AT24CM01 I2C-Compatible (2-wire) Serial EEPROM 1-Mbit (131,072 x 8) DATASHEET Features  Low Voltage and Standard Voltage Operation Available ̶ 1.7V (V = 1.7V to 5.5V) CC ̶ 2.5V (V = 2.5V to 5.5V) CC  Internally Organized 131,072 x 8  2-wire Serial Interface  Schmitt Triggers, Filtered Inputs for Noise Suppression  Bidirectional Data Transfer Protocol  400kHz (1.7V) and 1MHz (5V, 2.5V) Compatibility  Write Protect Pin for Hardware Data Protection  256-byte Page Write Mode ̶ Partial Page Writes Allowed  Random and Sequential Read Modes  Self-timed Write Cycle (5ms Max)  High Reliability ̶ Endurance: 1,000,000 Write Cycles ̶ Data Retention: 40 Years  Green Package Options (Pb/Halide-free/RoHS Compliant) ̶ 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, and 8-ball WLCSP  Die Sale Options: Wafer Form and Tape and Reel Available Description The Atmel® AT24CM01 provides 1,048,576 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 131,072 words of 8 bits each. The device’s cascadable feature allows up to four devices to share a common 2-wire bus. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The devices are available in space-saving 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, and 8-ball WLCSP. In addition, the entire family is available in 1.7V (1.7V to 5.5V) and 2.5V (2.5V to 5.5V) versions. Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

1. Pin Configurations and Pinouts Pin Name Function 8-lead SOIC 8-lead TSSOP NC No Connect NC 1 8 VCC NC 1 8 VCC A1 2 7 WP A1 2 7 WP A Address Input A2 3 6 SCL A2 3 6 SCL 1 GND 4 5 SDA GND 4 5 SDA A Address Input 2 Top View Top View GND Ground 8-ball WLSCP SDA Serial Data SCL Serial Clock Input VCC WP NC WP Write Protect SCL A1 V Power Supply SDA A2 GND CC Top View Note: Drawings are not to scale. 2. Absolute Maximum Ratings* Operating Temperature . . . . . . . . . . .-55C to +125C *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage Storage Temperature. . . . . . . . . . . . .-65C to +150C to the device. This is a stress rating only and functional operation of the device at these or any Voltage on any pin other conditions beyond those indicated in the with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V operational sections of this specification is not implied. Exposure to absolute maximum rating Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V conditions for extended periods may affect device DC Output Current. . . . . . . . . . . . . . . . . . . . . . .5.0mA reliability. 2 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

3. Block Diagram V CC GND WP Start SCL Stop SDA Logic Serial EN Control H.V. Pump/Timing Logic LOAD Device COMP Data Recovery Address Comparator LOAD INC A A21 R/W Data Word EC EEPROM Addr/counter D X Y DEC Serial MUX D D /ACK IN OUT Logic D OUT 4. Pin Description Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open drain driven and may be wire-ORed with any number of other open drain or open collector devices. Device Addresses (A and A ): The A and A pins are device address inputs that can be hardwired or left not 2 1 2 1 connected for hardware compatibility with other Atmel AT24Cxx devices. When the A and A pins are 2 1 hardwired, as many as four 1-Mbit devices may be addressed on a single bus system (See “Device Addressing” on page 9. for more details). If the A and A pins are left floating, the A and A pin will be internally pulled down 2 1 2 1 to GND if the capacitive coupling to the circuit board V plane is <3pF. If coupling is >3pF, Atmel recommends CC connecting the A and A pin to GND. 2 1 Write Protect (WP): The Write Protect input, when connected to GND, allows normal write operations. When WP is connected high to V , all write operations to the memory are inhibited. If the pin is left floating, the WP CC pin will be internally pulled down to GND if the capacitive coupling to the circuit board V plane is <3pF. If CC coupling is >3pF, Atmel recommends connecting the pin to GND. Switching WP to V prior to a write operation CC creates a software write protect function. Table 4-1. Write Protect WP Pin Status Part of the Array Protected At V Full Array CC At GND Normal Read/Write Operations AT24CM01 [DATASHEET] 3 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

