for key 5 KEY9/ Comms mode: Key 9 / General-purpose output 20 OUT4 I/O Leave open GPO7 Standalone mode: push-pull output for key 4 I Input only I/O Input and output OD Open drain output P Ground or power AT42QT2120 4 9634E–AT42–06/12
AT42QT2120 1.2.2 20-pin VQFN Table 1-2. Pin Listings (20-pin VQFN) Name Name Pin (Comms) (Standalone) Type Description If Unused... KEY6/ Comms mode: Key 6 / General-purpose output 1 KEY6 I/O Leave open GPO4 Standalone mode: Key 6 KEY5/ Comms mode: Key 5 / General-purpose output 2 KEY5 I/O Leave open GPO3 Standalone mode: Key 5 KEY4/ Comms mode: Key 4 / General-purpose output 3 KEY4 I/O Leave open GPO2 Standalone mode: Key 4 KEY3/ Comms mode: Key 3 / General-purpose output 4 KEY3 I/O Leave open GPO1 Standalone mode: Key 3 KEY2/ Comms mode: Key/slider/wheel 2 / General-purpose output 5 KEY2 I/O Leave open GPO0 Standalone mode: Key 2 Comms mode: Key/slider/wheel 1 6 KEY1 GUARD I/O Leave open Standalone mode: Guard channel Comms mode: Key/slider/wheel 0 7 KEY0 PROX I/O Leave open Standalone mode: Proximity channel 8 VSS VSS P Ground – 9 VDD VDD P Power – Mode selection pin 10 MODE MODE I Comms mode: connect to Vss – Standalone mode: connect to Vdd Comms mode: Serial Interface Data 11 SDA N/C OD Pull up to Vdd Standalone mode: Unused 12 RESET RESET I Active low reset; has internal pull-up 60k resistor Tie to Vdd Comms mode: no connection 13 N/C PXOUT OD Leave open Standalone mode: open drain output for proximity channel Comms mode: Serial Interface Clock 14 SCL N/C OD Pull up to Vdd Standalone mode: Unused Comms mode: Active low state change interrupt (external 15 CHANGE N/C OD pull-up resistor needed) Pull up to Vdd Standalone mode: Unused KEY11/ Comms mode: Key 11 / General-purpose output 16 OUT6 I/O Leave open GPO9 Standalone mode: push-pull output for key 6 KEY10/ Comms mode: Key 10 / General-purpose output 17 OUT5 I/O Leave open GPO8 Standalone mode: push-pull output for key 5 KEY9/ Comms mode: Key 9 / General-purpose output 18 OUT4 I/O Leave open GPO7 Standalone mode: push-pull output for key 4 KEY8/ Comms mode: Key 8 / General-purpose output 19 OUT3 I/O Leave open GPO6 Standalone mode: push-pull output for key 3 KEY7/ Comms mode: Key 7 / General-purpose output 20 OUT2 I/O Leave open GPO5 Standalone mode: push-pull output for key 2 I Input only I/O Input and output OD Open drain output P Ground or power O Output only 5 9634E–AT42–06/12
1.3 Schematics Figure 1-1. 20-pin SOIC/TSSOP – Comms Mode VDD VDD R12 VDD 11 14 18 R11 RESET D KEY11/GPO9 KEY 11 D KEY10/GPO8 19 R10 KEY 10 V 20 R9 R13 KEY9/GPO7 1 R8 KEY 9 R14 15 KEY8/GPO6 2 R7 KEY 8 R15 N/C KEY7GPO5 3 R6 KEY 7 KEY6/GPO4 KEY 6 4 R5 KEY5/GPO3 KEY 5 5 R4 KEY4/GPO2 KEY 4 CHANGE 17 6 R3 CHANGE KEY3/GPO1 KEY 3 SDA 13 7 R2 SDA KEY2/GPO0 KEY 2 SCL 16 SCL KEY1 8 R1 KEY 1 May be used for 12 SS KEY0 9 R0 KEY 0 wheel or slider MODE V 0 1 VSS VSS Figure 1-2. 20-pin SOIC/TSSOP – Standalone Mode VDD VDD R12 1 1 14 18 RESET D OUT6 D OUT5 19 V 20 17 OUT4 OUTPUTS 13 N/C OUT3 1 VDD 16 NN//CC OKEUYT62 234 RR65 KEY6 12 KEY5 KEY5 MODE 5 R4 KEY4 6 R3 KEY4 15 PXOUT KEY3 7 R2 KEY3 KEY2 KEY2 8 R1 D1 SS GUARD 9 R0 GUARD KEY V PROX R13 0 1 PROXIMITY SENSOR VSS VSS AT42QT2120 6 9634E–AT42–06/12
AT42QT2120 Figure 1-3. 20-pin VQFN – Comms Mode VDD VDD R12 9 VDD 12 RESET D KEY11/GPO9 16 R11 KEY11 D 17 R10 V KEY10/GPO8 18 R9 KEY10 R13 KEY9/GPO7 KEY9 19 R8 R14 R15 13 N/C KKEEYY78//GGPPOO56 20 R7 KEY7 KEY8 1 R6 KEY6/GPO4 KEY6 2 R5 KEY5/GPO3 KEY5 3 R4 SCSCDHLAANGE 111145 SSCDCHALANGE KKKEEEYYY243///GGGKPPPEOOOY0211 456 RRR321 KKEEYY31 KKEEYY42 Mwhaeye bl eo ru ssleidde fror S 7 R0 10 S KEY0 KEY0 MODE V 8 VSS VSS Figure 1-4. 20-pin VQFN – Standalone Mode VDD VDD R12 9 12 16 RESET D OUT6 D OUT5 17 V 18 11 OUT4 19 OUTPUTS N/C OUT3 14 N/C OUT2 20 15 1 R6 VDD N/C KEY6 2 R5 KEY6 10 KEY5 KEY5 MODE 3 R4 KEY4 4 R3 KEY4 13 PXOUT KEY3 5 R2 KEY3 KEY2 KEY2 6 R1 D1 SS GUARD 7 R0 GUARD KEY V PROX R13 8 PROXIMITY SENSOR VSS VSS 7 9634E–AT42–06/12
2. Overview 2.1 Introduction The AT42QT2120 (QT2120) is a QTouchADC sensor driver. The device can sense from one to 12 keys, dependent on mode. Three of the keys can be used as sense channels for a slider or wheel, leaving a maximum of nine standard touch keys. The device also supports the use of proximity sensors and a guard channel. The QT2120 includes all signal processing functions necessary to provide stable sensing under a wide variety of changing conditions, and the outputs are fully debounced. Only a few external parts are required for operation and no external Cs capacitors are required. The QT2120 modulates its bursts in a spread-spectrum fashion in order to heavily suppress the effects of external noise, and to suppress RF emissions. The QT2120 uses a QTouchADC method of acquisition. This provides greater noise immunity and eliminates the need for external sampling capacitors, allowing touch sensing using a single pin. The QT2120 can operate in two ways; comms and standalone. 2.2 Modes 2.2.1 Comms Mode The QT2120 can operate in comms mode where a host can communicate with the device via an I2C bus. This allows the user to configure settings such as Threshold, Adjacent Key Suppression (AKS), Detect Integrator, Low Power (LP) Mode, Guard Channel and Max Time On for keys. 2.2.2 Standalone Mode The QT2120 can operate in a standalone mode where an I2C-compatible interface is not required. To enter standalone mode, connect the Mode pin to Vdd before powering up the QT2120. In standalone mode, the start-up values are hard coded in firmware and cannot be changed. The default start-up values are used. This means that key detection is reported via its respective input/output. The Guard channel feature is automatically implemented on key 1 in standalone mode. This means that this channel has a higher sensitivity and is used to protect against false triggering, perhaps by a hand covering all keys. A proximity sensor is also available on channel (key) 0 in standalone mode. AT42QT2120 8 9634E–AT42–06/12
AT42QT2120 2.3 Keys Dependent on mode, the QT2120 can have a minimum of one key and a maximum of 12 keys. These can be constructed in different shapes and sizes. See “Features” on page 1 for the recommended dimensions. The possible combinations of keys are: Comms mode: • 1 to 12 keys or • 1 to 9 keys plus 1 slider/wheel • Key channels 2 to 11 can be reassigned as general outputs, if required Note: Any number of keys can be configured as proximity channels. Standalone mode: • 1 to 5 keys plus corresponding discrete outputs • 1 Guard Channel • 1 Proximity sensor Unused keys should be disabled by setting bit 0 of their control bytes to 1 (see Section5.17 on page26). The Key Status register (see Section5.5 on page21) can be read to determine the touch status of the corresponding key. It is recommended using the open-drain CHANGE line to detect when a change of status has occurred. 2.4 Output Lines In comms mode some pins, normally used for touch keys, can be used as output pins. If the Key Control bit 0 (EN) is set to 1, the pin can be used as an output. The state of the pin is then controlled by Key Control bit 1 (GPO). In Standalone mode pins OUT2 to OUT6 are driven by KEY2 to KEY6 respectively. The OUT pins drive high during touch and can be used to drive, for example, LEDs. 2.5 Acquisition/Low Power Mode (LP) There are 255 different acquisition times possible. These are controlled via the LP Mode byte (see Section5.9 on page22) which can be written to via I2C-compatible communication. LP mode controls the intervals between acquisition measurements. Longer intervals consume lower power but have an increased response time. During calibration, touch and during the detect integrator (DI) period, the LP mode is temporarily set to LP mode 1 for a faster response. The QT2120 operation is based on a fixed cycle time of approximately 16ms. The LP mode setting indicates how many of these periods exist per measurement cycle. For example, If LP mode = 1, there is an acquisition every cycle (16ms). If LP mode = 3, there is an acquisition every 3 cycles (48ms). If a high PULSE setting is selected then the acquisition time may exceed 16ms. An LP setting of 0 will send the device into Power-down mode. To wake the device from this mode a nonzero LP setting should be written to the LP address at location 8. 9 9634E–AT42–06/12
