AP2501/AP2511 Green 2.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2501 and AP2511 are single channel current-limited integrated high-side power switches optimized for Universal Serial (Top View) ((T Toopp VViieeww )) Bus (USB) and other hot-swap applications. The family of devices GND 1 8 NC complies with USB standards and is available with both polarities of Enable input. IN 2 7 OUT The devices have fast short-circuit response time for improved IN 3 6 OUT overall system robustness, and have integrated output discharge EN 4 5 FLG function to ensure completely controlled discharging of the output U-DFN3030-8 (Type E) voltage capacitor. They provide a complete protection solution for SSOO--88 applications subject to heavy capacitive loads and the prospect of (Top View) (Top View) short circuit, and offer reverse current blocking, over-current, over- temperature and short-circuit protection, as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. All devices are available in SO-8, MSOP-8, MSOP-8EP, MSOP-8 /MSOP-8EP U-DFN2020-6 Note: latter with exposed pad U-DFN3030-8 (Type E) and U-DFN2020-6 packages. (dotted line) Features Applications  Single Channel Current-limited Power Switch  Output Discharge Function  LCD TVs & Monitors  Fast Short-circuit Response Time: 2µs  Set-Top-Boxes, Residential Gateways  3.7A Accurate Current Limiting (Typ)  Laptops, Desktops, Servers, e-Readers  Reverse Current Blocking  Printers, Docking Stations, HUBs  70mΩ On-resistance (Typ)  Input Voltage Range: 2.7V to 5.5V  Built-in Soft-start with 0.6ms Typical Rise Time  Over-current and Thermal Protection  Fault Report (FLG) with Blanking Time (7ms Typ)  ESD Protection: 2kV HBM, 200V MM  Active Low (AP2501) or Active High (AP2511) Enable  Ambient Temperature Range: -40°C to +85°C  SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 (Type E) and U-DFN2020-6: Available in “Green” Molding Compound (No Br, Sb)  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  UL Recognized, File Number E322375  IEC60950-1 CB Scheme Certified Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2501/AP2511 1 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Typical Applications Circuit Enable Active High (AP2511) Power Supply IN OUT Load 2.7V to 5.5V 10k 0.1µF 0.1µF 120µF FLG EN GND ON OFF Available Options Enable Pin Recommended Maximum Typical Current Limit Part Number Channel Package (EN) Continuous Load Current (A) (A) SO-8 AP2501 1 Active Low MSOP-8 2.5A 3.7A MSOP-8EP U-DFN3030-8 (Type E) AP2511 1 Active High U-DFN2020-6 Pin Descriptions Pin Number MSOP-8EP, Pin Name SO-8, Function U-DFN3030-8 U-DFN2020-6 MSOP-8 (Type E) GND 1 1 2 Ground Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to IN 2, 3 2, 3 1 GND as close as possible. (all IN pins must be tied together externally) EN 4 4 3 Enable Input. Active low (AP2501) or active high (AP2511). Over-temperature and over-current fault reporting with 7ms deglitch; active FLG 5 5 4 low open-drain output. FLG is disabled for 7ms after turn-on. OUT 6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally) NC 8 8 6 No internal connection; recommend tie to OUT pins. Exposed pad. It should be externally connected to GND and thermal mass for Exposed Pad Exposed Pad Not Applicable Exposed Pad enhanced thermal impedance. It should not be used as electrical ground conduction path. AP2501/AP2511 2 