5. Memory Organization AT24CM01, 1-Mbit Serial EEPROM: The 1-Mbit is internally organized as 512 pages of 256 bytes each. Random word addressing requires a 17-bit data word address. 5.1 Pin Capacitance Table 5-1. Pin Capacitance(1) Applicable over recommended operating range from T = 25C, f = 1.0MHz, V = 5.5V. A CC Symbol Test Condition Max Units Conditions C Input/Output Capacitance (SDA) 8 pF V = 0V I/O I/O C Input Capacitance (A , A , SCL) 6 pF V = 0V IN 2 1 IN Note: 1. This parameter is characterized and is not 100% tested. 5.2 DC Characteristics Table 5-2. DC Characteristics Applicable over recommended operating range from: T = -40C to +85C, V = 1.7V to 5.5V (unless otherwise noted). AI CC Symbol Parameter Test Condition Min Typ Max Units Supply Voltage, V 1.7 5.5 V CC1 1.7V Option Supply Voltage, V 2.5 5.5 V CC2 2.5V Option I Supply Current V = 5.0V Read at 400kHz 2.0 mA CC CC I Supply Current V = 5.0V Write at 400kHz 3.0 mA CC CC V = 1.7V 1.0 μA CC V = V or V IN CC SS V = 2.5V 2.0 μA CC I Standby Current SB V = 3.6V 3.0 μA CC V = V or V IN CC SS V = 5.5V 6.0 μA CC I Input Leakage Current V = V orV 0.10 3.0 μA LI IN CC SS I Output Leakage Current V = V orV 0.05 3.0 μA LO OUT CC SS V Input Low Level(1) -0.6 V x 0.3 V IL CC V Input High Level(1) V x 0.7 V + 0.5 V IH CC CC V Output Low Level V = 1.7V I = 0.15mA 0.2 V OL1 CC OL V Output Low Level V = 3.0V I = 2.1mA 0.4 V OL2 CC OL Note: 1. V min and V max are reference only and are not tested. IL IH 4 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

5.3 AC Characteristics Table 5-3. AC Characteristics Applicable over recommended operating range from T = -40C to +85C, V = 1.7V to 5.5V (where applicable), AI CC CL = 100pF (unless otherwise noted). Test conditions are listed in Note 2. 1.7V 2.5V, 5.0V Symbol Parameter Min Max Min Max Units f Clock Frequency, SCL 400 1000 kHz SCL t Clock Pulse Width Low 1300 400 ns LOW t Clock Pulse Width High 600 400 ns HIGH t Noise Suppression Time(1) 100 50 ns I t Clock Low to Data Out Valid 50 900 50 550 ns AA Time the bus must be free before a t 1300 500 ns BUF new transmission can start(1) t Start Condition Hold Time 600 250 ns HD.STA t Start Condition Set-up Time 600 250 ns SU.STA t Data In Hold Time 0 0 ns HD.DAT t Data In Set-up Time 100 100 ns SU.DAT t Inputs Rise Time(1) 300 300 ns R t Inputs Fall Time(1) 300 100 ns F t Stop Condition Set-up Time 600 250 ns SU.STO t Data Out Hold Time 50 50 ns DH t Write Cycle Time 5 5 ms WR Endurance(1) 25°C, Page Mode, 3.3V 1,000,000 Write Cycles Notes: 1. This parameter is ensured by characterization only. 2. AC measurement conditions:  R (connects to V ): 1.3 k (2.5V, 5V), 10 k (1.7V) L CC  Input pulse voltages: 0.3 V to 0.7 V CC CC  Input rise and fall times:  50ns  Input and output timing reference voltages: 0.5 V CC AT24CM01 [DATASHEET] 5 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

6. Device Operation Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or Stop condition as defined below. Figure 6-1. Data Validity SDA SCL Data Stable Data Stable Data Change Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any other command. Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the Stop condition will place the EEPROM in a standby power mode. Figure 6-2. Start and Stop Definition SDA SCL Start Stop Condition Condition 6 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit words. The EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word. Figure 6-3. Output Acknowledge SCL 1 8 9 Data In Data Out Start Acknowledge Condition Standby Mode: The AT24CM01 features a low-power standby mode which is enabled:  Upon power-up.  After the receipt of the Stop condition and the completion of any internal operation. Software Reset: After an interruption in protocol, power loss, or system reset, any 2-wire part can be protocol reset by following these steps: 1. Create a Start condition (if possible). 2. Clock nine cycles. 3. Create another Start condition followed by Stop condition as in Figure 6-4. The device should be ready for the next communication after the above steps have been completed. In the event that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device. Figure 6-4. Software Reset Dummy Clock Cycles SCL 1 2 3 8 9 Start Start Stop Condition Condition Condition SDA AT24CM01 [DATASHEET] 7 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