2.6 Adjacent Key Suppression (AKS) Technology The device includes the Atmel patented Adjacent Key Suppression (AKS) technology, to allow the use of tightly spaced keys on a keypad with no loss of selectability by the user. There can be up to three AKS groups, implemented so that only one key in the group may be reported as being touched at any one time. Once a key in a particular AKS group is in detect no other key in that group can go into detect. Only when the key in detect goes out of detection can another key go into detect state. Keys which are members of the AKS groups can be set in the Key Control register (see Section5.17 on page26). Keys outside the group may be in detect simultaneously. Note: To use a key as a guard channel, its AKS group should be set to be the same as that of the keys it is to protect. 2.7 CHANGE Line (Comms Mode Only) The CHANGE line is active low and signals when there is a change of state in the Detection Status and/or Key Status bytes. It is cleared (allowed to float high) when the host reads the status bytes. If the status bytes change back to their original state before the host has read the status bytes (for example, a touch followed by a release), the CHANGE line will be held low. In this case, a read to any memory location will clear the CHANGE line. The CHANGE line is open-drain and should be connected via a 47k resistor to Vdd. It is necessary for minimum power operation as it ensures that the QT2120 can sleep for as long as possible. Communications wake up the QT2120 from sleep causing a higher power consumption if the part is randomly polled. Note that the CHANGE line is pulled low 85ms after power-up or reset. The CHANGE line is pulled low approximately for another 16ms before any bursting on the touch pins will occur. If any of the pins are required to be outputs then the relevant Key Control settings should be written within this 16ms time to prevent bursting on pins required as outputs. Also note that the CHANGE line is cleared during a read of the Detection Status bytes when all bytes differing from the previous read have been read. 2.8 Types of Reset 2.8.1 External Reset An external reset logic line can be used if desired, fed into the RESET pin. However, under most conditions it is acceptable to tie RESET to Vdd. The minimum reset pulse width is 2µs. 2.8.2 Soft Reset The host can cause a device reset by writing a nonzero value to the Reset byte. This soft reset triggers the internal watchdog timer on a 125ms interval. After 125ms the device executes a full reset. The device NACKs any attempts to communicate with it for approximately 200ms after the soft reset command. Communication can begin as soon the CHANGE line is first asserted. Note: The device can process a Soft Reset command while in Power Down (LPM=0) mode, causing a chip reset. AT42QT2120 10 9634E–AT42–06/12
AT42QT2120 2.9 Calibration Writing a nonzero value to the calibration byte can force a recalibration at any time. This can be useful to clear out a stuck key condition after a prolonged period of uninterrupted detection. A calibration command executes 15 burst cycles at LPM 1 and sets the CALIBRATE bit of the Detection Status register during the calibration sequence. Note: A calibration command should be sent whenever Key Control bit 0 (EN) is changed. This changes the use of the key from a standard touch key to an output pin and vice-versa. 2.10 Guard Channel A guard channel to help prevent false detection is available in both modes. This is fixed on key1 for standalone mode and programmable for comms mode by setting Key Control bit 4 (GUARD) (see Section5.17 on page26). Guard channel keys should be more sensitive than the other keys and physically bigger. Because the guard channel key is physically bigger it becomes more susceptible to noise so it should have a higher Oversampling (see Section 5.18 on page 27) than the other keys. In standalone mode it is assigned to key 1 and cannot be changed. In comms mode any key can be selected to be a guard key by setting Key Control bit 4 (GUARD). The guard channel is connected to a sensor pad which detects the presence of touch. Because of its larger size and sensitivity it goes into touch before the keys it surrounds (if, for example, a hand covers all the keys). Figure 2-1. Guard Channel Example Guardchannel 2.11 Signal Processing 2.11.1 Detect Threshold The device detects a touch when the signal has crossed a threshold level and remained there for a specified number of counts (see Section 5.11 on page 24). This can be altered on a key-by-key basis using the key Detect Threshold I2C-compatible commands. This detect threshold is based on the reference value of the particular key. The delta of the key is obtained by subtracting the reference value from the signal value (the signal value rises when touch is present). 11 9634E–AT42–06/12
In standalone mode the detect threshold is set to a fixed value of 10 counts of change with respect to the internal reference level for the guard channel and 10 counts for the other six keys (including proximity channel). The reference level has the ability to adjust itself slowly in accordance with the drift compensation mechanism. The drift mechanism will drift toward touch at a rate of 160ms x 20 = 3.2 seconds (Towards Touch Drift (TTD) register) and away from touch at a rate of 160ms x 5 = 0.8 seconds (Away from Touch Drift (ATD) register). These values are fixed in standalone mode but can be configured in comms mode see Section5.10 on page22. 2.11.2 Detect Integrator The device features a fast detection integrator counter (DI filter), which acts to filter out noise at the small expense of a slower response time. The DI filter requires a programmable number of consecutive samples confirmed in detection before the key is declared to be touched. The minimum number for the DI filter is 1. A setting of 0 for the DI also defaults to 1. The DI has a maximum usable value of 32. Values above this will prevent a key from entering touch. The DI is also implemented when a touch is removed. 2.11.3 Cx Limitations The recommended range for key capacitance Cx is 1pF–30pF. Larger values of Cx will give reduced sensitivity. 2.11.4 Touch Recalibration Delay If an object or material obstructs the sense pad the signal may rise enough to create a detection, preventing further operation. To prevent this, the sensor includes a timer which monitors detections. If a detection exceeds the timer setting the sensor performs a key recalibration. This is known as the Touch Recalibration Delay (TRD) and is set to approximately 30s in standalone mode. In comms mode this feature can be changed by setting a value in the range 1–255 (160ms– 40,800ms) in steps of 160ms. A setting of 0 disables the TRD. TRD is a global setting and applies to all keys. 2.11.5 Away from Touch Recalibration If a keys signal jumps in the negative direction (with respect to its reference) by more than the Away from Touch Recalibration setting (25% of detect threshold), then a recalibration of that key takes place. Note: The minimum Away from Touch Recalibration is hard limited to 4 counts. AT42QT2120 12 9634E–AT42–06/12
