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  • 型号: AP2191DM8G-13
  • 制造商: Diodes Inc.
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AP2191DM8G-13产品简介:

ICGOO电子元器件商城为您提供AP2191DM8G-13由Diodes Inc.设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 AP2191DM8G-13价格参考。Diodes Inc.AP2191DM8G-13封装/规格:PMIC - 配电开关,负载驱动器, 。您可以下载AP2191DM8G-13参考资料、Datasheet数据手册功能说明书,资料中有AP2191DM8G-13 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)

描述

IC PWR SW USB MSOP-8

产品分类

PMIC - 电源分配开关

品牌

Diodes Incorporated

数据手册

点击此处下载产品Datasheet

产品图片

产品型号

AP2191DM8G-13

Rds(On)

115 毫欧

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

RoHS指令信息

http://diodes.com/download/4349

产品系列

-

供应商器件封装

8-MSOP

其它名称

AP2191DM8G-13DICT

内部开关

包装

剪切带 (CT)

安装类型

表面贴装

封装/外壳

8-TSSOP,8-MSOP(0.118",3.00mm 宽)

工作温度

-40°C ~ 85°C

标准包装

1

电压-输入

2.7 V ~ 5.5 V

电流限制

2.1A

类型

USB 开关

输出数

1

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PDF Datasheet 数据手册内容提取

Green AP2181D/AP2191D 1.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH WITH OUTPUT DISCHARGE Description Pin Assignments The AP2181D and AP2191D are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap ( Top View ) applications. The family of devices complies with USB 2.0 and is GND 1 8 NC available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise IN 2 7 OUT time and undervoltage lockout functionality. A 7ms deglitch capability on the open-drain flag output prevents false overcurrent reporting and IN 3 6 OUT does not require any external components. EN 4 5 FLG All devices are available in SO-8, MSOP-8, MSOP-8EP, SOT25, and SO-8 U-DFN2018-6 packages. ( Top View ) Features GND 1 8 NC • Single USB Port Power Switches with Output Discharge IN 2 7 OUT • Overcurrent and Thermal Protection • 2.1A Accurate Current Limiting IN 3 6 OUT • Fast Transient Response EN 4 5 FLG • Reverse Current Blocking MSOP-8 / MSOP-8EP • 90mΩ On-Resistance Note: Latter with Exposed Pad • Input Voltage Range: 2.7V – 5.5V (Dotted Line) • 0.6ms Typical Rise Time • Very Low Shutdown Current: 1µA (max) ( Top View ) • Fault Report (FLG) with Blanking Time (7ms typ) • ESD Protection: 4kV HBM, 300V MM OUT 1 5 IN • Active High (AP2191D) or Active Low (AP2181D) Enable GND 2 • Ambient Temperature Range -40°C to +85°C • SOT25, SO-8, MSOP-8, MSOP-8EP (Exposed Pad), and FLG 3 4 EN U-DFN2018-6: Available in “Green” Molding Compound • (No Br, Sb) SOT25 • Lead-Free Finish; RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) ( Top View ) • UL Recognized, File Number E322375 GND 1 6 OUT • IEC60950-1 CB Scheme Certified IN 2 5 OUT Applications EN 3 4 FLG • Consumer Electronics – LCD TVs & Monitors, Game Machines U-DFN2018-6 • Communications – Set-Top-Boxes, GPS, Smartphones • Computing – Laptops, Desktops, Servers, Printers, Docking Stations, HUBs Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2181D/AP2191D 1 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Typical Applications Circuit AAAAPPPP2222111199991111DDDD EEEEnnnnaaaabbbblllleeee AAAAccccttttiiiivvvveeee HHHHiiiigggghhhh PPPPoooowwwweeeerrrr SSSSuuuuppppppppllllyyyy IIIINNNN OOOOUUUUTTTT LLLLooooaaaadddd 2222....7777VVVV ttttoooo 5555....5555VVVV 11110000kkkk 11110000uuuuFFFF 0000....1111uuuuFFFF 0000....1111uuuuFFFF 111122220000uuuuFFFF FFFFLLLLGGGG OOOONNNN EEEENNNN GGGGNNNNDDDD OOOOFFFFFFFF Available Options Enable Pin Current Limit Recommended Maximum Part Number Channel (EN) (Typical) Continuous Load Current AP2181D 1 Active Low 2.1A 1.5A AP2191D 1 Active High 2.1A 1.5A Pin Descriptions Pin Number Pin SO-8 Functions Name MSOP-8EP SOT25 U-DFN2018-6 MSOP-8 GND 1 1 2 1 Ground IN 2, 3 2, 3 5 2 Voltage input pin (all IN pins must be tied together externally) EN 4 4 4 3 Enable input, active low (AP2181D) or active high (AP2191D) Overcurrent and over-temperature fault report; open-drain flag is active low when FLG 5 5 3 4 triggered OUT 6, 7 6, 7 1 5, 6 Voltage output pin (all OUT pins must be tied together externally) NC 8 8 N/A N/A No internal connection; recommend tie to OUT pins Exposed pad. It should be connected to GND and thermal mass for enhanced thermal Exposed tab — Exposed tab — Exposed tab impedance. It should not be used as electrical ground conduction path. AP2181D/AP2191D 2 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Functional Block Diagram Current IN OUT Sense UVLO Discharge Control Current EN Driver Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Ratings Unit ESD HBM Human Body Model ESD