AT24C04C and AT24C08C I2C-Compatible, (2-wire) Serial EEPROM 4-Kbit (512 x 8), 8-Kbit (1024 x 8) DATASHEET Standard Features  Low-voltage and Standard-voltage Operation ̶ V = 1.7V to 5.5V CC  Internally Organized as 512 x 8 (4K), or 1024 x 8 (8K)  I2C-compatible (2-wire) Serial Interface  Schmitt Trigger, Filtered Inputs for Noise Suppression  Bidirectional Data Transfer Protocol  1MHz (2.5V, 2.7V, 5V), 400kHz (1.7V) Compatibility  Write Protect Pin for Hardware Data Protection  16-byte Page Write Mode ̶ Partial Page Writes Allowed  Self-timed Write Cycle (5ms Max)  High-reliability ̶ Endurance: 1,000,000 Write Cycles ̶ Data Retention: 100 Years  Green Package Options (Pb/Halide-free/RoHS Compliant) ̶ 8-lead PDIP, 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 5-lead SOT23, and 8-ball VFBGA  Die Options: Wafer Form and Tape and Reel Description The Atmel® AT24C04C and AT24C08C provides 4,096/8,192 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 512/1024 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. AT24C04C/08C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 5-lead SOT23, and 8-ball VFBGA packages and is accessed via a 2-wire serial interface. Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

1. Pin Configurations and Pinouts Pin Name Function 8-lead PDIP 8-lead SOIC (Top View) (Top View) NC No Connect NC 1 8 VCC NC 1 8 VCC A1 Address Input (4K Only) A1/NC 2 7 WP A1/NC 2 7 WP A2 3 6 SCL A Address Input 2 A2 3 6 SCL GND 4 5 SDA SDA Serial Data GND 4 5 SDA SCL Serial Clock Input 8-lead TSSOP 8-pad UDFN WP Write Protect (Top View) (Top View) GND Ground NC 1 8 VCC NC 1 8 VCC VCC Power Supply AG1/NNADC2 234 765 WSSCDPLA AG1/NNACD2 234 765 WSSCDPLA Notes: 1. For use of 5-lead SOT23, the 5-lead SOT23 8-ball VFBGA software A2 and A1 bits in the (Top View) (Top View) device address word must be set to zero to properly communicate. SCL 1 5 WP 2. Drawings are note to scale. NC 1 8 VCC GND 2 A1/NC 2 7 WP SDA 3 4 VCC A2 3 6 SCL GND 4 5 SDA 2. Absolute Maximum Ratings Operating Temperature . . . . . . . . . . .-55C to +125C *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent Storage Temperature . . . . . . . . . . . . .-65C to +150C damage to the device. This is a stress rating only and functional operation of the device at these or Voltage on any pin any other conditions beyond those indicated in the with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V operational sections of this specification is not implied. Exposure to absolute maximum rating Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V conditions for extended periods may affect device DC Output Current. . . . . . . . . . . . . . . . . . . . . . .5.0mA reliability. 2 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

3. Block Diagram V CC GND WP Start SCL Stop SDA Logic Serial High Voltage Enable Control Pump & Timing Logic Data Latches Device Load COMP Address INC Comparator r Data Word e d Read/Write ADDR/Counter o A c EEPROM 2 e D Array A1 w o R Column Serial MUX Decoder D / ACK OUT Logic D IN D OUT AT24C04C/08C [DATASHEET] 3 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

4. Pin Description Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open-collector devices. Device/Page Addresses (A and A ): The AT24C04C uses the A and A inputs for hard wire addressing 2 1 2 1 allowing a total of four 4K devices to be addressed on a single bus system. Pin 1 is a no connect and can be connected to ground (see Section 7. “Device Addressing” on page 10). The AT24C08C only uses the A input 2 for hardware addressing and a total of two 8K devices may be addressed on a single bus system. The A and A 0 1 pins are no connects and can be connected to ground (see Section 7.). Write Protect (WP): AT24C04C/08C has a Write Protect pin that provides hardware data protection. The Write Protect pin allows normal read/write operations when connected to Ground (GND). When the Write Protect pin is connected to V , the write protection feature is enabled and operates as shown in Table 4-1. CC Table 4-1. Write Protect WP Pin Status Part of the Array Protected At V Full array CC At GND Normal read/write operations 4 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

