NOT RECOMMENDED FOR NEW DESIGN USE AP7330 or AP7343 AP133 Green 300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT LINEAR REGULATOR Description Pin Assignments The AP133 is a 300mA, adjustable output voltage, low dropout linear regulator. The device includes pass element, error amplifier, band- gap, current limit and thermal shutdown circuitry. The device is turned on when EN pin is set to logic high level. (Top View) The characteristics of low dropout voltage and less quiescent current make it good for low power applications, for example, battery IN 1 5 OUT powered devices. The typical quiescent current is approximately 40μA from zero to maximum load. GND 2 Built-in current-limit and thermal-shutdown functions prevent IC from damage in fault conditions. EN 3 4 ADJ The AP133 is available in SOT25 and DFN2020-6 packages. SOT25 Features  300mA Low Dropout Regulator with EN (Top View)  Very Low IQ: 40µA  Wide Input Voltage Range: 2V to 6V  Adjustable Output: 1V to 5V EN 1 6 ADJ  High PSRR: 65dB at 1kHz  Ultra-fast Start-Up Time: 25µs GND 2 5 NC  Stable with Low ESR, 1µF Ceramic Output Capacitor  Excellent Load/Line Transient Response  Low Dropout: 350mV at 300mA IN 3 4 OUT  Current Limit Protection  Short Circuit Protection  Thermal Shutdown Protection DFN2020-6  Ambient Temperature Range: -40ºC to +85°C  SOT25 and DFN2020-6: Available in “Green” Molding Applications Compound (No Br, Sb)  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Cellular Phones  Halogen and Antimony Free. “Green” Device (Note 3)  Smart Phones, PDAs  MP3/MP4  Bluetooth Head Set  Low Power Application Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP133 1 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Typical Applications Circuit V V IN OUT IN OUT AP133 R1 1mF 1mF Enable EN ADJ GND R2  R  V V 1 1  OUT REF R    2 Pin Descriptions Package Name Pin Number Function SOT25 DFN2020-6 IN 1 3 Voltage input pin. Bypass to ground through at least 0.1µF capacitor GND 2 2 Ground EN 3 1 Enable input, active high ADJ 4 6 Output feedback pin NC - 5 No connection OUT 5 4 Voltage output pin. Bypass to ground through 1µF ceramic capacitor AP133 2 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Functional Block Diagram IN OUT Current Limit Gate EN and Thermal Driver Shutdown FB 0.8V GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Ratings Unit VIN Input Voltage 7 V - OUT, ADJ, EN Voltage VIN + 0.3 V - Continuous Load Current Internal Limited - TOP Operating Junction Temperature Range -40 to +125 °C TST Storage Temperature Range -65 to +150 °C SOT25 740 mW PD Power Dissipation (Note 4) DFN2020-6 900 mW TJ Maximum Junction Temperature +150 °C Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input voltage (Note 5) 2 6 V IOUT Output Current 0 300 mA TA Operating Ambient Temperature -40 +85 °C Notes: 4. Ratings apply to ambient temperature at +25°C. 5. At VIN< 2.2V and TA< -20°C, the output current capability may be reduced. AP133 3 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Electrical Characteristics (@TA = +25°C, VIN = VOUT +1V, CIN = 1mF, COUT = 1mF, VEN = 2V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ. Max Unit IQ Input Quiescent Current IOUT = 0~300mA - 40 60 mA ISHDN Input Shutdown Current VEN = 0V, IOUT = 0 - - 1 mA ILEAK Input Leakage Current VEN = 0V, OUT grounded - - 1 mA VDropout Dropout Voltage VOUT  1.5V, IOUT = 300mA - 350 450 mV VREF ADJ reference voltage IOUT= 0 - 0.8 - V IADJ ADJ leakage - - - 1 mA VOUT Output Voltage Accuracy - -2 - 2 % VOUT Line Regulation VIN = VOUT +1V to 5.5V, - 0.05 - %/V /VIN/V IOUT = 1mA VOUT Load Regulation IOUT from 1mA to 300mA -1 - 1 % /VOUT tST Start-up Time VIOEUNT == 03V0 0tom 2A. 0V, - 25 - ms PSRR PSRR 1kHz, IOUT = 0mA - 65 - dB ISHORT Short-circuit Current VIN = 5.0V, VOUT < 0.2V - 120 - mA ILIMIT Current limit VOUT = 3V, ROUT = 3Ω 400 600 - mA VIL EN Input Logic Low Voltage - - - 0.4 V VIH EN Input Logic High Voltage - 1.4 - - V IEN EN Input leakage VEN = 0V or 5.5V -1 - 1 uA