Protection 4 kV ESD MM Machine Model ESD Protection 300 V VIN Input Voltage 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V ILOAD Maximum Continuous Load Current Internal Limited A TJMAX Maximum Junction Temperature 150 °C TST Storage Temperature Range (Note 4) -65 to +150 °C Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input Voltage 2.7 5.5 V IOUT Output Current 0 1.5 A VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2 VIN V TA Operating Ambient Temperature -40 +85 °C AP2181D/AP2191D 3 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit VUVLO Input UVLO — 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 — 0.5 1 µA IQ Input Quiescent Current Enabled, IOUT = 0 — 45 70 µA ILEAK Input Leakage Current Disabled, OUT grounded — 0.1 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 0.1 1 µA SOT25, MSOP-8, SO-8, — 95 115 VIN = 5V, TA = +25°C MSOP-8-EP IOUT = 1.5A U-DFN2018-6 — 90 110 RDS(ON) Switch On-Resistance -40°C ≤ TA ≤ +85°C — — 140 mΩ VIN = 3.3V, TA = +25°C — 120 140 IOUT = 1.5A -40°C ≤ TA ≤ +85°C — — 170 ISHORT Short-Circuit Current Limit Enabled into short circuit, CL=120µF — 2.0 — A ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4V, CL = 120µF, -40°C ≤ TA ≤ +85°C 1.6 2.1 2.6 A ITrig Current Limiting Trigger Threshold Output Current Slew rate (<100A/s) , CL = 120µF — 2.6 A VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V — — 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 — — V ISINK EN Input Leakage VEN = 5V — — 1 µA TD(ON) Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 ms TR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω — 0.6 1.5 ms TD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms TF Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω — 0.05 0.1 ms RFLG FLG Output FET On-Resistance IFLG =10mA — 20 40 Ω TBlank FLG Blanking Time CIN = 10uF, CL = 22F 4 7 15 ms TDIS Discharge Time CL = µF, VIN = 5V, disabled to VOUT < 0.5V — 0.6 — ms RDIS Discharge Resistance (Note 5) VIN = 5V, disabled, IOUT = 1mA — 100 — Ω TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ — 140 — °C THYS Thermal Shutdown Hysteresis — — 25 — °C SOT25 (Note 6) — 170 — SO-8 (Note 6) — 127 — Thermal Resistance Junction-to- θJA Ambient MSOP-8 (Note 6) — 118 — °C/W MSOP-8-EP (Note 7) — 67 — U-DFN2018-6 (Note 7) — 70 — Notes: 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. 6. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2181D/AP2191D 4 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Typical Performance Characteristics VVVV VVVV EEEENNNN 55550000%%%% 55550000%%%% EEEENNNN 55550000%%%% 55550000%%%% TTTT TTTT TTTT DDDD((((OOOOFFFFFFFF)))) TTTT DDDD((((OOOOFFFFFFFF)))) RRRR RRRR TTTT TTTT FFFF FFFF TTTT TTTT DDDD((((OOOONNNN)))) 99990000%%%% 99990000%%%% DDDD((((OOOONNNN)))) 99990000%%%% 99990000%%%% VVVV VVVV OOOOUUUUTTTT OOOOUUUUTTTT 11110000%%%% 11110000%%%% 11110000%%%% 11110000%%%% Figure 1 Voltage Waveforms: AP2181D (left), AP2191D (right) All Enable Plots are for AP2181D Active Low Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div Vout 2V/div CL = 1µF CL = 1µF TA = +25°C TA = +25°C Vout 2V/div RL = 10Ω RL = 10Ω 100µs/div 100µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div Vout 2V/div CL = 120µF CL = 120µF TA = 25°C Vout TA = +25°C RL = 10Ω 2V/div RL = 10Ω 500µs/div 500µs/div AP2181D/AP2191D 5 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Typical Performance Characteristics (continued) Short Circuit Current, Device Enabled Into Short Short Circuit with Blanking Time and Recovery Ven VIN = 5V VIN = 5V 5V/div TA = +25°C TA = +25°C Vout CL = 120µF 5V/div CL = 120µF Vflag 5V/div Iout Iout 2A/div 500mA/div 500us/div 50ms/div 0.6 Ω Load Connected to Enabled Device Power On with Full Load Vflag VIN = 5V 2V/div TA = +25°C Vin CL = 120µF 5V/div Iout 500mA/div Iout Vflg 1A/div 5V/div Vout 5V/div TA = +25°C CL = 120µF RL = 3.3Ω 2ms/div 1ms/div UVLO Increasing With Full Load UVLO Decreasing With Full Load TA = +25°C CL = 22µF RL = 3.3Ω Vin Vin 2V/div 2V/div Iout Iout 500mA/div TA = +25°C 500mA/div CL = 22µF RL = 3.3Ω 1ms/div 10ms/div AP2181D/AP2191D 6 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Typical Performance Characteristics (cont.) Discharge Time (No Load Resistance) Inrush Current Ven VIN = 5V Vout TA = +25°C 5V/div TA = +25°C 2V/div CL =120µF VNIoN =L o5aVd RL = 3.3Ω CL =470µF R esistance CL=470uF CL =22µF CL=100uF CL=220uF Iout 500mA/div Ven 2V/div 100ms/div 1ms/div Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage 850 55 750 50 CL = 1µF RL = 10Ω us) 650 us) 45 TA = +25°C me ( me ( On Ti 550 Off Ti 40 Turn- 450 CL = 1µF Turn- 35 RL = 10Ω 350 30 TA = +25°C 250 25 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Rise Time vs Input Voltage Fall Time vs Input Voltage 650 25 600 24 550 me (us) 500 me (us) 2223 Rise Ti 450 CL = 1µF Fall Ti 21 CL = 1µF 400 RL = 10Ω RL = 10Ω 350 TA = +25°C 20 TA = +25°C 300 19 2 2.5 3 3.5 4 4.5 5 5.