5. Memory Organization AT24C04C, 4K Serial EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit data word address for random word addressing. AT24C08C, 8K Serial EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit data word address for random word addressing. Table 5-1. Pin Capacitance(1) Applicable over recommended operating range from T = 25°C, f = 1.0MHz, V = +1.7V to +5.5V. A CC Symbol Test Condition Max Units Conditions C Input/Output capacitance (SDA) 8 pF V = 0V I/O I/O C Input capacitance (A , A , A , SCL) 6 pF V = 0V IN 0 1 2 IN Note: 1. This parameter is characterized and is not 100% tested. Table 5-2. DC Characteristics Applicable over recommended operating range from: T = -40°C to +85°C, V = +1.7V to +5.5V (unless otherwise noted). AI CC Symbol Parameter Test Condition Min Typ Max Units V Supply Voltage 1.7 5.5 V CC1 V Supply Voltage 4.5 5.5 V CC2 I Supply Current V = 5.0V Read at 100kHz 0.4 1.0 mA CC CC I Supply Current V = 5.0V Write at 100kHz 2.0 3.0 mA CC CC I Standby Current V = 1.7V V = V or V 1.0 μA SB1 CC IN CC SS I Standby Current V = 5.5V V = V or V 6.0 μA SB2 CC IN CC SS I Input Leakage Current V = V or V 0.10 3.0 μA LI IN CC SS I Output Leakage Current V = V or V 0.05 3.0 μA LO OUT CC SS V Input Low Level(1) -0.6 V x 0.3 V IL CC V Input High Level(1) V x 0.7 V + 0.5 V IH CC CC V Output Low Level V = 3.0V I = 2.1mA 0.4 V OL2 CC OL V Output Low Level V = 1.7V I = 0.15mA 0.2 V OL1 CC OL Note: 1. V min and V max are reference only and are not tested. IL IH AT24C04C/08C [DATASHEET] 5 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

Table 5-3. AC Characteristics Applicable over recommended operating range from T = -40C to +85C, V = +1.7V to +5.5V, CL = 1TTL Gate and 100pF AI CC (unless otherwise noted). 1.7V 2.5V, 2.7V, 5.0V Symbol Parameter Min Max Min Max Units f Clock Frequency, SCL 400 1000 kHz SCL t Clock Pulse Width Low 1.2 0.4 μs LOW t Clock Pulse Width High 0.6 0.4 μs HIGH t Noise Suppression Time 100 50 ns I t Clock Low to Data Out Valid 0.1 0.9 0.05 0.55 μs AA Time the bus must be free before a new t 1.2 0.5 μs BUF transmission can start. t Start Hold Time 0.6 0.25 μs HD.STA t Start Setup Time 0.6 0.25 μs SU.STA t Data In Hold Time 0 0 μs HD.DAT t Data In Setup Time 100 100 ns SU.DAT t Inputs Rise Time(1) 0.3 0.3 μs R t Inputs Fall Time(1) 300 100 ns F t Stop Setup Time 0.6 .25 μs SU.STO t Data Out Hold Time 50 50 ns DH t Write Cycle Time 5 5 ms WR Endurance(1) 3.3V, +25C, Page Mode 1,000,000 Write Cycles Note: 1. This parameter is ensured by characterization only. 6 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

6. Device Operation Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or Stop condition as defined below. Figure 6-1. Data Validity SDA SCL Data Stable Data Stable Data Change Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any other command. Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the Stop command will place the EEPROM in a standby power mode. Figure 6-2. Start and Stop Definition SDA SCL Start Stop AT24C04C/08C [DATASHEET] 7 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. Figure 6-3. Output Acknowledge SCL 1 8 9 DATA IN DATA OUT Start Acknowledge Standby Mode: The Atmel AT24C04/08C features a low-power standby mode which is enabled:  Upon power-up.  After the receipt of the Stop condition and the completion of any internal operations. 2-wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these steps: 1. Create a Start condition (if possible). 2. Clock nine cycles. 3. Create another Start condition followed by Stop condition as shown below. The device should be ready for the next communication after above steps have been completed. In the event that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device. Figure 6-4. Software Reset Dummy Clock Cycles SCL 1 2 3 8 9 Start Start Stop Condition Condition Condition SDA 8 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

