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产品目录

光电元件

描述

TXRX SFP+ 850NM 10GBE SR

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光纤 - 收发器

品牌

Avago Technologies US Inc.

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产品型号

AFBR-709DMZ

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

*

其它名称

516-3108
AFBR-709DMZ-ND

标准包装

10

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AFBR-709DMZ 10Gb/1Gb Ethernet, 850nm SFP+ Transceiver Data Sheet AFBR-709DMZ Description Features • Avago 850nm VCSEL source and Transmitter Optical The Avago AFBR-709DMZ transceiver is part of a family Subassembly technology of SFP+ products. This transceiver utilizes Avago’s 850nm VCSEL and PIN Detector technology to provide an IEEE • Avago PIN detector and Receiver Optical Subassembly 10Gb Ethernet design compliant with the 10GBASE-SR technology /SW standard and allows the operation at 1.25GBd for • Typical power dissipation 600mW Gigabit Ethernet application. The AFBR-709DMZ trans- • Full digital diagnostic management interface ceiver is designed to enable 10Gb Ethernet equipment designs with very high port density based on the new • Avago SFP+ package design enables equipment EMI electrical and mechanical specification enhancements performance in high port density applications with to the well known SFP specifications developed by the margin to Class B limits SFF Committee. These specifications are referred to as • Flexibility in data rate selection through either SFP+ to recognize these enhancements to previous SFP hardware or software control specifications used for lower speed products. Avago Technologies is an active participant in the SFF Commit- Specifications tee specification development activities. • Optical interface specifications per IEEE 802.3ae Related Products 10GBASE-SR and 10GBASE-SW • Compliant to the transmitter extinction ratio and • AFCT-701SDDZ SFP+ 10Gb/1Gb Gigabit Ethernet the receiver sensitivity specs per IEEE 802.3 Gigabit 10GBASE-LR transceiver for operation in SMF link Ethernet (1.25GBd) 1000BASE-SX applications to 10 km • Electrical interface specifications per SFF Committee • AFBR-709SMZ (AFBR-709ASMZ) SFP+ 10 Gigabit SFF 8431 Specifications for Enhanced 8.5 and 10 Ethernet 10GBASE-SR transceiver with case tempe- Gigabit Small Form Factor Pluggable Module “SFP+” rature 0-70°C (0-85°C) for use on multimode fiber cables. It is best suited for OM3 high bandwidth MMF • Management interface specifications per SFF link applications with link lengths up to 300 meters. Committee SFF 8431 and SFF 8472 Diagnostic Monitoring Interface for Optical Transceivers • AFBR-707SDZ SFP+ 10 Gigabit Ethernet 10GBASE- LRM transceiver for 220 meter operation in all MMF • Mechanical specifications per SFF Committee SFF link applications including OM1 and OM2 legacy fiber 8432 Improved Pluggable Formfactor “IPF” cables and new high bandwidth OM3 fiber cables. • LC Duplex optical connector interface confirming to • AFCT-701SDZ (AFCT-701ASDZ) SFP+ 10 Gigabit ANSI TIA/EA 604-10 (FOCIS 10A) Ethernet 10GBASE-LR transceiver with case tempe- • Compliant to Restriction on Hazardous Substances rature 0-70°C (0-85°C) for operation in SMF link (RoHS) per EU and China requirements applications to 10 km • Compliant to halogen free requirements • AFCT-5016Z SFP+ Evaluation Board The purpose of • Class 1 Eye safe per requirements of IEC 60825-1 / this SFP+ evaluation board is to provide the designer CDRH with a convenient means for evaluating SFP+ fiber optic transceivers. Patent - www.avagotech.com/patents

Description, continued Installation Compliance Prediction The AFBR-709DMZ transceiver package is compliant Compliance prediction is the ability to determine if an with the SFF 8432 Improved Pluggable Formfactor hous- optical transceiver is operating within its operating and ing specification for the SFP+. It can be installed in any environmental requirements. AFBR-709DMZ devices INF-8074 or SFF-8431/2 compliant Small Form Pluggable provide real-time access to transceiver internal supply (SFP) port regardless of host equipment operating status voltage and temperature, allowing a host to identify po- The AFBR-709DMZ is hot-pluggable, allowing the mod- tential component compliance issues. Received optical ule to be installed while the host system is operating and power is also available to assess compliance of a cable on-line. Upon insertion, the transceiver housing makes plant and remote transmitter. When operating out of initial contact with the host board SFP cage, mitigating requirements, the link cannot guarantee error free trans- potential damage due to Electro-Static Discharge (ESD). mission. By selecting TX rate select to 1.25 Gbps operation, the Fault Isolation module TX performance complies with the extinction ratio and output power level in 1000BASE-SX specifica- The fault isolation feature allows a host to quickly pin- tions. point the location of a link failure, minimizing downtime. For optical links, the ability to identify a fault at a local Likewise RX performance complies with the sensitivity device, remote device or cable plant is crucial to speed- performance in the 1000BASE-SX specifications by se- ing service of an installation. AFBR-709DMZ real-time lecting RX rate select to 1.25 Gbps operation. monitors of Tx_Bias, Tx_Power, Vcc, Temperature and The rate select can be done through either the hardware Rx_Power can be used to assess local transceiver current pins or the software access to the A2h page of EEPROM operating conditions. In addition, status flags TX_DIS- map. The user can refer to the Appendix for details of ABLE and Rx Loss of Signal (LOS) are mirrored in memory rate select. and available via the two-wire serial interface. Digital Diagnostic Interface and Serial Identification Component Monitoring The two-wire interface protocol and signaling detail are Component evaluation is a more casual use of the based on SFF-8431. Conventional EEPROM memory, AFBR-709DMZ real-time monitors of Tx_Bias, Tx_Power, bytes 0-255 at memory address 0xA0, is organized in Vcc, Temperature and Rx_Power. Potential uses are as compliance with SFF-8431. New digital diagnostic in- debugging aids for system installation and design, and formation, bytes 0-255 at memory address 0xA2, is transceiver parametric evaluation for factory or field compliant to SFF-8472. The new diagnostic information qualification. For example, temperature per module can provides the opportunity for Predictive Failure Identifi- be observed in high density applications to facilitate cation, Compliance Prediction, Fault Isolation and Com- thermal evaluation of blades, PCI cards and systems. ponent Monitoring. Predictive Failure Identification The AFBR-709DMZ predictive failure feature allows a host to identify potential link problems before system performance is impacted. Prior identification of link problems enables a host to service an application via “fail over” to a redundant link or replace a suspect de- vice, maintaining system uptime in the process. For ap- plications where ultra-high system uptime is required, a digital SFP provides a means to monitor two real-time laser metrics asso ciated with laser degradation and pre- dicting failure: average laser bias current (Tx_Bias) and average laser optical power (Tx_Power). 2