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Functional Block Diagram Current IN OUT Sense UVLO Discharge Control Current Driver EN Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit ESD HBM Human Body Model ESD Protection 2 kV ESD MM Machine Model ESD Protection 200 V VIN Input Voltage (Note 4) -0.3 to +6.5 V VOUT Output Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V VEN , VFLG Enable Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V ILOAD Maximum Continuous Load Current Internal Limited A TJMAX Maximum Junction Temperature +150 °C TST Storage Temperature Range (Note 5) -65 to +150 °C Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V. 5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input Voltage 2.7 5.5 V IOUT Output Current 0 2.5 A VIH High-Level Input Voltage on EN 2.0 VIN V VIL Low-Level Input Voltage on EN 0 0.8 V TA Operating Ambient Temperature (Note 6) -40 +85 °C Note: 6. TA(MAX) = +70°C if VIN ≤ 4.1V and IOUT = 2.5A to keep device from going into thermal protection. AP2501/AP2511 3 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Electrical Characteristics (@ TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.) Symbol Parameter Conditions (Note 7) Min Typ Max Unit VUVLO Input UVLO VIN Rising 1.6 2.0 2.4 V ΔVUVLO Input UVLO Hysteresis VIN Decreasing – 50 – mV ISHDN Input Shutdown Current Disabled, OUT = Open – 0.1 1.0 µA IQ Input Quiescent Current Enabled, OUT = Open – 60 100 µA ILEAK Input Leakage Current Disabled, OUT Grounded – 0.1 1.0 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN – 0.01 1.00 µA TA = +25oC – 70 78 VIN = 5V, IOUT = 1A -40°C ≤ TA ≤ +85°C – – 105 RDS(ON) Switch On-resistance TA = +25oC – 90 108 mΩ VIN = 3.3V, IOUT = 1A -40°C ≤ TA ≤ +85°C – – 135 ILIMIT Over-Load Current Limit (Note 7) VIN = 5V, VOUT = 4.5V -40°C ≤ TA ≤ +85°C 2.8 3.7 4.6 A ITRIG Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s) – 3.7 – A ISHORT Short-Circuit Current Limit Enabled into Short Circuit – 3.7 – A tSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (OUT Shorted to Ground) – 2 – µs VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V – – 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 – – V ILEAK-EN EN Input Leakage VIN = 5V, VEN = 0V and 5.5V – 0.01 1.00 µA ILEAK-O Output Leakage Current Disabled, VOUT = 0V – 0.5 1 µA tD(ON) Output Turn-on Delay Time CL = 1µF, RLOAD = 5Ω – 0.1 – ms tR Output Turn-on Rise Time CL = 1µF, RLOAD = 5Ω – 0.6 1.5 ms tD(OFF) Output Turn-off Delay Time CL = 1µF, RLOAD = 5Ω – 0.1 – ms tF Output Turn-off Fall Time CL = 1µF, RLOAD = 5Ω – 0.05 0.10 ms RFLG FLG Output FET On-resistance IFLG = 10mA – 20 40 Ω IFOH FLG Off Current VFLG = 5V – 0.01 1.00 µA Assertion or deassertion due to overcurrent and tBLANK FLG Blanking Time over-temperature condition 4 7 15 ms tDIS Discharge Time CL = 1µF, VIN = 5V, Disabled to VOUT < 0.5V – 0.6 – ms RDIS Discharge Resistance (Note 8) VIN = 5V, Disabled, IOUT = 1mA – 100 – Ω TSHDN Thermal Shutdown Threshold Enabled – +140 C THYS Thermal Shutdown Hysteresis – – +20 – C SO-8 (Note 9) – 96 – C/W MSOP-8 (Note 9) – 130 – C/W Thermal Resistance Junction-to- θJA Ambient MSOP-8EP (Note 10) – 92 – C/W U-DFN3030-8 (Type E) (Note 10) – 84 – C/W U-DFN2020-6 (Note 11) – 90 – C/W Notes: 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time. 9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 10. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 11. Device mounted on 1" x 1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground. AP2501/AP2511 4 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Typical Performance Characteristics V V EN 50% 50% EN 50% 50% t t t D(OFF) t D(OFF) R R t t F F t t D(ON) 90% 90% D(ON) 90% 90% V V OUT OUT 10% 10% 10% 10% Figure 1. Voltage Waveforms: AP2501 (Left), AP2511 (Right) All Enable Plots are for Enable Active Low Turn-On Delay and Rise Time Turn-Off Delay and Fall Time TA=25°C V2VO/UdTi v TVAIN==255V°C V2VO/UdTi v VCILN==15µVF CL=1µF ROUT=2.5Ω VEN ROUT=2.5Ω VEN 5V/div 5V/div Device Enable Device Disable IIN IIN 1A/div 1A/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time V2VO/UdTi v TVCRAILON==U=21T552=V°02C µ.5 FΩ V2VVOEN/Ud Ti v TVCRAILON==U=21T552=V°02C µ.5 FΩ 5V/div Device Enable VEN Device Disable 5V/div IIN IIN 1A/div 1A/div AP2501/AP2511 5 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Typical Performance Characteristics (Cont.) Device Enabled Into Short-Circuit Inrush Current TA=25°C TA=25°C VEN VIN=5V VEN VIN=5V 5V/div CL=120µF 5V/div CL=120µF,220µF,470µF ROUT=1Ω CL=470µF ROUT=2.5Ω CL=220µF I1INA /div I1INA /div CL=120µF Full-Load to Short-Circuit Short-Circuit to Full-Load Transient Response Recovery Response TA=25°C Output Short Circuit Removed Output Short Circuit VIN=5V V2VO/UdTi v ROUT=2Ω TA=25°C VOUT VIN=5V 2V/div ROUT=2Ω IIN Device Turns off and Re-enables 2A/div Into Current-Limit IIN Short Circuit Present Device FLG 2A/div Thermal Cycles 5V/div FLG 5V/div No-Load to Short-Circuit Short-Circuit to No-Load Transient Response Recovery Response V2VO/UdTi v TA=25°C Output Short Circuit Removed Output Short Circuit VIN=5V VOUT 2V/div TA=25°C VIN=5V Device Enable Current-Limit IIN 2A/div IIN 2A/div Short Circuit Present Device FLG FLG Thermal Cycles 5V/div 5V/div AP2501/AP2511 6 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Typical Performance Characteristics (Cont.) Power ON Short-Circuit with Blanking Time and Recovery FLG 5V/div TA=25°C FLG TA=25°C VIN=5V 5V/div VIN=5V ROUT=2.5Ω I1OAU/Td iv CL=120µF VOUT 5V/div VOUT 5V/div IOUT 2A/div VIN 5V/div UVLO Increasing UVLO Decreasing VOUT 2V/div TA=25°C TA=25°C VIN=5V VIN=5V V2VO/UdTi v RCOL=U1T2=03µ3FΩ V2VIN/ div RCOL=U1T2=03µ3FΩ VIN 2V/div AP2501/AP2511 7 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Typical Performance Characteristics (Cont.) 150 200 111342000 118600 CRT A LL === 152µ 5F° C TURN-ON TIME (µs) TURN-NTM()O IE µs 111234567890100000000000 CRTA LL === 152µ 5F° C TURN-OFF TIME (µs) TURN-OFF TIME (µs) 11186424200000000 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Turn-On Time vs. Input Voltage Turn-Off Time vs. Input Voltage 1000 100 980000 9800 CRT A LL = == 1 25µ5 F° C TURN-ON TIME (µs) TURN-NTM()O IE µs 765432100000000000000 CRTA LL === 152µ 5F° C FALL TIME (µs) FTM()ALL IE µs 76543210000000 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 INPINUPTU VTO VLOTLATGAEG (EV )( V) INPUT VOLTAGE (V) T urnT-uornn T-oimn eT ivmse. Ivnsp.u Itn Vpuotlt aVgoelt age Fall Time vs. Input Voltage D (µA) 19000 VIN = 5.5V D (µA) 00..2350 ABLE 80 VIN = 5V ABLE 00..1250 VIN = 5.5V T EN 70 T DIS 0.10 VIN = 5V U 60 U 0.05 P P UT 50 VIN = 2.7V UT 0.00 NT O 40 VIN =3.3V NT O -0.05 VIN = 2.7VVIN =3.3V RE 30 RE -0.10 R R U U -0.15 C 20 C Y Y -0.20 L L P 10 P -0.25 P P U U S 0 S -0.30 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Supply