Figure 6-5. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O t t HIGH t F R t t SCL LOW LOW t t t t t SU.STA HD.STA HD.DAT SU.DAT SU.STO SDA IN t t t AA DH BUF SDA OUT Figure 6-6. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th Bit AC(cid:31) WORD N (1) t WR Stop Start Condition Condition Note: 1. The write cycle time t is the time from a valid Stop condition of a write sequence to the end of the internal WR clear/write cycle. 8 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

7. Device Addressing The 1-Mbit EEPROM requires an 8-bit device address word following a Start condition to enable the chip for a read or write operation (see Figure 7-1 below). The device address word consists of a mandatory ‘1010’ sequence for the first four most significant bits. This is common to all 2-wire EEPROM devices. The 1-Mbit uses the two device address bits, A2 and A1, to allow up to four devices on the same bus. These A2 and A1 bits must compare to the corresponding hardwired input pins, A and A . The A and A pins uses an 2 1 2 1 internal proprietary circuit that biases it to a logic low condition if the pin is allowed to float. The seventh bit (P ) of the device address is a memory page address bit. This memory page address bit is the 0 most significant bit of the data word address that follows. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a valid compare is not made, the device will return to a standby state. Figure 7-1. Device Address 1Mb 1 0 1 0 A2 A1 P0 R/W MSB LSB 8. Write Operations Byte Write: To select a data word in the 1-Mbit memory requires a 17-bit word address. The word address field consists of the P bit in the device address byte, then the most significant word address followed by the least 0 significant word address (Figure 8-1). A write operation requires the P bit and two 8-bit data word addresses following the device address word and 0 acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then the part is to receive the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero. The addressing device, such as a microcontroller, then must terminate the write sequence with a Stop condition. At this time the EEPROM enters an internally timed write cycle, t , to the nonvolatile memory. All inputs are WR disabled during this write cycle and the EEPROM will not respond until the write is complete (Figure 8-1). Figure 8-1. Byte Write S W T R S A I T R Device T First Word Second Word O T Address E Address Address Data P SDA LINE M PR A L A L A A S 0 / C S C S C C B W K B K B K K AT24CM01 [DATASHEET] 9 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

Page Write: The 1-Mbit EEPROM is capable of a 256-byte Page Write. A Page Write is initiated the same way as a Byte Write, but the microcontroller does not send a Stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to 255 more data words. The EEPROM will respond with an acknowledge after each data word is received. The microcontroller must terminate the page write sequence with a Stop condition (Figure 8-2) and the internally timed write cycle will begin. The data word address lower 8 bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the internally generated word address, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than 256 data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. The address “rollover” during write is from the last byte of the current page to the first byte of the same page. Figure 8-2. Page Write S W T R S A I T R Device T First Word Second Word O T Address E Address Address Data (n) Data (n + x) P SDA LINE M PR A L A L A A A S 0 / C S C S C C C B W K B K B K K K Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled, Acknowledge Polling can be initiated. This involves sending a Start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero, allowing a new read or write sequence to be initiated. Data Security: The AT24CM01 has a hardware data protection scheme that allows the user to write protect the entire memory when the WP pin is at V . CC 10 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

9. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: Current Address Read, Random Address Read, and Sequential Read. Current Address Read: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the V to the part is maintained. The address “rollover” during read is from the last byte of the last page, to the first CC byte of the first page of the memory. Once the device address with the read/write select bit set to one is input and acknowledged by the EEPROM, the current address data word is serially clocked out on the SDA line. The microcontroller does not respond with a zero but does generate a following Stop condition. Figure 9-1. Current Address Read S T R S A E T R Device A O T Address D Data P SDA LINE M PR A N S 0 / C O B W K A C K Random Read: A Random Read requires an initial byte write sequence to load in the data word address. This is known as a “dummy write” operation. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another Start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word on the SDA line. The microcontroller does not respond with a zero but does generate a following Stop condition. Figure 9-2. Random Read S W S T R T R S A I A E T R Device T First Word Second Word R Device A O T Address E Address Address T Address D Data (n) P SDA LINE M P R A A L A P R A N S 0 / C C S C 0 / C O B W (cid:31) (cid:31) B (cid:31) W(cid:31) A C Dummy Write (cid:31) AT24CM01 [DATASHEET] 11 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The Sequential Read operation is terminated when the microcontroller does not respond with a zero, but does generate a following Stop condition. Figure 9-3. Sequential Read S W T R A I R Device T First Word Second Word T Address E Address Address . . . SDA LINE M PR A A L A S 0 / C C S C B W K K B K Dummy Write S T R S A E T R Device A O T Address D Data (n) Data (n + 1) Data (n + 2) Data (n + x) P . . . P R A A A A N 0 / C C C C O K K K K W A C K 12 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