OPTICAL INTERFACE ELECTRICAL INTERFACE RECEIVER RD+ (RECEIVE DATA) AMPLIFICATION LIGHT FROM FIBER PHOTO-DETECTOR & QUANTIZATION RD– (RECEIVE DATA) RX_LOS RS0 RS1 CONTROLLER & MEMORY SDA SCL MOD-ABS TRANSMITTER TX_DISABLE LASER DRIVER & TD+ (TRANSMIT DATA) LIGHT TO FIBER VCSEL SAFETY TD– (TRANSMIT DATA) CIRCUITRY TX_FAULT Figure 1. Transceiver functional diagram Transmitter Section Transmit Fault (TX_FAULT) The transmitter section includes the Transmitter A catastrophic laser fault will activate the transmitter Optical Sub-Assembly (TOSA) and laser driver circuitry. signal, TX_FAULT, and disable the laser. This signal is The TOSA, containing an Avago designed and manufac- an open collector output (pull-up required on the host tured 850 nm VCSEL (Vertical Cavity Surface Emitting board). A low signal indicates normal laser operation Laser) light source, is located at the optical interface and and a high signal indicates a fault. The TX_FAULT will mates with the LC optical connector. The TOSA is driven be latched high when a laser fault occurs and is cleared by an IC which uses the incoming differential high speed by toggling the TX_DISABLE input or power cycling the logic signal to modulate the laser diode driver current. transceiver. The transmitter fault condition can also be This Tx laser driver circuit regulates the optical power at monitored via the two-wire serial interface (address A2, a constant level provided the incoming data pattern is byte 110, bit 2). DC balanced. Transmit Disable (TX_DISABLE) The AFBR-709DMZ accepts an LVTTL compatible trans- mit disable control signal input which shuts down the transmitter optical output. A high signal implements this function while a low signal allows normal transceiver operation. In the event of a fault (e.g. eye safety circuit activated), cycling this control signal resets the module as depicted in Figure 6. An internal pull up resistor dis- ables the transceiver transmitter until the host pulls the input low. TX_DISABLE can also be asserted via the two- wire interface (address A2h, byte 110, bit 6) and moni- tored (address A2h, byte 110, bit 7). The contents of A2h, byte 110, bit 6 are logic OR’d with hardware TX_DISABLE (contact 3) to control transmitter operation. 3

Receiver Section Caution The receiver section includes the Receiver Optical Sub- There are no user serviceable parts nor maintenance Assembly (ROSA) and the amplification/quantization requirements for the AFBR-709DMZ. All mechanical circuitry. The ROSA, containing a PIN photodiode and adjustments are made at the factory prior to shipment. custom transimpedance amplifier, is located at the op- Tampering with, modifying, misusing or improperly tical interface and mates with the LC optical connector. handling the AFBR-709DMZ will void the product war- The ROSA output is fed to a custom IC that provides ranty. It may also result in improper operation and pos- post-amplification and quantization. sibly overstress the laser source. Performance degrada- tion or device failure may result. Connection of the Receiver Loss of Signal (Rx_LOS) AFBR-709DMZ to a light source not compliant with IEEE Std. 802.3ae Clause 52 and SFF-8341 specifications, op- The post-amp IC also includes transition detection cir- erating above maximum operating conditions or in a cuitry which monitors the AC level of incoming optical manner inconsistent with it’s design and function may signals and provides a LVTTL/CMOS compatible status result in exposure to hazardous light radiation and may signal to the host. A high status signal indicates loss of constitute an act of modifying or manufacturing a laser modulated signal, indicating link failures such as broken product. Persons performing such an act are required by fiber or failed transmitter. Rx_LOS can also be monitored law to recertify and re-identify the laser product under via the two-wire serial interface (address A2h, byte 110, the provisions of U.S. 21 CFR (Subchapter J) and TUV. bit 1). Customer Manufacturing Processes Functional Data I/O This module is pluggable and is not designed for The AFBR-709DMZ interfaces with the host circuit board aqueous wash, IR reflow, or wave soldering processes. through the twenty contact SFP+ electrical connector. See Table 2 for contact descriptions. The module edge Ordering Information connector is shown in Figure 4. The host board layout for this interface is depicted in Figure 7. Please contact your local field sales engineer or one of Avago Technologies franchised distributors for ordering The AFBR-709DMZ high speed transmit and receive information. For technical information, please visit in terfaces require SFF-8431 compliant signal lines on Avago Technologies’ WEB page at www.avagotech.com. the host board. To simplify board requirements, biasing For information related to SFF Committee documenta- resistors and AC coupling capacitors are incorpor ated tion visit www.sffcommittee.org. into the SFP+ transceiver module (per SFF-8431) and hence are not required on the host board. The TX_DIS- ABLE, TX_FAULT and RX_LOS signals require LVTTL signals on the host board (per SFF-8431) if used. If an application does not take advantage of these func tions, care must be taken to ground TX_DISABLE to enable normal operation. Figure 2 depicts the recom mended interface circuit to link the AFBR-709DMZ to supporting physical layer ICs. Timing for the dedicated SFP+ control signals imple- mented in the transceiver are listed in Figure 6. Application Support An Evaluation Kit and Reference Designs are available to assist in evaluation of the AFBR-709DMZ. Please contact your local Field Sales representative for availability and ordering details. 4