Figure 6-5. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O t t HIGH t F R t t SCL LOW LOW t t t t t SU.STA HD.STA HD.DAT SU.DAT SU.STO SDA IN t t t AA DH BUF SDA OUT Figure 6-6. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th bit ACK WORDn (1) t WR Stop Start Condition Condition Notes: 1. The write cycle time t is the time from a valid Stop condition of a write sequence to the end of the internal WR clear/write cycle. AT24C04C/08C [DATASHEET] 9 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

7. Device Addressing Standard EEPROM Access: The 4K and 8K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation. The device address word consists of a mandatory “1010” (0xA) sequence for the first four Most Significant Bits (MSB) as shown in Figure 7-1. This is common to all the EEPROM devices. The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a memory page address bit. The two device address bits must compare to their corresponding hard-wired input pins. The A pin is no 0 connect. The 8K EEPROM only uses the A2 device address bit with the next two bits being for memory page addressing. The A2 address bit must compare to its corresponding hard-wired input pin. The A and A pins are no connect. 1 0 The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. For the SOT23 package offering, the 4K EEPROM software A2 and A1 bits in the device address word must be set to zero to properly communicate. The 8K EEPROM software A2 bit in the device address word must be set to zero to properly communicate. Figure 7-1. Device Address Density Access Area Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 4K EEPROM 1 0 1 0 A A P0 R/W 2 1 8K EEPROM 1 0 1 0 A P1 P0 R/W 2 MSB LSB 10 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

8. Write Operations Byte Write: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a Stop condition. At this time the EEPROM enters an internally timed write cycle, t , to the nonvolatile memory. All inputs are disabled WR during this write cycle and the EEPROM will not respond until the write is complete. Figure 8-1. Byte Write S W T R S A I T R Device T O T Address E Word Address Data P SDA LINE M R A A A S / C C C B W K K K Page Write: The 4K and 8K EEPROM devices are capable of a 16-byte Page Write. A Page Write is initiated in the same way as a Byte Write, but the microcontroller does not send a Stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the Page Write sequence with a Stop condition. The data word address lower four bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than 16 data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. Figure 8-2. Page Write S W T R S A I T R Device T Word O T Address E Address (n) Data (n) Data (n + 1) Data (n + x) P SDA LINE M R A A A A A S / C C C C C B W K K K K K Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled, Acknowledge Polling can be initiated. This involves sending a Start condition followed by the device address word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. AT24C04C/08C [DATASHEET] 11 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

9. Read Operations Read operations are initiated in the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: Current Address Read, Random Address Read, and Sequential Read. Current Address Read: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address roll-over during read is from the last byte of the last memory page to the first byte of the first page. The address roll-over during write is from the last byte of the current page to the first byte of the same page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following stop condition. Figure 9-1. Current Address Read S T R S A E T R Device A O T Address D Data P SDA LINE M R A N S / C O B W K A C K Random Read: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a Current Address Read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition. Figure 9-2. Random Read S W S T R T R S A I A E T R Device T Word R Device A O T Address E Address (n) T Address D Data (n) P SDA LINE M R A A A N S / C C C O B W K K K A C Dummy Write K 12 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address Read. After the microcontroller receives a data word, it responds with an Acknowledge. As long as the EEPROM receives an Acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will roll-over and the Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond with a zero but does generate a following Stop condition. Figure 9-3. Sequential Read R S E T Device A O Address D Data (n) Data (n + 1) Data (n + 2) Data (n + x) P SDA LINE R A A A A N / C C C C O WK K K K A C K AT24C04C/08C [DATASHEET] 13 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