AT42QT2120 2.11.6 Drift Hold Time Drift Hold Time (DHT) is used to restrict drift on all keys while one or more keys are activated. DHT restricts the drifting on all keys until approximately four seconds after all touches have been removed. This feature is particularly useful in cases of high-density keypads where touching a key or hovering a finger over the keypad would cause untouched keys to drift, and therefore create a sensitivity shift, and ultimately inhibit touch detection. In Comms mode this value is settable, see Section5.13 on page24. The QT2120 will remain in fast mode (LP = 1) for the duration of the DHT counter. The total DHT time is 160ms × DHT value. The default setting for DHT is 25, so 160ms × 25 = ~4 seconds. The QT2120 will not drift or re-enter slow LP mode during this time. 2.11.7 Hysteresis Hysteresis is fixed at 12.5% of the Detect Threshold. When a key enters a detect state once the DI count has been reached, the Detect threshold (DTHR) value is changed by a small amount (12.5% of DTHR) in the direction away from touch. This is done to effect hysteresis and so makes it less likely a key will dither in and out of detect. DTHR is restored once the key drops out of detect. Note: The minimum value for hysteresis is 2 counts. 3. Wiring and Parts 3.1 Rs Resistors Series resistors Rs (Rs0 –Rs11 for comms mode and Rs0 –Rs6 for standalone mode) are inline with the electrode connections and should be used to limit electrostatic discharge (ESD) currents and to suppress radio frequency interference (RFI). Series resistors are recommended for noise reduction. They should be approximately 4.7k to 20k each. For maximum noise rejection the value may be up to 100k. Care should be taken in this case that the sensor keys are fully charged. The Charge Time may need to be increased (see Section5.15 on page26). Each count increase will extend the charge pulse by approximately 1µs. 3.2 LED Traces and Other Switching Signals Digital switching signals near the sense lines induce transients into the acquired signals, deteriorating the signal-to-noise (SNR) performance of the device. Such signals should be routed away from the sensing traces and electrodes, or the design should be such that these lines are not switched during the course of signal acquisition (bursts). LED terminals which are multiplexed or switched into a floating state, and which are within, or physically very near, a key (even if on another nearby PCB) should be bypassed to either Vss or Vdd with at least a 10nF capacitor. This is to suppress capacitive coupling effects which can induce false signal shifts. The bypass capacitor does not need to be next to the LED, in fact it can be quite distant. The bypass capacitor is noncritical and can be of any type. LED terminals which are constantly connected to Vss or Vdd do not need further bypassing. 13 9634E–AT42–06/12
3.3 PCB Cleanliness Modern no-cleanflux is generally compatible with capacitive sensing circuits. CAUTION: If a PCB is reworked to correct soldering faults relating to the device, or to any associated traces or components, be sure that you fully understand the nature ! of the flux used during the rework process. Leakage currents from hygroscopic ionic residues can stop capacitive sensors from functioning. If you have any doubts, a thorough cleaning after rework may be the only safe option. If a PCB is reworked in any way, clean it thoroughly to remove all traces of the flux residue around the capacitive sensor components. Dry it thoroughly before any further testing is conducted. 3.4 Power Supply See Section6.2 on page30 for the power supply range. If the power supply fluctuates slowly with temperature, the device tracks and compensates for these changes automatically with only minor changes in sensitivity. If the supply voltage drifts or shifts quickly, the drift compensation mechanism is not able to keep up, causing sensitivity anomalies or false detections. The power should be clean and come from a separate regulator if possible. However, this device is designed to minimize the effects of unstable power, and except in extreme conditions should not require a separate Low Dropout (LDO) regulator. CAUTION: A regulator IC shared with other logic can result in erratic operation and is not advised. ! A single ceramic 0.1µF bypass capacitor, with short traces, should be placed very close to the power pins of the IC. Failure to do so can result in device oscillation, high current consumption and erratic operation. It is assumed that a larger bypass capacitor (like 1µF) is somewhere else in the power circuit; for example, near the regulator. AT42QT2120 14 9634E–AT42–06/12
AT42QT2120 4. I2C-compatible Communications (Comms Mode Only) 4.1 I2C-compatible Protocol 4.1.1 Protocol The I2C-compatible protocol is based around access to an address table (see Table 5-1 on page 18) and supports multibyte reads and writes. The maximum clock rate is 400kHz. See SectionA on page41 for an overview of I2C bus operation. 4.1.2 Signals The I2C-compatible interface requires two signals to operate: • SDA – Serial Data • SCL – Serial Clock A third line, CHANGE, is used to signal when the device has seen a change in the status byte: • CHANGE: Open-drain, active low when the device status has changed since the last I2C read. After reading the four status bytes (1) (or all the status bytes which have changed since the previous read), this pin floats (high) again if it is pulled up with an external resistor. If the status bytes change back to their original state before the host has read the status bytes (for example, a touch followed by a release), the CHANGE line is held low. In this case, a read to any memory location clears the CHANGE line. 4.2 I2C-compatible Address There is one preset I2C-compatible address of 0x1C (28). This is not changeable. 4.3 Data Read/Write 4.3.1 Address Pointer The internal address pointer is initialized to address 0. 4.3.2 Writing Data to the Device The sequence of events required to write data to the device is shown next. Host to Device DeviceTx to Host S SLA+W A MemAddress A Data A P Table 4-1. Description of Write Data Bits Key Description S START condition SLA+W Slave address plus write bit A Acknowledge bit MemAddress Target memory address within device Data Data to be written P Stop condition 1. Detection Status Byte, Key Status Byte[0], Key Status Byte[1], Slider Position 15 9634E–AT42–06/12