Regulatory Compliance Electromagnetic Interference (EMI) The AFBR-709DMZ complies with all applicable laws Equipment incorporating 10 gigabit transceivers is and regulations as detailed in Table 1. Certification level typically subject to regulation by the FCC in the United is dependent on the overall configuration of the host States, CENELEC EN55022 (CISPR 22) in Europe and VCCI equipment. The transceiver performance is offered as a in Japan. The AFBR-709DMZ enables equipment compli- figure of merit to assist the designer. ance to these standards detailed in Table 1. The metal housing and shielded design of the AFBR-709DMZ mini- Electrostatic Discharge (ESD) mizes the EMI challenge facing the equipment designer. For superior EMI performance it is recommended that The AFBR-709DMZ is compatible with ESD levels found equipment designs utilize SFP+ cages per SFF 8432. in typical manufacturing and operating environments as described in Table 1. In the normal handling and RF Immunity (Susceptibility) operation of optical transceivers, ESD is of concern in two circumstances. Due to its proprietary bulk optics TOSA and ROSA de- sign, the EMI immunity of the AFBR-709DMZ exceeds The first case is during handling of the transceiver prior typical industry standards. to insertion into an SFP compliant cage. To protect the device, it’s important to use normal ESD handling Eye Safety pre-cautions. These include use of grounded wrist straps, work-benches and floor wherever a transceiver is The AFBR-709DMZ provides Class 1 (single fault handled. tolerant) eye safety by design and has been tested for compliance with the requirements listed in Table 1. The The second case to consider is static discharges to the eye safety circuit continuously monitors the optical out- exterior of the host equipment chassis after installation. put power level and will disable the transmitter upon If the optical interface is exposed to the exterior of host detecting a condition beyond the scope of Class 1 cer- equipment cabinet, the transceiver may be subject to tification Such conditions can be due to inputs from the system level ESD requirements. host board (Vcc fluctuation, unbalanced code) or a fault within the transceiver. US CDRH and EU TUV certificates are listed in table 1. Flammability The AFBR-709DMZ optical transceiver is made of metal and high strength, heat resistant, chemical resistant and UL 94V-0 flame retardant plastic. 5

Table 1. Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) MIL-STD-883C Class 1 (> 2000 Volts) to the Electrical Pins Method 3015.4 Electrostatic Discharge (ESD) IEC 61000-4-2 Typically, no damage occurs with 25 kV when to the Duplex LC Receptacle the duplex LC connector receptacle is con- tacted by a Human Body Model probe. IEC 61000-4-2 10 contacts of 8 kV on the electrical faceplate with device inserted into a panel. Electrostatic Discharge (ESD) IEC 61000-4-2 Air discharge of 15 kV (min.) to the Optical Connector contact to connector without damage. Electromagnetic Interference FCC Class B System margins are dependent on customer (EMI) CENELEC EN55022 Class B board and chassis design. (CISPR 22A) VCCI Class A Immunity IEC 61000-4-3 Typically shows no measurable effect from a 10 V/m field swept from 10 MHz to 1 GHz. Laser Eye Safety and US FDA CDRH AEL Class 1 CDRH Certification No.: 9720151-128 Equipment Type Testing US21 CFR, Subchapter J per TUV file: R 72121699 Paragraphs 1002.10 BAUART and 1002.12 GEPRU¬FT TU¬V (IEC) EN 60825-1: 2007 ProRdhuecint lSaanfdety APPTYRPOEVED (IEC) EN 60825-2: 2004+A1 (IEC) EN 60950-1: 2006+A11 Component Recognition Underwriters Laboratories and Canadian UL file: E173874, Vol. 1 Standards Association Joint Component Recognition for Information Technology Equipment including Electrical Business Equipment RoHS Compliance RoHS Directive 2002/95/EC and SGS Test Report No. LPC/13392 (AD-1)/07 it’s amendment directives 6/6 CTS Ref. CTS/07/3283/Avago 6

VCC,T GND,T 10 kΩ Tx DIS Tx_DISABLE Tx FAULT Tx_FAULT 0.1 µF TD+ 100 Ω TD- 0.1 µF LASER DRIVER 4.7 k to 10 kΩ 4.7 µH VCC,T 0.1 µF 22 µF 0.1 µF 3.3 V PROTOCOL IC SERDES IC 4.7 µH VCC,R VCC,R 0.1 µF 22 µF 0.1 µF VCC,R µF 50 Ω 4.7 k to 10 kΩ 50 Ω 0.1 µF RD+ 100 Ω RD- 0.1 µF Rx LOS LOSS OF SIGNAL 3.3 V GND,R POST AMPLIFIER 4.7 k to 10 kΩ 4.7 k to 10 kΩ 4.7 k to 10 kΩ MOD_DEF0 MOD_DEF1 MOD_DEF2 MODULE DETECT SCL SDA Figure 2. Typical application configuration. 4.7 µH VCCT 0.1 µF 22 µF 0.1 µF 3.3 V 4.7 µH VCCR 0.1 µF 22 µF 0.1 µF SFP MODULE HOST BOARD NOTE: INDUCTORS MUST HAVE LESS THAN 1Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE. Figure 3. Recommended power supply filter. 7