TSHDN Thermal shutdown threshold - - +145 - °C THYS Thermal shutdown hysteresis - - +20 - °C Thermal Resistance SOT25 - 176 - θJA Junction-to-Ambient DFN2020-6 Device mounted on FR-4 substrate, - 142 - °C/W 2oz copper, with minimum Thermal Resistance SOT25 - 41 - θJC Junction-to-Case DFN2020-6 recommended pad layout. - 36 - °C/W AP133 4 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Typical Performance Characteristics Output Voltage vs. Temperature Output Voltage vs. Temperature 3.3100 1.8200 VIN=5V, Vout=3.3V VIN=3.3V, Vout=1.8V ge (V)3.3050 e (V)1.8150 a g put Volt3.3000 ut Volta1.8100 Out utp 3.2950 O1.8050 3.2900 1.8000 -50.0 -25.0 0.0 25.0 50.0 75.0 100.0 125.0 -50.0 -25.0 0.0 25.0 50.0 75.0 100.0 125.0 Temperature (°C) Temperature (°C) Output Voltage vs. Input Voltage Quiescent Current vs. Input Voltage 2.0 60 VOUT=1.2V 1.8 A) IOUT=0mA m 55 ge (V)111...246 urrent ( 50 IOUT=300mA a C put Volt001...680 escent 4405 Out0.4 IOUT=0mA Qui 35 0.2 IOUT=150mA 0.0 30 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2.0 3.0 4.0 5.0 6.0 Input Voltage (V) Input Voltage (V) Quiescent Current vs. I Quiescent Current vs. Temperature OUT VOUT=2.8V 60.00 50 Vin=3.3V A)m 55.00 Vin=5V A) ent ( 50.00 nt (m 45 Curr urre ent 45.00 nt C 40 esc 40.00 sce Qui 35.00 uie 35 VOUT=1.2V VIN=3.3V Q VOUT=3.3V VIN=5.0V 30.00 30 0.00 50.00 100.00 150.00 200.00 250.00 300.00 -50.0 -25.0 0.0 25.0 50.0 75.0 100.0 125.0 IOUT(mA) Temperature (°C) AP133 5 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Typical Performance Characteristics Dropout Voltage vs. I ADJ Pin Voltage vs. Input Voltage OUT V =3.3V OUT 0.8020 450 400 V) 0.8015 mV)350 ge ( 0.8010 e (300 a g J Pin Volt 00..88000005 pout Volta122505000 D o100 25°C A 0.7995 Dr 50 90°C -45°C 0 0.7990 0.0 50.0 100.0 150.0 200.0 250.0 300.0 2.0 3.0 4.0 5.0 6.0 Input Voltage (V) I (mA) OUT Current Limit Protection Current Limit vs. Temperature 800 Vin=3.3V, Vout=1.2V A)750 Vin=5.0V, Vout=3.3V m mit (700 Li650 nt e urr600 C 550 500 -50 -30 -10 10 30 50 70 90 Temperature (°C) Time (50ms/div) Short Circuit Protection Short Circuit Protection Time (1ms/div) Time (2ms/div) AP133 6 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Typical Performance Characteristics Short Circuit Current vs. Input Voltage Short Circuit Current vs. Temperature 150 Vin=3.3V, Vout=1.2V A) 150 mA) 140 Vin=3.3V, Vout=1.8V nt (m 113400 ent ( 130 Vin=5.0V, Vout=3.3V urre 120 Curr 120 ort Circuit C 1189010000 hort Circuit 11901000 h S S 70 80 2.0 3.0 4.0 5.0 6.0 -50 -30 -10 10 30 50 70 90 Temperature (°C) Input Voltage (V) Thermal Shutdown Protection PSRR -20.00 -30.00 -40.00 B) R (d-50.00 R-60.00 S P -70.00 -80.00 -90.00 100 1000 10000 100000 Frequency (Hz) Time (20ms/div) Line Transient Response Line Transient Response Time (20ms/div) Time (20ms/div) AP133 7 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Typical Performance Characteristics Line Transient Response Line Transient Response Time (20ms/div) Time (20ms/div) Load Transient Response Load Transient Response Time (100ms/div) Time (100ms/div) Load Transient Response Load Transient Response Time (20ms/div) Time (100ms/div) AP133 8 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Typical Performance Characteristics Start-up Time Start-up Time EN=VIN=5V EN=VIN=5V CIN=1mF CIN=1mF COUT=1mF COUT=1mF Time (5ms/div) Time (5ms/div) Start-up Time Start-up Time EN=VIN=3.3V EN=VIN=3.3V CIN=1mF CIN=1mF COUT=1mF COUT=1mF Time (5ms/div) Time (5ms/div) AP133 9 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Application Note Input Capacitor A1mF ceramic capacitor is recommended to connect between VIN and GND pins to decouple input power supply glitch and noise. The amount of the capacitance may be increased without limit. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both VIN and GND. A lower ESR capacitor allows the use of less capacitance, while higher ESR type requires more capacitance. Output Capacitor The output capacitor is required to stabilize and help transient response for LDO. The AP133 is stable with very small ceramic output capacitors. The recommended capacitance is from 1mF to 4.7mF, Equivalent Series Resistance (ESR) is from 10m to 100m, and temperature characteristic is X7R or X5R. Higher capacitance values help to improve load/line transient response. The output capacitance may be increased to keep low undershoot/overshoot. Place output capacitor as close as possible to OUT and GND pins, and keep the leads as short as possible. Adjustable Operation The AP133 provides output voltage from 1.0V to 5.0V through external resistor divider as shown below. VIN AP133 VOUT IN OUT CIN R1 COUT Enable EN ADJ GN D R2 The output voltage is calculated by:  R  VOUT VREF1 R1    2 Where VREF=0.8V (the internal reference voltage) Rearranging the equation will give the following that is used for adjusting the output to a particular voltage: V  R  R  OUT 1 1 2V    REF To maintain the stability of the internal reference voltage, R2 needs to be kept smaller than 250k. No Load Stability Other than external resistor divider, no minimum load is required to keep the device stable. The device will remain stable and regulated in no load condition. ON/OFF Input Operation The AP133 is turned on by setting the EN pin high, and is turned off by pulling it low. If this feature is not used, the EN pin should be tied to IN pin to keep the regulator output on at all time. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. Current Limit Protection When output current at OUT pin is higher than current limit threshold, the current limit protection will be triggered and clamp the output current to approximately 600mA to prevent over-current and to protect the regulator from damage due to overheating. Short Circuit Protection When OUT pin is short-circuit to GND or OUT pin voltage is less than 200mV, short circuit protection will be triggered and clamp the output current to approximately 120mA. This feature protects the regulator from over-current and damage due to overheating. Thermal Shutdown Protection Thermal protection disables the output when the junction temperature rises to approximately +145°C, allowing the device to cool down. When the junction temperature reduces to approximately +125°C the output circuitry is enabled again. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the heat dissipation of the regulator, protecting it from damage due to overheating. AP133 10 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Application Note (Cont.) Ultra Fast Start-up After enabled, the AP133 is able to provide full power in as little as tens of microseconds, typically 25µs, without sacrificing low ground current. This feature will help load circuitry move in and out of standby mode in real time, eventually extend battery life for mobile phones and other portable devices. Fast Transient Response Fast transient response LDOs can also extend battery life. TDMA-based cell phone protocols such as Global System for Mobile Communications (GSM) have a transmit/receive duty factor of only 12.5 percent, enabling power savings by putting much of the baseband circuitry into standby mode in between transmit cycles. In baseband circuits, the load often transitions virtually instantaneously from 100µA to 100mA. To meet this load requirement, the LDO must react very quickly without a large voltage drop or overshoot — a requirement that cannot be met with conventional, general-purpose LDOs. The AP133’s fast transient response from 0 to 300mA provides stable voltage supply for fast DSP and GSM chipset with fast changing load. Small Overshoot and Undershoot The AP133 has small and controlled overshoot and undershoot in load and line transitions. This helps to protect supplied circuit from damage and operation error caused by glitches. This feature also permits the usage of small value output decoupling capacitor with AP133. Low Quiescent Current Cellular phone baseband internal digital circuits typically operate from 1.8V