1. The host initiates the transfer by sending the START condition 2. The host follows this by sending the slave address of the device together with the WRITE bit. 3. The device sends an ACK. 4. The host then sends the memory address within the device it wishes to write to. 5. The device sends an ACK. 6. The host transmits one or more data bytes; each is acknowledged by the device (unless trying to write to an invalid address). Valid write address are 5 – 51. 7. If the host sends more than one data byte, they are written to consecutive memory addresses. 8. The device automatically increments the target memory address after writing each data byte. 9. After writing the last data byte, the host should send the STOP condition. Note: the host should not try to write to addresses outside the range 0x06 to 0x33 (6– 51) because this is the limit of the device’s internal memory address. 4.3.3 Reading Data From the Device The sequence of events required to read data from the device is shown next. Host to Device DeviceTx to Host S SLA+W A MemAddress A P S SLA+R A Data 1 A Data 2 A Data n A P 1. The host initiates the transfer by sending the START condition 2. The host follows this by sending the slave address of the device together with the WRITE bit. 3. The device sends an ACK. 4. The host then sends the memory address within the device it wishes to read from. 5. The device sends an ACK if the address to be read from is less than 0x63 otherwise it sends a NACK). 6. The host must then send a STOP and a START condition followed by the slave address again but this time accompanied by the READ bit. Note: Alternatively, instead of step 6, a repeated START can be sent so the host does not need to relinquish control of the bus. 7. The device returns an ACK, followed by a data byte. 8. The host must return either an ACK or NACK. a. If the host returns an ACK, the device subsequently transmits the data byte from the next address. Each time a data byte is transmitted, the device automatically increments the internal address. The device continues to return data bytes until the host responds with a NACK. b. If the host returns a NACK, it should then terminate the transfer by issuing the STOP condition. 9. The device resets the internal address to the location indicated by the memory address sent to it previously. Therefore, there is no need to send the memory address again when reading from the same location. AT42QT2120 16 9634E–AT42–06/12
AT42QT2120 Note: Reading the 16-bit reference and signal values is not an automatic operation; reading the first byte of a 16-bit value does not lock the other byte. As a result glitches in the reported value may be seen as values increase from 255 to 256, or decrease from 256 to 255. This device also supports the use of a repeated START condition as an alternative to the Stop condition. 4.4 SDA, SCL The I2C-compatible bus transmits data and clock with SDA and SCL respectively. They are open-drain; that is I2C-compatible master and slave devices can only drive these lines low or leave them open. The termination resistors pull the line up to Vdd if no I2C-compatible device is pulling it down. The termination resistors commonly range from 1k to 10k and should be chosen so that the rise times on SDA and SCL meet the I2C-compatible specifications (300 ns maximum for 400kHz operation). 4.5 Standalone Mode If I2C-compatible communications are not required, then standalone mode can be enabled by connecting the MODE pin to Vdd. See Section2.4 on page9 for more information. In Standalone mode (Mode pin connected to Vdd at start-up) the chip is configured to specific settings: • Key0 is configured as a proximity channel. If this key goes into detect then PXOUT is asserted high. • Key1 is configured as a guard channel and should have a PCB layout which reflects this. • Keys 2–6 are standard QTouchADC keys and have pins OUT 2–6 configured to reflect their respective touch status. • Keys1–6 are configured to have the same AKS group setting. 17 9634E–AT42–06/12
5. Setups 5.1 Introduction The device calibrates and processes signals using a number of algorithms specifically designed to provide for high survivability in the face of adverse environmental challenges. User-defined Setups are employed to alter these algorithms to suit each application. These Setups are loaded into the device over the I2C-compatible serial interfaces. In standalone mode these settings are fixed to predetermined values. Table 5-1. Internal Register Address Allocation Address Use Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R/W 0 Chip ID Chip Id = 0x3E (62) R 1 Firmware Version Major version Minor version R 2 Detection Status CALIBRATEOVERFLOW – – – – SDET TDET R 3 KEY7 KEY6 KEY5 KEY4 KEY3 KEY2 KEY1 KEY0 R Key Status 4 Reserved KEY11 KEY10 KEY9 KEY8 R 5 Slider Position Slider position R 6 Calibrate Calibrate Command R/W 7 Reset Reset Command R/W 8 LP Low Power (LP) Mode R/W 9 TTD 0 Towards Touch Drift compensation R/W 10 ATD 0 Away from Touch Drift compensation R/W 11 DI Detection integrator R/W 12 TRD Touch Recal Delay R/W 13 DHT Drift Hold Time R/W 14 Slider Options EN WHEEL Reserved R/W 15 Charge Time Reserved Charge Time – 16 Key 0 Detect Threshold Detect Threshold level for key 0 R/W 17 Key 1 Detect Threshold Detect Threshold level for key 1 R/W 18 Key 2 Detect Threshold Detect Threshold level for key 2 R/W 19 Key 3 Detect Threshold Detect Threshold level for key 3 R/W 20 Key 4 Detect Threshold Detect Threshold level for key 4 R/W 21 Key 5 Detect Threshold Detect Threshold level for key 5 R/W 22 Key 6 Detect Threshold Detect Threshold level for key 6 R/W 23 Key 7 Detect Threshold Detect Threshold level for key 7 R/W 24 Key 8 Detect Threshold Detect Threshold level for key 8 R/W 25 Key 9 Detect Threshold Detect Threshold level for key 9 R/W 26 Key 10 Detect Threshold Detect Threshold level for key 10 R/W 27 Key 11 Detect Threshold Detect Threshold level for key 11 R/W 28 Key 0 Control Reserved GUARD AKS GPO EN R/W 29 Key 1 Control Reserved GUARD AKS GPO EN R/W 30 Key 2 Control Reserved GUARD AKS GPO EN R/W AT42QT2120 18 9634E–AT42–06/12
AT42QT2120 Table 5-1. Internal Register Address Allocation (Continued) Address Use Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R/W 31 Key 3 Control Reserved GUARD AKS GPO EN R/W 32 Key 4 Control Reserved GUARD AKS GPO EN R/W 33 Key 5 Control Reserved GUARD AKS GPO EN R/W 34 Key 6 Control Reserved GUARD AKS GPO EN R/W 35 Key 7 Control Reserved GUARD AKS GPO EN R/W 36 Key 8 Control Reserved GUARD AKS GPO EN R/W 37 Key 9 Control Reserved GUARD AKS GPO EN R/W 38 Key 10 Control Reserved GUARD AKS GPO EN R/W 39 Key 11 Control Reserved GUARD AKS GPO EN R/W 40 Key 0 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 41 Key 1 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 42 Key 2 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 43 Key 3 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 44 Key 4 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 45 Key 5 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 46 Key 6 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 47 Key 7 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 48 Key 8 