Table 2. Contact Description Contact Symbol Function/Description Notes 1 VeeT Transmitter Signal Ground Note 1 2 TX_FAULT Transmitter Fault (LVTTL-O) – High indicates a fault condition Note 2 3 TX_DISABLE Transmitter Disable (LVTTL-I) – High or open disables the transmitter Note 3 4 SDA Two Wire Serial Interface Data Line (LVCMOS – I/O) (same as MOD-DEF2 in INF-8074) Note 4 5 SCL Two Wire Serial Interface Clock Line (LVCMOS – I/O) (same as MOD-DEF1 in INF-8074) Note 4 6 MOD_ABS Module Absent (Output), connected to VeeT or VeeR in the module Note 5 7 RS0 Rate Select 0 - RS0=Lo for 1000BASE-SX, RS0=Hi for 10GBASE-SR Note 6 8 RX_LOS Receiver Loss of Signal (LVTTL-O) Note 2 9 RS1 Rate Select 1 - RS1=Lo for 1000BASE-SX, RS1=Hi for 10GBASE-SR Note 6 10 VeeR Receiver Signal Ground Note 1 11 VeeR Receiver Signal Ground Note 1 12 RD- Receiver Data Out Inverted (CML-O) 13 RD+ Receiver Data Out (CML-O) 14 VeeR Receiver Signal Ground 15 VccR Receiver Power + 3.3 V 16 VccT Transmitter Power + 3.3 V 17 VeeT Transmitter Signal Ground Note 1 18 TD+ Transmitter Data In (CML-I) 19 TD- Transmitter Data In Inverted (CML-I) 20 VeeT Transmitter Signal Ground Note 1 Notes: 1. The module signal grounds are isolated from the module case. 2. This is an open collector/drain output that on the host board requires a 4.7 kΩ to 10 kΩ pullup resistor to VccHost. See Figure 2. 3. This input is internally biased high with a 4.7 kΩ to 10 kΩ pullup resistor to VccT. 4. Two-Wire Serial interface clock and data lines require an external pullup resistor dependent on the capacitance load. 5. This is a ground return that on the host board requires a 4.7 kΩ to 10 kΩ pullup resistor to VccHost. 6. Refer to the Appendix for detailed operation of RS0 and RS1. 10 11 BOTTOM OF BOARD AS TOP VIEW TOWARD VIEWED FROM OF BOARD HOST TOP THROUGH BOARD 1 20 Figure 4. Module edge connector contacts 8

Table 3. Absolute Maximum Ratings Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate catastrophic damage to the module even if all other parameters are within Recommended Operating Conditions. It should not be assumed that limiting values of more than one parameter can be applied concurrently. Exposure to any of the Absolute Maximum Ratings for extended periods can adversely affect reliability. Parameter Symbol Minimum Maximum Unit Notes Storage Temperature TS -40 85 C Case Operating Temperature TC -40 85 C Relative Humidity RH 5 95 % Supply Voltage VccT, VccR -0.3 3.8 V Note 1 Low Speed Input Voltage -0.5 Vcc+0.5 V Two-Wire Interface Input Voltage -0.5 Vcc+0.5 V High Speed Input Voltage, Single Ended -0.3 Vcc+0.5 V High Speed Input Voltage, Differential 2.5 V Low Speed Output Current -20 20 mA Optical Receiver Input Average Power 0 dBm Notes: 1. The module supply voltages, VccT and VccR must not differ by more than 0.5 V or damage to the device may occur. Table 4. Recommended Operating Conditions Recommended Operating Conditions specify parameters for which the electrical and optical characteristics hold unless otherwise noted. Optical and electrical charactristics are not defined for operation outside the Recommended Operat- ing Conditions, reliability is not implied and damage to the module may occur for such operation over an extended period of time. Parameter Symbol Minimum Maximum Unit Notes Case Operating Temperature TC 0 70 °C Note 1 Module Supply Voltage VccT, VccR 3.135 3.465 V Fig. 3 Host Supply Voltage VccHost 3.14 3.46 V Signal Rate 9.8 10.313 GBd Note 2 1000BASE-SX (1.25GBd Typical) Power Supply Noise Tolerance 66 10Hz to 10MHz mVp-p Fig. 3 Tx Input Single Ended DC V -0.3 4.0 V Voltage Tolerance (Ref VeeT) Rx Output Single Ended Voltage Tolerance V -0.3 4.0 V N otes: 1. Ambient operating temperature limits are based on the Case Operating Temperature limits and are subject to the host system thermal design. See Figure 7 for the module Tc reference point. 2. For 10GBASE-SR 9

Table 5. Low Speed Signal Electrical Characteristics The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical values are for Tc = 40°C. VccT and VccR = 3.3 V. Parameter Symbol Minimum Typical Maximum Unit Notes Module Supply Current ICC 180 289 mA Note 1 Power Dissipation PDISS 600 1000 mW TX_FAULT, RX_LOS IOH - 50 + 37.5 mA Note 2 VOL - 0.3 0.4 V TX_DISABLE VIH 2.0 VccT + 0.3 V Note 3 VIL -0.3 0.8 V Notes: 1. Supply current includes both VccT and VccR connections. 2. Measured with a 4.7 kΩ load to VccHost. 3. TX_DISABLE has an internal 4.7 kΩ to 10 kΩ pull-up to VccT Table 6. High Speed Signal Electrical Characteristics The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical values are for Tc = 40°C. VccT and VccR = 3.3 V. Parameter Symbol Minimum Typical Maximum Unit Notes Tx Input Differential Voltage (TD +/-) VI 180 1200 mVpp Note 1 Tx Input AC Common Mode Voltage Tolerance 15 mV(RMS) Tx Input Differential S-parameter (100 Ω Ref.) SDD11 -10 dB 0.01-1.0 GHz Note 3 dB 1.0-11.1 GH Tx Input Differential to Common SCD11 -10 dB 0.01-11.1 GHz Mode Conversion (25 Ω Ref.) Rx Output Differential Voltage (RD +/-) Vo 300 850 mVpp Note 1, 10 GBd 1.25 Gbd Rx Output Termination Mismatch @ 1MHz DZm 5 % Rx Output AC Common Mode Voltage 7.5 mV(RMS) Note 5 Rx Output Output Rise and Fall Time tr, tf 28 ps (20% to 80%) Rx Output Total Jitter TJ 0.70 Ulp-p Note 6, 10 GBd 0.332 Ulp-p 1.25 Gbd Rx Output 99% Jitter DJ 0.42 Ulp-p Note 6 Rx Output Differential S-parameter (100 Ω Ref.) SDD22 Note 4 dB 0.01-11.1GHz Rx Output Common Mode Reflection SCC22 -6 dB 0.01-2.5 GHz Coefficient (25 Ω Ref.) -3 dB 2.5-11.1 GHz Receiver Output Eye Mask See Figure 5a Notes: 1. Internally AC coupled and terminated (100 Ohm differential). 2. Internally AC coupled but requires an external load termination (100 Ohm differential). 3. Maximum reflection coefficient is expressed as SDD11=Max(-12+2*sqrt(f) , -6.3+13*log10(f/5.5)), for f in GHz. 4. Maximum reflection coefficient is expressed as SDD22=Max(-12+2*sqrt(f) , -6.3+13*log10(f/5.5)), for f in GHz. 5. The RMS value is measured by calculating the standard deviation of the histogram for one UI of the common mode signal. 6. TJ conditions per SFF-8431. 10