10. Ordering Code Detail A T 2 4 C M 0 1 - S S H M - B Atmel Designator Shipping Carrier Option B or blank = Bulk (Tubes) T = Tape and Reel Product Family Operating Voltage 24C = Standard I2C M = 1.7V to 5.5V Serial EEPROM D = 2.5V to 5.5V Device Density Package Device Grade or M = Megabit Family Wafer/Die Thickness 01 = 1 Megabit H = Green, NiPdAu Lead Finish Industrial Temperature Range (-40°C to +85°C) U = Green, Matte Sn Lead Finish Industrial Temperature Range (-40°C to +85°C) 11 = 11mil Wafer Thickness Package Option SS = JEDEC SOIC S = EIAJ SOIC X = TSSOP U = 3x5 Grid Array, WLCSP WWU = Wafer Unsawn AT24CM01 [DATASHEET] 13 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

11. Part Markings AT24CM01: Package Marking Information 8-lead SOIC 8-lead EIAJ ATMLHYWW ATMLHYWW ###% @ A#A#A#A%A A A A@ AAAAAAAA 8-lead TSSOP 8-ball WLCSP ATHYWW %U ###% @ ### AAAAAAA YXX Note 1: designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT24CM01 Truncation Code ###: 2G Date Codes Voltages Y = Year M = Month WW = Work Week of Assembly % = Minimum Voltage 4: 2014 8: 2018 A: January 02: Week 2 D: 2.5V min 5: 2015 9: 2019 B: February 04: Week 4 M: 1.7V min 6: 2016 0: 2020 ... ... 7: 2017 1: 2021 L: December 52: Week 52 Country of Assembly L ot Number Grade/Lead Finish Material @ = Country of Assembly AAA...A = Atmel Wafer Lot Number H: Industrial/NiPdAu U: Industrial/Matte Tin/SnAgCu Trace Code Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel Example: AA, AB.... YZ, ZZ ATM: Atmel ATML: Atmel 12/12/14 TITLE DRAWING NO. REV. Package Mark Contact: 24CM01SM, AT24CM01 Package Marking Information 24CM01SM F DL-CSO-Assy_eng@atmel.com 14 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

12. Ordering Information Delivery Information Operation Atmel Ordering Code Lead Finish Package Voltage Form Quantity Range AT24CM01-SSHM-B Bulk (Tubes) 100 per Tube 1.7V to 5.5V AT24CM01-SSHM-T Tape and Reel 4,000 per Reel 8S1 AT24CM01-SSHD-B Bulk (Tubes) 100 per Tube 2.5V to 5.5V AT24CM01-SSHD-T Tape and Reel 4,000 per Reel AT24CM01-SHM-B Bulk (Tubes) 95 per Tube 1.7V to 5.5V AT24CM01-SHM-T Tape and Reel 2,000 per Reel NiPdAu 8S2 (Lead-free/Halogen-free) Industrial AT24CM01-SHD-B Bulk (Tubes) 95 per Tube Temperature 2.5V to 5.5V (-40C to 85C) AT24CM01-SHD-T Tape and Reel 2,000 per Reel AT24CM01-XHM-B Bulk (Tubes) 100 per Tube 1.7V to 5.5V AT24CM01-XHM-T Tape and Reel 5,000 per Reel 8X AT24CM01-XHD-B Bulk (Tubes) 100 per Tube 2.5V to 5.5V AT24CM01-XHD-T Tape and Reel 5,000 per Reel SnAgCu AT24CM01-UUM-T(1) 8U-6 Tape and Reel 5,000 per Reel (Lead-free/Halogen-free) 1.7V to 5.5V AT24CM01-WWU11M(2) N/A Wafer Sale Note 2 Notes: 1. WLCSP Package — CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells. Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light does not occur. 2. For wafer sales, please contact Atmel Sales. Package Type 8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8S2 8-lead, 0.208” wide, Plastic Gull Wing Small Outline (EIAJ SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP) 8U-6 8-ball, 3x5 Grid Array, Wafer Level Chip Scale (WLCSP) AT24CM01 [DATASHEET] 15 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