to 2.6V. When the Li+ battery voltage falls to 3.2 to 3.3V, most phones shut off, giving at least 500-600mV of headroom for the baseband digital LDO, so dropout is not critical. Output noise and the PSRR are not critical specs for the digital circuits. Nonetheless, this supply requires low quiescent current at light loads because this LDO stays on at all times. Figure below shows how the digital supply current of a representative GSM chipset core varies as a function of time. In the standby mode, the microprocessor consumes only around 200µA. Since the phone stays in standby for the longest percentage of time, using a 40µA quiescent current LDO, instead of 140µA, saves 100µA and extends the standby time by 340µA/240µA, or 1.417 times. The baseband internal analog circuit is typically 2.4V-3.0V, and it requires 200-600mV dropout. This LDO is on all the time, so it requires low quiescent current as well. The cellular phone real-time clock LDO needs a very low quiescent current, since this LDO is on all the time even though the handset is powered off. The AP133, consuming only around 40µA for all input range and output loading, provides great power saving in portable and low power applications. Wide Output Range The AP133, with a wide output range of 1.0V to 5.0V, provides a versatile LDO solution for many portable applications. High PSRR The RF circuit consists of receive and transmit sections, which typically require 2.6V-3.0V supply voltage. The RF circuits such as LNA (low-noise amplifier), up/down-converter, mixer, PLL, VCO, and IF stage, require low noise and high PSRR LDOs. The temperature-compensated crystal oscillator circuit requires very high PSRR at RF power amplifier burst frequency. For instance, minimum 65dB PSRR at 217Hz is recommended for the GSM handsets. In order to provide good audio quality, the audio power supply for hand-free, game, MP3, and multimedia applications in cellular phones, require low-noise and high PSRR at audio frequency range (20Hz to 20kHz). The AP133, with PSRR of 70dB at 1kHz in best case, is suitable for some of these applications that require high PSRR. AP133 11 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Ordering Information AP 133 - XX G - 7 Package Green Packing W : SOT25 G : Green 7 : Tape & Reel SN : DFN2020-6 Packaging 7” Tape and Reel Device Package Code (Note 6) Quantity Part Number Suffix AP133-WG-7 W SOT25 3000/Tape & Reel -7 AP133-SNG-7 SN DFN2020-6 3000/Tape & Reel -7 Note: 6. Pad layout as shown on Diodes Incorporated’s suggested pad layout document, which can be found on our website at http://www.diodes.com/package-outlines.html. AP133 12 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Marking Information (1) SOT25 ( Top View ) 5 4 7 XX : Identification code Y : Year 0~9 XX Y W X W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week 1 2 3 X : A~Z : Green Part Number Package Identification Code AP133-WG-7 SOT25 NB (2) DFN2020-6 ( Top View ) XX : Identification Code X X Y : Year : 0~9 W : Week : A~Z : 1~26 week; YWX a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Part Number Package Identification Code AP133-SNG-7 DFN2020-6 NB AP133 13 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Package Outline Dimensions (All dimensions in mm.) (1) Package Type: SOT25 (2) Package Type: DFN2020-6 3 n. 6 o 0. m 7/ 43 0.5 Marking 0. 0.05 C (Active area depth) x. a m 0.08 C 5 Seating plane 1 0. C 5 C 0 5 0/0. 0.1 2x 1.95/2.075 A B 1.45/1.65 0 1.95/2.075 0.76/0.96 0.30/0.4 R0.1 2x- 0.15 C 0.65nom. 0.2/0.3 0.05M C A B Pin#1 ID Bottom View AP133 14 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 Taping Orientation (Note 7) Note: 7. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf. AP133 15 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated

NOT RECOMMENDED FOR NEW DESIGN AP133 USE AP7330 or AP7343 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com AP133 16 of 16 June 2018 Document number: DS31122 Rev. 7 - 3 www.diodes.com © Diodes Incorporated