AP2186/ AP2196 1.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2186 and AP2196 are integrated high-side power switches ( Top View ) optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and EN1 1 8 OUT1 available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise FLG1 2 7 IN time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting FLG2 3 6 GND and does not require any external components. All devices are available in SO-8 and MSOP-8EP packages EN2 4 5 OUT2 SO-8 Features  Dual USB Port Power Switches ( Top View )  Over-Current and Thermal Protection EN1 1 8 OUT1  2.1A Accurate Current Limiting  Reverse Current Blocking FLG1 2 7 IN  90mΩ On-Resistance FLG2 3 6 GND  Input Voltage Range: 2.7V - 5.5V EN2 4 5 OUT2  0.6ms Typical Rise Time  Very Low Shutdown Current: 1µA (max) MSOP-8EP  Fault Report (FLG) with Blanking Time (7ms typ)  ESD Protection: 6KV HBM, 300V MM  Active Low (AP2186) or Active High (AP2196) Enable Applications  Ambient Temperature Range -40ºC to +85°C  SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”  Consumer electronics – LCD TV & Monitor, Game Machines Molding Compound (No Br, Sb)  Communications – Set-Top-Box, GPS, Smartphone  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Computing – Laptop, Desktop, Servers, Printers, Docking Station,  Halogen and Antimony Free. “Green” Device (Note 3) HUB  UL Recognized, File Number E322375  IEC60950-1 CB Scheme Certified Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit Power Supply IN OUT1 Load 2.7V to 5.5V 0.1uF 68uF 10k 10k 10uF 0.1uF FLG1 OUT2 Load FLG2 0.1uF 68uF ON EN1 OFF EN2 GND AP2186/ AP2196 1 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Available Options Enable Pin Current Limit Recommended Maximum Part Number Channel (EN) (typ) Continuous Load Current AP2186 2 Active Low 2.1A 1.5A AP2196 2 Active High 2.1A 1.5A Pin Descriptions Pin Number Pin Name Function SO-8 MSOP-8EP EN1 1 1 Switch 1 enable input, active low (AP2186) or active high (AP2196) FLG1 2 2 Switch 1 over-current and over-temperature fault report, open-drain FLG2 3 3 Switch 2 over-current and over-temperature fault report, open-drain EN2 4 4 Switch 2 enable input, active low (AP2186) or active high (AP2196) OUT2 5 5 Switch 2 voltage output pin GND 6 6 Ground IN 7 7 Voltage input pin OUT1 8 8 Switch 1 voltage output pin Exposed Pad: Exposed Pad — Exposed Pad It should be connected externally to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. Functional Block Diagram FLG1 Thermal Sense Deglitch EN1 Driver Current Limit UVLO GND CS OUT1 Reverse blocking IN Reverse blocking CS OUT2 UVLO FLG2 Current Driver EN2 Limit Deglitch Thermal Sense GND AP2186/ AP2196 2 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit ESD HBM Human Body Model ESD Protection 6 kV ESD MM Machine Model ESD Protection 300 V VIN Input Voltage 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V ILOAD Maximum Continuous Load Current Internal Limited A TJ(MAX) Maximum Junction Temperature 150 °C TST Storage Temperature Range (Note 4) -65 to +150 °C Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Units VIN Input voltage 2.7 5.5 V IOUT Output Current 0 1.5 A VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2.0 VIN V TA Operating Ambient Temperature -40 +85 C AP2186/ AP2196 3 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Electrical Characteristics (@TA = +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit VUVLO Input UVLO RLOAD = 1kΩ 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 0.5 1 µA IQ Input Quiescent Current, Dual Enabled, IOUT = 0 95 140 µA ILEAK Input Leakage Current Disabled, OUT grounded 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 1 µA MSOP-8EP 90 135 mΩ VIN = 5V, IOUT = 1.5A, -40°C ≤ TA ≤ +85°C SO-8 100 135 mΩ RDS(ON) Switch On-Resistance MSOP-8EP VIN = 3.3V, IOUT = 1.5A, -40°C ≤ TA ≤ +85°C SO-8 120 160 mΩ ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 68µF 2.1 A ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.5V, CL = 120µF, -40°C ≤ TA ≤ +85°C 1.6 2.1 2.6 A ITrig Current Limiting Trigger Threshold VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF 2.5 A TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 68µF 20 µs VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V ISINK EN Input Leakage VEN = 5V 1 µA TD(ON) Output