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 49 Key 9 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 50 Key 10 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 51 Key 11 Pulse Scale PULSE3 PULSE2 PULSE1 PULSE0 SCALE3 SCALE2 SCALE1 SCALE0 R/W 52–53 Key Signal 0 Key signal 0 (MSByte) – Key signal 0 (LSByte) R 54–55 Key Signal 1 Key signal 1 (MSByte) – Key signal 1 (LSByte) R 56–57 Key Signal 2 Key signal 2 (MSByte) – Key signal 2 (LSByte) R 58–59 Key Signal 3 Key signal 3 (MSByte) – Key signal 3 (LSByte) R 60–61 Key Signal 4 Key signal 4 (MSByte) – Key signal 4 (LSByte) R 62–63 Key Signal 5 Key signal 5 (MSByte) – Key signal 5 (LSByte) R 64–65 Key Signal 6 Key signal 6 (MSByte) – Key signal 6 (LSByte) R 66–67 Key Signal 7 Key signal 7 (MSByte) – Key signal 7 (LSByte) R 68–69 Key Signal 8 Key signal 8 (MSByte) – Key signal 8 (LSByte) R 70–71 Key Signal 9 Key signal 9 (MSByte) – Key signal 9 (LSByte) R 72–73 Key Signal 10 Key signal 10 (MSByte) – Key signal 10 (LSByte) R 74–75 Key Signal 11 Key signal 11 (MSByte) – Key signal 11 (LSByte) R 76–77 Reference Data 0 Reference data 0 (MSByte) – Reference data 0 (LSByte) R 78–79 Reference Data 1 Reference data 1 (MSByte) – Reference data 1 (LSByte) R 80–81 Reference Data 2 Reference data 2 (MSByte) – Reference data 2 (LSByte) R 82–83 Reference Data 3 Reference data 3 (MSByte) – Reference data 3 (LSByte) R 84–85 Reference Data 4 Reference data 4 (MSByte) – Reference data 4 (LSByte) R 19 9634E–AT42–06/12
Table 5-1. Internal Register Address Allocation (Continued) Address Use Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R/W 86–87 Reference Data 5 Reference data 5 (MSByte) – Reference data 5 (LSByte) R 88–89 Reference Data 6 Reference data 6 (MSByte) – Reference data 6 (LSByte) R 90–91 Reference Data 7 Reference data 7 (MSByte) – Reference data 7 (LSByte) R 92–93 Reference Data 8 Reference data 8 (MSByte) – Reference data 8 (LSByte) R 94–95 Reference Data 9 Reference data 9 (MSByte) – Reference data 9 (LSByte) R 96–97 Reference Data 10 Reference data 10 (MSByte) – Reference data 10 (LSByte) R 98–99 Reference Data 11 Reference data 11 (MSByte) – Reference data 11 (LSByte) R 5.2 Address 0: Chip ID Table 5-2. Chip ID Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 CHIP ID CHIP ID: Holds the chip ID; always 0x3E. 5.3 Address 1: Firmware Version Table 5-3. Firmware Version Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 MAJOR VERSION MINOR VERSION MAJOR VERSION: Holds the major firmware version (for example revision 1.5). MINOR VERSION: Holds the minor firmware version (for example revision 1.5). 5.4 Address 2: Detection Status Table 5-4. Detection Status Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 OVERFLO 2 CALIBRATE – – – – SDET TDET W CALIBRATE: This bit is set during a calibration sequence. OVERFLOW: This bit is set if the time to acquire all key signals exceeds 16ms. SDET: This bit is set if any of the slider/wheel channels are in detect. TDET: This bit is set if any of the keys are in detect. Note: If the slider or wheel is enabled then the SDET bit will be set when it is in detect. Also the relevant Key Status bit (0–2) and TDET will be set. These bits can be ignored if the SDET bit is set as the slider/wheel takes priority. A change in these bytes will cause the CHANGE line to trigger. AT42QT2120 20 9634E–AT42–06/12
AT42QT2120 5.5 Addresses 3 – 4: Key Status Table 5-5. Key Status Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 3 KEY7 KEY6 KEY5 KEY4 KEY3 KEY2 KEY1 KEY0 4 Reserved KEY11 KEY10 KEY9 KEY8 KEY0–KEY11: These bits indicate which keys are in detection, if any. Touched keys report as 1, untouched or disabled keys report as 0. A change in these bytes will cause the CHANGE line to trigger. 5.6 Address 5: Slider Position Table 5-6. Slider Position Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 5 SLIDER POSITION SLIDER POSITION: Reports the slider/wheel position. This value is only valid when the SDET bit in the Detection Status byte is set. A change in this value will cause the CHANGE line to assert low. 5.7 Address 6: Calibrate Table 5-7. Calibrate Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 6 CALIBRATE COMMAND CALIBRATE COMMAND: Writing any nonzero value into this address triggers the device to start a calibration cycle. The CALIBRATE flag in the detection status register is set when the calibration begins and clears when the calibration has finished. 5.8 Address 7: Reset Table 5-8. Reset Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 7 RESET COMMAND RESET COMMAND: Writing any nonzero value to this address triggers the device to reset. 21 9634E–AT42–06/12
5.9 Address 8: Low Power (LP) Mode Table 5-9. LP Mode Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 8 LP MODE LP MODE: This 8-bit value determines the number of 16 ms intervals between key measurements. Longer intervals between measurements yield a lower power consumption but at the expense of a slower response to touch. Setting Time 0 Power Down 1 16ms 2 32ms 3 48ms 4 64ms ...254 4.064 s 255 4.08 s Default: 1 (16ms between key acquisitions) To wake the device from Power-down mode a nonzero LP setting should be written to this address. The QT2120 can also be reset during power-down mode by writing a nonzero value to the reset register (address 7). 5.10 Address 9 – 10: Toward Touch and Away from Touch Drift (TTD, ATD) Table 5-10. Toward Touch and Away from Touch Drift Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 0 TOWARD TOUCH DRIFT 10 0 AWAY FROM TOUCH DRIFT TOWARD TOUCH DRIFT and AWAY FROM TOUCH DRIFT: Signals can drift because of changes in Cx and Cs over time and temperature. It is crucial that such drift be compensated for, else false detections and sensitivity shifts can occur. Drift compensation (see Figure5-1) is performed by making the reference level track the raw signal at a slow rate, but only while there is no detection in effect. The rate of adjustment must be performed slowly, otherwise legitimate detections could be ignored. The parameters can be configured in increments of 0.16s. AT42QT2120 22 9634E–AT42–06/12
AT42QT2120 Figure 5-1. Thresholds and Away From Touch Drift Signal Threshold Hysteresis Reference Output The device drift compensates using a slew-rate limited change to the reference level; the threshold and hysteresis values are slaved to this reference. When a finger is sensed, the signal increases due to capacitance being added to Cx. An isolated, untouched foreign object (a coin, or a water film) will cause the signal to drop very slightly due to an enhancement of coupling. Once a finger is sensed, the drift compensation mechanism ceases since the signal is legitimately detecting an object. Drift compensation only works when the signal in question has not crossed the negative threshold level. The drift compensation mechanism can be asymmetric; the drift-compensation can be made to occur in one direction faster than it does in the other simply by changing the TTD and ATD Setup parameters. This is a global configuration. Specifically, drift compensation should be set to compensate faster for decreasing signals than for increasing signals. Increasing signals should not be compensated quickly, since an approaching finger could be compensated for partially or entirely before even touching the touchpad (Toward Touch Drift (TTD)). However, an obstruction over the sense pad, for which the sensor has already made full allowance, could suddenly be removed leaving the sensor with an artificially suppressed reference level and thus become insensitive to touch. In this latter case, the sensor should compensate for the object's removal by lowering the reference level relatively quickly (Away from Touch Drift (ATD)). Drift compensation and the detection time-outs work together to provide for robust, adaptive sensing. The time-outs provide abrupt changes in reference calibration depending on the duration of the signal 'event'. If ATD or TTD is set to 0 then the drift compensation in the respective direction is disabled. Note: it is recommended that the drift compensation rate be more than four times the LP mode period. This is to prevent undersampling, which decreases the algorithm's efficiency. Default TTD: 20 (3.2s/reference level) Default ATD: 5 (0.8s/reference level) 23 9634E–AT42–06/12