Current, Output Enabled vs. Temperature Supply Current, Output Disabled vs. Temperature AP2501/AP2511 8 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Typical Performance Characteristics (Cont.) 180 4.5 170 A) 4.4 160 NT( 4.3 115400 VIN = 2.7V RE 4.2 VIN =3.3V VIN = 2.7V 130 UR 4.1 ) 120 VIN =3.3V T C 4.0 m 110 U 3.9 (S(ON)1980000 OUTP 33..87 VIN = 5V VIN = 5.5V RD 70 UIT 3.6 60 VIN = 5.5V RC 3.5 5400 VIN = 5V T-CI 33.34 30 R 20 HO 3.2 10 S 3.1 0 3.0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) RDS(ON) vs. Temperature Short-Circuit Output Current vs. Temperature 2.2 4.5 GE LOCKOUT (V) 221...109 UVLO Rising RIP CURRENT (A) TRIP CURRENT(A) 44444.....34210 CTA L == 12250°µCF UNDERVOLTA 11..87 UVLO Falling THRESHOLD TTHRESHOLD 3333....8769 1.6-50 -25 0 25 50 75 100 125 3.52.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 TEMPERATURE (C) INPUT VOLTAGE (V) Undervoltage Lockout vs. Temperature Threshold Trip Current vs. Input Voltage AP2501/AP2511 9 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Application Note Power Supply Considerations A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device to short circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2501/AP2511 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2501/AP2511 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7ms deglitch timeout. The AP2501/AP2511 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON) × I2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2501/AP2511 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +20°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7ms deglitch. AP2501/AP2511 10 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Application Note (Cont.) Under-voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output. Dual-Purpose Port Applications The AP2501/AP2511 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a non- recommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2501/AP2511 includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2501/AP2511 is disabled. An overstress condition to the device's discharge MOS transistor may result. In addition, if the output of the AP2501/AP2511 is subjected to a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device may result. Ordering Information AP25X1XXX-XX Product Name Enable Channel Package Packing 0 : Active Low 1 : 1 Channel S : SO-8 7 : 7" Tape & Reel 1 : Active High M8 : MSOP-8 13 : 13" Tape & Reel MP : MSOP-8EP FGE : U-DFN3030-8 (Type E) SN : U-DFN2020-6 7”/13” Tape and Reel Part Number Package Code Packaging Quantity Part Number Suffix AP25X1S-13 S SO-8 2500/Tape & Reel -13 AP25X1M8-13 M8 MSOP-8 2500/Tape & Reel -13 AP25X1MP-13 MP MSOP-8EP 2500/Tape & Reel -13 AP25X1FGE-7 FGE U-DFN3030-8 (Type E) 3000/Tape & Reel -7 AP25X1SN-7 SN U-DFN2020-6 3000/Tape & Reel -7 Marking Information (1) SO-8 AP2501/AP2511 11 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Marking Information (Cont.) (2) MSOP-8 (3) MSOP-8EP (4) U-DFN3030-8 (Type E) ( Top View ) XX : Identification Code XX Y : Year : 0~9 W : Week : A~Z : 1~26 week; YWX a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Part Number Package Identification Code AP2501FGE-7 U-DFN3030-8 (Type E) BP AP2511FGE-7 U-DFN3030-8 (Type E) BR (5) U-DFN2020-6 ( Top View ) XX : Identification Code XX Y : Year : 0~9 W : Week : A~Z : 1~26 week; YWX a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Part