Turn-On Delay Time CL=1µF, RLOAD = 10Ω 0.05 ms TR Output Turn-On Rise Time CL=1µF, RLOAD = 10Ω 0.6 1.5 ms TD(OFF) Output Turn-Off Delay Time CL=1µF, RLOAD = 10Ω 0.01 ms TF Output Turn-Off Fall Time CL=1µF, RLOAD = 10Ω 0.05 0.1 ms RFLG FLG Output FET On-Resistance IFLG =10mA 20 40 Ω IFOH Error Flag Off Current VFLG = 5V 0.01 1 µA TBlank FLG Blanking Time CL = 68µF 4 7 15 ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ 140 C THYS Thermal Shutdown Hysteresis 25 C SO-8 (Note 5) 110 oC/W θJA Thermal Resistance Junction-to-Ambient MSOP-8EP (Note 6) 60 oC/W Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane. AP2186/ AP2196 4 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics V V EN 50% 50% EN 50% 50% T T T D(OFF) T D(OFF) R T R T CL=1µF F F TA= +25°C TD(ON) 90% 90% TD(ON) 90% 90% RL=5Ω V V OUT OUT 10% 10% 10% 10% Figure 1 Voltage Waveforms: AP2186 (left), AP2196 (right) All Enable Plots are for AP2196 Active High Channel 1 Turn-On Delay and Rise Time Channel 1 Turn-Off Delay and Fall Time Ven 1 Ven 1 5V/div 5V/div CL=1µF Vout 1 2V/div TA= +25°C RL=5Ω Vout 1 CL=1µF 2V/div TA= +25°C RL=5Ω 400µs/div 400µs/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 Ven 2 5V/div 5V/div CL=1µF Vout 2 2V/div TA= +2 5°C RL=5Ω Vout 2 2V/div CL=1µF TA= +25°C RL=5Ω 400µs/div 400µs/div AP2186/ AP2196 5 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics (cont.) Channel 1 Turn-On Delay and Rise Time Channel 1 Turn-Off Delay and Fall Time Ven 2 Ven 2 5V/div 5V/div CL=100µF TA= +25°C Vout 2 Vout 2 2V/div 2V/div RL=5Ω CL=100µF TA= +25°C RL=5Ω 400µs/div 400µs/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 Ven 2 5V/div 5V/div CL=100µF TA= +25°C Vout 2 Vout 2 2V/div 2V/div RL=5Ω CL=100µF TA= +25°C RL=5Ω 400µs/div 400µs/div Channel 1 Short Circuit Current, Channel 2 Short Circuit Current, Device Enabled Into Short Device Enabled Into Short Ven 1 Ven 2 5V/div 5V/div Iout 1 Iout 2 500mA/div 500mA/div VIN=5V VIN=5V TA= +25°C TA= +25°C CL=68µF CL=68µF 500µs/div 500µs/div AP2186/ AP2196 6 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics (cont.) Channel 1 Inrush Current Channel 2 Inrush Current Ven 1 Ven 2 5V/div 5V/div CL=100µF CL=470µF VIN=5V CL=100µF CL=470µF VIN=5V TA= +25° C TA= +25° C RL=3.3Ω RL=3.3Ω Iout 1 Iout 2 500mA/div 500mA/div CL=220µF CL=220µF 1ms/div 1ms/div Channel 1 Channel 2 0.6 Ω Load Connected to Enabled Device 0.6 Ω Load Connected to Enabled Device VIN=5V VIN=5V TA= +25°C TA= +25°C Vflag 1 CL=68µF Vflag 2 CL=68µF 2V/div 2V/div Iout 1 Iout 2 1A/div 1A/div 2ms/div 2ms/div Channel 1 Channel 2 Short Circuit with Blanking Time and Recovery Short Circuit with Blanking Time and Recovery Vout 1 Vout 2 5V/div VIN=5V 5V/div VIN=5V TA= +25°C TA= +25°C Vflag 1 CL=68µF Vflag 2 CL=68µF 5V/div 5V/div Iout 1 Iout 2 2A/div 2A/div 20ms/div 20ms/div AP2186/ AP2196 7 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics (cont.) Channel 1 Power On Channel 2 Power On Vflag 1 Vflag 2 5V/div 5V/div TA= +25°C TA= +25°C CL=68µF CL=68µF Iout 1 RL=3Ω Iout 2 RL=3Ω 500mA/div 500mA/div Ven 1 Ven 2 5V/div 5V/div Vin Vin 5V/div 5V/div 1ms/div 1ms/div Channel 1 UVLO Increasing Channel 1 UVLO Decreasing TA= +25°C CL=68µF RL=3Ω Vin Vin 2V/div 2V/div TA= +25°C Iout 1 CL=68µF Iout 1 500mA/div 500mA/div RL=3Ω 1ms/div 10ms/div Channel 2 UVLO Increasing Channel 2 UVLO Decreasing TA= +25°C Vin Vin CL=68µF 2V/div 2V/div RL=3Ω Iout TA= +25°C Iout 500mA/div CL=68µF 500mA/div RL=3Ω 1ms/div 10ms/div AP2186/ AP2196 8 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics (cont.) Channel 1 Enabled and Shorted with Channel 2 Disabled Channel 1 Disabled and Channel 2 Enabled Vout 1 5V/div Ven1 5V/div Vout 2 5V/div Vout 1 5V/div Vflag 1 5V/div TA= +25°C Ven2 CL=68µF 5V/div TA= +25°C CL=68µF Iout 2 500mA/div Vout 2 5V/div 100ms/div 50ms/div Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage 850 55 750 50 CL=1µF us) 650 us) 45 RL=10Ω e ( e ( TA=+25°C m m On Ti 550 Off Ti 40 urn- 450 urn- 35 T CL=1µF T 350 RL=10Ω 30 TA=+25°C 250 25 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Rise Time vs Input Voltage Fall Time vs Input Voltage 650 25 600 24 550 me (us) 500 me (us) 2223 Rise Ti 450 CL=1µF Fall Ti 21 CL=1µF 400 RL=10Ω RL=10Ω 350 TA=+25°C 20 TA=+25°C 300 19 2 2.5 3 3.5 4 4.5 5 5.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) AP2186/ AP2196 9 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics (cont.) Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Disabled vs Ambient Temperature 52 0.9 A) A) Vin=5.5V Enabled (u 47 Vin=5.5V Vin=5.0V Disabled (u 000...678 Vin=5.0V Supply Current, Output 334272 Vin=3.3V Vin=2.7V Supply Current, Output 00000.....12345 Vin=3.3V Vin=2.7V 27 0.0 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) Static Drain-Source On-State Resistance vs Ambient Short-Circuit Output Current vs Ambient Temperature Temperature 2.60 180 Drain-Source On-State Resistance (mΩ) 111111112345670000000 V in=2.7V V in=3.3V Circuit Output Current (A) 2222....23450000 CL=100µV Fi n=2.7V V in=3.3V V in=5.0V Static 19000 V in=5V Short- 2.10 Vin=5.5V 80 2.00 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage 2.15 3.24 3.22 ckout (V) 22..0150 UVLO Rising urrent (A) 33..1280 ervoltage Lo 2.00 UVLO Falling shold Trip C 33..1146 TCAL==6 +82µ5F° C Und 1.95 Thre 3.12 3.10 1.90 3.08 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Ambient Temperature (°C) Input Voltage (V) AP2186/ AP2196 10 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Typical Performance Characteristics (cont.) Current Limit Response vs Peak Current 45 40 s) u 35 e ( VIN = 5V ons 30 TA= +25°C p es 25 CL=68µF, R mit 20 L=68µF Li nt 15 e urr 10 C 5 0 0 2 4 6 8 10 12 Peak Current (A) AP2186/ AP2196 11 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Application Information Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2186/AP2196 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2186/AP2196 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2186/AP2196 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2186/AP2196 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2186/ AP2196 12 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Application Information (cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Power Supply Downstream USB Ports 3.3V 5V D+ AP2186 D- 2 7 IN OUT1 V BUS 0.1uF 0.1uF 68uF GND 8 FLG1 3 D+ USB EN1 5 D- Controller FLG2 6 4 OUT2 V EN2 BUS GND 0.1uF 68uF GND 1 Figure 2 Typical Two-Port USB Host / Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2186/AP2196, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2186/AP2196 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2186/AP2196 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2186/ AP2196 13 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Ordering Information 13” Tape and Reel Part Number Package Code Packaging Quantity Part Number Suffix AP21X6SG-13 S SO-8 2500/Tape & Reel -13 AP21X6MPG-13 MP MSOP-8EP 2500/Tape & Reel -13 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo 6 : 2 Channel Part Number AP21X X G : Green 8 : Active Low YY : Year : 08, 09,10~ YY WW X X 9 : Active High WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code 1 2 3 4 (2) MSOP-8EP AP2186/ AP2196 14 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. (1) Package Type: SO-8 SO-8 54 Dim Min Max E1 E 0.2 Gauge Plane A - 1.75 A1 Seating Plane A1 0.10 0.20 L A2 1.30 1.50 Detail ‘A’ A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 h 7°~9° E 5.90 6.10 45° E1 3.85 3.95 Detail ‘A’ A2 A A3 e 1.27 Typ h - 0.35 e b L 0.62 0.82 D  0 8 All Dimensions in mm (2) Package Type: MSOP-8EP D MSOP-8EP Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 D1 4X10° AA23 00..7259 00..9459 00..8369 x 5 E E2 0.2 b 0.22 0.38 0.30 Gauge Plane c 0.08 0.23 0.15 y Seating Plane D 2.90 3.10 3.00 a D1 1.60 2.00 1.80 1 e 8Xb 4X10° L EE1 42..7900 53..1100 34..0900 E3 Detail C E2 1.30 1.70 1.50 A1 A3 E3 2.85 3.05 2.95 c e - - 0.65 A A2 L 0.40 0.80 0.60 D E1 a 0° 8° 4° x - - 0.750 See Detail C y - - 0.750 All Dimensions in mm AP2186/ AP2196 15 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions Value (in mm) X 0.60 Y 1.55 C1 C1 5.4 C2 1.27 C2 Y (2) Package Type: MSOP-8EP X C G Y Value Dimensions (in mm) C 0.650 G 0.450 X 0.450 Y2 Y1 X1 2.000 X1 Y 1.350 Y1 1.700 Y2 5.300 AP2186/ AP2196 16 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

AP2186/ AP2196 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com AP2186/ AP2196 17 of 17 March 2013 Document number: DS31815 Rev. 3 - 2 www.diodes.com © Diodes Incorporated

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: D iodes Incorporated: AP2186MPG-13 AP2186SG-13 AP2196MPG-13 AP2196SG-13