5.11 Address 11: Detection Integrator (DI) Table 5-11. Detection Integrator Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 11 DI DI: Allows the DI level to be set for each key. This 8-bit value controls the number of consecutive measurements that must be confirmed as having passed the key threshold before that key is registered as being in detect. The minimum value for the DI filter is 1. A settings of 0 for the DI also defaults to 1. Default: 4 (maximum = 32) 5.12 Address 12: Touch Recal Delay (TRD) Table 5-12. Touch Recal Delay Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 12 TRD If an object unintentionally contacts a key resulting in a detection for a prolonged interval it is usually desirable to recalibrate the key in order to restore its function, perhaps after a time delay of some seconds. The Touch Recal Delay timer monitors such detections; if a detection event exceeds the timer's setting, the key will be automatically recalibrated. After a recalibration has taken place, the affected key will once again function normally even if it is still being contacted by the foreign object. This feature is set globally. TRD can be disabled by setting it to zero (infinite timeout) in which case the key will never autorecalibrate during a continuous detection (but the host could still command it). TRD is set globally, which can range in value from 1 – 255. TRD above 0 is expressed in 0.16s increments. Default: 255 (Comms) 255 (Standalone) 5.13 Address 13: Drift Hold Time (DHT) Table 5-13. Drift Hold Time Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 13 DHT This is used to restrict drift on all keys while one or more keys are activated. DHT defines the length of time the drift is halted after a key detection. When DHT = 0, drifting is never suspended, even during a valid touch of another key. AT42QT2120 24 9634E–AT42–06/12
AT42QT2120 This feature is particularly useful in cases of high-density keypads where touching a key or hovering a finger over the keypad would cause untouched keys to drift, and therefore create a sensitivity shift, and ultimately inhibit any touch detection. It is expressed in 0.16s increments. DHT default value: 25 DHT range: 0 – 255 5.14 Address 14: Slider Options Table 5-14. Slider Options Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 14 EN WHEEL Reserved EN: Setting this bit enables a Slider or Wheel to be configured. Only the first three channels (0, 1 and2) can be used. WHEEL: Setting this bit allows a wheel to be configured. If not set, and EN is enabled, it defaults to a slider. The range of both is from 0 – 255. Figure 5-2. Slider/Wheel Settings Tips of triangles should Position 0 be spaced4 mm apart. CH2 CH2 CH0 CH1 CH2 4 mm 4 mm 0 1 to 254 255 Position(at8bits-0to255 Position 86 Position 170 CH1 CH0 EN default value: 0 WHEEL default value: 0 25 9634E–AT42–06/12
5.15 Address 15: Charge Time Table 5-15. Charge Time Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 15 CHARGE TIME Prolongs the charge-transfer period of signal acquisition by 1µs per count. Allows full charge-transfer for keys with heavy Rs / Cx loading. Range: 0–255 Default: 0 5.16 Address 16 – 27: Detect Threshold (DTHR) Table 5-16. Detect Threshold Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 16 DTHR KEY 0 : : 27 DTHR KEY 11 DTHR KEY 0 – DTHR KEY 11: these 8-bit values set the threshold value for each key to register a detection. Default: 10 counts Note: Do not use a setting of 0 as this causes a key to go into detection when its signal is equal to its reference. 5.17 Addresses 28 – 39: Key Control Table 5-17. Key Control Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 28 Reserved GUARD AKS GPO EN : : 39 Reserved GUARD AKS GPO EN GUARD: If set to 1, this key will act as a guard channel. A key set as a guard key does not affect the Detection Status or Key Status register and the CHANGE line is not asserted if this key goes into detect. AKS: These bits control which keys are included in an AKS group. There can be up to three groups, each containing any number of keys (up to the maximum allowed for the mode). A setting of 0 disables AKS for that key. Each key can have a value between 0 and 3, which assigns it to an AKS group of that number. A key may only go into detect when it has the largest signal change of any key in its group. A value of 0 means the key is not in any AKS group. AT42QT2120 26 9634E–AT42–06/12
AT42QT2120 GPO: If set to 0, this key is a driven-low output. If set to 1 then the output is driven high. Setting this bit only has an effect if the EN bit is set to 1. EN: If set to 0, indicates that this key is to be used as a touch channel. Setting this bit to 1 will disable the key for touch use and make the channel pin an output. Note: It is not possible to enable Channel 0 or Channel 1 as an output. Setting the GPO bit on these channels will only have the effect of disabling the key. When a change is made to the EN bit a calibration cycle may occur because of the change in the signal values. It is recommended to manually initiate a calibration cycle after a change is made to the EN bit regardless of this. Comms Defaults: All Key Control bytes set to 0x00 Standalone Defaults: Key 0 Control byte = 0x00 Key 1 Control byte = 0x14 Key 2–11 Control bytes = 0x04 5.18 Addresses 40 – 51: Pulse/Scale for Keys Table 5-18. Controls for Keys Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 40 PULSE SCALE : : 51 PULSE SCALE PULSE/SCALE: The PULSE/SCALE settings are used to set up a proximity key. In comms mode the proximity key is set up by configuring a key’s PULSE/SCALE settings via an I2C bus. In standalone mode, default settings make key 0 a proximity key. This cannot be changed. These bits represent two numbers; the low nibble is SCALE, high nibble is PULSE. Each acquisition cycle consists signal accumulation and signal averaging. PULSE determines the number of measurements accumulated, SCALE the averaging factor. The SCALE factor (averaging factor) for the accumulated signal is an exponent of 2. PULSE is the number of measurements accumulated and is an exponent of 2. For example: Oversampling is used to enhance the resolution of the Analog-to-Digital-Converter (ADC). Oversampling theory says that for each additional bit of resolution, n, the signal must be oversampled four times (or 22 × n.) If two bits of addition resolution are required then the pulse setting would be 4 (42 = 24). If 3-bits of additional resolution are required the Pulse setting would be 6 (43 = 26). Here the result of each ADC pulse measurement is taken and added to the last. The oversampling theory also states that this accumulated result must be scaled back by a factor of 2n. The will be the Scale value. Table 5-19 on page 28 shows some of the recommended oversampling settings (1). 1.Other settings are possible but the Pulse value should never be more than six higher than the Scale setting as the signal result is stored in a 16-bit variable. 27 9634E–AT42–06/12