10. Ordering Code Detail A T 2 4 C 0 4 C - S S H M - B Atmel Designator Shipping Carrier Option B or blank = Bulk (Tubes) T = Tape and Reel, Standard Quantity Option E = Tape and Reel, Expanded Quantity Option Product Family 24C = Standard Serial EEPROM Operating Voltage M = 1.7V to 5.5V Device Density Package Device Grade or 04 = 4K Wafer/Die Thickness 08 = 8K H = Green, NiPdAu Lead Finish, Industrial Temperature Range Device Revision (-40˚C to +85˚C) U = Green, Matte Sn Lead Finish, Industrial Temperature Range (-40˚C to +85˚C) 11 = 11mil Wafer Thickness Package Option P = PDIP SS = JEDEC SOIC X = TSSOP MA = UDFN ST = SOT23 C = VFBGA WWU = Wafer Unsawn 14 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

11. Product Markings AT24C04C and AT24C08C: Package Marking Information 8-lead PDIP 8-lead SOIC 8-lead TSSOP ATMLUYWW ATMLHYWW ATHYWW ###% @ ###% @ ###% @ AAAAAAAA AAAAAAAA AAAAAAA 8-pad UDFN 5-lead SOT-23 8-ball VFBGA 2.0 x 3.0 mm Body 1.5 x 2.0 mm Body ### ##@%U H%@ ###U YMXX YMXX YXX PIN 1 Note 1: designates pin 1 Note 2: Package drawings are not to scale Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly (@) mark on the top line. Catalog Number Truncation AT24C04C Truncation Code ###: 04C / ##: 4C AT24C08C Truncation Code ###: 08C / ##: 8C Date Codes V oltages Y = Year M = Month WW = Work Week of Assembly % = Minimum Voltage 6: 2016 0: 2020 A: January 02: Week 2 M: 1.7V min 7: 2017 1: 2021 B: February 04: Week 4 8: 2018 2: 2022 ... ... 9: 2019 3: 2023 L: December 52: Week 52 Country of Assembly Lot Number Grade/Lead Finish Material @ = Country of Assembly AAA...A = Atmel Wafer Lot Number U: Industrial/Matte Tin/SnAgCu H: Industrial/NiPdAu Trace Code Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel Example: AA, AB.... YZ, ZZ ATM: Atmel ATML: Atmel 12/7/16 TITLE DRAWING NO. REV. Package Mark Contact: 24C04-08CSM, AT24C04C and AT24C08C Package Marking 24C04-08CSM C DL-CSO-Assy_eng@atmel.com Information AT24C04C/08C [DATASHEET] 15 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

12. Ordering Information Delivery Information Operation Atmel Ordering Code Lead Finish Package Form Quantity Range AT24C04C-SSHM-B Bulk (Tubes) 100 per Tube 8S1 AT24C04C-SSHM-T Tape and Reel 4,000 per Reel AT24C04C-XHM-B Bulk (Tubes) 100 per Tube NiPdAu 8X (Lead-free/Halogen-free) AT24C04C-XHM-T Tape and Reel 5,000 per Reel AT24C04C-MAHM-T Tape and Reel 5,000 per Reel Industrial 8MA2 Temperature AT24C04C-MAHM-E Tape and Reel 15,000 per Reel (-40C to 85C) AT24C04C-PUM 8P3 Bulk (Tubes) 50 per Tube Matte Tin (Lead-free/Halogen-free) AT24C04C-STUM-T 5TS1 Tape and Reel 5,000 per Reel SnAgCu Ball AT24C04C-CUM-T 8U3-1 Tape and Reel 5,000 per Reel (Lead-free/Halogen-free) AT24C04C-WWU11M(1) N/A Wafer Sale Note 1 AT24C08C-SSHM-B Bulk (Tubes) 100 per Tube 8S1 AT24C08C-SSHM-T Tape and Reel 4,000 per Reel AT24C08C-XHM-B Bulk (Tubes) 100 per Tube NiPdAu 8X (Lead-free/Halogen-free) AT24C08C-XHM-T Tape and Reel 5,000 per Reel AT24C08C-MAHM-T Tape and Reel 5,000 per Reel Industrial 8MA2 Temperature AT24C08C-MAHM-E Tape and Reel 15,000 per Reel (-40C to 85C) AT24C08C-PUM 8P3 Bulk (Tubes) 50 per Tube Matte Tin (Lead-free/Halogen-free) AT24C08C-STUM-T 5TS1 Tape and Reel 5,000 per Reel SnAgCu Ball AT24C08C-CUM-T 8U3-1 Tape and Reel 5,000 per Reel (Lead-free/Halogen-free) AT24C08C-WWU11M(1) N/A Wafer Sale Note 1 Note: 1. For Wafer sales, please contact Atmel Sales. Package Type 8P3 8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP) 8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN) 5TS1 5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23) 8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA) 16 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