Number Package Identification Code AP2501SN-7 U-DFN2020-6 DP AP2511SN-7 U-DFN2020-6 DR AP2501/AP2511 12 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SO-8 SO-8 Dim Min Max A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h - 0.35 L 0.62 0.82  0 8 All Dimensions in mm (2) Package Type: MSOP-8 D MSOP-8 Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 4x10 A2 0.75 0.95 0.86 ° 0.25 A3 0.29 0.49 0.39 x E Gauge Plane b 0.22 0.38 0.30 Seating Plane c 0.08 0.23 0.15 y a D 2.90 3.10 3.00 L E 4.70 5.10 4.90 4x10° E1 2.90 3.10 3.00 Detail C E3 2.85 3.05 2.95 1 b e - - 0.65 E3 A3 L 0.40 0.80 0.60 a 0° 8° 4° A2 A x - - 0.750 e y - - 0.750 A1 E1 c All Dimensions in mm See Detail C AP2501/AP2511 13 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Package Outline Dimensions (Cont.) Please see http://www.diodes.com/package-outlines.html for the latest version. (3) Package Type: MSOP-8EP MSOP-8EP D Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 D1 4X10° A3 0.29 0.49 0.39 x 5 b 0.22 0.38 0.30 2 E E2 0. c 0.08 0.23 0.15 Gauge Plane D 2.90 3.10 3.00 y Seating Plane a D1 1.60 2.00 1.80 E 4.70 5.10 4.90 1 e 8Xb 4X10° L EE12 21..9300 31..1700 31..0500 E3 Detail C E3 2.85 3.05 2.95 A1 A3 e - - 0.65 c A A2 L 0.40 0.80 0.60 a 0° 8° 4° D E1 x - - 0.750 See Detail C y - - 0.750 All Dimensions in mm (4) Package Type: U-DFN3030-8 (Type E) A A3 U-DFN3030-8 A1 Type E Dim Min Max Typ D A 0.57 0.63 0.60 D2 A1 0 0.05 0.02 A3   0.15 L (x8) b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.15 2.35 2.25 E E2 E 2.95 3.05 3.00 e   0.65 E2 1.40 1.60 1.50 L 0.30 0.60 0.45 Z   0.40 Z (x4) e b (x8) All Dimensions in mm (5) Package Type: U-DFN2020-6 A1 A3 U-DFN2020-6 A Dim Min Max Typ Seating Plane A 0.57 0.63 0.60 A1 0 0.05 0.03 D A3 - - 0.15 D2 b 0.20 0.30 0.25 D2/2 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 R0.100 e - - 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 E2/2 EE2 L 0.30 0.40 0.35 Pin #1 ID All Dimensions in mm L e b AP2501/AP2511 14 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SO-8 X Dimensions Value (in mm) X 0.60 C1 Y 1.55 C1 5.4 C2 1.27 C2 Y (2) Package Type: MSOP-8 X C Y Dimensions Value (in mm) Y1 C 0.650 X 0.450 Y 1.350 Y1 5.300 (3) Package Type: MSOP-8EP X C Value Dimensions (in mm) G Y C 0.650 G 0.450 X 0.450 X1 2.000 Y 1.350 Y2 Y1 Y1 1.700 X1 Y2 5.300 AP2501/AP2511 15 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Suggested Pad Layout (Cont.) Please see http://www.diodes.com/package-outlines.html for the latest version. (4) Package Type: U-DFN3030-8 (Type E) X (x8) C Y (x8) Dimensions Value (in mm) C 0.65 Y1 Y2 C1 2.35 X 0.30 Y 0.65 Y1 1.60 Y2 2.75 C1 (5) Package Type: U-DFN2020-6 X C G Y Value Dimensions (in mm) C 0.65 Y1 G 0.15 X 0.37 X1 1.67 Y 0.45 Y1 0.90 G X X1 AP2501/AP2511 16 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 Taping Orientation (Note 12) For U-DFN2020-6 and U-DFN3030-8 (Type E) Note: 12. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf. AP2501/AP2511 17 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

AP2501/AP2511 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2016, Diodes Incorporated www.diodes.com AP2501/AP2511 18 of 18 May 2016 Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: D iodes Incorporated: AP2501FGE-7 AP2511M8-13 AP2501S-13 AP2511MP-13 AP2501M8-13 AP2511FGE-7 AP2501MP-13 AP2511S-13 AP2511SN-7 AP2501SN-7