13. Packaging Information 13.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b A COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A1 A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 D E1 3.81 – 3.99 E 5.79 – 6.20 SIDE VIEW e 1.27 BSC Notes: This drawing is for general information only. L 0.40 – 1.27 Refer to JEDEC Drawing MS-012, Variation AA ØØ 0° – 8° for proper dimensions, tolerances, datums, etc. 6/22/11 TITLE GPC DRAWING NO. REV. 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing SWB 8S1 G Package Drawing Contact: Small Outline (JEDEC SOIC) packagedrawings@atmel.com 16 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

13.2 8S2 — 8-lead EIAJ SOIC TOP VIEW END VIEW C 1 E E1 L 8 q SIDE VIEW e b A COMMON DIMENSIONS (Unit of Measure = mm) A1 SYMBOL MIN NOM MAX NOTE A 1.70 2.16 A1 0.05 0.25 b 0.35 0.48 4 C 0.15 0.35 4 D D 5.13 5.35 E1 5.18 5.40 2 Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. E 7.70 8.26 2. Mismatch of the upper and lower dies and resin burrs aren't included. L 0.51 0.85 3. Determines the true geometric position. q 0° 8° 4. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. e 1.27 BSC 3 11/10/14 TITLE GPC DRAWING NO. REV. 8S2, 8-lead, 0.208” Body, Plastic Package Drawing Contact: STN 8S2 G Small Outline Package (EIAJ) packagedrawings@atmel.com AT24CM01 [DATASHEET] 17 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

13.3 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 COMMON DIMENSIONS e A2 (Unit of Measure = mm) D SYMBOL MIN NOM MAX NOTE Side View A - - 1.20 A1 0.05 - 0.15 Notes: 1. This drawing is for general information only. A2 0.80 1.00 1.05 Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. D 2.90 3.00 3.10 2, 5 2. Dimension D does not include mold Flash, protrusions or gate E 6.40 BSC burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. E1 4.30 4.40 4.50 3, 5 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm b 0.19 0.25 0.30 4 (0.010in) per side. e 0.65 BSC 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess L 0.45 0.60 0.75 of the b dimension at maximum material condition. Dambar L1 1.00 REF cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. C 0.09 - 0.20 5. Dimension D and E1 to be determined at Datum Plane H. 2/27/14 TITLE GPC DRAWING NO. REV. 8X, 8-lead 4.4mm Body, Plastic Thin Package Drawing Contact: Shrink Small Outline Package (TSSOP) TNR 8X E packagedrawings@atmel.com 18 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

13.4 8U-6 — 8-ball WLCSP — 4X d 0.015 C d0.075 C A C D j n0.015m C j n0.05m C A B Pin 1 A1 A B C D E Øb E D C B A Pin 1 1 1 2 E 2 e 3 3 A2 e2 d2 d A TOP VIEW SIDE VIEW BALL SIDE * Dimensions are NOT to scale. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN TYP MAX NOTE Pin Assignment Matrix A 0.460 0.499 0.538 A1 0.164 - 0.224 A B C D E A2 0.280 0.305 0.330 1 V WP NC CC E Contact Atmel for details 2 SCL A1 e 0.866 3 SDA A2 GND e2 0.500 d 1.000 d2 0.500 D Contact Atmel for details b 0.239 0.269 0.299 4/25/13 TITLE GPC DRAWING NO. REV. 8U-6, 8-ball (3x5 Array) Wafer Level Chip Scale Package Drawing Contact: Package (WLCSP) GHZ 8U-6 B packagedrawings@atmel.com AT24CM01 [DATASHEET] 19 Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

14. Revision History Doc. No. Date Comments Update the ordering information section, part markings, and the 8X and 8S2 package outline 8821F 01/2015 drawings. Update document status from preliminary to complete. 8821E 03/2013 Correct WLCSP pinout. Update footers and disclaimer page. 8812D 01/2013 Correct TSSOP pin label 7 to WP. Add WLCSP package. Update part markings. Update pinout diagram. 8812C 12/2012 Update part markings. Correct Byte Write figure from second typo error to first word address. Update Sequential Read figure. Correct ordering code: 8812B 07/2012 - AT24CM01-WWU-11, Die Sale to AT24CM01-WWU11M, Wafer Sale. Update Atmel logos and disclaimer page. 8812A 05/2012 Initial document release. 20 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015

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