1.40 425 1.0 V m DE E - TU 0.75 UD 150 PLI 0.73 MPLIT 0 D AM 0.5 A ZE LUTE -150 MALI 0.28 O R 0.25 S O B N A 0 -425 -0.40 0 0.35 0.65 1.0 0 0.25 0.40 0.45 0.55 0.60 0.75 1 NORMALIZED TIME (UNIT INTERVAL) NORMALIZED TIME (UNIT INTERVAL) Figure 5a. 10GBd Receiver Electrical Optical Eye Mask Definition Figure 5b. 10GBd Transmitter Optical Eye Mask Definition Table 7. Two-Wire Interface Electrical Characteristics Parameter Symbol Min. Max. Unit Conditions Host Vcc Range VccHTWI 3.135 3.465 V SCL and SDA VOL 0.0 0.40 V Rp[1] pulled to VccHTWI, VOH VccHTWI - 0.5 VccHTWI + 0.3 V measured at host side of connector SCL and SDA VIL -0.3 VccT*0.3 V VIH VccT*0.7 VccT + 0.5 V Input Current on the Il -10 10 µA SCL and SDA Contacts Capacitance on SCL Ci[2] 14 pF and SDA Contacts Total bus capacitance Cb[3] 100 pF At 400 kHz, 3.0 kΩ Rp, max for SCL and for SDA At 100 kHz, 8.0 kΩ Rp, max 290 pF At 400 kHz, 1.1 kΩ Rp, max At 100 kHz, 2.75 kΩ Rp, max Notes: 1. Rp is the pull up resistor. Active bus termination may be used by the host in place of a pullup resistor. Pull ups can be connected to various power supplies, however the host board design shall ensure that no module contact has voltage exceeding VccT or VccR by 0.5 V nor requires the module to sink more than 3.0 mA current. 2. Ci is the capacitance looking into the module SCL and SDA contacts 3. Cb is the total bus capacitance on the SCL or SDA bus. 11

Table 8a. 10GBd Optical Specifications - Transmitter The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical values are for Tc = 40°C. VccT and VccR = 3.3 V. Parameter Minimum Typical Maximum Units Notes Laser OMA output power -4.3 dBm 1, 2, 3, See Table 9 Laser mean output power -1.0 dBm 1, 2, 4 Laser off power -30 dBm 1 Extinction ratio 3.0 dB 1, 2 Transmitter and dispersion penalty (TDP) 3.9 dB 1 Center Wavelength 840 860 nm 1,3, See Table 9 RMS spectral width, standard deviation 1,3, See Table 9 RIN12OMA -128 dB/Hz 1 Optical Return Loss Tolerance 12 dB 1 Encircled Flux 5 Transmitter Output Eye Mask 1, See Figure 5b General Specification Considerations (Notes): 1. IEEE 802.3ae Clause 52 compliant. 2. These parameters are interrelated: see IEEE 802.3ae, Clause 52. 3. See Table 9. Trade-offs are available among spectral width, center wavelength, and minimum optical modulation amplitude. 4. The 10GBASE-SR launch power shall be the lesser of the Class 1 safety limit as defined in IEEE 802.3ae 52.10.2 or the average receive power maximum defined by IEEE 802.3ae -2002 Table 52-9. 5. The transceiver’s launch condition meets the requirement of 10 Gigabit Ethernet multimode fiber as detailed in TIA 492AAAC. 6. Vertical eye closure penalty and Stressed eye jitter are test conditions for Stressed sensitivity (OMA) measurements. Table 8b. 1.25GBd Optical Characteristics - Transmitter Parameter Symbol Minimum Typical Maximum Unit Notes Output Optical Power (Average) POUT -9.5 -6.5 -1 dBm 1 Optical Extinction Ratio ER 9 12 dB Total Jitter (TP1 to TP2 Contribution TJ 227 ps 0.284 UI Coupled Power Ratio CPR 9 dB Notes: 1. 50/125 mm fiber with NA = 0.2, 62.5/125 µm fiber with NA = 0.275. 12

