DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5% sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512 RoHS compliant & Halogen free 5 V. 9 1 0 2 7, 1 r e b m e t p e S – n o ti a c cifi e p s t c u d o r P

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 29 SCOPE ORDERING INFO RMATION - GLOBAL PART NUMBER This specification describes Part number is identified by the series name, size, tolerance, packaging AF0201 to AF2512 chip resistors type, temperature coefficient, taping reel and resistance value. with anti-sulfur ation capabilities. GLOBAL PART NUMBER AF XXXX X X X XX XXXX L APPLICATIO NS (1) (2) (3) (4) (5) (6) (7)  Industrial Equipment  Power Application (1) SIZE  Networking Application 0201/0402/0603/0805/1206/1210/1218/2010/2512  High-end Computer & (2) TOLERANCE Multimedia Electronics in high sulfur environment D = ±0.5%  Automotive electronics F = ±1% J = ±5% (for jumper ordering, use code of J) FEATURES (3) PACKAGING TYPE  AEC-Q200 qualified R = Paper taping reel  Superior resistance against K = Embossed plastic tape reel sulfur containing atmosphere  Halogen free product and (4) TEMPERATURE COEFFICIENT OF RESISTANCE production – = Base on spec  RoHS compliant  Reduces environmentally (5) TAPING REEL hazardous waste 07 = 7 inch dia. Reel  High component and equipment reliability 13 = 13 inch dia. Reel  Saving of PCB space (6) RESISTANCE VALUE  Moisture sensitivity level: There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point. MSL 1 Detailed resistance rules are displayed in the table of “Resistance rule of global part number”. (7) DEFAULT CODE Letter L is system default code for ordering only (Note) Resistance rule of global part ORDERING EXAMPLE number The ordering code for an AF0402 Resistance coding rule Examp le chip resistor, value 100 KΩ with 1R = 1 Ω ±1% tolerance, supplied in 7-inch XRXX 1R5 = 1.5 Ω tape reel with 10Kpcs quantity is: (1 to 9.76 Ω) 9R76 = 9.76 Ω AF0402FR-07100KL. XXRX 10R = 10 Ω NOTE (10 to 97.6 Ω) 97R6 = 97.6 Ω 1. All our R-Chip products are RoHS XXXR compliant and Halogen free. "LFP" of the 100R = 100 Ω (100 to 976 Ω) internal 2D reel label states "Lead-Free XKXX 1K = 1,000 Ω Process" (1 to 9.76 KΩ) 9K76 = 9760 Ω 2. On customized label, "LFP" or specific symbol can be printed XMXX 1M = 1,000,000 Ω (1 to 9.76 MΩ) 9M76= 9,760,000 Ω www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 39 M ARKING AF0201 / AF0402 No marking Fig. 1 AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512 03 E-24 series: 3 digits, ±5%, ≥10Ω First two digits for significant figure and 3rd digit for number of zeros YNSC001 Fig. 2 Value=10 KΩ AF0 603 0 E-24 series: 3 digits, ±1% YNSC037 One short bar under marking letter Fig. 3 Value = 24 Ω E-96 series: 3 digits, ±1% First two digits for E-96 marking rule and 3rd letter for number of zeros Fig. 4 Value = 12.4 KΩ AF0805 / AF120 6 / AF1210 / AF2010 / AF2512 Both E-24 and E-96 series: 4 digits, ±1% First three digits for significant figure and 4th digit for number of zeros Fig. 5 Value = 10 KΩ AF 1218 E-24 series: 3 digits, ±5% First two digits for significant figure and 3rd digit for number of zeros Fig. 6 Value = 10 KYNSΩC099-2 Both E-24 and E-96 series: 4 digits, ±1% First three digits for significant figure and 4th digit for number of zeros Fig. 7 Value = 10 KYNSCΩ103-2 N O TE F or further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 49 CONSTRUCTION OOUUTTLLIINNEESS The resistors are constructed on top of a high grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The For dimensions see Table 1 resistive glaze is covered by a glass. marking layer The compositio n of the glaze is adjusted to give the overcoat approximate