Table 5-19. Oversample for “n” Bits Sample Scaling Bits Gained (n) 4n 2n n 1 1 0 (Pulse = 0x0 / Scale = 0x00) 4 2 1 (Pulse = 0x2 / Scale = 0x01) 16 4 2 (Pulse = 0x4 / Scale = 0x02) 64 8 3 (Pulse = 0x6 / Scale = 0x03) 256 16 4 (Pulse = 0x8 / Scale = 0x04) 1024 32 5 (Pulse = 0x0A / Scale = 0x05) 4096 64 6 (Pulse = 0x0C / Scale = 0x06) 16384 128 7 (Pulse = 0x0E / Scale = 0x07) Consideration should be taken on the overall effect on timing when setting Pulse values. A single pulse takes approximately 90µs to complete. As all keys are acquired sequentially a high-bit gain setting will add considerably to the time taken to acquire all channels. Figure 5-3. Pulse and Scale Settings Standalone Mode Defaults: Key 0 Pulse Scale = 0x84 Key 1 Pulse Scale = 0x42 Key 2–6 Pulse Scale = 0x00 Comms Mode Defaults: PULSE0 – PULSE3 = 0 SCALE0 – SCALE3 = 0 AT42QT2120 28 9634E–AT42–06/12
AT42QT2120 5.19 Address 52 – 75: Key Signal Table 5-20. Key Signal Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 52 MSByte OF KEY SIGNAL FOR KEY 0 53 LSByte OF KEY SIGNAL FOR KEY 0 : : 74 MSByte OF KEY SIGNAL FOR KEY 11 75 LSByte OF KEY SIGNAL FOR KEY 11 KEY SIGNAL: addresses 52–75 allow key signals to be read for each key, starting with key 0. There are two bytes of data for each key. These are the key’s 16-bit key signals which are accessed as two 8-bit bytes, stored MSByte first. These addresses are read-only. 5.20 Address 76–99: Reference Data Table 5-21. Reference Data Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 76 MSByte OF REFERENCE DATA FOR KEY 0 77 LSByte OF REFERENCE DATA FOR KEY 0 : : 98 MSByte OF REFERENCE DATA FOR KEY 11 99 LSByte OF REFERENCE DATA FOR KEY 11 REFERENCE DATA: addresses 76–99 allow reference data to be read for each key, starting with key 0. There are two bytes of data for each key. These are the key’s 16-bit reference data which is accessed as two 8-bit bytes, stored MSByte first. These addresses are read-only. 29 9634E–AT42–06/12
6. Specifications 6.1 Absolute Maximum Specifications Vdd –0.5 to +6V Max continuous pin current, any control or drive pin ±10mA Short circuit duration to ground, any pin infinite Short circuit duration to Vdd, any pin infinite Voltage forced onto any pin –0.5V to (Vdd + 0.5) V CAUTION: Stresses beyond those listed under Absolute Maximum Specifications may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum specification conditions for extended periods may affect device reliability. 6.2 Recommended Operating Conditions Operating temperature –40oC to +85oC Storage temperature –55oC to +125oC Vdd +1.8V to 5.5V Supply ripple+noise ±25mV Cx load capacitance per key 1 to 30pF 6.3 DC Specifications Vdd = 3.3V, Cs = 10nF, load = 5pF, 32ms default sleep, Ta = recommended range, unless otherwise noted Parameter Description Minimum Typical Maximum Units Notes Vil Low input logic level – – 0.2×Vdd V Vih High input logic level 0.7×Vdd – Vdd + 0.5 V Vol Low output voltage – – 0.6 V Voh High output voltage Vdd – 0.7V – – V Iil Input leakage current – – ±1 µA AT42QT2120 30 9634E–AT42–06/12
AT42QT2120 6.4 Timing Specifications Parameter Description Minimum Typical Maximum Units Notes LP mode + DI setting T Response time – (DI setting ms Under host control R × 16ms × 16ms) Modulated F Sample frequency 10.5 12.5 – kHz QT spread-spectrum (chirp) Power-up delay to Can be longer if burst is T – <230 – ms D operate/calibration time very long. F I2C-compatible clock rate – – 400 kHz – I2C Fm Burst modulation, percentage 15 – % – RESET pulse width 2 – – µs 2µs at 1.8V 31 9634E–AT42–06/12
6.5 Power Consumption 6.5.1 1 Channel Enabled Table 6-1. Power Consumption (µA) LP Mode 5V 4.2V 3.6V 3.3V 3V 2.5V 2V 1.8V 0 <1 <1 <1 <1 <1 <1 <1 <1 1 910 720 590 530 475 385 310 280 2 790 625 515 465 420 340 280 255 3 750 595 490 445 400 330 265 245 4 730 580 480 430 390 320 260 240 5 720 570 460 415 385 315 255 235 255 670 535 445 405 360 300 245 225 Pulse=0 and Scale=0 Figure 6-1. Idd Curve with 1 Channel Enabled Vdd = 5 V Vdd = 4.2 V Vdd = 3.6 V Vdd = 3.3 V Vdd = 3.0 V Vdd = 2.5 V Vdd = 2 V Vdd = 1.8 V 1000 900 800 700 A) 600 u ( t 500 n e r r u 400 C 300 200 100 0 0 1 2 3 4 5 255 LP Mode AT42QT2120 32 9634E–AT42–06/12
AT42QT2120 6.5.2 12 Channels Enabled 255 Table 6-2. Power Consumption (µA) LP Mode 5V 4.2V 3.6V 3.3V 3V 2.5V 2V 1.8V 0 <1 <1 <1 <1 <1 <1 <1 <1 1 1095 860 700 630 560 460 370 330 2 880 700 575 515 460 380 305 280 3 810 645 530 480 425 350 285 260 4 780 615 510 455 410 340 275 250 5 760 600 490 440 400 330 270 240 255 675 535 445 410 360 295 245 225 Pulse= 0 and Scale=0 Figure 6-2. Idd Curve with 12 Channels Enabled Vdd = 5 V Vdd = 4.2 V Vdd = 3.6 V Vdd = 3.3 V Vdd = 3.0 V Vdd = 2.5 V Vdd = 2 V Vdd = 1.8 V 1200 1000 800 A) u ( t 600 n e r r u C 400 200 0 0 1 2 3 4 5 25 LP Mode 33 9634E–AT42–06/12
6.6 Mechanical Dimensions 6.6.1 AT42QT2120-SU–20-pin SOIC AT42QT2120 34 9634E–AT42–06/12
AT42QT2120 6.6.2 AT42QT2120-XU–20-pin TSSOP Dimensions in Millimeters and (Inches). Controlling dimension: Millimeters. JEDEC Standard MO-153 AC INDEX MARK PIN 1 4.50 (0.177) 6.50 (0.256) 4.30 (0.169) 6.25 (0.246) 6.60 (.260) 1.20 (0.047) MAX 6.40 (.252) 0.65 (.0256) BSC 0.15 (0.006) SEATING 0.30 (0.012) 0.05 (0.002) PLANE 0.19 (0.007) 0.20 (0.008) 0º ~ 8º 0.09 (0.004) 0.75 (0.030) 0.45 (0.018) 10/23/03 TITLE DRAWING NO. REV. 2325 Orchard Parkway 20X, (Formerly 20T), 20-lead, 4.4 mm Body Width, San Jose, CA 95131 20X C R Plastic Thin Shrink Small Outline Package (TSSOP) 35 9634E–AT42–06/12
6.6.3 AT42QT2120-MMH–20-pin VQFN D C y Pin 1 ID E SIDE VIEW TOP VIEW AA11 A D2 16 17 18 19 20 COMMON DIMENSIONS (Unit of Measure = mm) C0.18 (8X) 15 1 SYMBOL MIN NOM MAX NOTE A 0.75 0.80 0.85 Pin #1 Chamfer 14 (C 0.3) 2 A1 0.00 0.02 0.05 e b 0.17 0.22 0.27 E2 13 3 C 0.152 12 4 D 2.90 3.00 3.10 D2 1.40 1.55 1.70 11 5 E 2.90 3.00 3.10 b E2 1.40 1.55 1.70 e – 0.45 – 10 9 8 7 6 L 0.35 0.40 0.45 0.3 Ref (4x) L K K 0.20 – – BOTTOM VIEW y 0.00 – 0.08 10/24/08 TITLE GPC DRAWING NO. REV. Package Drawing Contact: 20M2, 20-pad, 3 x 3 x 0.85 mm Body, Lead Pitch 0.45 mm, packagedrawings@atmel.com 1.55 x 1.55 mm Exposed Pad, Thermally Enhanced ZFC 20M2 B Plastic Very Thin Quad Flat No Lead Package (VQFN) AT42QT2120 36 9634E–AT42–06/12
AT42QT2120 6.7 Marking 6.7.1 AT42QT2120X-SU Shortenedpart number DateCode QT2120 Pin 1 2R0 CodeRevision 2.0Released DateCodeDescription W=Week code W week code number 1-52 where: A=1 B=2 .... Z=26 then using the underscore A=27...Z=52 Variablefactory Shortenedpart #### text number QT2120-SU Pin 1 37 9634E–AT42–06/12