Table 9a. 10GBd Optical Specifications - Receiver Parameter Minimum Typical Maximum Units Notes Stressed sensitivity (OMA) – -7.5 dBm 1 Receive sensitivity (OMA) -11.1 dBm Receive Power (Pave) Overload -1.0 dBm 1 Reflectance -12 dB 1 Center Wavelength 840 860 nm 1 RX_LOS (OMA) De-Asserted -12 dBm RX_LOS (OMA) Asserted -30 dBm RX_LOS (OMA) Hysteresis 0.5 dB Vertical eye closure penalty 3.5 dB 6 Stressed eye jitter 0.3 UI p-p 6 Electrical 3dB Cutoff Frequency 12.3 GHz General Specification Considerations (Notes): 1. IEEE 802.3ae Clause 52 compliant. 2. These parameters are interrelated: see IEEE 802.3ae, Clause 52. 3. See Table 9. Trade-offs are available among spectral width, center wavelength, and minimum optical modulation amplitude. 4. The 10GBASE-SR launch power shall be the lesser of the Class 1 safety limit as defined in IEEE 802.3ae 52.10.2 or the average receive power maximum defined by IEEE 802.3ae -2002 Table 52-9. 5. The transceiver’s launch condition meets the requirement of 10 Gigabit Ethernet multimode fiber as detailed in TIA 492AAAC. 6. Vertical eye closure penalty and Stressed eye jitter are test conditions for Stressed sensitivity (OMA) measurements. Table 9b. 1.25GBd Optical Characteristics - Receiver Parameter Minimum Typical Maximum Unit Notes Receiver Sensitivity -21 -17 dBm (Optical Input Power) Stressed Receiver Sensitivity -12.5 dBm 62.5/125 mm fiber -13.5 dBm 50/125 mm fiber Total Jitter 266 ps (TP3 to TP4 Contribution 1.25GBd) 0.332 UI RX_LOS(OMA) De-Asserted - -17 dBm RX_LOS(OMA) Asserted -30 dBm RX_LOS(OMA) Hysterisis 3 dB Receive Electrical 3 dB Upper Cutoff 2.5 4 GHz Frequency Average Receive Power 0 dBm Wavelength 770 860 nm 13

Table 10. 10 GBd Minimum Optical Modulation Amplitude Center RMS Spectral Width (nm) Wavelength Up to 0.05 to 0.1 to 0.15 to 0.2 to 0.25 to 0.3 to 0.35 to 0.4 to (nm) 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 840 to 842 -4.2 -4.2 -4.1 -4.1 -3.9 -3.8 -3.5 -3.2 -2.8 842 to 844 -4.2 -4.2 -4.2 -4.1 -3.9 -3.8 -3.6 -3.3 -2.9 844 to 846 -4.2 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9 846 to 848 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9 848 to 850 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -3.0 850 to 852 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.4 -3.0 852 to 854 -4.3 -4.2 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1 854 to 856 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1 856 to 858 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.5 -3.1 858 to 860 -4.3 -4.3 -4.2 -4.2 -4.1 -3.9 -3.7 -3.5 -3.2 Table 11. Control Functions: Low Speed Signals Timing Characteristics The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Parameter Symbol Minimum Maximum Unit Notes TX_DISABLE Assert Time t_off 10 ms Note 1 , Fig. 6 TX_DISABLE Negate Time t_on 1 ms Note 2 , Fig. 6 Time to initialize, including reset of TX_FAULT t_init 300 ms Note 3 , Fig. 6 TX_FAULT Assert Time t_fault 1 ms Note 4 , Fig. 6 TX_DISABLE to Reset t_reset 10 ms Note 5 , Fig. 6 RX_LOS Assert Time t_los_on 100 ms Note 6 , Fig. 6 RX_LOS Deassert Time t_los_off 100 ms Note 7 , Fig. 6 Rate select Time t_rate 40 ms Notes: 1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal. A 10 ms interval between assertions of TX_ DISABLE is required. 2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal. 3. Time from power on or falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal and the Two-Wire interface is available. 4. From power on or negation of TX_FAULT using TX_DISABLE. 5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry. 6. Time from loss of optical signal to Rx_LOS Assertion. 7. Time from valid optical signal to Rx_LOS De-Assertion. 14

Table 12. Control Functions: Two-Wire Interface Timing Characteristics The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Parameter Symbol Minimum Maximum Unit Notes TX_DISABLE Assert Time t_off_twi 100 ms Note 1 TX_DISABLE Negate Time t_on_twi 100 ms Note 2 TX_FAULT Assert Time t_fault_twi 100 ms Note 3 Rx_LOS Assert Time t_loss_on_twi 100 ms Note 4 Rx_LOS Deassert Time t_loss_off_twi 100 ms Note 5 Analog parameter data ready t_data 1000 ms Note 6 Two-Wire Interface Ready t_serial 300 ms Note 7 Write Cycle Time Parameter t_write 80 ms Note 8 Two-Wire Interface Clock Rate f_serial_clock 400 kHz Time bus free before new t_buf 20 ms Note 9 transmission can start N otes: 1. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured from falling clock edge after stop bit of write transaction. 2. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of nominal. 3. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted. 4. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal. 5. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal. 6. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional. 7. Time from power on until module is ready for data transmission over the two-wire interface (reads or writes over A0h and A2h). 8. Time from stop bit to completion of a 1-8 byte write command. Measured from the stop bit, for a one t om four byte write the maximum cycle time is 40ms and for a five to eight byte write the maximum cycle time is 80ms. 9. Between STOP and START. See SFF 8431 Section 4.3 15

Table 13. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical values are for Tc = 40°C. VccT and VccR = 3.3 V. Parameter Symbol Min. Units Notes Transceiver Internal Temperature TINT ±3.0 °C Temperature is measured internal to the transceiver. Accuracy Valid from = -10°C to 85°C case temperature. Transceiver Internal Supply VINT ±0.1 V Supply voltage is measured internal to the transceiver Voltage Accuracy and can, with less accuracy, be correlated to voltage at the VccT contact. Valid over 3.3 V ± 10%. Transmitter Laser DC Bias Current IINT ±10 % IINT accuracy is better than ±10% of the nominal value. Accuracy Transmitted Average Optical PT ±3.0 dB Average Power coupled into 50/125 µm multi-mode Output Power Accuracy fiber. Valid from100 mW to 500 mW. Received Average Optical Input PR ±3.0 dB Average Power coupled from 50/125 µm multi-mode Power Accuracy fiber. Valid from 77 mW to 500 mW. VCCT, VCCR > 2.97 V VCCT, VCCR > 2.97 V TX_FAULT TX_FAULT TX_DISABLE TX_DISABLE TRANSMITTED SIGNAL TRANSMITTED SIGNAL t_init t_init t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED VCCT, VCCR > 2.97 V TX_FAULT TX_FAULT TX_DISABLE TX_DISABLE TRANSMITTED SIGNAL TRANSMITTED SIGNAL t_off t_on t_init INSERTION t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED t-off & t-on: TX DISABLE ASSERTED THEN NEGATED OCCURANCE OF FAULT OCCURANCE OF FAULT TX_FAULT TX_FAULT TX_DISABLE TX_DISABLE TRANSMITTED SIGNAL TRANSMITTED SIGNAL t_fault * SFP SHALL CLEAR TX_FAULT IN t_reset t_init* < t_init IF THE FAILURE IS TRANSIENT t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED OCCURANCE OF FAULT TX_FAULT OCCURANCE OPTICAL SIGNAL OF LOSS TX_DISABLE TRANSMITTED SIGNAL LOS t_fault t_reset t_loss_on t_loss_off * SFP SHALL CLEAR TX_FAULT IN t_init* < t_init IF THE FAILURE IS TRANSIENT t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED t-los-on & t-los-off Figure 6. Transceiver timing diagrams (module installed and power applied except where noted) 16