required resistance value and laser trimming primary glass layer of this resistive glaze achieves the value within tolerance. resistive layer (Jumper chip is a conductor) The whole element is covered by a protective overcoat. inner electrode Size 0603 and bigger is marked with the resistance value H termination(Ni/matte tin) inner electrode on top. Finally, the two external terminations (Ni / matte tin) are added. See fig.8 I2 ceramic substrate overcoat I1 DIMENSIONS Table 1 For outlines see fig. 8 TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm) W AF0201 0.60±0.03 0.30±0.03 0.23±0.03 0.12±0.05 0.15±0.05 AF0402 1.00±0.05 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10 YNSC086 L AF0603 1.60±0.10 0.80±0.10 0.45±0.10 0.25±0.15 0.25±0.15 AF0805 2.00±0.10 1.25±0.10 0.50±0.10 0.35±0.20 0.35±0.20 Fig. 8 Chip resistor outlines AF1206 3.10±0.10 1.60±0.10 0.55±0.10 0.45±0.20 0.50±0.20 AF1210 3.10±0.10 2.60±0.15 0.57±0.10 0.45±0.20 0.50±0.20 AF1218 3.10±0.10 4.60±0.10 0.57±0.10 0.45±0.20 0.50±0.20 AF2010 5.00±0.10 2.50±0.15 0.57±0.10 0.55±0.20 0.55±0.20 AF2512 6.35±0.10 3.20±0.15 0.57±0.10 0.60±0.20 0.60±0.20 www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 59 ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS Operating Max. Max. Dielectric TYPE RESIS TANCE RANGE Temperature Coefficient Jumper Temperature Working Overload Withstanding of Resistance Criteria Range Voltage Voltage Voltage Rated Current ±5% (E24), 0.5A 1Ωto 10MΩ Max. Current 1Ω ≤ R ≤10Ω, -100/+350 ppm/°C AF0201 ±0.5%, ±1% (E24/E96), 25 V 50 V 50 V 1.0A 10Ω < R ≤ 10MΩ, ±200 ppm/°C 1Ω to 10MΩ Zero Ohm Jumper < 0.05Ω Rated Current AF0402 50 V 100 V 100 V 1.0A Max. Current AF0603 75 V 150 V 150 V 2.0A ±5% (E24), Rated Current 1 Ω to 22 MΩ 1 Ω ≤ R ≤ 10 Ω, ±200 ppm/°C 2.0A AF0805 ±0.5%, ±1% (E24/E96), 150 V 300 V 300 V 10 Ω < R ≤ 10 MΩ, ±100 ppm/°C Max. Current 1 Ω to 10 MΩ 10 MΩ < R ≤ 22 MΩ, ±200 ppm/°C 5.0A Zero Ohm Jumper < 0.05 Ω Rated Current –55 °C to +155 °C 2.0A AF1206 200 V 400 V 500 V Max. Current 10.0A ±5% (E24), Rated Current 1Ω to 10MΩ 2.0A AF1210 ± 0.5%, ±1% (E24/E96), 200 V 500 V 500 V Max. Current 1Ω to 10M 10.0A Zero Ohm Jumper < 0.05Ω ±5% (E24), Rated Current 1Ω to 1MΩ 1Ω ≤ R ≤ 10Ω, ±200 ppm/°C 2.0A AF1218 ± 0.5%, ±1% (E24/E96), 200 V 500 V 500 V Max. Current 1Ω to 1M 10Ω < R ≤ 10MΩ, ±100 ppm/°C 10.0A Zero Ohm Jumper < 0.05Ω AF2010 1Ω± t5o% 1 0(EM2Ω4), 200 V 500 V 500 V Rated Cur2r.e0nAt ± 0.5%, ±1% (E24/E96), Max. Current AF2512 1Ω to 10M 200V 500V 500V 10.0A Zero Ohm Jumper < 0.05Ω www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 69 F OOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special data sheet “Chip resistors mounting”. PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PA CKING STYLE REEL AF0201 AF0402 AF0603/0805/ AF1210 AF1218/2010/ DIMENSION 1206 2512 Paper taping reel (R) 7" (178 mm) 10,000/20,000 10,000/20,000 5,000 5,000 -- 13" (330 mm) 50,000 50,000 20,000 20,000 -- Embossed taping reel (K) 7" (178 mm) -- -- -- -- 4,000 NOTE 1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”. TEMPERATURE COEFFICIENT OF RESISTANCE RESISTANCE RANGE PT040 100 mΩ to 910 mΩ FUNCTIONAL DESCRIPTION 2 ±200 ppm/°C OOPPEERRAATTIINNGG TTEEMMPPEERRAATTUURREE RRAANNGGEE PT060 AF0201 - AF2512 Range: ±200 ppm/°C 3 -55 °C to + 155 °C (Fig. 7) handbook, halfpage PT080 ±200 ppm/°C 5 P MLB206_1 PPOOWWEERR RRAATTIINNGG 100 MΩ TO 910 MΩ (%Pr a t e d ) EPaTc1h2 0type rated power at 70 °C: 100 mΩ 100 > 100 mΩ 6 AF0201=1/20W (0.05W) APTF0240012=1/16 W (0.0625W) A0 F0603=1/10 W (0.1W) ±100 ppm/°C 50 ±75 ppm/°C AF0805=1/8 W (0.125W) PT251 AF1206=1/4 W (0.25W) ±100 ppm/°C ±75 ppm/°C 2 AF1210=1/2W (0.5W) 0 AAFF12201180==13W/4W (0.75W) 55 