13. Packaging Information 13.1 8P3 — 8-lead PDIP E 1 E1 .381 Gage Plane N Top View c eA End View COMMON DIMENSIONS D (Unit of Measure = mm) e D1 A2 A SYMBOL MIN NOM MAX NOTE A - - 5.334 2 A1 0.381 - - A2 2.921 3.302 4.953 b 0.356 0.457 0.559 5 b2 1.143 1.524 1.778 6 A1 b3 0.762 0.991 1.143 6 c 0.203 0.254 0.356 b2 L D 9.017 9.271 10.160 3 b3 D1 0.127 0.000 0.000 3 4 PLCS b v 0.254m C E 7.620 7.874 8.255 4 E1 6.096 6.350 7.112 3 Side View e 2.540 BSC eA 7.620 BSC 4 L 2.921 3.302 3.810 2 Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 07/31/14 TITLE GPC DRAWING NO. REV. 8P3, 8-lead, 0.300” Wide Body, Plastic Dual Package Drawing Contact: In-line Package (PDIP) PTC 8P3 E packagedrawings@atmel.com AT24C04C/08C [DATASHEET] 17 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

13.2 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b A COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A1 A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 D E1 3.81 – 3.99 E 5.79 – 6.20 SIDE VIEW e 1.27 BSC Notes: This drawing is for general information only. L 0.40 – 1.27 Refer to JEDEC Drawing MS-012, Variation AA ØØ 0° – 8° for proper dimensions, tolerances, datums, etc. 6/22/11 TITLE GPC DRAWING NO. REV. 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing SWB 8S1 G Package Drawing Contact: Small Outline (JEDEC SOIC) packagedrawings@atmel.com 18 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

13.3 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 COMMON DIMENSIONS e A2 (Unit of Measure = mm) D SYMBOL MIN NOM MAX NOTE Side View A - - 1.20 A1 0.05 - 0.15 Notes: 1. This drawing is for general information only. A2 0.80 1.00 1.05 Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. D 2.90 3.00 3.10 2, 5 2. Dimension D does not include mold Flash, protrusions or gate E 6.40 BSC burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. E1 4.30 4.40 4.50 3, 5 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm b 0.19 0.25 0.30 4 (0.010in) per side. e 0.65 BSC 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess L 0.45 0.60 0.75 of the b dimension at maximum material condition. Dambar L1 1.00 REF cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. C 0.09 - 0.20 5. Dimension D and E1 to be determined at Datum Plane H. 2/27/14 TITLE GPC DRAWING NO. REV. 8X, 8-lead 4.4mm Body, Plastic Thin Package Drawing Contact: Shrink Small Outline Package (TSSOP) TNR 8X E packagedrawings@atmel.com AT24C04C/08C [DATASHEET] 19 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

13.4 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 D 3 6 4 5 TOP VIEW C SIDE VIEW A2 A A1 E2 b (8x) 8 1 COMMON DIMENSIONS 7 2 Pin#1 ID (Unit of Measure = mm) D2 6 3 SYMBOL MIN NOM MAX NOTE A 0.50 0.55 0.60 5 4 A1 0.0 0.02 0.05 e (6x) A2 - - 0.55 L (8x) K D 1.90 2.00 2.10 BOTTOM VIEW D2 1.40 1.50 1.60 Notes: 1. This drawing is for general information only. Refer to E 2.90 3.00 3.10 Drawing MO-229, for proper dimensions, tolerances, E2 1.20 1.30 1.40 datums, etc. 2. The Pin #1 ID is a laser-marked feature on Top View. b 0.18 0.25 0.30 3 3. Dimensions b applies to metallized terminal and is C 1.52 REF measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on L 0.30 0.35 0.40 the other end of the terminal, the dimension should e 0.50 BSC not be measured in that radius area. 4. The Pin #1 ID on the Bottom View is an orientation K 0.20 - - feature on the thermal pad. 11/26/14 TITLE GPC DRAWING NO. REV. 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally Package Drawing Contact: Enhanced Plastic Ultra Thin Dual Flat No-Lead YNZ 8MA2 G packagedrawings@atmel.com Package (UDFN) 20 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