6.7.2 AT42QT2120X-XU Shortenedpart number 2120 Pin1 2R0 DateCode CodeRevision 2.0Released DateCodeDescription W=Week code W week code number 1-52 where: A=1 B=2 .... Z=26 then using the underscore A=27...Z=52 Variablefactory ### text QT2120 Shortenedpart number Pin1 XU AT42QT2120 38 9634E–AT42–06/12
AT42QT2120 6.7.3 AT42QT2120X-MMH Shortenedpart numberin hexadecimal “848” =“2120” Pin1 848 Identification 20 CodeRevision 2.0Prereleased DateCode (NOTEPOSITION (NOTEPOSITION -Released) -Released) DateCodeDescription W=Week code W week code number 1-52 where: A=1 B=2 .... Z=26 then using the underscore A=27...Z=52 Shortenedpart numberin 848 hexadecimal “848” =“2120” Pin1 Identification Variablefactory ### text Variablefactory ### text 39 9634E–AT42–06/12
6.8 Part Number Part Number Order Code Description AT42QT2120-SU QS589 20-pin 0.300 inch wide body, SOIC RoHS-compliant IC AT42QT2120-SUR AT42QT2120-XU QS589 20-pin 4.4 mm body, TSSOP RoHS-compliant IC AT42QT2120-XUR AT42QT2120-MMH QS589 20-pad 3×3×0.85mm body VQFN RoHS-compliant IC AT42QT2120-MMHR The part number comprises: AT = Atmel 42 = Touch Business Unit QT = Charge-transfer technology 2120 = (2) capable of slider/wheel, (12) number of channels, (0) variant number SU = SOIC chip XU = TSSOP chip MMH = VQFN chip R = Tape and reel 6.9 Moisture Sensitivity Level (MSL) MSL Rating Peak Body Temperature Specifications MSL3 260oC IPC/JEDEC J-STD-020 AT42QT2120 40 9634E–AT42–06/12
AT42QT2120 Appendix A. I2C-compatible Operation A.1 Interface Bus The device communicates with the host over an I2C bus. The following sections give an overview of the bus; more detailed information is available from www.i2C-bus.org. Devices are connected to the I2C bus as shown in FigureA-1. Both bus lines are connected to Vdd via pull- up resistors. The bus drivers of all I2C devices must be open-drain type. This implements a wired AND function that allows any and all devices to drive the bus, one at a time. A low level on the bus is generated when a device outputs a zero. Figure A-1. I2C Interface Bus Vdd Device 1 Device 2 Device 3 Device n R1 R2 SDA SCL A.2 Transferring Data Bits Each data bit transferred on the bus is accompanied by a pulse on the clock line. The level of the data line must be stable when the clock line is high; the only exception to this rule is for generating START and STOP conditions. Figure A-2. Data Transfer SDA SCL Data Stable Data Stable Data Change 41 9634E–AT42–06/12
A.3 START and STOP Conditions The host initiates and terminates a data transmission. The transmission is initiated when the host issues a START condition on the bus, and is terminated when the host issues a STOP condition. Between the START and STOP conditions, the bus is considered busy. As shown in FigureA-3, START and STOP conditions are signaled by changing the level of the SDA line when the SCL line is high. Figure A-3. START and STOP Conditions SDA SCL START STOP A.4 Address Byte Format All address bytes are 9 bits long, consisting of 7 address bits, one READ/WRITE control bit and an acknowledge bit. If the READ/WRITE bit is set, a read operation is performed, otherwise a write operation is performed. When the device recognizes that it is being addressed, it will acknowledge by pulling SDA low in the ninth SCL (ACK) cycle. An address byte consisting of a slave address and a READ or a WRITE bit is called SLA+R or SLA+W, respectively. The most significant bit of the address byte is transmitted first. The address sent by the host must be consistent with that selected with the option jumpers. Figure A-4. Address Byte Format Addr MSB Addr LSB R/W ACK SDA SCL 1 2 7 8 9 START A.5 Data Byte Format All data bytes are 9 bits long, consisting of 8 data bits and an acknowledge bit. During a data transfer, the host generates the clock and the START and STOP conditions, while the receiver is responsible for acknowledging the reception. An acknowledge (ACK) is signaled by the receiver pulling the SDA line low during the ninth SCL cycle. If the receiver leaves the SDA line high, a NACK is signaled. AT42QT2120 42 9634E–AT42–06/12
AT42QT2120 Figure A-5. Data Byte Format Data MSB Data LSB ACK Aggregate SDA SDA from Transmitter SDA from Receiver SCL from Master 1 2 7 8 9 SLA+R/W Data Byte Stop orNext Data Byte A.6 Combining Address and Data Bytes into a Transmission A transmission consists of a START condition, an SLA+R/W, one or more data bytes and a STOP condition. The wired “ANDing” of the SCL line is used to implement handshaking between the host and the device. The device extends the SCL low period by pulling the SCL line low whenever it needs extra time for processing between the data transmissions. Note: Each write or read cycle must end with a stop condition. The device may not respond correctly if a cycle is terminated by a new start condition. FigureA-6 shows a typical data transmission. Note that several data bytes can be transmitted between the SLA+R/W and the STOP. Figure A-6. Byte Transmission Addr MSB Addr LSB R/W ACK Data MSB Data LSB ACK SDA SCL 1 2 7 8 9 1 2 7 8 9 START SLA+RW Data Byte STOP 43 9634E–AT42–06/12
Associated Documents • QTAN0079–Buttons, Sliders and Wheels Touch Sensors Design Guide • QTAN0087–Proximity Design Guide • Atmel AVR3000: QTouch Conducted Immunity Application Note Revision History Revision Number History Revision A – November 2011 Initial release of document for code revision 1.5 Revision B – December 2011 Release of document for code revision 1.7 (rev 1.6 unreleased) Revision C – February 2012 Small amendment to diagram (code revision 1.7 unreleased) Release of document for code revision 1.8 Updated Part Markings Revision D – February 2012 Added Power Consumption figures Updated description for CHANGE Line timings Release of document for code revision 2.0 Revision E – June 2012 Updated Part Markings Other minor changes AT42QT2120 44 9634E–AT42–06/12
AT42QT2120 Notes 45 9634E–AT42–06/12
Headquarters International Atmel Corporation Atmel Asia Atmel Munich GmbH Atmel Japan 1600 Technology Drive Unit 01-05 & 16, 19F Business Campus 16F Shin-Osaki Kangyo Building San Jose, CA 95110 BEA Tower, Millennium City 5 Parkring 4 1-6-4 Osaki USA 418 Kwun Tong Road D- 85748 Garching bei München Shinagawa-ku, Tokyo 141-0032 Tel: (+1) (408) 441-0311 Kwun Tong GERMANY JAPAN Fax: (+1) (408) 436-4314 Kowloon Tel: (+49) 89-31970-111 Tel: (+81) (3) 6417-0300 HONG KONG Fax: (+49) 89-3194621 Fax: (+81) (3) 6417-0370 Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Touch Technology Division 1560 Parkway Solent Business Park Whiteley Fareham Hampshire PO15 7AG UNITED KINGDOM Tel: (+44) 844 894 1920 Fax: (+44) 1489 557 066 Product Contact Web Site Technical Support Sales Contact www.atmel.com touch@atmel.com www.atmel.com/contacts Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALE LOCATED ON THE ATMEL WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2012 Atmel Corporation. All rights reserved. Atmel®, Atmel logo and combinations thereof, Adjacent Key Suppression®, AKS®, QTouch® and others are registered trademarks, others are trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be registered trademarks or trademarks of others. 9634E–AT42–06/12
Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: AT42QT2120-XU AT42QT2120-MMH AT42QT2120-SUR AT42QT2120-SU AT42QT2120-XUR AT42QT2120- MMHR