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) AP2181D/AP2191D 7 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Typical Performance Characteristics (cont.) Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Disabled vs Ambient Temperature 52 0.9 A) A) Vin = 5.5V Enabled (u 47 Vin = Vin = 5.0V Disabled (u 000...678 V in = 5.0V urrent, Output 3472 5.5V Vin = 2.7V urrent, Output 000...345 V in = 3.3V upply C 32 Vin = 3.3V upply C 00..12 V in = 2.7V S S 27 0.0 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) Static Drain-Source On-State Resistance vs Ambient Short-Circuit Output Current vs Ambient Temperature Temperature 2.60 180 Vin = 2.7V A) CL = 100µF Drain-Source On-State ΩResistance (m) 111111112345670000000 V in = 3.3V Circuit Output Current ( 2222....23450000 V in = 2.7V V in = 3.3V V in = 5.0V Static 19000 V in = 5V Short- 2.10 Vin = 5.5V 80 2.00 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage 2.15 3.24 3.22 ckout (V) 22..0150 UVLO Rising urrent (A) 33..1280 o C Undervoltage L 12..9050 UVLO Falling Threshold Trip 333...111246 TCAL == +12205µ°CF 3.10 1.90 3.08 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Ambient Temperature (°C) Input Voltage (V) AP2181D/AP2191D 8 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Application Note The AP2181D and AP2191D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection features and special functions, make these power switches ideal for hot-swap or hot-plug applications. Protection Features: Undervoltage Lockout (UVLO) Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Overcurrent and Short Circuit Protection An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2181D/AP2191D are outlined below: S. NO Conditions Explanation Behavior of the AP2181D/AP2191D Output is shorted before The IC senses the short circuit and immediately clamps 1 Short circuit condition at start-up input voltage is applied or before the part is enabled. output current to a certain safe level namely ILIMIT. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit Short-circuit or overload Short-circuit or overcurrent function can react. 2 condition that occurs when condition After the current limit function has tripped (reached the the part is enabled. overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. Gradual increase from nominal Load increases gradually The current rises until ITRIG or thermal limit. Once the 3 until the current-limit threshold has been reached, the device switches into its operating current to ILIMIT threshold.(ITRIG) current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at an extremely low temperature (< -20°C), a minimum 120-µF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Thermal Protection Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or short-circuit faults are present for extended periods of time. The AP2181D/AP2191D implements thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the output is turned back on. The built-in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an overcurrent occurs with 7-ms deglitch. Reverse Current Protection In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such back currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature blocks reverse current flow from the output back to the input. AP2181D/AP2191D 9 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Application Note (continued) Special Functions: Discharge Function When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FLG Response The FLG open-drain output goes active low for any of the two conditions: Overcurrent or Over-Temperature. The time from when a fault condition is encountered to when the FLG output goes low is 7-ms (TYP). The FLG output remains low until both overcurrent and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7-ms deglitch timeout. This 7-ms timeout is also applicable for overcurrent recovery and Thermal recovery. The AP2181D/AP2191D is designed to eliminate erroneous overcurrent reporting without the need for external components, such as an RC delay network. Power Supply Considerations A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents output from going negative during turn-off due to inductive parasitics. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 The junction temperature can be calculated by: TJ = PD x RθJA + TA Where: TA= Ambient Temperature °C RθJA = Thermal Resistance PD = Total Power Dissipation Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise and fall times of the AP2181D/AP2191D, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2181D/AP2191D also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2181D/AP2191D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls the system surge current and provides a hot-plugging mechanism for any device. Dual-Purpose Port Applications AP2181D/AP2191D is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a non- recommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2181D/AP2191D includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2181D/AP2191D is disabled. In addition, if the output of the AP2181D/AP2191D is subjected to a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device’s discharge MOS transistor may result. AP2181D/AP2191D 10 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Ordering Information 7”/1133”” TTaappee aanndd RReeeell Part Number Package Code Packaging Quantity Part Number Suffix AP21X1DSG-13 S SO-8 2,500/Tape & Reel -13 AP21X1DM8G-13 M8 MSOP-8 2,500/Tape & Reel -13 AP21X1DMPG-13 MP MSOP-8EP 2,500/Tape & Reel -13 AP21X1DWG-7 W SOT25 3,000/Tape & Reel -7 AP21X1DFMG-7 FM U-DFN2018-6 3,000/Tape & Reel -7 Marking Information (1) SO-8 ( Top View ) 8 7 6 5 Logo 1 : 1 Channel YY : Year : 08, 09,10~ Part Number AP21XXD WW : Week : 01~52; 52 8 :76 A :: cAAtccivttiievv eeL LHoowigw h YY WW X X represents 52 and 53 wweeeekk 9 : Active High X : Internal Code G : Green 1 2 3 4 (2) MSOP-8 ( Top view ) 8 7 6 5 AX~: ZIn t:e Grnraele Cnode LLooggoo Y W X YY :: YYeeaar r: :0 0~~99 PaPrat rNt Nuummbbeerr AAPP2213 XX 11 D WW :: WWeeeekk : :A A~~ZZ : 1: ~12~62 6w ewweeekee;kk; 08 : : AAccttiivvee LLooww aa~~zz ::: 222777~~~555222 ww weeeeekke;;k zz; rrzzee rprpeerreeppssrreeeessnneettssnn ttss 19 : :A Accttiivvee HHiigghh 5522 aanndd 5 533 w weeeekk 11 :: 11 CChhaannnneel l 1 2 3 4 AP2181D/AP2191D 11 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Marking Information (continued) (3) MSOP-8EP ( Top view ) 8 7 6 5 AX~: ZIn :t eGrnreael Cnode LLooggoo Y W X E MMSSOOPP--88E-EPP Y : Year : 0~9 Y: Year : 0~9 PPaartr tN Nuummbbeerr AAPP2213 XX 11 D WW :: WWeeeekk :: AA~~ZZ :: 11~~2266 w weeeekk;; a~z : 27~52 week; z represents 08 :: AAccttiivvee LLooww a~z: 27~52 week; z represents 52 and 53 week 19 :: AAccttiivvee HHiigghh 52 and 53 week 1 : 1 Channel 1 : 1 Channel 1 2 3 4 (4) SOT25 ( Top View ) 5 74 XX : Identification code Y : Year 0~9 XX Y W X W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week 1 2 3 X : A~Z : Green Device Package Type Identification Code AP2181DW SOT25 JE AP2191DW SOT25 JF (5) U-DFN2018-6 (Top View) XX : Identification Code XX Y : Year : 0~9 Y W X W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Device Package Type Identification Code AP2181DFM U-DFN2018-6 JE AP2191DFM U-DFN2018-6 JF AP2181D/AP2191D 12 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (1) SO-8 SO-8 Dim Min Max A - 1.75 4 E1 E 0.25 Gauge Plane AA12 01..1300 01..2500 A1 L Seating Plane A3 0.15 0.25 b 0.3 0.5 Detail ‘A’ D 4.85 4.95 E 5.90 6.10 h 7°~9° E1 3.85 3.95 45° e 1.27 Typ Detail ‘A’ h - 0.35 A2 A A3 L 0.62 0.82 e b θθθθ 0° 8° All Dimensions in mm D (2) MSOP-8 MSOP-8 D Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 4x10° A2 0.75 0.95 0.86 0.25 A3 0.29 0.49 0.39 x E Gauge Plane b 0.22 0.38 0.30 Seating Plane c 0.08 0.23 0.15 y a D 2.90 3.10 3.00 4x10° L E 4.70 5.10 4.90 E1 2.90 3.10 3.00 Detail C 1 b E3 Ee3 2.-8 5 3.-0 5 20..9655 A3 L 0.40 0.80 0.60 A2 A a 0° 8° 4° x - - 0.750 A1 e E1 c y - - 0.750 See Detail C All Dimensions in mm (3) MSOP-8EP MSOP-8EP D Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 x D1 5 4X 10° Ab3 00..2292 00..4398 00..3390 2 E E2 0. c 0.08 0.23 0.15 Gauge Plane D 2.90 3.10 3.00 y Seating Plane D1 1.60 2.00 1.80 a E 4.70 5.10 4.90 1 e 8Xb 4X10° L EE12 21..9300 31..1700 31..0500 E3 Detail C E3 2.85 3.05 2.95 A1 A3 e - - 0.65 c A A2 L 0.40 0.80 0.60 a 0° 8° 4° D E1 x - - 0.750 y - - 0.750 See Detail C All Dimensions in mm AP2181D/AP2191D 13 o f 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.dio des.com © Diodes Incorporated