13.5 5TS1 — 5-lead SOT23 e1 5 4 C E1 E CL L1 1 2 3 TOP VIEW END VIEW b A2 A SEATING PLANE e A1 D SIDE VIEW COMMON DIMENSIONS (Unit of Measure = mm) 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does SYMBOL MIN NOM MAX NOTE not include interlead flash or protrusion. Interlead flash or protrusion shall not A - - 1.00 exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 A1 0.00 - 0.10 are determined at the outermost extremes of the plastic body exclusive of mold A2 0.70 0.90 1.00 flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. c 0.08 - 0.20 3 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 D 2.90 BSC 1,2 mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion E 2.80 BSC 1,2 shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum E1 1.60 BSC 1,2 space between protrusion and an adjacent lead shall not be less than 0.07 mm. L1 0.60 REF e 0.95 BSC e1 1.90 BSC This drawing is for general information only. Refer to JEDEC b 0.30 - 0.50 3,4 Drawing MO-193, Variation AB for additional information. 5/31/12 TITLE GPC DRAWING NO. REV. 5TS1, 5-lead 1.60mm Body, Plastic Thin Package Drawing Contact: Shrink Small Outline Package (Shrink SOT) TSZ 5TS1 D packagedrawings@atmel.com AT24C04C/08C [DATASHEET] 21 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

13.6 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 1 2 3 4 d (d1) 8 7 6 5 e COMMON DIMENSIONS (Unit of Measure - mm) (e1) SYMBOL MIN NOM MAX NOTE BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 2 1. This drawing is for general information only. D 1.50 BSC E 2.0 BSC 2. Dimension ‘b’ is measured at maximum solder ball diameter. e 0.50 BSC 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/11/13 TITLE GPC DRAWING NO. REV. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Package Drawing Contact: Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 F packagedrawings@atmel.com 22 AT24C04C/08C [DATASHEET] Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

14. Revision History Doc. Rev. Date Comments Part marking SOT23: 8787F 12/2016 - Moved backside mark (YMXX) to front side line2. - Added @ = Country of Assembly. Add the UDFN expanded quantity options and update the ordering information section. 8787E 01/2015 No change in functional or electrical specification. Update the 8P3, 8X, 8MA2, and 8U3-1 package outline drawings and the disclaimer page. In the Page Write description, correct from eight to 16 data words. 8787D 04/2013 Update ordering code table, footers, and disclaimer page. Correct ordering codes: - AT24C04C-WWU11, Die Sale to AT24C04C-WWU11M, Wafer Sale. - AT24C08C-WWU11, Die Sale to AT24C08C-WWU11M, Wafer Sale. 8787C 07/2012 Remove WDT from ordering code detail. Update Atmel logos and disclaimer page. Remove preliminary status. Remove A signal from the block diagram. 0 I parameter measured at 5.5V. SB2 In AC Characteristics table, changed 1.7V, 2.5V, 2.7V to 1.7 and 5.0V to 2.5V, 2.7V, 5.0V. Increase t maximum value from 50ns to 100ns. I 8787B 05/2012 Endurance parameter is studied at 3.3V, to +25C, Page mode. Remove Serial Number Read from read operations. Update product markings. Update 8X and 8U3-1 package drawings. Update template. 8787A 10/2011 Initial document release. AT24C04C/08C [DATASHEET] 23 Atmel-8787F-SEEPROM-AT24C04C-08C-Datasheet_122016

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