Table 14. EEPROM Serial ID Memory Contents – Conventional SFP Memory (Address A0h) Byte # Data Notes Byte # Data Notes Decimal Hex Decimal Hex 0 03 SFP physical device 37 00 Hex Byte of Vendor OUI[1] 1 04 SFP function defined by serial ID only 38 17 Hex Byte of Vendor OUI[1] 2 07 LC optical connector 39 6A Hex Byte of Vendor OUI[1] 3 10 10G BASE-SR 40 41 “A” - Vendor Part Number ASCII character 4 00 41 46 “F” - Vendor Part Number ASCII character 5 00 42 42 “B” - Vendor Part Number ASCII character 6 01 43 52 “R” - Vendor Part Number ASCII character 7 00 44 2D “-” - Vendor Part Number ASCII character 8 00 45 37 “7” - Vendor Part Number ASCII character 9 00 46 30 “0” - Vendor Part Number ASCII character 10 00 47 39 “9” - Vendor Part Number ASCII character 11 06 64B/66B 48 44 “D” - Vendor Part Number ASCII character 12 67 10312.5 Mbit/sec nominal bit rate 49 4D “M” - Vendor Part Number ASCII character (10.3125 Gbit/s) 13 00 Unspecified 50 5A “Z” - Vendor Part Number ASCII character 14 00 51 20 “ ” - Vendor Part Number ASCII character 15 00 52 20 “ ” - Vendor Part Number ASCII character 16 08 82 m of OM2 50/125 µm fiber 53 20 “ ” - Vendor Part Number ASCII character 17 03 33 m of OM1 62.5/125 µm fiber 54 20 “ ” - Vendor Part Number ASCII character 18 00 55 20 “ ” - Vendor Part Number ASCII character 19 1E 300 m of OM3 50/125 µm fiber 56 20 “ ” - Vendor Revision Number ASCII character 20 41 “A” - Vendor Name ASCII character 57 20 “ ” - Vendor Revision Number ASCII character 21 56 “V” - Vendor Name ASCII character 58 20 “ ” - Vendor Revision Number ASCII character 22 41 “A” - Vendor Name ASCII character 59 20 “ ” - Vendor Revision Number ASCII character 23 47 “G” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength[2] 24 4F “O” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength[2] 25 20 “ ” - Vendor Name ASCII character 62 00 26 20 “ ” - Vendor Name ASCII character 63 Checksum for Bytes 0-62[3] 27 20 “ ” - Vendor Name ASCII character 64 00 Receiver limiting output. 1 Watt power class. 28 20 “ ” - Vendor Name ASCII character 65 3A Hardware SFP TX_DISABLE, TX_FAULT, & RX_LOS, RATE_SELECT 29 20 “ ” - Vendor Name ASCII character 66 00 30 20 “ ” - Vendor Name ASCII character 67 00 31 20 “ ” - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters[4] 32 20 “ ” - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters[5] 33 20 “ ” - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Pwr Avg 34 20 “ ” - Vendor Name ASCII character 93 FA A/W, Soft SFP TX_DISABLE, TX_FAULT, & RX_LOS, RATE_SELECT 35 20 “ ” - Vendor Name ASCII character 94 03 SFF-8472 Compliance to revision 10.0 36 00 95 Checksum for Bytes 64-94[3] 96 - 255 00 Notes: 1. The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex). 2. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352. 3. Addresses 63 and 95 are checksums calculated (per SFF-8472) and stored prior to product shipment. 4. Addresses 68-83 specify the AFBR-709DMZ ASCII serial number and will vary on a per unit basis. 5. Addresses 84-91 specify the AFBR-709DMZ ASCII date code and will vary on a per date code basis. 17