0 50 70 100 Tamb(1 o 5C5) AF2512=1W Fig. 7 Maximum dissipation (Pma x) in percentage of rated power as a function of the operat ing ambient temperature (Tamb) RATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V = R Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω) www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 79 TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature IEC 60115-1 4.8 At +25/–55 °C and +25/+125 °C Refer to table 2 Coefficient of MIL-STD-202 Method 304 Resistance Formula: (T.C.R.) R –R 2 1 T.C.R= ------------------------- ×106 (ppm/°C) R (t –t ) 1 2 1 Where t =+25 °C or specified room temperature 1 t =–55 °C or +125 °C test temperature 2 R =resistance at reference temperature in ohms 1 R =resistance at test temperature in ohms 2 Life/Endurance IEC 60115-1 4.25 At 70±2 °C for 1,000 hours, RCWV applied for ±(1.0%+0.05 Ω) MIL-STD-202 Method 108 1.5 hours on, 0.5 hour off, still-air required <100 mΩ for Jumper High MIL-STD-202 Method 108 1,000 hours at 155±3°C ±(1.0%+0.05 Ω) Temperature unpowered <100 mΩ for Jumper Exposure Moisture MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 ±(0.5%+0.05 Ω) for 0.5%, 1% Resistance hours, 3 cycles / 24 hours for 10d. with 25 °C / tol. 65 °C 95% R.H, without steps 7a & 7b, ±(1.0%+0.05 Ω) for 5% tol. unpowered <100 mΩ for Jumper Parts mounted on test-boards, without condensation on parts Thermal Shock MIL-STD-202 Method 107 –55 / +125 °C ±(0.5%+0.05 Ω) for 0.5%, 1% Number of cycles required is 300. Devices tol. mounted ±(1%+0.05 Ω) for 5% tol. Maximum transfer time is 20 seconds. Dwell time <100 mΩ for Jumper is 15 minutes Short Time IEC60115-1 4.13 2.5 times of rated voltage or maximum overload ±(1.0%+0.05 Ω) Overload voltage whichever is less for 5 seconds at room No visible damage temperature Bending IEC 60115-1 4.33 Chips mounted on a 90 mm glass epoxy resin ±(1.0%+0.05 Ω) PCB (FR4) <100 mΩ for Jumper Bending: 0201/0402: 5 mm No visible damage 0603/0805: 3 mm 1206 & above: 2 mm Bending time: 60±5 seconds www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 89 TEST TEST METHO D PROCEDUR E REQUIREMENTS Biased Humidity MIL-STD-202 method 103 1,000 hours; 85℃/85%R.H., 10% of operating 1Ω≤R≤1MΩ: ±(3%+0.05Ω) power. 1MΩ<R≤10MΩ: ±(5%+0.05Ω) Measurement at 24±4 hours after test conclusion. Solderability - Resistance to IEC 60115-1 4.18 Condition B, no pre-heat of samples ±(0.5%+0.05Ω) for 0.5%, 1% tol. Soldering Heat MIL-STD-202 Method 215 Lead-free solder, 260±5 °C, 10±1 seconds ±(1.0%+0.05Ω) for 5% tol. immersion time <50 mΩfor Jumper Procedure 2 for SMD: devices fluxed and No visible damage cleaned with isopropanol - Wetting J-STD-002 Electrical test not required Well tinned (≥95% covered) Magnification 10X No visible damage SMD conditions: (a) Method B, aging 4 hours at 155 °C dry heat, lead-free solder bath at 245 °C (b) Method B, dipping at 215 °C for 3 seconds FOS ASTM-B-809-95* Sulfur 750 hours, 105 °C. unpowered ±(4.0%+0.05Ω) * Modified www.yageo.com Sep. 17, 2019 V.5

Chip Resist or Surface Mount AF SERIES 0201 to 2512 Product specification 99 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 6 Sep. 05, 2019 - - Updated dimensions Version 5 Ju n. 21, 2016 - - Update test and requirement Version 4 Dec. 24, 2015 - - Update Dielectric Withstanding Voltage& Resistance value Version 3 Apr. 01, 2015 - - Modified test and requirements Version 2 Nov. 20, 2014 - - Tests and requirement update Version 1 Sep. 27, 2013 - - Size 0201/1210/1218/2010/2512 extend Version 0 Jan 07, 2011 - - First issue of this specification “ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any product change will be announced by PCN.” www.yageo.com Sep. 17, 2019 V.5