AP2181D/AP2191D Package Outline Dimensions (continued) (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (4) SOT25 A SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B C B 1.50 1.70 1.60 C 2.70 3.00 2.80 D   0.95 H 2.90 3.10 3.00 H J 0.013 0.10 0.05 K 1.00 1.30 1.10 K N M L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 J D L αααα 0° 8°  All Dimensions in mm (5) U-DFN2018-6 A3 A SEATING PLANE A1 U-DFN2018-6 Dim Min Max Typ Pin#1 ID D A 0.545 0.605 0.575 D2 A1 0 0.05 0.02 A3   0.13 L b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 E E2 e   0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 z L 0.20 0.30 0.25 z   0.30 b e All Dimensions in mm AP2181D/AP2191D 14 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) SO-8 X Dimensions Value (in mm) X 0.60 Y 1.55 C1 C1 5.4 C2 1.27 C2 Y (2) MSOP-8 X C Y Y1 Dimensions Value (in mm) C 0.650 X 0.450 Y 1.350 Y1 5.300 (3) MSOP-8-EP X C Y Value G Dimensions (in mm) C 0.650 G 0.450 X 0.450 Y2 Y1 X1 2.000 X1 Y 1.350 Y1 1.700 Y2 5.300 AP2181D/AP2191D 15 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Suggested Pad Layout (continued) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) SOT25 C2 C2 G C1 Z Dimensions Value (in mm) Z 3.20 Y G 1.60 X 0.55 X Y 0.80 C1 2.40 C2 0.95 (5) U-DFN2018-6 X C Y Dimensions Value (in mm) C 0.50 G 0.20 X 0.25 Y1 X1 1.60 Y 0.35 Y1 1.20 G X1 AP2181D/AP2191D 16 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D Taping Orientation (Note 8) For U-DFN2018-6 Note: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf. AP2181D/AP2191D 17 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

AP2181D/AP2191D IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com AP2181D/AP2191D 18 of 18 March 2015 Document number: DS32251 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: D iodes Incorporated: AP2181DFMG-7 AP2181DM8G-13 AP2181DMPG-13 AP2181DSG-13 AP2181DWG-7 AP2191DFMG-7 AP2191DM8G-13 AP2191DMPG-13 AP2191DSG-13 AP2191DWG-7