Table 15. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h) Byte # Byte # Byte # Decimal Notes Decimal Notes Decimal Notes 0 Temp H Alarm MSB [1] 26 Tx Pwr L Alarm MSB [4] 104 Real Time Rx Pwr MSB [5] 1 Temp H Alarm LSB [1] 27 Tx Pwr L Alarm LSB [4] 105 Real Time Rx Pwr LSB [5] 2 Temp L Alarm MSB [1] 28 Tx Pwr H Warning MSB [4] 106 Reserved 3 Temp L Alarm LSB [1] 29 Tx Pwr H Warning LSB [4] 107 Reserved 4 Temp H Warning MSB [1] 30 Tx Pwr L Warning MSB [4] 108 Reserved 5 Temp H Warning LSB [1] 31 Tx Pwr L Warning LSB [4] 109 Reserved 6 Temp L Warning MSB [1] 32 Rx Pwr H Alarm MSB [5] 110 Status/Control - See Table 17 7 Temp L Warning LSB [1] 33 Rx Pwr H Alarm LSB [5] 111 Reserved 8 Vcc H Alarm MSB [2] 34 Rx Pwr L Alarm MSB [5] 112 Flag Bits - See Table 18 9 Vcc H Alarm LSB [2] 35 Rx Pwr L Alarm LSB [5] 113 Flag Bits - See Table 18 10 Vcc L Alarm MSB [2] 36 Rx Pwr H Warning MSB [5] 114 Reserved 11 Vcc L Alarm LSB [2] 37 Rx Pwr H Warning LSB [5] 115 Reserved 12 Vcc H Warning MSB [2] 38 Rx Pwr L Warning MSB [5] 116 Flag Bits - See Table 18 13 Vcc H Warning LSB [2] 39 Rx Pwr L Warning LSB [5] 117 Flag Bits - See Table 18 14 Vcc L Warning MSB [2] 40-55 Reserved 118 Extended Control/Status byte - See Table 16 15 Vcc L Warning LSB [2] 56-94 External Calibration Constants [6] 119-127 Reserved 16 Tx Bias H Alarm MSB [3] 95 Checksum for Bytes 0-94 [7] 128-247 Customer Writeable 17 Tx Bias H Alarm LSB [3] 96 Real Time Temperature MSB [1] 248-255 Vendor Specific 18 Tx Bias L Alarm MSB [3] 97 Real Time Temperature LSB [1] 19 Tx Bias L Alarm LSB [3] 98 Real Time Vcc MSB [2] 20 Tx Bias H Warning MSB [3] 99 Real Time Vcc LS [2] 21 Tx Bias H Warning LSB [3] 100 Real Time Tx Bias MSB [3] 22 Tx Bias L Warning MSB [3] 101 Real Time Tx Bias LSB [3] 23 Tx Bias L Warning LSB [3] 102 Real Time Tx Power MSB [4] 24 Tx Pwr H Alarm MSB [4] 103 Real Time Tx Power LSB [4] 25 Tx Pwr H Alarm LSB [4] N otes: 1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C. 2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 mV. 3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 mA. 4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 mW. 5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 mW. 6. Bytes 56-94 are not intended for use with AFBR-709DMZ, but have been set to default values per SFF-8472. 7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment. 8. See Table 16. 18

Table 16. EEPROM Serial ID Memory Contents - Extended Control/Status (Address A2h, Byte 118) Bit # Status/ Description Notes Control Name 7 Reserved 6 Reserved 5 Reserved 4 Reserved 3 Soft RS1 Select Read/write bit that allows software Tx rate control. Writing '1' selects full lspeed 1 Tx operation. Power on default is logic zero/low. This bit is OR'd with the hard- ware RS1 pin value (see Appendix). 2 Reserved 1 Class2 Operation State Value=0. Power class2 operation is not active. 0 Power Class Select Has no effect. Notes: 1. The response time for soft commands of the AFBR-709DMZ is 100ms as specified by SFF-8472. Table 17. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110) Status/ Bit # Control Name Description Notes 7 TX_ DISABLE State Digital state of SFP TX_ DISABLE Input (1 = TX_DISABLE asserted) Note 1 6 Soft TX_ DISABLE Read/write bit for changing digital state of TX_DISABLE function Note 1, 2 5 Reserved 4 Reserved 3 Soft RS0 Select Read/write bit that allows software RX rate control. Writing ‘1’ selects full speed RX operation. Power on default is logic zero/low. This bit is OR’d with the hardware RS0 pin value (see Appendix). 2 TX_FAULT State Digital state of the SFP TX_FAULT Output (1 = TX_FAULT asserted) Note 1 1 RX_LOS State Digital state of the SFP RX_LOS Output (1 = RX_LOS asserted) Note 1 0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) N otes: 1. The response time for soft commands of the AFBR-709DMZ is 100 msec as specified by SFF-8472. 2. Bit 6 is logic OR’d with the SFP TX_DISABLE input on contact 3; either asserted will disable the SFP+ transmitter. 19

Table 18. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117) Byte Bit Flag Bit Name Description 112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold 6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold 5 Vcc High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold 4 Vcc Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold 3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold 2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold 1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold 0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold 113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold 6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold 0-5 Reserved 116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold 6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold 5 Vcc High Warning Set when transceiver internal supply voltage exceeds high warning threshold 4 Vcc Low Warning Set when transceiver internal supply voltage exceeds low warning threshold 3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold 2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold 1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold 0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold 117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold 6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold 0-5 Reserved 20

TOP LABEL RECESS TCASE REFERENCE POINT 8.9 47.5 12.2 13.9 13.4±0.1 30.8 13.6 0.64 UNCOMPRESSED 13 8.55±0.1 6.25 0.69 UNCOMPRESSED BOTTOM LABEL RECESS 25.2 12 TX RX 15.14 UNCOMPRESSED Figure 7. Module Drawing AFBR-709DMZ Figure 8. Module label 21

Appendix: Rate Select Control RX and TX rates can be independently controlled by either hardware input pins or via register writes. Module electri- cal input pins 7 and 9 are used to select RX and TX rate respectively. Status of each logic level is reflected to register byte 110 bit 4 and 5 on address A2h as shown in the diagram below. RX and TX rates can also be controlled by register writes to byte 110 bit 3 and 118 bit 3. Power on default of these bits are logic low. Hardware and software control inputs are OR’d to allow flexible control. RS0 RX Rate Select control flow RS1 TX Rate Select control flow Hardware Software Hardware Software Input Input Input Input RS0 (PIN7) Voltage A2h, byte 110 RS1 (PIN9) Voltage A2h, byte 118 "1"...V>2.0 Bit 3 "1"...V>2.0 Bit 3 "0"...V<0.8 "0"...V<0.8 A2h, byte 110 A2h, byte 110 Bit 4 OR Bit 5 OR RX Rate TX Rate Control Control RS0 Control Input RS1 Control Input RX TX Hardware Software Operation Hardware Software Operation 0 0 1.25G 0 0 1.25G 0 1 10G 0 1 10G 1 0 10G 1 0 10G 1 1 10G 1 1 10G For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. AV02-3828EN - September 14, 2015